CN111225511A - Method for manufacturing electronic device - Google Patents
Method for manufacturing electronic device Download PDFInfo
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- CN111225511A CN111225511A CN201811402237.7A CN201811402237A CN111225511A CN 111225511 A CN111225511 A CN 111225511A CN 201811402237 A CN201811402237 A CN 201811402237A CN 111225511 A CN111225511 A CN 111225511A
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- release
- flexible substrate
- electronic device
- substrate
- releasing
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
Abstract
The invention discloses a manufacturing method of an electronic device, which comprises the following steps: providing a carrier plate; forming a release layer on the carrier plate, wherein the release layer has a release surface opposite to the carrier plate; forming a flexible substrate on the release surface of the release layer, wherein the flexible substrate has a substrate surface in contact with the release surface; forming an electronic element layer on the flexible substrate so that the flexible substrate and the electronic element layer form an electronic device; after the flexible substrate is formed, a release type concave structure is formed on the release type surface, so that the release type layer and the flexible substrate are not contacted with each other at the position of the release type concave structure; and after the release concave structure is formed, carrying out a release process to separate the electronic device from the release layer.
Description
Technical Field
The present invention relates to a method for manufacturing an electronic device, and more particularly, to a method for manufacturing an electronic device capable of improving a yield of separation between the electronic device and a carrier.
Background
With the development of technology and technology, electronic devices have become an indispensable article in society, and for example, a display or a touch display in an electronic device has characteristics of light and thin appearance, low power consumption, no radiation pollution, and the like, so that the electronic devices have been widely applied to various portable or wearable electronic products such as a notebook computer (notebook), a smart phone (smart phone), a watch, a car display, and the like to provide more convenient information transmission and display. In an electronic device having a flexible substrate, because the flexible substrate has insufficient rigidity, a film layer (e.g., a release layer) having adhesive force is disposed between the flexible substrate and a carrier to fix the flexible substrate on the carrier having superior rigidity, and after electronic components are fabricated, the electronic device is separated from the carrier by a separation process. However, in the separation process, if the adhesion between the film layer with adhesion and the flexible substrate is too strong, the yield of the separation process is affected, and therefore, the separation process needs to be properly designed to improve the production yield of the electronic device.
Disclosure of Invention
The invention provides a manufacturing method of an electronic device, which reduces the integral adhesive force between a flexible substrate and a release layer by arranging a concave structure on the release layer with adhesive force, thereby improving the qualification rate of the separation of the electronic device and a carrier plate and improving the production yield of the electronic device.
To solve the above technical problem, the present invention provides a method for manufacturing an electronic device, comprising: providing a carrier plate; forming a release layer on the carrier plate, wherein the release layer has a release surface opposite to the carrier plate; forming a flexible substrate on the release surface of the release layer, wherein the flexible substrate has a substrate surface in contact with the release surface; forming an electronic element layer on the flexible substrate so that the flexible substrate and the electronic element layer form an electronic device; after the flexible substrate is formed, a release type concave structure is formed on the release type surface, so that the release type layer and the flexible substrate are not contacted with each other at the position of the release type concave structure; and after the release concave structure is formed, carrying out a release process to separate the electronic device from the release layer.
In the invention, the contact area between the flexible substrate and the release layer is reduced due to the formation of the release recessed structure, so as to reduce the overall adhesive force between the flexible substrate and the release layer, therefore, the adhesive force required to be overcome in the release process is reduced, the possibility of cracking or damaging the flexible substrate can be reduced, the qualification rate of separating the electronic device and the carrier plate is improved, the production yield of the electronic device is further improved, and in addition, the force applied to separate the electronic device and the carrier plate can even be reduced.
Drawings
Fig. 1 is a flowchart illustrating a method for manufacturing an electronic device according to an embodiment of the invention.
Fig. 2 to 4 are schematic cross-sectional views illustrating a manufacturing process of an electronic device according to a first embodiment of the invention.
Fig. 5 to 6 are schematic cross-sectional views illustrating a manufacturing process of an electronic device according to a variation of the first embodiment of the present invention.
Fig. 7 to 10 are schematic plan views illustrating a release surface of a release layer according to some embodiments of the present invention.
Fig. 11 and 12 are schematic cross-sectional views illustrating a manufacturing process of an electronic device according to a second embodiment of the invention.
Fig. 13 and 14 are schematic cross-sectional views illustrating a manufacturing process of an electronic device according to a third embodiment of the invention.
Fig. 15 is a schematic cross-sectional view of an electronic device according to a variation of the third embodiment of the invention.
Wherein the reference numerals are as follows:
100. 100 ', 300' electronic device
110 flexible substrate
110s substrate surface
112 recess
120 electronic component layer
122 electronic component
314 substrate recess structure
314a first substrate recess structure
314b second substrate recess structure
CB carrier plate
D direction of overlook
DBL release layer
DBLs release surface
DS is from type sunk structure
DS1 first release type concave structure
DS2 second release type concave structure
LS laser pulse
S1-S6
SP1, SP2 distance
Detailed Description
In order to make the present invention more comprehensible to those skilled in the art, preferred embodiments of the present invention are specifically described below, and the present invention will be described in detail with reference to the accompanying drawings. It should be noted that the drawings are simplified schematic drawings, and thus, only the elements and combinations related to the present invention are shown to provide a clearer description of the basic structure or implementation method of the present invention, and the actual elements and layout may be more complicated. In addition, for convenience of description, the elements shown in the drawings are not necessarily drawn to scale, and the specific scale may be adjusted according to design requirements.
Referring to fig. 1 to 4, fig. 1 is a flowchart illustrating a method for manufacturing an electronic device according to an embodiment of the invention, fig. 2 to 4 are schematic cross-sectional views illustrating a manufacturing process of an electronic device according to a first embodiment of the invention, and fig. 4 is a schematic cross-sectional view illustrating the electronic device according to the first embodiment of the invention. It should be noted that, the electronic device 100 may be a flexible display (such as a Liquid Crystal Display (LCD), a micro light-emitting diode (micro LED) display, an active-matrix organic light-emitting diode (AMOLED) display, etc.), a flexible touch sensor, or other suitable flexible electronic devices, but the invention is not limited thereto, and the electronic device 100 may also be a non-flexible electronic device.As shown in fig. 1 and fig. 2, in the method for manufacturing an electronic device according to the present embodiment, step S1 is performed to provide a carrier CB, step S2 is performed to form a release layer DBL on the carrier CB, where the release layer DBL has a release surface DBLs opposite to the carrier CB, and step S3 is performed to form a flexible substrate 110 on the release surface DBLs of the release layer DBL, where the flexible substrate 110 has a substrate surface 110S in contact with the release surface DBLs. The carrier CB is a rigid carrier CB with high rigidity, for example, a carrier comprising glass, plastic, quartz, sapphire substrate, synthetic resin substrate or other suitable materials, and is used for carrying the flexible substrate 110 or electronic components disposed on the flexible substrate 110, so that the electronic device 100 having the flexible substrate 110 can be manufactured on the carrier CB. The release layer DBL may provide adhesion between the carrier CB and the flexible substrate 110, so that the flexible substrate 110 is adhered and fixed on the carrier CB, wherein the release layer DBL may include silicon oxide (SiO) for examplex) Zirconium oxide (ZrO)x) Silicon nitride (SiN)x) Niobium oxide (NbO)x) Aluminum oxide (AlO)x) At least one of silicon-containing organic material, fluorine-containing organic material and other suitable materials, but the invention is not limited thereto. The flexible substrate 110 is used as a substrate of the electronic device 100, and examples thereof include Polyimide (PI), polyethylene terephthalate (PET), Cyclic Olefin Polymer (COP), Polycarbonate (PC), Polymethyl Methacrylate (PMMA), Cyclic Olefin Copolymer (COC), Cellulose Triacetate (TAC), Polypropylene (PP), Polystyrene (PS), glass, or a combination thereof, or other suitable flexible materials, but the invention is not limited thereto. The flexible substrate 110 may be formed on the carrier CB by, for example, coating, but the invention is not limited thereto. In addition, in the embodiment, the area of the release layer DBL is larger than the area of the flexible substrate 110, that is, in the top view direction D, a part of the release layer DBL is not covered by the flexible substrate 110, but the invention is not limited thereto, and in another embodiment, the flexible substrateThe substrate 110 may completely cover the release layer DBL.
After the step S3, the method for manufacturing an electronic device according to the embodiment proceeds to a step S4, in which the electronic element layer 120 is formed on the flexible substrate 110, so that the electronic device 100 is formed by the flexible substrate 110 and the electronic element layer 120. The electronic device layer 120 may include one or more electronic devices 122, and the electronic devices 122 may vary according to the type of the electronic device 100, for example, the electronic devices 122 may include switching devices, light emitting devices (e.g., organic or inorganic light emitting diodes or micro leds), thin film transistors, conductive lines, electrodes, resistors, inductors, capacitors, diodes, amplifiers, processors, controllers, micro-electromechanical devices, feedback devices, pressure sensing devices, temperature sensing devices, optical sensing devices, peripheral driving circuits (e.g., gate driving circuits, source driving circuits, etc.), Integrated Circuits (ICs), traces, and/or other suitable active or passive devices, so that the electronic device 100 may have functions of displaying images, touch sensing, or other desired functions. In addition, other films or structures, such as a color filter layer, a shielding layer, and/or a polarizer, may be disposed in the electronic device 100, but the invention is not limited thereto.
As shown in fig. 1 and fig. 3, the method for manufacturing an electronic device of the present embodiment proceeds to step S5, and forms at least one releasing recess structure DS on the releasing surface DBLs of the releasing layer DBL, such that the releasing layer DBL and the flexible substrate 110 do not contact each other at the position of the releasing recess structure DS. The releasing recess structure DS can be formed by a suitable process, and the step of forming the releasing recess structure DS in this embodiment includes forming the releasing recess structure DS by a laser pulse (laser) process, but the invention is not limited thereto. In detail, in the laser pulse process, the release recess structure DS may be formed by focusing the laser pulse LS at a proper position and depth, that is, the laser pulse LS may be focused at the release surface DBLs of the release layer DBL or a portion of the release layer DBL adjacent to the release surface DBLs, so as to remove (or burn) the release layer DBL at the focused position of the laser pulse LS, and thus, since the release layer DBL and the flexible substrate 110 are not in contact with each other at the position of the release recess structure DS, the contact area between the flexible substrate 110 and the release layer DBL may be reduced, and further, the overall adhesion between the flexible substrate 110 and the release layer DBL may be reduced. It should be noted that, since the overall adhesion between the flexible substrate 110 and the release layer DBL is reduced, the overall adhesion between the flexible substrate 110 and the release layer DBL may be smaller than the overall adhesion between the release layer DBL and the carrier CB. In addition, in the laser pulse process, the laser pulse LS can be emitted to the release layer DBL from a proper angle and direction, for example, the laser pulse LS of the embodiment is emitted from bottom to top in fig. 3 and passes through the carrier CB to be focused on the release layer DBL to form the release recess structure DS at the focused position, but the invention is not limited thereto. In addition, since the releasing recess structure DS of the embodiment is formed by the laser pulse process, after the releasing recess structure DS is formed, the formed releasing recess structure DS may have a burn trace, and on the other hand, when the laser pulse LS is focused on the releasing surface DBLs, a portion of the substrate surface 110s of the flexible substrate 110 corresponding to the releasing recess structure DS may be simultaneously burned, so that the substrate surface 110s also has a burn trace, but the invention is not limited thereto.
Finally, as shown in fig. 1 and 4, a step S6 is performed to perform a release process to separate the electronic device 100 from the release layer DBL. The releasing process may include any suitable separation method, for example, in a releasing process, a conversion film, such as an ultraviolet film (UV film) or a thermal plastic film (thermal plastic film), may be formed on the electronic device 100, a force (such as a peeling force) is applied to the conversion film opposite to the direction of the carrier CB, such that the electronic device 100 and the carrier CB can be separated from the interface between the flexible substrate 110 and the release layer DBL and/or the interface between the release layer DBL and the carrier CB, a supporting layer (such as an optional ultraviolet film or a thermal plastic film) is formed on the substrate surface 110s of the flexible substrate 110 to support the whole structure, and the conversion film is removed to complete the releasing process, but the releasing process is not limited thereto. In the present invention, since the formation of the release recess structure DS reduces the overall adhesion between the flexible substrate 110 and the release layer DBL, the adhesion to be overcome in the release process is reduced, so that the possibility of cracking or damaging the flexible substrate 110 is reduced, the yield of the separated electronic device 100 and the carrier CB is increased, and the production yield of the electronic device 100 is further increased, and in addition, the force applied to separate the electronic device 100 and the release layer DBL can be even reduced. On the other hand, since the overall adhesion between the flexible substrate 110 and the release layer DBL is reduced, a pre-releasing step may be omitted during the releasing process, for example, an additional separating notch may not be required to be cut, so that the flexible substrate 110 and the release layer DBL are separated from the separating notch.
It can be seen that, in fig. 4, the formed electronic device 100 includes a flexible substrate 110 and an electronic device layer 120 disposed on the flexible substrate 110, and optionally includes other required structures and films, such as but not limited to a color filter layer, a shielding layer and/or a polarizer, and a substrate surface 110s of the flexible substrate 110 opposite to the electronic device layer 120 may have burning traces, such as burning traces caused by laser pulses LS or a roughened surface. Referring to fig. 5 and 6, fig. 5 to 6 are schematic cross-sectional views illustrating a manufacturing process of an electronic device according to a variation of the first embodiment of the present invention, wherein fig. 6 is a schematic cross-sectional view of an electronic device 100' according to a variation of the first embodiment of the present invention. As shown in fig. 5, in the modified embodiment, when the step of forming the releasing recess structure DS is performed (step S5), for example, in the process of forming the releasing recess structure DS by removing (or etching) part of the releasing layer DBL by the laser pulse LS, the adjacent part of the flexible substrate 110 may be simultaneously removed (or etched) to form the recess 112, so that a part of the substrate surface 110S is simultaneously roughened, and even a burning trace may be formed in the recess 112 at the same time, therefore, the roughened part of the substrate surface 110S of the flexible substrate 110 is caused by the recess 112 (as shown in fig. 6), and the position of the recess 112 of the substrate surface 110S may correspond to the position of the releasing recess structure DS of the releasing layer DBL.
Referring to fig. 7 to 10 and fig. 3 together, fig. 7 to 10 are schematic plan views of a release surface of a release layer according to some embodiments of the present invention, wherein fig. 7 to 10 further illustrate a top-view projection position (shown by a dotted line) of the flexible substrate 110 on the release layer DBL. As shown in fig. 3 and 7, the releasing recess structure DS of the present embodiment may include a first releasing recess structure DS1 adjacent to the edge of the flexible substrate 110 and/or the edge of the releasing layer DBL in the top view direction D, for example, the distance SP1 between the first releasing recess structure DS1 and the edge of the flexible substrate 110 in the top view direction D may be less than or equal to 10 mm, and/or the distance SP2 between the first releasing recess structure DS1 and the edge of the releasing layer DBL in the top view direction D may be less than or equal to 10 mm, so that the edge portion of the flexible substrate 110 may be easily peeled off from the releasing layer DBL just before the releasing process is performed. In the embodiment, the plurality of first releasing recess structures DS1 are substantially annularly disposed along the edge of the flexible substrate 110 and/or the edge of the releasing layer DBL in the top view direction D, but the invention is not limited thereto, and the number and the disposition positions of the first releasing recess structures DS1 may be designed according to the requirement. Optionally, the releasing recess structure DS of the present embodiment may further include a second releasing recess structure DS2, and the second releasing recess structure DS2 has no specific requirement on the installation position, but when the second releasing recess structure DS2 is seen from the top view direction, the location thereof is preferably located on the surface of the flexible substrate 110 away from the edge portion, and does not have the projection overlapping relationship with the first releasing recess structure DS 1. For example, the plurality of first releasing recess structures DS1 of the embodiment substantially surround the second releasing recess structures DS2, and the second releasing recess structures DS2 may be arranged in an array, or may be designed to have a regular variation or be designed to be randomly distributed, but the invention is not limited thereto, the number and the arrangement position of the second releasing recess structures DS2 may be designed as required, and the design of the second releasing recess structures DS2 may reduce the adhesion of the non-edge portion when the flexible substrate 110 is peeled, and further increase the success rate of peeling the flexible substrate 110. In addition, the depth of the release recess structure DS may be less than or equal to 10 microns, or less than or equal to 8 microns, or the ratio of the depth of the release recess structure DS to the maximum thickness of the release layer DBL may be less than 1, or less than or equal to 0.8, but the invention is not limited thereto. In addition, the pattern of the releasing recess structure DS in the top view direction D may be a dot, a stripe, a circle, a polygon, a combination of the above shapes, or other suitable shapes, and the size of the pattern may also be designed according to actual requirements, for example, in fig. 7, the pattern of the first releasing recess structure DS1 is a rectangle (or a stripe) or an L-shape (or a polygon), the pattern of the second releasing recess structure DS2 is a circle (or a dot), the size (length, width) of the pattern of the first releasing recess structure DS1 is larger than the size (length, width) of the pattern of the second releasing recess structure DS2, but the invention is not limited thereto, and in a variation, the width of the pattern of the first releasing recess structure DS1 may be smaller than the diameter length of the pattern of the second releasing recess structure DS 2. In addition, the sidewall of the release recess structure DS may be perpendicular or not to the release surface DBLs, but the invention is not limited thereto.
In another embodiment, as shown in fig. 8, one first releasing recess structure DS1 may be annularly disposed along the edge of the flexible substrate 110 in the top view direction D to surround the second releasing recess structure DS2, the adjacent rows of second releasing recess structures DS2 may be disposed in a staggered manner, the pattern of the first releasing recess structure DS1 may be a frame pattern formed by a plurality of strips, and the pattern of the second releasing recess structure DS2 may be rectangular. In another embodiment, as shown in fig. 9, the plurality of first releasing recess structures DS1 may be disposed substantially along the edge of the flexible substrate 110 in a ring shape in the top view direction D to surround the second releasing recess structure DS2, the second releasing recess structures DS2 may be arranged in an array, and the patterns, depths, etc. of the first releasing recess structure DS1 and the second releasing recess structure DS2 may be the same or different from each other, wherein the patterns may be circular (or dot). In another embodiment, as shown in fig. 10, the plurality of first releasing recess structures DS1 may overlap the edge of the flexible substrate 110 in the top view direction D and partially expose outside the flexible substrate 110, and are annularly disposed along the edge of the flexible substrate 110 to surround the second releasing recess structures DS2, the second releasing recess structures DS2 may be arranged in an array, the pattern of the first releasing recess structures DS1 may be rectangular (or called stripe) or L-shaped (or called polygon), and the pattern of the second releasing recess structures DS2 may be circular (or called dot).
The arrangement position, pattern, size and depth of the first and second releasing recess structures DS1 and DS2 may be designed according to practical requirements, and are not limited to the above embodiments, for example, in another embodiment, the releasing recess structures DS may be formed on the releasing surface DBLs of the releasing layer DBL in any distribution manner, wherein in the releasing recess structures DS, the releasing recess structures DS having a distance SP1 from the edge of the flexible substrate 110 and/or a distance SP2 from the edge of the releasing layer DBL of less than or equal to 10 mm are defined as the first releasing recess structures DS1, and the other releasing recess structures DS are defined as the second releasing recess structures DS 2.
In addition, as shown in fig. 3, in the top view direction D, the second releasing recess structure DS2 is closer to the center of the flexible substrate 110 than the first releasing recess structure DS1, so that the electronic element 122 included in the electronic element layer 120 can overlap the second releasing recess structure DS2 in the top view direction D, for example, if the electronic device 100 is a flexible display, the electronic element 122 such as a display element, a light emitting element, etc. located at the center can overlap the second releasing recess structure DS 2. On the other hand, since the first releasing recess structure DS1 is adjacent to the edge of the flexible substrate 110 and/or the edge of the releasing layer DBL in the top view direction D, the electronic element 122 in the electronic element layer 120 may or may not overlap the first releasing recess structure DS1 in the top view direction D according to the layout and design requirements, but the invention is not limited thereto.
Referring to fig. 11 and 12 and fig. 1, 3 and 4 simultaneously, fig. 11 and 12 are schematic cross-sectional views illustrating a manufacturing process of an electronic device according to a second embodiment of the invention. As shown in fig. 1 and 11, in the method for manufacturing an electronic device according to the second embodiment, step S1 is performed to provide a carrier board CB, step S2 is performed to form a release layer DBL on the carrier board CB, and step S3 is performed to form a flexible substrate 110 on a release surface DBLs of the release layer DBL. Then, as shown in fig. 1 and 12, after the step S3, a step S5 is performed to form at least one release recess structure DS on the release surface DBLs of the release layer DBL, so that the release layer DBL and the flexible substrate 110 do not contact each other at the position of the release recess structure DS. Then, as shown in fig. 1 and fig. 3 (wherein, in the embodiment, the laser pulse LS shown in the lower portion of fig. 3 is omitted), step S4 is performed to form the electronic element layer 120 on the flexible substrate 110, so that the flexible substrate 110 and the electronic element layer 120 form the electronic device 100. Finally, as shown in fig. 1 and 4, a step S6 is performed to perform a release process to separate the electronic device 100 from the release layer DBL. That is, the order of step S4 and step S5 may be interchanged as compared to the first embodiment manufacturing method.
Therefore, as can be seen from the manufacturing method of the electronic device and fig. 1 of the first and second embodiments, the step S4 of forming the electronic element layer 120 can be performed before or after the step S5 of forming the releasing recess structure DS, and the step S5 of forming the releasing recess structure DS is performed after the step (i.e., step S3) of forming the flexible substrate 110, in other words, after the step (i.e., step S3) of forming the flexible substrate 110 and the step (i.e., step S4) of forming the electronic element layer 120, the step (i.e., step S5) of forming the releasing recess structure DS is performed in the first embodiment, while in the second embodiment, the step (i.e., step S5) of forming the releasing recess structure DS is performed between the step (i.e., step S3) of forming the flexible substrate 110 and the step (i.e., step S4) of forming the electronic element layer 120. In addition, the releasing process described in step S6 is performed after the step of forming the releasing recess structure DS (i.e., step S5).
Referring to fig. 13 and 14 and fig. 1 simultaneously, fig. 13 and 14 are cross-sectional views illustrating a manufacturing process of an electronic device according to a third embodiment of the invention, wherein fig. 14 is a cross-sectional view illustrating an electronic device 300 according to the third embodiment of the invention simultaneously. As shown in fig. 1 and 13, in the method for manufacturing an electronic device according to the present embodiment, a substrate recess structure 314 may be further formed on the substrate surface 110S of the flexible substrate 110 after the step of forming the flexible substrate 110 (i.e., step S3) and before the step of releasing (i.e., step S6), so that the release layer DBL and the flexible substrate 110 are not in contact with each other at the position of the substrate recess structure 314. For example, the recessed substrate structure 314 and the recessed release structure DS may be formed by the same process (laser pulse process), i.e., the recessed substrate structure 314 and the recessed release structure DS are formed simultaneously, but the invention is not limited thereto, and the recessed substrate structure 314 and the recessed release structure DS may be formed by different processes or at different times. In the embodiment, the substrate recess structure 314 and the release recess structure DS may not overlap in the top view direction D, so that the contact area between the release layer DBL and the flexible substrate 110 is smaller, but the invention is not limited thereto. In detail, the substrate recess structure 314 may include a first substrate recess structure 314a and/or a second substrate recess structure 314b, the first substrate recess structure 314a is adjacent to the edge of the flexible substrate 110, and the second substrate recess structure 314b has no specific requirement on the installation position, for example, the distance between the first substrate recess structure 314a and the edge of the flexible substrate 110 in the top view direction D is less than or equal to 10 mm, and the distance between the second substrate recess structure 314b and the edge of the flexible substrate 110 in the top view direction D is greater than 10 mm, but the invention is not limited thereto. In addition, the electronic component 122 in the electronic component layer 120 may overlap the second substrate recess structure 314b in the top view direction D, and may overlap or not overlap the first substrate recess structure 314 a. In addition, the depth of the substrate recess structure 314 may be less than or equal to 10 microns, or less than or equal to 8 microns, or the ratio of the depth of the substrate recess structure 314 to the maximum thickness of the flexible substrate 110 may be less than 1, or less than or equal to 0.8, but the invention is not limited thereto. In addition, the pattern of the substrate recess structure 314 in the top view direction D is a dot, a stripe, a circle, a polygon, a combination of the above shapes, or other suitable shapes, and the size of the pattern can also be designed according to actual requirements. In addition, the sidewall of the substrate recess 314 may or may not be perpendicular to the substrate surface 110s, but the invention is not limited thereto.
In another embodiment, similar to the releasing recess structure DS, the substrate recess structures 314 may be formed on the substrate surface 110s of the flexible substrate 110 in any distribution manner, wherein among the substrate recess structures 314, the substrate recess structure 314 having a distance less than or equal to 10 mm from the edge of the flexible substrate 110 is defined as a first substrate recess structure 314a, and the remaining substrate recess structures 314 are defined as second substrate recess structures 314 b.
As shown in fig. 1 and 14, after the substrate recess structure 314 and the release recess structure DS are formed, the release process described in step S6 is performed to separate the electronic device 300 from the release layer DBL. Due to the formation of the substrate recess structure 314, the contact area between the release layer DBL and the flexible substrate 110 is smaller, so that the overall adhesion between the release layer DBL and the flexible substrate 110 is further reduced, the yield of separating the electronic device 300 and the carrier board CB is improved, and the production yield of the electronic device 300 is further improved. In the electronic device 300 shown in fig. 14, the substrate surface 110s of the flexible substrate 110 opposite to the electronic device layer 120 has a roughened portion caused by the substrate recess structure 314, and the substrate recess structure 314 may have a burning trace caused by the laser pulse LS, and the portion of the substrate surface 110s corresponding to the release recess structure DS may also have a burning trace caused by the laser pulse LS.
In addition, in a variation embodiment, as shown in fig. 15, the substrate surface 110s of the flexible substrate 110 opposite to the electronic element layer 120 may further have additional recesses 112, and the recesses 112 are formed in the process of forming the release recess structure DS, and the contents thereof can refer to fig. 5 and 6 and the related description thereof, and are not repeated herein. Therefore, in the electronic device 300' of fig. 15, the roughened portion of the substrate surface 110s of the flexible substrate 110 may be caused by the substrate recess structure 314 and the recess 112, the substrate recess structure 314 and the recess 112 may have burning traces, and the portion of the substrate surface 110s corresponding to the release recess structure DS may also have burning traces. In addition, in the embodiment, the depth of the substrate recess structure 314 may be the same as or different from the depth of the recess 112, and in the embodiment, the depth of the substrate recess structure 314 is greater than the depth of the recess 112, but the invention is not limited thereto.
In addition, the method for manufacturing an electronic device of the present invention may further include other steps, and the steps may be performed before or after any of the above steps, or may be performed between any two of the above steps. In addition, the steps of the method for manufacturing the electronic device described above may be adjusted or changed in the order of execution without departing from the spirit and principles of the present invention.
In summary, in the invention, the contact area between the flexible substrate and the release layer is reduced due to the formation of the release recess structure, so as to reduce the overall adhesive force between the flexible substrate and the release layer, and therefore, the adhesive force to be overcome in the release process is reduced, which can reduce the possibility of cracking or damaging the flexible substrate, so as to improve the yield of separating the electronic device and the carrier plate, and further improve the production yield of the electronic device, and in addition, can even reduce the force applied to separate the electronic device and the carrier plate.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A method of manufacturing an electronic device, comprising:
providing a carrier plate;
forming a release layer on the carrier, wherein the release layer has a release surface opposite to the carrier;
forming a flexible substrate on the release surface of the release layer, wherein the flexible substrate has a substrate surface in contact with the release surface;
forming an electronic element layer on the flexible substrate so that the flexible substrate and the electronic element layer form an electronic device;
after the flexible substrate is formed, a release recessed structure is formed on the release surface, so that the release layer and the flexible substrate are not in contact with each other at the position of the release recessed structure; and
after the release recessed structure is formed, a release process is performed to separate the electronic device from the release layer.
2. The method of claim 1, wherein the step of forming the release recess structure is performed between the step of forming the flexible substrate and the step of forming the electronic component layer.
3. The method of manufacturing an electronic device according to claim 1, wherein the step of forming the release recess structure is performed after the step of forming the electronic element layer.
4. The method of manufacturing an electronic device according to claim 1, further comprising:
after the flexible substrate is formed, a substrate concave structure is formed on the surface of the substrate, so that the release layer and the flexible substrate are not in contact with each other at the position of the substrate concave structure.
5. The method of manufacturing an electronic device according to claim 1, wherein after the releasing recess structure is formed, a burn mark is formed on the surface of the flexible substrate.
6. The method of manufacturing an electronic device according to claim 1, wherein a portion of the surface of the substrate is roughened at the same time as the step of forming the release recess structure.
7. The method of claim 1, wherein a distance between the releasing recess structure and the edge of the flexible substrate in a top view direction is less than or equal to 10 mm.
8. The method of claim 1, wherein the pattern of the release recess structure in the top view direction is dot-shaped, stripe-shaped, circular, polygonal, or a combination thereof.
9. The method of claim 1, wherein after the forming the releasing recess structure, an overall adhesion between the flexible substrate and the releasing layer is less than an overall adhesion between the releasing layer and the carrier.
10. The method of claim 1, wherein the step of forming the release recess structure comprises forming the release recess structure using a laser pulse process.
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Application publication date: 20200602 |