CN111235605A - Additive for ultralow-profile electrolytic copper foil and process for preparing electrolytic copper foil - Google Patents
Additive for ultralow-profile electrolytic copper foil and process for preparing electrolytic copper foil Download PDFInfo
- Publication number
- CN111235605A CN111235605A CN202010112650.0A CN202010112650A CN111235605A CN 111235605 A CN111235605 A CN 111235605A CN 202010112650 A CN202010112650 A CN 202010112650A CN 111235605 A CN111235605 A CN 111235605A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- electrolytic copper
- additive
- parts
- preparing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention belongs to the technical field of electrolytic copper foil, and particularly relates to an additive for an ultralow-profile electrolytic copper foil and a process for preparing the electrolytic copper foil. The composite additive comprises the following components in parts: 1-10 parts of sodium polydithio-dipropyl sulfonate, 0.5-5 parts of 2-mercapto benzimidazole propane sulfonate and 2-20 parts of collagen. The invention has the beneficial effects that: the additive has the advantages of less and simple components, lower cost and convenient field stable control, and the ultralow-profile electrolytic copper foil with the roughness Rz less than or equal to 1 mu m can be prepared by adopting the additive. The performance indexes of the prepared electrolytic copper foil are as follows: the thickness is 8-18 μm, the roughness Rz of the rough surface of the copper foil is less than or equal to 1 μm, the elongation is more than or equal to 4 percent, and the tensile strength is more than or equal to 33Kgf/mm2The brightness is 300-.
Description
Technical Field
The invention belongs to the technical field of electrolytic copper foil, and particularly relates to an additive for an ultralow-profile electrolytic copper foil and a process for preparing the electrolytic copper foil.
Background
The Ministry of industry and communications in China officially issued 5G commercial license plates 6.6.6.9, and a 5G base station with the coverage of 5G in the central area of a city needs 200-300 meters. Due to the wide application of the 5G terminal, the electrolytic copper foil for the high-frequency high-speed copper-clad plate is expected to grow.
The use frequency of the 5G wireless communication is 3 GHz-30 GHz; the corresponding wavelength is 100 mm-10 mm. The high-frequency high-speed digital signals have skin effect when being transmitted in the copper foil lead of the PCB, so that the transmission signal loss is serious. The production and preparation of the ultra-low profile electrolytic copper foil become a new direction for the development of the current copper foil industry.
The performance indexes of the copper foil such as roughness Rz, glossiness, tensile strength, elongation and the like are greatly influenced by adding a small amount of the composite additive in the electrolytic copper foil preparation process, and interaction exists among different types of additives, so that the fewer the types of the additives contained in the composite additive, the more beneficial to field regulation and control. At present, most of the compound additive formulas used in the low-profile electrolytic copper foil patents use more than 5 additives, which is not favorable for stable production of products.
Disclosure of Invention
The embodiment of the invention discloses an additive for an ultralow-profile electrolytic copper foil and a process for preparing the electrolytic copper foil, which aim to solve any one of the above and other potential problems in the prior art.
In order to solve the problems, the technical scheme of the invention is as follows: an additive for an ultra-low profile electrolytic copper foil: the composite additive comprises the following components in parts: 1-10 parts of sodium polydithio-dipropyl sulfonate, 0.5-5 parts of 2-mercapto benzimidazole propane sulfonate and 2-20 parts of collagen.
The purity of the sodium polydithio-dipropyl sulfonate is more than or equal to 98 percent, the molecular weight of the collagen is 1500-6000, and the preferred molecular weight is 4000-6000.
Furthermore, hydroxyethyl cellulose can be added into the additive in an amount of 1-10 parts, and the roughness of the electrolytic copper foil is further reduced under the interaction with other three additives.
Another object of the present invention is to develop a process for producing an ultra-low profile electrolytic copper foil. Adding a fine copper wire with the copper and silver (Cu + Ag) content of more than 99.95% into a copper dissolving tank with bottom blowing, and dissolving the copper wire under the action of dilute sulfuric acid and oxygen to form a copper sulfate electrolyte. Wherein the copper ion content in the copper sulfate electrolyte is 80-110g/L, the sulfuric acid content is 100-140g/L, the chlorine ion content is 0.01-0.05g/L, and the electrolyte temperature is 45-60 ℃.
Adding the composite additive solution into electrolyte at a flow rate of 10-100mL/min, and mixing the electrolyte and the additive solution uniformly at a flow rate of 40-70m3The flow rate/h is fed into the electrolysis cell.
The ultralow-profile electrolytic copper foil is prepared by adopting the process.
The electrolytic bath consists of a PVC tank body, a titanium iridium-plated anode plate, a titanium cathode roller and the like, and the current density is 7500A/m when the electrolytic copper foil is prepared2And continuously electroplating the surface of the titanium cathode roller to generate an ultra-low profile electrolytic copper foil, and rolling the copper foil by a rolling shaft after the copper foil is stripped from the surface of the titanium roller.
Compared with the prior art, the invention has the following beneficial effects: the method solves the problems that the copper foil has large roughness and large fluctuation and is difficult to stably control at a low roughness level in the production process, simultaneously avoids the warping problem of the produced electrolytic copper foil, and prepares the ultralow-profile electrolytic copper foil with the roughness Rz of less than or equal to 1 mu m. The composite additive adopted by the invention is simple in type, and is more beneficial to regulating and controlling the content of the additive in the plating solution on site compared with most composite additives containing 5 or more additive types, so that the quality of the produced electrolytic copper foil is more stable. In addition, the additives involved in the invention are all domestic additives, are easy to obtain and low in price, and are beneficial to reducing the production cost.
The specific indexes of the ultralow-profile electrolytic copper foil prepared by adopting the composite additive and the production process are as follows: the thickness of the copper foil is 8-18 μm, the roughness Rz of the rough surface of the copper foil is less than or equal to 1 μm, the elongation is more than or equal to 4 percent, and the tensile strength is more than or equal to 33Kgf/mm2The brightness is 300-.
Drawings
FIG. 1 is a scanning electron micrograph (1000 times magnification) of a matte surface of an ultra-low profile electrolytic copper foil according to example 1 of the present invention.
FIG. 2 is a scanning electron micrograph (1000 times magnification) of the matte side of the ultra-low profile electrolytic copper foil according to example 2 of the present invention.
FIG. 3 is a scanning electron micrograph (1000 times magnification) of the matte side of the ultra-low profile electrolytic copper foil according to example 3 of the present invention.
FIG. 4 is a scanning electron micrograph (1000 times magnification) of the matte side of the ultralow profile electrolytic copper foil of comparative example 1.
Detailed Description
In order to make the technical purpose, technical scheme and beneficial effects of the invention clearer, the invention is further described in detail with reference to the accompanying drawings and specific embodiments. The scope of the invention is not limited to the following examples.
The invention relates to a composite additive for an ultralow-profile electrolytic copper foil, which comprises the following components in parts: 1-10 parts of sodium polydithio-dipropyl sulfonate, 0.5-5 parts of 2-mercapto benzimidazole propane sulfonate and 2-20 parts of collagen.
The molecular weight of the collagen is 1500-.
Another object of the present invention is to provide a process for preparing an ultra-low profile electrolytic copper foil using the commercial composite additive, which is characterized by comprising the steps of:
s1) preparing a copper sulfate electrolyte;
s2) adjusting and heating the copper sulfate electrolyte prepared in S1);
s3) weighing the components of the composite additive respectively to prepare a solution, adding the solution into the electrolyte treated by the S2), mixing uniformly and flowing into an electrolytic cell;
s4), electrifying to carry out electrodeposition, and continuously electroplating on the surface of the titanium cathode roller to generate the ultra-low profile electrolytic copper foil.
In the S2), the copper ion content in the copper sulfate electrolyte is adjusted to be 80-110g/L, the sulfuric acid content is 100-140g/L, the chlorine ion content is 0.01-0.05g/L, and the temperature of the copper sulfate electrolyte is 45-60 ℃.
The additive solution in the S3) is added into the electrolyte at the flow rate of 10-100 mL/min.
The current density in electrodeposition in S4) is 5000-2。
The thickness of the ultralow-profile electrolytic copper foil is 8-18um, and the roughness Rz of the rough surface of the copper foil is less than or equal to 1 mu mElongation is not less than 4%, and tensile strength is not less than 33Kgf/mm2The brightness is 300-.
The molecular weight of the collagen is 4000-6000.
The purity of the sodium polydithio-dipropyl sulfonate is more than or equal to 98 percent.
Example 1
And (4) preparing the composite additive. 500g of sodium polydithio-dipropyl sulfonate, 250g of sodium 2-mercapto-benzimidazole propane sulfonate and 2000g of collagen are weighed and added into an additive preparation tank containing 500L of deionized water, and the materials are dissolved by mechanical stirring. Wherein the molecular weight of the collagen is 2000-3000.
And preparing a copper sulfate electrolyte. Adding a fine copper wire with the copper and silver (Cu + Ag) content of more than 99.95% into a copper dissolving tank with bottom blowing, and dissolving the copper wire under the action of dilute sulfuric acid and oxygen to form a copper sulfate electrolyte. Wherein the copper ion content in the copper sulfate electrolyte is 100g/L, the sulfuric acid content is 130g/L, the chlorine ion content is 0.03g/L, and the temperature of the electrolyte is 50-55 ℃.
Adding the composite additive. Adding the composite additive solution into electrolyte at a flow rate of 20mL/min, and uniformly mixing the electrolyte and the additive solution at a flow rate of 45m3The flow rate/h is fed into the electrolysis cell. The electrolytic bath consists of a PVC tank body, a titanium iridium-plated anode plate, a titanium cathode roller and the like.
And electroplating to prepare the electrolytic copper foil. The current density was set to 55A/m2And continuously electroplating the surface of the titanium cathode roller to generate an ultra-low profile electrolytic copper foil, and rolling the copper foil by a rolling shaft after the copper foil is stripped from the surface of the titanium roller.
The electrolytic copper foil obtained in this example had the performance parameters that the thickness of the copper foil was 8 μm, the matte surface roughness Rz of the copper foil was 0.9 μm, the elongation was 4.2%, and the tensile strength was 33.5Kgf/mm2Brightness 387 units gloss.
Example 2
And (4) preparing the composite additive. 1500g of sodium polydithio-dipropyl sulfonate, 1000g of sodium 2-mercapto-benzimidazole propane sulfonate and 2500g of collagen are weighed and added into an additive preparation tank containing 500L of deionized water, and the materials are dissolved by mechanical stirring. Wherein the molecular weight of the collagen is 2000-3000.
And preparing a copper sulfate electrolyte. Adding a fine copper wire with the copper and silver (Cu + Ag) content of more than 99.95% into a copper dissolving tank with bottom blowing, and dissolving the copper wire under the action of dilute sulfuric acid and oxygen to form a copper sulfate electrolyte. Wherein the copper ion content in the copper sulfate electrolyte is 100g/L, the sulfuric acid content is 120g/L, the chlorine ion content is 0.04g/L, and the temperature of the electrolyte is 50-55 ℃.
Adding the composite additive. Adding the composite additive solution into electrolyte at a flow rate of 15mL/min, and uniformly mixing the electrolyte and the additive solution at a flow rate of 45m3The flow rate/h is fed into the electrolysis cell. The electrolytic bath consists of a PVC tank body, a titanium iridium-plated anode plate, a titanium cathode roller and the like.
And electroplating to prepare the electrolytic copper foil. The current density was set to 60A/m2And continuously electroplating the surface of the titanium cathode roller to generate an ultra-low profile electrolytic copper foil, and rolling the copper foil by a rolling shaft after the copper foil is stripped from the surface of the titanium roller.
The electrolytic copper foil obtained in this example had the performance parameters that the copper foil thickness was 12 μm, the matte surface roughness Rz of the copper foil was 0.85 μm, the elongation was 4.8%, and the tensile strength was 35.0Kgf/mm2The brightness is 478 units of gloss.
Example 3
And (4) preparing the composite additive. 800g of sodium polydithio-dipropyl sulfonate, 1000g of sodium 2-mercapto benzimidazole propane sulfonate and 1500g of collagen are weighed and added into an additive preparation tank containing 500L of deionized water, and the materials are dissolved by mechanical stirring. Wherein the molecular weight of the collagen is 4000-6000.
And preparing a copper sulfate electrolyte. Adding a fine copper wire with the copper and silver (Cu + Ag) content of more than 99.95% into a copper dissolving tank with bottom blowing, and dissolving the copper wire under the action of dilute sulfuric acid and oxygen to form a copper sulfate electrolyte. Wherein the copper ion content in the copper sulfate electrolyte is 90g/L, the sulfuric acid content is 120g/L, the chlorine ion content is 0.03g/L, and the temperature of the electrolyte is 50-55 ℃.
Adding the composite additive. Adding the composite additive solution into electrolyte at a flow rate of 50mL/min, and uniformly mixing the electrolyte and the additive solutionThen 60m3The flow rate/h is fed into the electrolysis cell. The electrolytic bath consists of a PVC tank body, a titanium iridium-plated anode plate, a titanium cathode roller and the like.
And electroplating to prepare the electrolytic copper foil. The current density was set to 60A/m2And continuously electroplating the surface of the titanium cathode roller to generate an ultra-low profile electrolytic copper foil, and rolling the copper foil by a rolling shaft after the copper foil is stripped from the surface of the titanium roller.
The electrolytic copper foil obtained in this example had the performance parameters that the thickness of the copper foil was 18 μm, the matte surface roughness Rz of the copper foil was 0.67 μm, the elongation was 6.6%, and the tensile strength was 34.2Kgf/mm2Lightness 504 units gloss.
Comparative example 1
And (4) preparing the composite additive. 1000g of sodium polydithio-dipropyl sulfonate, 2000g of collagen, 500g of hydroxyethyl cellulose, 50g of polyethylene glycol and 20g of ethylene thiourea were weighed into an additive preparation tank containing 500L of deionized water, and dissolved by mechanical stirring. Wherein the molecular weight of the collagen is 4000-6000.
And preparing a copper sulfate electrolyte. Adding a fine copper wire with the copper and silver (Cu + Ag) content of more than 99.95% into a copper dissolving tank with bottom blowing, and dissolving the copper wire under the action of dilute sulfuric acid and oxygen to form a copper sulfate electrolyte. Wherein the copper ion content in the copper sulfate electrolyte is 90g/L, the sulfuric acid content is 120g/L, the chlorine ion content is 0.02g/L, and the temperature of the electrolyte is 50-55 ℃.
Adding the composite additive. Adding the composite additive solution into electrolyte at a flow rate of 50mL/min, and mixing the electrolyte and the additive solution uniformly at a flow rate of 60m3The flow rate/h is fed into the electrolysis cell. The electrolytic bath consists of a PVC tank body, a titanium iridium-plated anode plate, a titanium cathode roller and the like.
And electroplating to prepare the electrolytic copper foil. The current density was set to 65A/m2And continuously electroplating the surface of the titanium cathode roller to generate an ultra-low profile electrolytic copper foil, and rolling the copper foil by a rolling shaft after the copper foil is stripped from the surface of the titanium roller.
The electrolytic copper foil obtained in this example had the performance parameters that the copper foil thickness was 12 μm, the matte surface roughness Rz of the copper foil was 1.25 μm, the elongation was 4.0%, and the tensile strength was 33.6Kgf/mm2The lightness was 273 units of gloss.
The additive for ultra-low profile electrolytic copper foil and the process for preparing the electrolytic copper foil provided by the embodiments of the present application are described in detail above. The above description of the embodiments is only for the purpose of helping to understand the method of the present application and its core ideas; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
As used in the specification and claims, certain terms are used to refer to particular components. As one skilled in the art will appreciate, manufacturers may refer to a component by different names. This specification and claims do not intend to distinguish between components that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. "substantially" means within an acceptable error range, and a person skilled in the art can solve the technical problem within a certain error range to substantially achieve the technical effect. The description which follows is a preferred embodiment of the present application, but is made for the purpose of illustrating the general principles of the application and not for the purpose of limiting the scope of the application. The protection scope of the present application shall be subject to the definitions of the appended claims.
It is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a good or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such good or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a commodity or system that includes the element.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
The foregoing description shows and describes several preferred embodiments of the present application, but as aforementioned, it is to be understood that the application is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the application as described herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the application, which is to be protected by the claims appended hereto.
Claims (10)
1. The composite additive for the ultralow-profile electrolytic copper foil is characterized by comprising the following components in parts: 1-10 parts of sodium polydithio-dipropyl sulfonate, 0.5-5 parts of 2-mercapto benzimidazole propane sulfonate and 2-20 parts of collagen.
2. The additive package of claim 1 wherein the collagen has a molecular weight of 1500-7000.
3. The additive composition as defined in claim 1, wherein the molecular weight of said collagen is 4000-6000.
4. The additive package of claim 1 wherein said sodium polydithio-dipropyl sulfonate has a purity of greater than or equal to 98%.
5. A process for preparing an ultra-low profile electrolytic copper foil using the composite additive of claim 1, comprising the steps of:
s1) preparing a copper sulfate electrolyte;
s2) adjusting the components of the copper sulfate electrolyte prepared in S1) and heating;
s3) weighing the components of the composite additive respectively, preparing the components into solutions respectively, adding the solutions into the copper sulfate electrolyte treated in S2), mixing uniformly, and adding the solutions into an electrolytic cell;
s4), electrifying to carry out electrodeposition, and continuously electroplating on the surface of the titanium cathode roller to generate the ultra-low profile electrolytic copper foil.
6. The process as claimed in claim 5, wherein in S2), the copper ion content of the copper sulfate electrolyte is adjusted to 80-110g/L, the sulfuric acid content is adjusted to 140g/L, the chlorine ion content is adjusted to 0.01-0.05g/L, and the temperature of the copper sulfate electrolyte is adjusted to 45-60 ℃.
7. The process as claimed in claim 5, wherein the additive solution in S3) is added into the copper sulfate electrolyte at a flow rate of 10-100 mL/min; the flow rate of the solution added into the electrolytic cell is 40-70m3/h。
8. The process as claimed in claim 5, wherein the current density in the electrodeposition in S4) is 5000-7500A/m2。
9. The process as claimed in claim 5, wherein the thickness of the ultra-low profile electrolytic copper foil is 8-18 μm, the roughness Rz of the matte surface of the copper foil is not more than 1 μm, the elongation is not less than 4%, and the tensile strength is not less than 33Kgf/mm2The brightness is 300-.
10. An ultra-low profile electrolytic copper foil, characterized in that it is prepared by the process according to any one of claims 5 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010112650.0A CN111235605A (en) | 2020-02-24 | 2020-02-24 | Additive for ultralow-profile electrolytic copper foil and process for preparing electrolytic copper foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010112650.0A CN111235605A (en) | 2020-02-24 | 2020-02-24 | Additive for ultralow-profile electrolytic copper foil and process for preparing electrolytic copper foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111235605A true CN111235605A (en) | 2020-06-05 |
Family
ID=70875039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010112650.0A Pending CN111235605A (en) | 2020-02-24 | 2020-02-24 | Additive for ultralow-profile electrolytic copper foil and process for preparing electrolytic copper foil |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111235605A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112080768A (en) * | 2020-09-09 | 2020-12-15 | 江西省江铜耶兹铜箔有限公司 | Production process of smooth high-speed electrolytic copper foil |
| CN112195487A (en) * | 2020-09-18 | 2021-01-08 | 九江德福科技股份有限公司 | Manufacturing method for improving tensile strength of light and thin copper foil |
| CN113652718A (en) * | 2021-08-27 | 2021-11-16 | 安徽华威铜箔科技有限公司 | Preparation method of 3-micron electrolytic copper foil additive, product and application thereof |
| CN116083972A (en) * | 2022-12-09 | 2023-05-09 | 浙江花园新能源股份有限公司 | Production process of reverse copper foil with low roughness and high peel strength, product and application thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106637308A (en) * | 2016-11-16 | 2017-05-10 | 山东金宝电子股份有限公司 | Mixing additive for electrolytic profile-free copper foil and method thereof for preparing electrolytic copper foil |
| CN110093637A (en) * | 2019-06-11 | 2019-08-06 | 九江德福科技股份有限公司 | For flexibility coat copper plate, the electrolytic copper foil of flexible printed-circuit board and preparation method |
-
2020
- 2020-02-24 CN CN202010112650.0A patent/CN111235605A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106637308A (en) * | 2016-11-16 | 2017-05-10 | 山东金宝电子股份有限公司 | Mixing additive for electrolytic profile-free copper foil and method thereof for preparing electrolytic copper foil |
| CN110093637A (en) * | 2019-06-11 | 2019-08-06 | 九江德福科技股份有限公司 | For flexibility coat copper plate, the electrolytic copper foil of flexible printed-circuit board and preparation method |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112080768A (en) * | 2020-09-09 | 2020-12-15 | 江西省江铜耶兹铜箔有限公司 | Production process of smooth high-speed electrolytic copper foil |
| CN112195487A (en) * | 2020-09-18 | 2021-01-08 | 九江德福科技股份有限公司 | Manufacturing method for improving tensile strength of light and thin copper foil |
| CN112195487B (en) * | 2020-09-18 | 2022-04-05 | 九江德福科技股份有限公司 | Manufacturing method for improving tensile strength of light and thin copper foil |
| CN113652718A (en) * | 2021-08-27 | 2021-11-16 | 安徽华威铜箔科技有限公司 | Preparation method of 3-micron electrolytic copper foil additive, product and application thereof |
| CN113652718B (en) * | 2021-08-27 | 2024-05-17 | 安徽华威铜箔科技有限公司 | Preparation method of 3-micrometer electrolytic copper foil additive, product and application thereof |
| CN116083972A (en) * | 2022-12-09 | 2023-05-09 | 浙江花园新能源股份有限公司 | Production process of reverse copper foil with low roughness and high peel strength, product and application thereof |
| CN116083972B (en) * | 2022-12-09 | 2023-08-18 | 浙江花园新能源股份有限公司 | Production process of reverse copper foil with low roughness and high peel strength, product and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111235605A (en) | Additive for ultralow-profile electrolytic copper foil and process for preparing electrolytic copper foil | |
| CN108677224B (en) | Electrolyte for preparing high-tensile-strength lithium electrolytic copper foil | |
| CN111020644B (en) | Method for manufacturing electrolytic copper foil for lithium ion secondary battery | |
| CN111455416B (en) | Preparation process of high-mechanical-property electrolytic copper foil of high-precision circuit board | |
| CN111270273A (en) | Additive for high-tensile electrolytic copper foil and process for preparing high-tensile electrolytic copper foil | |
| EP2976447A1 (en) | Apparatus and method for electrolytic deposition of metal layers on workpieces | |
| CN110760898A (en) | Preparation method of high-tensile electrolytic copper foil for lithium battery | |
| CN110396704A (en) | A kind of ultrathin electrolytic copper foil and preparation method | |
| CN111910222B (en) | Electrolytic copper foil additive with brightening and leveling functions and application thereof | |
| CN113337857B (en) | Acidic sulfate copper electroplating combined additive for thickening PCB through hole metal | |
| CN112144084A (en) | Additive and process for preparing high-tensile electrolytic copper foil by using same | |
| KR101535853B1 (en) | Manufacturing method of high strength copper foil using micro-hardening and high strength copper foil manufactured by the same | |
| CN112080768A (en) | Production process of smooth high-speed electrolytic copper foil | |
| CN111286765B (en) | Electrolytic copper foil and preparation method and application thereof | |
| CN113293408B (en) | Method for electrolytic deposition of high-purity manganese from manganese chloride electrodeposit liquid | |
| CN114959804A (en) | Preparation method of bright fine-grain copper foil | |
| CN104846407A (en) | Additive and process for producing 6mu.m high-tensile-strength electrolytic copper foil by using same | |
| CN103014786A (en) | Electroplating liquid, method for manufacturing same and tin plating process by applying electroplating liquid | |
| CN108817376A (en) | A kind of electrically conductive graphite copper facing not method for oxidation | |
| CN108950614B (en) | VCP high-efficiency copper plating brightener | |
| CN111074307A (en) | Process for stabilizing copper plating solution by diaphragm electrolysis method | |
| CN113832503A (en) | Composite additive for improving modulus of lithium-ion battery copper foil and electrolytic copper foil production method | |
| CN111020675B (en) | Preparation method of titanium dioxide nanotube-doped cobalt-tungsten alloy electrodeposition coating | |
| KR101173879B1 (en) | Multi-functional super-saturated slurry plating solution for nickel flash plating | |
| Lee et al. | Evaluating and monitoring nucleation and growth in copper foil |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200605 |