CN111240378A - Variable temperature control system and temperature control method suitable for frozen soil test - Google Patents
Variable temperature control system and temperature control method suitable for frozen soil test Download PDFInfo
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/02—Investigating or analyzing materials by the use of thermal means by investigating changes of state or changes of phase; by investigating sintering
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/02—Investigating or analyzing materials by the use of thermal means by investigating changes of state or changes of phase; by investigating sintering
- G01N25/12—Investigating or analyzing materials by the use of thermal means by investigating changes of state or changes of phase; by investigating sintering of critical point; of other phase change
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
- G01N3/18—Performing tests at high or low temperatures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/022—Environment of the test
- G01N2203/0222—Temperature
- G01N2203/0224—Thermal cycling
Abstract
The invention discloses a variable temperature control system and a temperature control method suitable for frozen soil tests. The temperature control system uses the semiconductor wafer as a cold source to replace the traditional cold bath refrigeration, overcomes the problem of low temperature change control precision caused by temperature loss and temperature control lag commonly existing in the mechanical refrigeration technology, effectively controls the volume of equipment and reduces the cost of test equipment; the system can realize the temperature control targets of high-precision linear temperature control, sine temperature control, combined temperature control and the like, and can be widely applied to various frozen soil test instruments, such as a frozen triaxial instrument, a frozen direct shear instrument, a frozen swelling instrument and the like.
Description
Technical Field
The invention belongs to the field of program temperature control systems, and particularly relates to a variable temperature control system and a temperature control method suitable for a frozen soil test.
Background
The frozen soil test is a basic test for guiding frozen soil engineering, such as a freeze-thaw characteristic test, a freezing temperature test, a frozen soil strength test and the like, and plays a key role in evaluating the bearing capacity of a frozen soil field and the stability of a frozen soil side slope or other structures. For the test equipment, the temperature control system is a core component for ensuring the quality of test data. The temperature control system of the current frozen soil test device mostly uses a mechanical refrigeration technology represented by a compressor, but the refrigeration technology has the problems of large equipment volume, high cost, large temperature control difficulty and insufficient temperature control precision, and particularly has the problems of temperature loss, temperature control lag and the like caused by the fact that the mechanical refrigeration needs a heat transfer medium under the condition of variable temperature control. Therefore, the novel refrigeration technology is applied to the frozen soil test, and the research and development of the novel high-precision variable-temperature control system applicable to the frozen soil test is a problem to be solved urgently in the field of the current frozen soil test.
In the frozen soil test, the core part of the temperature control system which is widely adopted at present is a compressor, the temperature control medium is cooling liquid such as alcohol, glycol and the like, and the temperature control process is as follows: (1) setting a target temperature; (2) the temperature sensor monitors the temperature of the cooling liquid and transmits data back to the temperature controller; the temperature controller determines the output power of the compressor according to the target temperature and the monitoring temperature; (3) the compressor is operated at the power determined by the temperature controller until the target temperature is reached. Through the whole temperature control process, the whole temperature control system can be found to indirectly control the temperature of the sample by controlling the temperature of the temperature control medium, namely, the temperature sensor monitors the temperature of the cooling liquid instead of the temperature of the sample. Temperature loss exists in the pumping process of cooling liquid, and response lag exists in the indirect temperature control process in the temperature changing control process, so that large temperature control errors are brought, and the quality of test data is influenced. Therefore, it is necessary to improve the temperature control technology to avoid the problems of temperature loss and temperature-varying control lag of the existing temperature control technology.
In addition, similar temperature control devices are also available in the fields of biological and chemical tests, and the refrigeration technology used comprises mechanical refrigeration (such as compressor refrigeration) and semiconductor refrigeration. Among them, semiconductor refrigeration is an emerging refrigeration technology. Compared with the traditional cooling liquid refrigeration technology, the semiconductor refrigeration technology can effectively avoid the problem that mechanical refrigeration depends on medium for indirect temperature control, thereby avoiding temperature loss and temperature change control response lag in the temperature control process. However, the test environment in the field of biological and chemical tests is mostly constant temperature environment, and the constructed semiconductor refrigeration temperature control system is mostly suitable for constant temperature control. Therefore, the temperature-variable control system for the frozen soil test can greatly promote the improvement of the frozen soil test level by combining the semiconductor refrigeration technology with the temperature-variable control algorithm.
From the above analysis, the disadvantages of the temperature control technology in the existing frozen soil test include: (1) the problem that temperature loss is caused due to the fact that a temperature control medium is needed in the temperature control process of mechanical refrigeration is solved, for example, in a literature, "experimental research on the one-way freezing and cooling structure development and frost heaving development process of Qinghai-Tibet powdery clay" (Wang Yong, Wang great Yan, Ma Wei, and the like; experimental research on the one-way freezing and cooling structure development and frost heaving development process of Qinghai-Tibet powdery clay [ J ]. rock and soil mechanics, 2016,37(5)) records that the device disclosed in patent 201310216526.9 is used, when the set temperature is-13 ℃, the actually achieved temperature is only-9.88 ℃, and the temperature loss reaches 24%, so that uncontrollable errors are brought to the test result; (2) the cost and the energy consumption of the current test device are high. Taking the frost heaving characteristic test of the soil body as an example, if mechanical refrigeration is used, two low-temperature cooling liquid circulating pumps and a constant temperature box are needed, and the test cost of the temperature control device which achieves the temperature control precision of +/-0.1 ℃ exceeds 20W yuan. In addition, in the test process, because the cooling liquid is used for indirectly controlling the temperature, most of refrigeration power is used for maintaining the temperature of the cooling liquid, but the refrigeration power is not effectively used for controlling the temperature of the sample, so that the test energy consumption is large; (3) the temperature changing capability of the current test equipment is insufficient, and the temperature changing control precision is generally low. On one hand, the temperature control of mechanical refrigeration has larger response lag in the temperature change control process, and on the other hand, the temperature change control capability of other refrigeration technologies (such as a semiconductor refrigeration technology) cannot be effectively developed and applied to the field of frozen soil tests.
Disclosure of Invention
In order to solve the problems of insufficient temperature change control capability, temperature loss, delayed temperature change response, high energy consumption, high cost and the like of the current temperature control system for the frozen soil test, the invention provides a temperature change control system and a temperature control method suitable for the frozen soil test, which are realized by the following technical scheme:
a temperature-changing control system suitable for frozen soil tests comprises a temperature-controlling execution system (1), a temperature-controlling operation system (2) and a cooling water supply system (3);
the temperature control execution system (1) comprises a semiconductor refrigeration chip (4), a cold storage block (5) and a water cooling head (6), wherein the semiconductor refrigeration chip (4) comprises a cold surface and a hot surface, and the cold surface and the hot surface of the semiconductor refrigeration chip (4) are respectively attached to the cold storage block (5) and the water cooling head (6);
the temperature control operating system (2) comprises an upper computer (7), a lower computer (8), a power supply (9) and a temperature sensor (10), wherein the upper computer (7) and the lower computer (8) are connected through a data line (13), the semiconductor refrigeration chip (4) is electrically connected with the lower computer (8), the temperature sensor (10) is connected with the lower computer (8) through a signal line (11), and the power supply (9) is connected with the lower computer (8) through a power line (12);
the cooling water supply system (3) comprises a water storage tank (15), a water pump (16), a water delivery pipe (17), a cooling water temperature control coil (18), a refrigerator (19) and a cooling liquid delivery pipe (14), wherein the water pump (16) and the cooling water temperature control coil (18) are arranged in the water storage tank (15), the water pump (16) is connected with the water cooling head (6) through the water delivery pipe (17), and the cooling water temperature control coil (18) is connected with the refrigerator (19) through the cooling liquid delivery pipe (14).
Furthermore, the cold surface and the hot surface of the semiconductor refrigeration chip (4) are adhered to the cold storage block (5) and the water cooling head (6) by uniformly coating silicone grease on the surfaces.
Further, the semiconductor refrigeration chip (4) is in one of a rectangular shape, a circular shape and a circular ring shape.
A temperature control method suitable for a frozen soil test specifically comprises the following steps:
the method comprises the following steps that a cold surface and a hot surface of a semiconductor refrigeration chip (4) are respectively attached to a cold storage block (5) and a water cooling head (6), an upper computer (7) and a lower computer (8) are connected through a data line (13), the semiconductor refrigeration chip (4) is electrically connected with the lower computer (8), a temperature sensor (10) is connected with the lower computer (8) through a signal line (11), a power supply (9) is connected with the lower computer (8) through a power line (12), a water pump (16) and a cooling water temperature control coil (18) are arranged in a water storage tank (15), the water pump (16) is connected with the water cooling head (6) through a water conveying pipe (17), and the cooling water temperature control coil (18) is connected with a refrigerator (19) through a cooling liquid conveying pipe (14).
Step b, setting a control parameter F (phi) of a PID control algorithm in an upper computer (7), generating an initial parameter of the single-node neural network through a random matrix R (delta), editing a temperature control time course function T (t), and transmitting the F (phi), the R (delta) and the T (t) to a lower computer (8);
c, the lower computer (8) collects t of the temperature control object through the temperature control probekTemperature data at time T0 (T)k) According to the instruction of the upper computer (7), the collected temperature and the set temperature T (T)k) Inputting the sum error delta T into a single-node neural network, optimizing and adjusting a control parameter F (phi) of a PID control algorithm by the single-node neural network, inputting the optimized control parameter F' (phi) into the PID control algorithm, and then executing PID temperature control calculation to obtain TkRegulated power u (t) at timek) And according to the regulated power u (t)k) Controlling the output voltage V (t) of the refrigeration chipk)；
D, the temperature control execution system (1) realizes real-time adjustment of refrigeration and heat production under the voltage control of the lower computer (8), the step c is repeatedly executed when the error is larger than the allowable error range, and the step e is executed when the error is smaller than the allowable error range;
step e, executing the next time tk+1And (c) calculating the temperature control, and repeating the steps (b) to (c).
Further, the PID control function u (k) takes an incremental form:
Δu(k)＝kp(e(k)-e(k-1))+kie(k)+kd(e(k)-2e(k-1)+e(k-2))
further, the single-node neural network adopts a supervised Hebb learning rule: Δ ωij(k)＝η(dj(k)-oj(k))oj(k)oi(k) Wherein, Δ ωij(k) Is the weight coefficient between the i neuron and the j neuron,η is learning efficiency, dj(k) Is a target value at time k, oj(k) For an input value at time k, oi(k) The value is output for time k.
Further, the control algorithm of the PID combined with the single-node neural network is:
the self-regulation coefficient of the neural network is as follows:
ω1(k)＝ω1(k-1)+η1e(k)u(k)(e(k)+Δe(k))，
ω2(k)＝ω2(k-1)+η2e(k)u(k)(e(k)+Δe(k))，
ω3(k)＝ω3(k-1)+η3e(k)u(k)(e(k)+Δe(k))，
wherein K is a neuron weight adjustment scaling factor, η1For learning efficiency of the scaling term, η2To integrate the learning efficiency of the adjustment term, η3For the learning efficiency of the differential adjustment term, x1(k)＝e(k)，x2(k)＝e(k)-e(k-1)，x3(k)＝e(k)-2e(k-1)+e(k-2)。
The invention has the beneficial effects that: compared with the existing frozen soil test temperature control system, the temperature control system of the invention uses the semiconductor wafer as a cold source to replace the traditional cold bath refrigeration, overcomes the problem of low temperature change control precision caused by temperature loss and temperature control lag commonly existing in the mechanical refrigeration technology, effectively controls the volume of equipment and reduces the cost of test equipment; meanwhile, the single-node neural network algorithm is introduced on the basis of the common PID temperature control algorithm, and the single-node neural network has the advantages of simple structure and high operation efficiency, so that the robustness of the algorithm is ensured while the temperature control precision and the temperature control efficiency of the PID control algorithm are greatly improved (the temperature change control precision can reach +/-0.01 ℃, and the temperature overshoot of the temperature change amplitude of 1 ℃ is only 0.05 ℃), and the temperature control precision and the stability of a temperature control system are improved. The system can realize the temperature control targets of high-precision linear temperature control, sine temperature control, combined temperature control and the like, and can be widely applied to various frozen soil test instruments, such as a frozen triaxial instrument, a frozen direct shear instrument, a frozen swelling instrument and the like.
Drawings
FIG. 1 is a diagram of a temperature change control system of the present invention;
FIG. 2 is a diagram of a temperature control execution system according to the present invention;
FIG. 3 is a diagram of a temperature controlled operating system according to the present invention;
FIG. 4 is a diagram of a cooling water supply system according to the present invention;
FIG. 5 is a topology structure diagram of a single node neural network of the present invention;
fig. 6 is a diagram of a temperature change control system according to embodiment 2 of the present invention;
FIG. 7 shows the set temperature of the top temperature control execution system in accordance with embodiment 2 of the present invention;
FIG. 8 is a graph showing the output temperature of the top temperature control execution system in accordance with embodiment 2 of the present invention;
FIG. 9 shows the set temperature of the bottom temperature control execution system in embodiment 2 of the present invention;
FIG. 10 is a graph showing the output temperature of the bottom temperature control execution system in accordance with embodiment 2 of the present invention;
wherein the reference numerals are: the system comprises a temperature control execution system 1, a temperature control operation system 2, a cooling water supply system 3, a semiconductor refrigeration chip 4, a cold storage block 5, a water cooling head 6, an upper computer 7, a lower computer 8, a power supply 9, a temperature sensor 10, a signal line 11, a power line 12, a data line 13, a cooling liquid conveying pipe 14, a water storage tank 15, a water pump 16, a water conveying pipe 17, a cooling water temperature control coil 18 and a refrigerator 19.
Detailed Description
The invention will be described below with reference to the accompanying drawings:
example 1
As shown in fig. 1, a variable temperature control system suitable for frozen soil test includes a temperature control execution system 1, a temperature control operation system 2, and a cooling water supply system 3;
as shown in fig. 2, the temperature control execution system 1 includes a semiconductor refrigeration chip 4, a cold storage block 5, and a water cooling head 6, where the semiconductor refrigeration chip 4 includes a cold surface and a hot surface, and the cold surface and the hot surface of the semiconductor refrigeration chip 4 are closely attached to the cold storage block 5 and the water cooling head 6 by changing the current direction;
as shown in fig. 3, the temperature control operating system 2 includes an upper computer 7 as a temperature control program sending component, the upper computer is used to realize editing of various temperature control programs such as sine temperature control, linear temperature control, constant temperature control, combined temperature control and the like, a lower computer 8 is used as a power supply of a semiconductor refrigeration chip, and is a temperature control program executing component, a power supply 9 and a temperature sensor 10, the upper computer 7 and the lower computer 8 are connected through a data line 13, the semiconductor refrigeration chip 4 is electrically connected with the lower computer 8, the temperature sensor 10 is connected with the lower computer 8 through a signal line 11 to realize real-time monitoring of a temperature control target temperature state, and realizes the adjustment of refrigeration power of the temperature control executing system 1 according to the instruction of the upper computer 7 and the PID control algorithm, and the power supply 9 is connected with the lower computer 8 through a;
as shown in fig. 4, the cooling water supply system 3 includes a water storage tank 15, a water pump 16, a water pipe 17, a cooling water temperature control coil 18, a refrigerator 19, and a cooling liquid delivery pipe 14, the water pump 16 and the cooling water temperature control coil 18 are disposed in the water storage tank 15, the water pump 16 is connected to the water cooling head 6 through the water pipe 17, and the cooling water temperature control coil 18 is connected to the refrigerator 19 through the cooling liquid delivery pipe 14.
Furthermore, the cold surface and the hot surface of the semiconductor refrigeration chip 4 are adhered to the cold storage block 5 and the water cooling head 6 by uniformly coating silicone grease on the surfaces.
Further, the semiconductor refrigeration chip 4 is in one of a rectangular shape, a circular shape and a circular ring shape.
A temperature control method suitable for a frozen soil test specifically comprises the following steps:
step a, setting a control parameter F (phi) of a PID control algorithm in an upper computer 7, generating an initial parameter of a single-node neural network through a random matrix R (delta), editing a temperature control time course function T (t), and transmitting the F (phi), the R (delta) and the T (t) to a lower computer 8;
b, the lower computer 8 collects temperature data T0(ti) of a temperature control object at the ti moment through a temperature control probe, inputs the collected temperature, the set temperature T (ti) and the error delta T into a single-node neural network according to the instruction of the upper computer 7, optimizes and adjusts a control parameter F (phi) of a PID control algorithm, inputs the optimized control parameter F' (phi) into the PID control algorithm, then executes PID temperature control calculation to obtain an adjusting power G (ti) at the ti moment, and controls the output voltage V (ti) of a refrigeration chip according to the adjusting power G (ti);
c, the temperature control execution system 1 realizes real-time adjustment of refrigeration and heat production under the voltage control of the lower computer 8, the step b is repeatedly executed when the error is larger than the allowable error range, and the step d is executed when the error is larger than the allowable error range;
and d, executing temperature control calculation of ti +1 at the next moment, and repeating the steps (b) to (c).
Further, the PID control function u (k) takes an incremental form:
Δu(k)＝kp(e(k)-e(k-1))+kie(k)+kd(e(k)-2e(k-1)+e(k-2))
as shown in fig. 5, the single-node neural network employs a supervised Hebb learning rule: Δ ωij(k)＝η(dj(k)-oj(k))oj(k)oi(k) Wherein, Δ ωij(k) Is the weight coefficient between the i neuron and the j neuron, η is the learning efficiency, dj(k) Is a target value at time k, oj(k) For an input value at time k, oi(k) The value is output for time k.
Further, the control algorithm of the PID combined with the single-node neural network is:
the self-regulation coefficient of the neural network is as follows:
ω1(k)＝ω1(k-1)+η1e(k)u(k)(e(k)+Δe(k))，
ω2(k)＝ω2(k-1)+η2e(k)u(k)(e(k)+Δe(k))，
ω3(k)＝ω3(k-1)+η3e(k)u(k)(e(k)+Δe(k))，
wherein K is a neuron weight adjustment scaling factor, η1For learning efficiency of the scaling term, η2To integrate the learning efficiency of the adjustment term, η3For the learning efficiency of the differential adjustment term, x1(k)＝e(k)，x2(k)＝e(k)-e(k-1)，x3(k)＝e(k)-2e(k-1)+e(k-2)。
Example 2
As shown in fig. 6, the application of the variable temperature control system suitable for the frozen soil test in the freeze-thaw test:
the test device comprises a test box, a temperature control execution system 1 at the top of the sample, a sample bottom temperature control execution system 1, a temperature control operation system 2 and a cooling water supply system 3, wherein the sample top temperature control execution system 1 and the sample bottom temperature control execution system 1 comprise a semiconductor refrigeration chip 4, a cold storage block 5 and a water cooling head 6, the semiconductor refrigeration chip 4 comprises a cold surface and a hot surface, and the cold surface and the hot surface of the semiconductor refrigeration chip 4 are tightly attached to the cold storage block 5 and the water cooling head 6 after being uniformly coated with silicone grease; the temperature control operation system 2 comprises an upper computer 7, a lower computer 8, a power supply 9 and a temperature sensor 10, wherein the upper computer 7 is a temperature control program sending part, a sinusoidal temperature control program is edited by the upper computer 7, the lower computer 8 is a power supply of the semiconductor refrigeration chip 4 and is a temperature control program execution component, the temperature sensor 10 is connected with the lower computer 8 through a signal wire 11, the lower computer 8 realizes the real-time monitoring of the temperature control target temperature state through the temperature sensor 10, the refrigeration power of the sample top temperature control execution system 1 and the sample bottom temperature control execution system 1 is adjusted by combining a PID control algorithm according to the instruction of the upper computer 7, the lower computer 8 is connected with the top temperature control execution system 1 and the sample bottom temperature control execution system 1 through a power line 12, the power supply 9 is connected with the lower computer 8 through a power line 11, and the upper computer 7 is connected with the lower computer 8 through a data line 13; the cooling water supply system 3 comprises a water storage tank 15, a water pump 16, a water delivery pipe 17, a cooling water temperature control coil 18, a refrigerator 19 and a cooling liquid delivery pipe 14, wherein the water pump 16 and the cooling water temperature control coil 18 are arranged in the water storage tank 15, the water pump 16 is connected with the water cooling head 6 through the water delivery pipe 17, and the cooling water temperature control coil 18 is connected with the refrigerator 19 through the cooling liquid delivery pipe 14.
During testing, the cold storage block 5 of the top temperature control execution system 1 is tightly attached to the top of the sample, the cold storage block 5 of the bottom temperature control execution system 1 is tightly attached to the bottom of the sample, the tested soil body is kaolin, the liquid limit of the soil body is 56%, the plastic limit is 30%, the plasticity index is 26%, the initial water content of the sample is 35%, and the dry density is 1.8g/cm 3. And uniformly mixing the soil, sealing and placing for 24 hours, and then obtaining a soil sample by adopting a layered filling mode, wherein the filling height is 12 cm. And then, communicating the sample with a Maytit water supplementing device and standing for 48 hours to enable pore water in the soil body to reach a relatively stable state.
The temperature control steps during the test are as follows:
preparation stage 1: the two temperature control execution systems 1 are respectively arranged at the top and the bottom of a soil sample, a cold storage block 5 of the temperature control execution system 1 is tightly attached to the soil sample, a water cooling head 6 is connected with a water pump 16 of a cooling water supply system 3 through a water conveying pipe 17, the water pump 16 is arranged in a water storage tank 15, water in the water storage tank 15 maintains constant temperature through a cooling water temperature control coil 18, and the cooling water temperature control coil 18 is connected with a refrigerating machine 19 through a cooling liquid conveying pipe 14. When the soil sample is manufactured, the temperature sensor 10 is buried in the middle of the soil sample, the temperature sensor 10 is connected with the lower computer 8 of the temperature control operating system 2 through the signal wire 11, and the semiconductor refrigeration chip 4 of the temperature control executing system 1 is connected with the lower computer through the power wire 12. The lower computer 8 is connected with the power supply 9 by a power line 12, and the upper computer 7 is connected with the lower computer 8 by a data line 13.
Preparation stage 2: editing a temperature control time course function in the upper computer 7, wherein the set temperature of the sample top temperature control execution system 1 is T1(T) ═ 3 ℃ sin (2 × pi/24 × T), the set temperature of the sample bottom temperature control execution system 1 is T2(T) ═ 1 ℃, an initial parameter R (delta) of the single-node neural network is generated by a random matrix, and a control parameter F (phi) ([ 0.4) of a PID control algorithm is set; 40; 0.1], and transmitting F (phi), R (delta), T1(T) and T2(T) to a lower computer 8;
and (3) a test stage: (1) the lower computer 8 collects temperature data T0(ti) of a temperature control object at the ti moment through a temperature control probe, inputs the collected temperature, the set temperature T (ti) and the error delta T into a single-node neural network according to an instruction of the upper computer, optimizes and adjusts a control parameter F (phi) of a PID control algorithm, inputs the optimized control parameter F' (phi) into the PID control algorithm, then executes PID temperature control calculation to obtain an adjusting power G (ti) at the ti moment, and controls an output voltage V (ti) of a refrigerating chip according to the adjusting power G (ti);
(2) the temperature control execution system 1 realizes real-time adjustment of refrigeration and heat production under the voltage control of the lower computer 8, and repeatedly executes the step (2) when the error is larger than the allowable error range; when the error is larger than the allowable error range, executing the step (4);
(3) and (5) performing temperature control calculation of ti +1 at the next moment, and repeating the steps (2) to (3) until 5 freeze-thaw cycles are completed.
The set temperature and the output temperature of the top temperature-controlled execution system 1 are shown in fig. 7-8, and the set temperature and the output temperature of the bottom temperature-controlled execution system 1 are shown in fig. 9-10.
And (4) experimental conclusion: in the test process, the maximum error between the actual temperature and the set temperature under the constant temperature control condition is +/-0.002 ℃; the maximum error between the actual temperature and the set temperature under the variable temperature control condition is +/-0.01 ℃, and the temperature control precision of the temperature control system is higher.
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the inventive work should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.
Claims (7)
1. A temperature-changing control system suitable for frozen soil tests is characterized by comprising a temperature-controlling execution system (1), a temperature-controlling operation system (2) and a cooling water supply system (3);
the temperature control execution system (1) comprises a semiconductor refrigeration chip (4), a cold storage block (5) and a water cooling head (6), wherein the semiconductor refrigeration chip (4) comprises a cold surface and a hot surface, and the cold surface and the hot surface of the semiconductor refrigeration chip (4) are respectively attached to the cold storage block (5) and the water cooling head (6);
the temperature control operating system (2) comprises an upper computer (7), a lower computer (8), a power supply (9) and a temperature sensor (10), wherein the upper computer (7) and the lower computer (8) are connected through a data line (13), the semiconductor refrigeration chip (4) is electrically connected with the lower computer (8), the temperature sensor (10) is connected with the lower computer (8) through a signal line (11), and the power supply (9) is connected with the lower computer (8) through a power line (12);
the cooling water supply system (3) comprises a water storage tank (15), a water pump (16), a water delivery pipe (17), a cooling water temperature control coil (18), a refrigerator (19) and a cooling liquid delivery pipe (14), wherein the water pump (16) and the cooling water temperature control coil (18) are arranged in the water storage tank (15), the water pump (16) is connected with the water cooling head (6) through the water delivery pipe (17), and the cooling water temperature control coil (18) is connected with the refrigerator (19) through the cooling liquid delivery pipe (14).
2. The temperature change control system suitable for the frozen soil test according to claim 1, wherein the cold surface and the hot surface of the semiconductor refrigeration chip (4) are bonded with the cold storage block (5) and the water cooling head (6) by uniformly coating silicone grease on the surfaces.
3. The temperature change control system suitable for the frozen soil test is characterized in that the semiconductor refrigeration chip (4) is one of rectangular, circular and annular in shape.
4. A temperature control method suitable for a frozen soil test is characterized by comprising the following steps:
the method comprises the following steps that a cold surface and a hot surface of a semiconductor refrigeration chip (4) are respectively attached to a cold storage block (5) and a water cooling head (6), an upper computer (7) and a lower computer (8) are connected through a data line (13), the semiconductor refrigeration chip (4) is electrically connected with the lower computer (8), a temperature sensor (10) is connected with the lower computer (8) through a signal line (11), a power supply (9) is connected with the lower computer (8) through a power line (12), a water pump (16) and a cooling water temperature control coil (18) are arranged in a water storage tank (15), the water pump (16) is connected with the water cooling head (6) through a water conveying pipe (17), and the cooling water temperature control coil (18) is connected with a refrigerator (19) through a cooling liquid conveying pipe (14).
Step b, setting a control parameter F (phi) of a PID control algorithm in an upper computer (7), generating an initial parameter of the single-node neural network through a random matrix R (delta), editing a temperature control time course function T (t), and transmitting the F (phi), the R (delta) and the T (t) to a lower computer (8);
c, the lower computer (8) collects t of the temperature control object through the temperature control probekTemperature data at time T0 (T)k) According to the instruction of the upper computer (7), the collected temperature and the set temperature T (T)k) Inputting the sum error delta T into a single-node neural network, optimizing and adjusting a control parameter F (phi) of a PID control algorithm by the single-node neural network, inputting the optimized control parameter F' (phi) into the PID control algorithm, and then executing PID temperature control calculation to obtain TkRegulated power u (t) at timek) And according to the regulated power u (t)k) Controlling the output voltage V (t) of the refrigeration chipk)；
D, the temperature control execution system (1) realizes real-time adjustment of refrigeration and heat production under the voltage control of the lower computer (8), the step c is repeatedly executed when the error is larger than the allowable error range, and the step e is executed when the error is smaller than the allowable error range;
step e, executing the next time tk+1And (c) calculating the temperature control, and repeating the steps (b) to (c).
5. The method according to claim 4, wherein the PID control function u (t) is a function of the frozen soil temperaturek) Taking an incremental formula:
Δu(tk)＝kp(e(tk)-e(tk-1))+kie(tk)+kd(e(tk)-2e(tk-1)+e(tk-2)) 。
6. the temperature control method suitable for the frozen soil test according to claim 4, wherein the single-node neural network adopts a supervised Hebb learning rule:
Δωij(tk)＝η(dj(tk)-oj(tk))oj(tk)oi(tk) Wherein, Δ ωij(tk) Is the weight coefficient between the i neuron and the j neuron, η is the learning efficiency, dj(tk) Is tkTarget value of time oj(tk) Is tkTime of day input value, oi(tk) Is tkAnd outputting the value at the moment.
7. The temperature control method suitable for the frozen soil test according to the claims 4 and 5, characterized in that the control algorithm of PID combined with the single node neural network is:
the self-regulation coefficient of the neural network is as follows:
ω1(tk)＝ω1(tk-1)+η1e(tk)u(tk)(e(tk)+Δe(tk))，
ω2(tk)＝ω2(tk-1)+η2e(tk)u(tk)(e(tk)+Δe(tk))，
ω3(tk)＝ω3(tk-1)+η3e(tk)u(tk)(e(tk)+Δe(tk))，
wherein K is a neuron weight adjustment scaling factor, η1For learning efficiency of the scaling term, η2To integrate the learning efficiency of the adjustment term, η3In order to differentiate the learning efficiency of the adjustment term,
x1(tk)＝e(tk)，x2(tk)＝e(tk)-e(tk-1)，x3(k)＝e(tk)-2e(tk-1)+e(tk-2)。
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