CN111253685A - Low-dielectric-constant low-loss easily-electroplated plastic, and preparation method and application thereof - Google Patents
Low-dielectric-constant low-loss easily-electroplated plastic, and preparation method and application thereof Download PDFInfo
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Abstract
The invention discloses low-dielectric-constant low-loss easily-electroplated plastic, and a preparation method and application thereof, and belongs to the field of electroplated plastics. Comprises the following components: 30-40% of polypropylene, 10-20% of polystyrene, 5-10% of hydrogenated styrene-butadiene block copolymer, 1-3% of stearic acid and 30-50% of ceramic powder; the plastic particles are produced by low-temperature secondary homogenization and blending, and then the plastic pieces to be electroplated are manufactured by injection molding or compression molding. According to the invention, the specially-prepared tungstate ceramic powder is added, so that the linear expansion coefficient of the plastic is close to that of metal; by using the titanium acid-based ceramic modifier, the compounding formula of the ceramic modifier is optimized, and the proportion of metal cations is adjusted, so that the dielectric constant of the product is kept stable in the use temperature range and in the range of 600MHz to 18 GHz.
Description
Technical Field
The invention belongs to the field of electroplated plastics, and particularly relates to low-dielectric-constant low-loss easily-electroplated plastic, and a preparation method and application thereof.
Background
At present, the housing of the communication product containing the antenna has two structures: 1. a full plastic structure; 2. the antenna part is made of non-metal materials such as plastic and glass fiber reinforced plastic, and the other part is made of metal materials. The structural mode of using all plastic materials mainly has the following points: 1. wave-transparent factors: the structure part covering the antenna is required to be made of non-metal materials, otherwise, electromagnetic waves cannot be radiated; 2. cost considerations: the plastic shell has high production efficiency and good consistency of mass production, and is suitable for mass production of civil products; 3. the weight factors are as follows: the specific gravity of the plastic material is only 50% -60% of that of the aluminum alloy material, and the plastic material is used as the shell, so that the weight of the product can be reduced excellently, and the transportation and the use are convenient. Typical products are mobile phones, notebook computers, home routers, etc.
The solution using an all-plastic housing also has drawbacks: ordinary plastics can not electrically conduct heat conduction, for the communication product that the consumption is great or electromagnetic shielding performance requires highly, use ordinary plastics can't solve heat dissipation and electromagnetic shielding's problem. Therefore, the communication product with high power consumption and high electromagnetic shielding can adopt a combination scheme of plastic and metal as a shell, namely, the part covering the antenna is made of non-metal materials such as plastic and glass fiber reinforced plastic, and the other parts are made of metal materials. There are also two drawbacks to this composite structure: 1. the difficulty of production and processing is high, so that the production efficiency is reduced, and the cost is increased; 2. the weight of the product is increased, and the use is inconvenient; 3. the appearances of the two materials are difficult to be consistent, and the overall appearance effect of the product is influenced.
Disclosure of Invention
The purpose of the invention is as follows: provides a low-dielectric-constant low-loss easy-electroplating plastic, a preparation method and application thereof, which aim to solve the problems involved in the background technology.
The technical scheme is as follows: the invention provides a preparation method of low-dielectric-constant low-loss easily-electroplated plastic, which comprises the following components in percentage by mass:
30-40% of polypropylene, 10-20% of polystyrene, 5-10% of hydrogenated styrene-butadiene block copolymer, 1-3% of stearic acid and 30-50% of ceramic powder;
mixing the components according to a ratio, carrying out low-temperature secondary homogenization and blending processing to produce plastic particles, and then carrying out injection molding or compression molding to prepare a plastic part; then in the activating solution, the target product is obtained through electroplating surface sensitization treatment.
As a preferable scheme, the ceramic powder is tungstate ceramic powder.
As a preferred embodiment, the tungstate ceramic powder has the following general formula:
wherein x: y = 1: (4-8).
As a preferred scheme, the preparation method of the tungstate ceramic powder comprises the following steps: slowly adding 5-10 ml of 0.5mol/L La-containing solution, 40-75 ml of 0.5mol/L Zr-containing solution and 80-150 ml of 0.5mol/L W-containing solution into 20-50 ml of deionized water at room temperature under the stirring condition, and continuously stirring for 8-12 h; then adding hydrochloric acid with the concentration of 5-8 mol/L, and fractionating the mixture for two days; and (3) after fractionation, standing for 3 weeks to gelatinize the tungstate, pouring out supernatant, filtering, washing, drying in an oven at 60-90 ℃, heating at 500-700 ℃ for 8-12 hours to obtain single-phase ceramic, and grinding to obtain the filler, namely the tungstate ceramic powder.
As a preferred scheme, the activating solution TiCl3The preparation process of the solution comprises the following steps: 50-80 g TiCl340-80 ml of 35% hydrochloric acid dissolved in 800-1000 ml of H2And O, preparing an activating solution.
As a preferable scheme, the sensitization temperature of the electroplating surface sensitization treatment is 25 ℃, and the sensitization time is 2-5 min.
The invention also provides low-dielectric-constant low-loss easily-electroplated plastic which comprises the following components in percentage by mass: 30-40% of polypropylene, 10-20% of polystyrene, 5-10% of hydrogenated styrene-butadiene block copolymer, 1-3% of stearic acid and 30-50% of ceramic powder.
The invention also provides application of the low-dielectric-constant low-loss easily-electroplated plastic in preparation of a shell of a communication product.
Has the advantages that: the invention relates to a low-dielectric-constant low-loss easy-to-electroplate plastic, a preparation method and application thereof, compared with the prior art, the plastic has the following advantages:
1. by the targeted improvement of the plastic formula, the specially customized tungstate ceramic powder is specially added in addition to the conventional glass fiber as an expansion coefficient regulator, so that the linear expansion coefficient of the plastic is close to that of metal;
2. by using the titanium acid based ceramic modifier, the dielectric constant of the product is greatly improved on the premise of ensuring that the tangent angle loss is not increased, and the dielectric constant of the product is kept stable in the use temperature range and the range from 600MHz to 18GHz by optimizing the compounding formula of the ceramic modifier and adjusting the proportion of metal cations;
3. by adding the easily-oxidized additive into the plastic raw material formula, the required oxidation energy is greatly reduced, and the plastic is easily electroplated.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the invention.
The solution of using an all-plastic housing as the housing of the communication product has the following drawbacks: ordinary plastics can not electrically conduct heat conduction, for the communication product that the consumption is great or electromagnetic shielding performance requires highly, use ordinary plastics can't solve heat dissipation and electromagnetic shielding's problem. The electroplating treatment is an effective method for solving the problems of electromagnetic shielding and heat conduction of common plastics, but the reliability problem can occur when the common plastics are directly electroplated: the linear expansion coefficient of the plastic is greatly different from that of the metal, and the plastic and the metal coating thereof can be stripped due to long-term expansion with heat and contraction with cold in certain areas with large environmental temperature change.
The linear expansion coefficient of the plastic is larger than that of the metal, and the plastic formula is improved in a targeted manner in consideration of the firmness of a metal coating, and specially customized tungstate ceramic powder is added besides the conventional glass fiber serving as an expansion coefficient regulator. The preparation method comprises the following steps: slowly adding 5-10 ml of 0.5mol/L La-containing solution, 40-75 ml of 0.5mol/L Zr-containing solution and 80-150 ml of 0.5mol/L W-containing solution into 20-50 ml of deionized water at room temperature under the stirring condition, and continuously stirring for 8-12 h; then adding hydrochloric acid with the concentration of 5-8 mol/L, and fractionating the mixture for two days; after fractionation, standing for 3 weeks to gelatinize the mixture, then pouring out supernatant, drying the supernatant in an oven at 60-90 ℃ after filtration and washing, and then heating the supernatant at 500-700 ℃ for 8-12 hours to obtain single-phase
And grinding the ceramic to obtain the filler, namely the tungstate ceramic powder. Because the linear expansion coefficient of the ceramic powder is infinitely close to zero within the use temperature range of the product, the comprehensive linear expansion coefficient of the ceramic powder is greatly reduced, and the final expansion coefficient is
To
Between aluminum alloy and copper.
According to the invention, the easily-oxidizable additive is added into the plastic raw material formula, and a large amount of free radicals are generated under the combined action of the fatty acid in the rare earth metal La compound formula in the ceramic powder, so that the required oxidation energy is greatly reduced, and the modified plastic is easier to electroplate. The special activating liquid is specially prepared according to the requirements of final products in the electroplating surface sensitization treatment process, and the formula of the activating liquid is as follows: 50-80 g TiCl340-80 ml of 35% hydrochloric acid dissolved in 800-1000 ml of H2And O, preparing an activating solution. Wherein the activating solution is TiCl3In addition to meeting normal plating requirements, the method also meets the requirements of normal electroplatingConsidering that other impurity oxides are not introduced subsequently, the dielectric constant is influenced.
In addition, the plastic structure and the plastic structure are common to each other, and the plastic is required to be used for the antenna covering part. The plastics commonly used at present are PC, ABS, nylon, etc., and the dielectric constant and the loss tangent of these commonly used materials vary with the frequency, for example, the PC material has a dielectric constant of 2.6 and a loss tangent of 0.002 when measured at a frequency of 1MHz, and has a dielectric constant of 2.9 and a loss tangent of 0.008 when measured at a frequency of 1 GHz. Such variations have a serious adverse effect on the antenna radiation performance of broadband communication products. The dielectric constant of the conventional plastic product can obviously float upwards along with the increase of frequency, so that the dielectric constant of the product is greatly improved on the premise of ensuring that the tangent angle loss is not increased by adding the titanate-based ceramic modifier, and the ratio of metal cations is adjusted by optimizing the compound formula of the ceramic modifier, so that the dielectric constant of the product in the use temperature range is basically kept unchanged within the range of 600MHz to 18GHz, and the fluctuation in the band is not more than +/-2%.
The invention will now be further described with reference to the following examples, which are intended to be illustrative of the invention and are not to be construed as limiting the invention.
Example 1
A preparation method of low-dielectric-constant low-loss easily-electroplated plastic comprises the following steps:
preparing tungstate ceramic powder: slowly adding 5ml of La-containing solution, 50ml of Zr-containing solution and 100ml of W-containing solution (the concentration is 0.5 mol/L) into 25ml of water at room temperature under the stirring condition, and continuously stirring for 10 hours; then adding hydrochloric acid with the concentration of 6mol/L, and fractionating the mixture for two days; fractionating, standing for 3 weeks to gelatinize, pouring out supernatant, filtering, washing, oven drying at 80 deg.C, and heating at 600 deg.C for 10 hr to obtain single phase
Ceramic materialAnd grinding to obtain the filler, namely the tungstate ceramic powder.
Forming a plastic part: the composition comprises the following components in percentage by mass: PPE (polypropylene) 35%, PS (polystyrene) 15%, SEBS (hydrogenated styrene-butadiene block copolymer) 8%, stearic acid 2%, and tungstate ceramic powder 40%, mixing the components, homogenizing and blending at low temperature twice to produce plastic particles, and then performing injection molding or compression molding to obtain the plastic part.
Electroplating treatment: soaking the plastic part after the coarsening and the water washing in TiCl3In the activating solution, the sensitization temperature is 25 ℃, and the sensitization time is 5 min. Wherein, the TiCl3The preparation process of the activating solution comprises the following steps: 60g of TiCl is added3And 50ml of 35% by mass hydrochloric acid dissolved in 950ml of H2And O, preparing an activating solution. Then in the activating solution, the target product is obtained through electroplating surface sensitization treatment. Having a coefficient of expansion of
To
Between aluminum alloy and copper.
Example 2
A preparation method of low-dielectric-constant low-loss easily-electroplated plastic comprises the following steps:
preparing tungstate ceramic powder: slowly adding 5ml of La-containing solution, 50ml of Zr-containing solution and 100ml of W-containing solution (the concentration is 0.5 mol/L) into 25ml of water at room temperature under the stirring condition, and continuously stirring for 10 hours; then adding hydrochloric acid with the concentration of 6mol/L, and fractionating the mixture for two days; fractionating, standing for 3 weeks to gelatinize, pouring out supernatant, filtering, washing, oven drying at 80 deg.C, and heating at 600 deg.C for 10 hr to obtain single phase
And grinding the ceramic to obtain the filler, namely the tungstate ceramic powder.
Forming a plastic part: the composition comprises the following components in percentage by mass: PPE (polypropylene) 40%, PS (polystyrene) 20%, SEBS (hydrogenated styrene-butadiene block copolymer) 7%, stearic acid 3%, and tungstate ceramic powder 30%, mixing the components, homogenizing and blending at low temperature twice to produce plastic particles, and then performing injection molding or compression molding to obtain the plastic part.
Electroplating treatment: soaking the plastic part after the coarsening and the water washing in TiCl3In the activating solution, the sensitization temperature is 25 ℃, and the sensitization time is 5 min. Wherein, the TiCl3The preparation process of the activating solution comprises the following steps: 60g of TiCl is added3And 50ml of 35% by mass hydrochloric acid dissolved in 950ml of H2And O, preparing an activating solution. Then in the activating solution, the target product is obtained through electroplating surface sensitization treatment. Having a coefficient of expansion of
To
Between aluminum alloy and copper.
Example 3
A preparation method of low-dielectric-constant low-loss easily-electroplated plastic comprises the following steps:
preparing tungstate ceramic powder: slowly adding 5ml of La-containing solution, 50ml of Zr-containing solution and 100ml of W-containing solution (the concentration is 0.5 mol/L) into 25ml of water at room temperature under the stirring condition, and continuously stirring for 10 hours; then adding hydrochloric acid with the concentration of 6mol/L, and fractionating the mixture for two days; fractionating, standing for 3 weeks to gelatinize, pouring out supernatant, filtering, washing, oven drying at 80 deg.C, and heating at 600 deg.C for 10 hr to obtain single phase
And grinding the ceramic to obtain the filler, namely the tungstate ceramic powder.
Forming a plastic part: the composition comprises the following components in percentage by mass: 30% of PPE (polypropylene), 10% of PS (polystyrene), 9% of SEBS (hydrogenated styrene-butadiene block copolymer), 1% of stearic acid and 50% of tungstate ceramic powder, mixing the components, carrying out low-temperature secondary homogenization and blending processing to produce plastic particles, and then carrying out injection molding or compression molding to prepare the plastic part.
Electroplating treatment: soaking the plastic part after the coarsening and the water washing in TiCl3In the activating solution, the sensitization temperature is 25 ℃, and the sensitization time is 5 min. Wherein, the TiCl3The preparation process of the activating solution comprises the following steps: 60g of TiCl is added3And 50ml of 35% by mass hydrochloric acid dissolved in 950ml of H2And O, preparing an activating solution. Then in the activating solution, the target product is obtained through electroplating surface sensitization treatment. Having a coefficient of expansion of
To
Between aluminum alloy and copper.
Example 4
A preparation method of low-dielectric-constant low-loss easily-electroplated plastic comprises the following steps:
preparing tungstate ceramic powder: slowly adding 50ml of Zr-containing solution and 100ml of W-containing solution (the concentration is 0.5 mol/L) into 25ml of water at the same time under the conditions of room temperature and stirring, and continuously stirring for 10 hours; then adding hydrochloric acid with the concentration of 6mol/L, and fractionating the mixture for two days; fractionating, standing for 3 weeks to gelatinize, pouring out supernatant, filtering, washing, oven drying at 80 deg.C, and heating at 600 deg.C for 10 hr to obtain single phase
And grinding the ceramic to obtain the filler, namely the tungstate ceramic powder.
Forming a plastic part: the composition comprises the following components in percentage by mass: 30-40% of PPE (polypropylene), 10-20% of PS (polystyrene), 5-10% of SEBS (hydrogenated styrene-butadiene block copolymer), 1-3% of tungstate stearic acid and 30-50% of ceramic powder, wherein the components are mixed, subjected to low-temperature secondary homogenization and blending processing to produce plastic particles, and then subjected to injection molding or compression molding to form the plastic part.
Electroplating treatment: soaking the plastic part after the coarsening and the water washing in TiCl3In the activating solution, the sensitization temperature is 50 ℃, and the sensitization time is 5 min. Wherein, the TiCl3The preparation process of the activating solution comprises the following steps: 60g of TiCl is added3And 50ml of 35% by mass hydrochloric acid dissolved in 950ml of H2And O, preparing an activating solution. Then in the activating solution, the target product is obtained through electroplating surface sensitization treatment. Having a coefficient of expansion of
To
Between aluminum alloy and copper.
Example 5
A preparation method of low-dielectric-constant low-loss easily-electroplated plastic comprises the following steps:
preparing tungstate ceramic powder: slowly adding 5ml of La-containing solution, 50ml of Zr-containing solution and 100ml of W-containing solution (the concentration is 0.5 mol/L) into 25ml of water at room temperature under the stirring condition, and continuously stirring for 10 hours; then adding hydrochloric acid with the concentration of 6mol/L, and fractionating the mixture for two days; fractionating, standing for 3 weeks to gelatinize, pouring out supernatant, filtering, washing, oven drying at 80 deg.C, and heating at 600 deg.C for 10 hr to obtain single phase
And grinding the ceramic to obtain the filler, namely tungstate ceramic powder.
Forming a plastic part: the composition comprises the following components in percentage by mass: PPE (polypropylene) 35%, PS (polystyrene) 15%, SEBS (hydrogenated styrene-butadiene block copolymer) 10%, tungstate ceramic powder 40%, mixing the components, carrying out low-temperature secondary homogenization and blending processing to produce plastic particles, and carrying out injection molding or compression molding to prepare the plastic part.
Electroplating treatment: soaking the plastic part after the coarsening and the water washing in TiCl3In the activating solution, the sensitization temperature is 50 ℃, and the sensitization time is 12 min. Wherein, the TiCl3The preparation process of the activating solution comprises the following steps: 60g of TiCl is added3And 50ml of 35% by mass hydrochloric acid dissolved in 950ml of H2And O, preparing an activating solution. Then in the activating solution, the target product is obtained through electroplating surface sensitization treatment. Having a coefficient of expansion of
To
Between aluminum alloy and copper.
Example 6
A preparation method of low-dielectric-constant low-loss easily-electroplated plastic comprises the following steps:
preparing tungstate ceramic powder: slowly adding 5ml of La-containing solution, 50ml of Zr-containing solution and 100ml of W-containing solution (the concentration is 0.5 mol/L) into 25ml of water at room temperature under the stirring condition, and continuously stirring for 10 hours; then adding hydrochloric acid with the concentration of 6mol/L, and fractionating the mixture for two days; fractionating, standing for 3 weeks to gelatinize, pouring out supernatant, filtering, washing, oven drying at 80 deg.C, and heating at 600 deg.C for 10 hr to obtain single phase
And grinding the ceramic to obtain the filler, namely the tungstate ceramic powder.
Forming a plastic part: the composition comprises the following components in percentage by mass: PPE (polypropylene) 35%, PS (polystyrene) 15%, SEBS (hydrogenated styrene-butadiene block copolymer) 8%, stearic acid 2%, and tungstate ceramic powder 40%, mixing the components, homogenizing and blending at low temperature twice to produce plastic particles, and then performing injection molding or compression molding to obtain the plastic part.
Electroplating treatment: soaking the plastic part after the coarsening and the water washing in TiCl3In the activating solution, the sensitization temperature is 25 ℃, and the sensitization time is 5 min. Wherein, the SnCl4The preparation process of the activating solution comprises the following steps: 100g of SnCl4And 50ml of 35% by mass hydrochloric acid dissolved in 950ml of H2And O, preparing an activating solution. Then in the activating solution, the target product is obtained through electroplating surface sensitization treatment. Having a coefficient of expansion of
To
Between aluminum alloy and copper.
Example of detection
The target products from examples 1, 4, 5 and 6 were tested for performance at the institute for antenna and electromagnetic scattering at the university of iegan electronics and technology, according to the test standards of GJB 1651A-2013-method 5012, and the specific test results are given in the following table:
from the above table, it can be seen that the dielectric constant and the loss tangent of the obtained products in examples 1, 4, 5 and 6 are less varied with frequency and substantially maintained constant in the range of 600MHz to 18 GHz; in particular, example 1 gave a product whose dielectric constant and loss tangent did not fluctuate by more than. + -. 2% in the variation with frequency.
It should be noted that the various features described in the above embodiments may be combined in any suitable manner without departing from the scope of the invention. The invention is not described in detail in order to avoid unnecessary repetition.
Claims (8)
1. The preparation method of the low-dielectric-constant low-loss easily-electroplated plastic is characterized by comprising the following components in percentage by mass:
30-40% of polypropylene, 10-20% of polystyrene, 5-10% of hydrogenated styrene-butadiene block copolymer, 1-3% of stearic acid and 30-50% of ceramic powder;
mixing the components according to a ratio, carrying out low-temperature secondary homogenization and blending processing to produce plastic particles, and then carrying out injection molding or compression molding to prepare a plastic part; then in the activating solution, the target product is obtained through electroplating surface sensitization treatment.
2. The method for preparing a low dielectric constant, low loss and easy electroplating plastic according to claim 1, wherein the ceramic powder is tungstate ceramic powder.
3. The method for preparing a low dielectric constant, low loss and easy electroplating plastic according to claim 2, wherein the tungstate ceramic powder has the following general formula:
wherein x: y = 1: (4-8).
4. The method for preparing the low dielectric constant, low loss and easy-to-electroplate plastic as claimed in claim 2, wherein the tungstate ceramic powder is prepared by the following steps: slowly adding 5-10 ml of 0.5mol/L La-containing solution, 40-75 ml of 0.5mol/L Zr-containing solution and 80-150 ml of 0.5mol/L W-containing solution into 20-50 ml of deionized water at room temperature under the stirring condition, and continuously stirring for 8-12 h; then adding hydrochloric acid with the concentration of 5-8 mol/L, and fractionating the mixture for two days; and (3) after fractionation, standing for 3 weeks to gelatinize the tungstate, pouring out supernatant, filtering, washing, drying in an oven at 60-90 ℃, heating at 500-700 ℃ for 8-12 hours to obtain single-phase ceramic, and grinding to obtain the filler, namely tungstate ceramic powder.
5. The method for preparing low dielectric constant, low loss and easy-to-electroplate plastic as claimed in claim 1, wherein the activating solution TiCl is3The preparation process of the solution comprises the following steps: 50-80 g TiCl340-80 ml of 35% hydrochloric acid dissolved in 800-1000 ml of H2And O, preparing an activating solution.
6. The method for preparing the low dielectric constant, low loss and easy electroplating plastic as claimed in claim 1, wherein the sensitization temperature of the electroplating surface sensitization treatment is 25 ℃, and the sensitization time is 2-5 min.
7. The plastic prepared by the preparation method of the low-dielectric-constant low-loss easy-electroplating plastic as claimed in any one of claims 1-6 is characterized by comprising the following components in percentage by mass: 30-40% of polypropylene, 10-20% of polystyrene, 5-10% of hydrogenated styrene-butadiene block copolymer, 1-3% of stearic acid and 30-50% of ceramic powder.
8. Use of the low dielectric constant, low loss, easy-to-plate plastic of claim 7 in the manufacture of housings for telecommunications products.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1989008088A1 (en) * | 1988-02-26 | 1989-09-08 | Allied-Signal Inc. | Fully dense alumina ceramic composite reinforced by surface-zirconated alumina fibers |
| JP2006210044A (en) * | 2005-01-26 | 2006-08-10 | Toray Ind Inc | Photosensitive dielectric paste and manufacturing method of electronic circuit component using it |
| CN1935926A (en) * | 2006-09-22 | 2007-03-28 | 清华大学 | High-heat-conductance electronic packaging material and its preparing method |
| CN103387704A (en) * | 2013-08-02 | 2013-11-13 | 清华大学 | Ceramic-polymer composite microwave material as well as preparation method and application methods thereof |
| CN104098845A (en) * | 2014-06-27 | 2014-10-15 | 广东威林工程塑料有限公司 | Electroplating polypropylene material coarsened by hydrochloric acid solution and preparation method thereof |
| CN109807327A (en) * | 2019-03-12 | 2019-05-28 | 株洲卓然新材料有限公司 | A kind of coating nanometer silicon carbide whiskers toughening Ti (C, N) base metal-ceramic material and preparation method thereof |
-
2020
- 2020-03-09 CN CN202010157631.XA patent/CN111253685A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1989008088A1 (en) * | 1988-02-26 | 1989-09-08 | Allied-Signal Inc. | Fully dense alumina ceramic composite reinforced by surface-zirconated alumina fibers |
| JP2006210044A (en) * | 2005-01-26 | 2006-08-10 | Toray Ind Inc | Photosensitive dielectric paste and manufacturing method of electronic circuit component using it |
| CN1935926A (en) * | 2006-09-22 | 2007-03-28 | 清华大学 | High-heat-conductance electronic packaging material and its preparing method |
| CN103387704A (en) * | 2013-08-02 | 2013-11-13 | 清华大学 | Ceramic-polymer composite microwave material as well as preparation method and application methods thereof |
| CN104098845A (en) * | 2014-06-27 | 2014-10-15 | 广东威林工程塑料有限公司 | Electroplating polypropylene material coarsened by hydrochloric acid solution and preparation method thereof |
| CN109807327A (en) * | 2019-03-12 | 2019-05-28 | 株洲卓然新材料有限公司 | A kind of coating nanometer silicon carbide whiskers toughening Ti (C, N) base metal-ceramic material and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 谢修好等: "《负热膨胀材料钨酸锆研究进展》", 《合成材料老化与应用》 * |
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