CN111222242A - Method for geometric cutting and grid optimization based on grid and electronic equipment - Google Patents
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Abstract
The invention discloses a method for geometric cutting and grid optimization based on grids and electronic equipment, wherein the method comprises the following steps: determining a geometric surface needing to be cut in the grid; based on a given geometric surface, marking the grid cells of the grid outside the geometric surface as cutting grid cells, and deleting the cutting grid cells; and projecting the nodes which are newly changed into boundaries in the grid after the grid unit cutting is deleted to the geometric surface to obtain a new grid. The invention directly modifies the model on the initial surface of the grid, and then locally optimizes the modified grid so as to save the time consumption brought by grid repartitioning and re-optimization.
Description
Technical Field
The invention relates to the technical field of grid correlation in computational mechanics, in particular to a method and electronic equipment for geometric cutting and grid optimization based on grids.
Background
With the widespread application of computational mechanics in industrial design, Computer Aided Design (CAD) and Computer Aided Engineering (CAE) play a great role therein. First, a digitized geometric model can be created by CAD software. Then, grid discretization processing is carried out on the geometric model, and small cells which are continuous one by one are generated. And finally, realizing digital simulation calculation by using CAE technology.
The discretized grid is a bridge connecting CAD modeling and CAE computational simulation. From the perspective of CAD modeling, the discretized mesh is intended to describe the digitized geometric model as accurately as possible. Meanwhile, from the perspective of CAE simulation calculation, the scale of the discrete grid determines the accuracy and efficiency of calculation, and assuming that the scale of the discrete grid is infinitesimal, the simulation result of calculation is necessarily closest to the real result, which results in huge calculation consumption. On the contrary, the grid scale is too large, and although the computing resource is saved, the computing precision cannot meet the requirement. Therefore, mesh optimization is particularly important in the process of establishing discrete meshes.
From the perspective of industrial design flow, a design engineer needs to establish a CAD model first, and then perform CAE simulation verification on the CAD model, thereby modifying and optimizing the CAD model. However, whenever a CAD model needs to be modified, for example, when a geometry needs to be cut by a given geometric surface, a new mesh needs to be created to represent the new geometry, and the mesh needs to be subdivided and re-optimized, which consumes much time and effort.
Disclosure of Invention
Based on this, it is necessary to provide a method and an electronic device for grid-based geometric cutting and grid optimization for solving the technical problem of the prior art that grid division requires much time and effort.
The invention provides a method for geometric cutting and grid optimization based on grids, which comprises the following steps:
determining a geometric surface needing to be cut in the grid;
based on a given geometric surface, marking the grid cells of the grid outside the geometric surface as cutting grid cells, and deleting the cutting grid cells;
and projecting the nodes which are newly changed into boundaries in the grid after the grid unit cutting is deleted to the geometric surface to obtain a new grid.
Further, still include:
one or more grid cells are selected from the formed new grid for optimization.
Further, the selecting one or more grid cells from the formed new grid for optimization specifically includes:
and selecting grid cells in a preset range facing the inside of the grid from the geometric surface as a starting surface from the formed new grid for optimization.
Still further, the selecting a mesh unit within a preset range facing the inside of the mesh with the geometric surface as a starting surface for optimization specifically includes:
the optimization is performed by selecting grid cells within a range of 3-4 cell sizes starting from the geometric surface and facing towards the interior of the grid.
Still further, the performing optimization specifically includes: and performing multiple operations on the selected grid cells, and selecting the operation with the maximum total cell mass of all the grid cells after the operation as an optimization operation, wherein the operation comprises moving, deleting and/or adding grid nodes.
The invention provides an electronic device for mesh-based geometric cutting and mesh optimization, comprising:
at least one processor; and the number of the first and second groups,
a memory communicatively coupled to the at least one processor; wherein the content of the first and second substances,
the memory stores instructions executable by the one processor to cause the at least one processor to:
determining a geometric surface needing to be cut in the grid;
based on a given geometric surface, marking the grid cells of the grid outside the geometric surface as cutting grid cells, and deleting the cutting grid cells;
and projecting the nodes which are newly changed into boundaries in the grid after the grid unit cutting is deleted to the geometric surface to obtain a new grid.
Further, the processor is further capable of:
one or more grid cells are selected from the formed new grid for optimization.
Further, the selecting one or more grid cells from the formed new grid for optimization specifically includes:
and selecting grid cells in a preset range facing the inside of the grid from the geometric surface as a starting surface from the formed new grid for optimization.
Still further, the selecting a mesh unit within a preset range facing the inside of the mesh with the geometric surface as a starting surface for optimization specifically includes:
the optimization is performed by selecting grid cells within a range of 3-4 cell sizes starting from the geometric surface and facing towards the interior of the grid.
Still further, the performing optimization specifically includes: and performing multiple operations on the selected grid cells, and selecting the operation with the maximum total cell mass of all the grid cells after the operation as an optimization operation, wherein the operation comprises moving, deleting and/or adding grid nodes.
The invention directly modifies the model on the initial surface of the grid, and then locally optimizes the modified grid so as to save the time consumption brought by grid repartitioning and re-optimization.
Drawings
FIG. 1 is a flowchart of the operation of a method of the present invention for grid-based geometric partitioning and grid optimization;
FIG. 2 is a flowchart of the operation of a method for mesh-based geometric partitioning and mesh optimization in accordance with the preferred embodiment of the present invention;
FIG. 3 is a side view of a grid cut;
FIG. 4 is a grid cut perspective view;
FIG. 5 is a side view of a portion of the grid cut;
FIG. 6 is a perspective view of a cut portion of the grid;
FIG. 7 is a side view of the grid after cutting;
FIG. 8 is a perspective view of the grid after cutting;
FIG. 9 is a projected side view after grid cutting;
FIG. 10 is a perspective view of the grid cut projection;
FIG. 11 is a side view of the grid cut optimized;
FIG. 12 is an optimized perspective view after grid cutting;
fig. 13 is a schematic diagram of a hardware structure of an electronic device for mesh-based geometric slicing and mesh optimization according to the present invention.
Detailed Description
The invention is described in further detail below with reference to the figures and specific examples.
Fig. 1 is a flowchart illustrating a method for geometry cutting and mesh optimization based on a mesh according to the present invention, which includes:
step S101, determining a geometric surface needing to be cut in a grid;
step S102, based on a given geometric surface, marking the grid unit of the grid outside the geometric surface as a cutting grid unit, and deleting the cutting grid unit;
step S103, projecting the nodes which are newly changed into boundaries in the grid after the grid unit is cut off onto the geometric surface to obtain a new grid.
Specifically, the geometric surface includes not only a straight line or a plane but also a curved line or a curved surface. The mesh types suitable for use are not limited to triangular, tetrahedral cell meshes, but also quadrilateral, hexahedral cell meshes.
And projecting the nodes which are newly changed into the boundary onto the geometric surface, which is equivalent to moving the coordinates of the grid nodes, and avoiding the consumption caused by generating a new grid without regenerating grid units.
The invention directly modifies the model on the initial surface of the grid, and then locally optimizes the modified grid so as to save the time consumption brought by grid repartitioning and re-optimization.
In one embodiment, the method further comprises the following steps:
one or more grid cells are selected from the formed new grid for optimization.
The embodiment optimizes the grid to improve the projection effect. By selecting part of grid cells for optimization, the optimization of the whole grid can be avoided, and only local optimization is needed to achieve the purpose of saving calculation.
In one embodiment, the selecting one or more grid cells from the formed new grid for optimization specifically includes:
and selecting grid cells in a preset range facing the inside of the grid from the geometric surface as a starting surface from the formed new grid for optimization.
In one embodiment, the selecting a mesh unit in a preset range facing the inside of the mesh with the geometric surface as a starting surface for optimization specifically includes:
the optimization is performed by selecting grid cells within a range of 3-4 cell sizes starting from the geometric surface and facing towards the interior of the grid.
In one embodiment, the performing optimization operation specifically includes: and performing multiple operations on the selected grid cells, and selecting the operation with the maximum total cell mass of all the grid cells after the operation as an optimization operation, wherein the operation comprises moving, deleting and/or adding grid nodes.
Specifically, the preset range is about 3-4 cell sizes in thickness, and the grid nodes are moved, deleted and added, so that the optimized grid cells have high cell quality.
Fig. 2 is a flowchart illustrating a method for mesh-based geometric segmentation and mesh optimization according to a preferred embodiment of the present invention, which includes:
in step S201, based on the existing mesh 1, the mesh may be a triangular/quadrangular unit mesh or a tetrahedral/hexahedral unit mesh. Given the geometric surface 2 to be cut, as shown in fig. 3 and 4, the grid needs to be cut.
Step S202, based on the given geometric surface 2, determines whether each cell of the grid 1 is outside the given geometric surface, and if there is only one node in the cell, it is determined that the cell is outside. The cut-out mesh cells 3 are deleted. As shown in fig. 5 and 6.
Step S203, finally obtaining the units reserved after cutting as shown in fig. 7 and 8, where the node 4 is the node of the new grid which newly becomes the boundary.
Step S204, finally, as shown in fig. 9 and 10, the node 4 of the new mesh which is newly changed into the boundary is projected onto the given geometric surface 2, and a mesh model of the cut geometric body is formed.
Step S205, optimizing the mesh of the formed mesh model of the new geometric body, wherein the optimized mesh cells are mainly concentrated near the given geometric surface 2. A new mesh cell 5 optimized as shown in fig. 11 and 12 is obtained.
Fig. 13 is a schematic diagram of a hardware structure of an electronic device for mesh-based geometric cutting and mesh optimization according to the present invention, which includes:
at least one processor 1301; and the number of the first and second groups,
a memory 1302 in communication with the at least one processor 1301; wherein the content of the first and second substances,
the memory 1302 stores instructions executable by the at least one processor to enable the at least one processor to:
determining a geometric surface needing to be cut in the grid;
based on a given geometric surface, marking the grid cells of the grid outside the geometric surface as cutting grid cells, and deleting the cutting grid cells;
and projecting the nodes which are newly changed into boundaries in the grid after the grid unit cutting is deleted to the geometric surface to obtain a new grid.
In fig. 13, one processor 1302 is illustrated as an example.
The electronic device may further include: an input device 1303 and an output device 1304.
The processor 1301, the memory 1302, the input device 1303 and the display device 1304 may be connected by a bus or other means, and the bus connection is taken as an example in the figure.
The memory 1302, which is a non-volatile computer-readable storage medium, may be used to store non-volatile software programs, non-volatile computer-executable programs, and modules, such as program instructions/modules corresponding to the method for mesh-based geometric partitioning and mesh optimization in the embodiments of the present application, for example, the method flows shown in fig. 1 and fig. 2. The processor 1301 executes various functional applications and data processing, i.e., implementing the method of mesh-based geometric cutting and mesh optimization in the above-described embodiments, by running non-volatile software programs, instructions, and modules stored in the memory 1302.
The memory 1302 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application program required for at least one function; the storage data area may store data created according to the use of the mesh-based geometric cutting and mesh optimization method, and the like. Further, the memory 1302 may include high speed random access memory and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other non-volatile solid state storage device. In some embodiments, memory 1302 may optionally include memory remotely located from processor 1301, which may be connected over a network to a device performing the method of mesh-based geometric cutting and mesh optimization. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The input device 1303 may receive input user clicks and generate signal inputs related to user settings and function control of the method of grid-based geometric cutting and grid optimization. The display device 1304 may include a display device such as a display screen.
The one or more modules stored in the memory 1302, when executed by the one or more processors 1301, perform the method of mesh-based geometric cutting and mesh optimization in any of the method embodiments described above.
The invention directly modifies the model on the initial surface of the grid, and then locally optimizes the modified grid so as to save the time consumption brought by grid repartitioning and re-optimization.
In one embodiment, the processor is further capable of:
one or more grid cells are selected from the formed new grid for optimization.
The embodiment optimizes the grid to improve the projection effect. By selecting part of grid cells for optimization, the optimization of the whole grid can be avoided, and only local optimization is needed to achieve the purpose of saving calculation.
In one embodiment, the selecting one or more grid cells from the formed new grid for optimization specifically includes:
and selecting grid cells in a preset range facing the inside of the grid from the geometric surface as a starting surface from the formed new grid for optimization.
In one embodiment, the selecting a mesh unit in a preset range facing the inside of the mesh with the geometric surface as a starting surface for optimization specifically includes:
the optimization is performed by selecting grid cells within a range of 3-4 cell sizes starting from the geometric surface and facing towards the interior of the grid.
In one embodiment, the performing optimization operation specifically includes: and performing multiple operations on the selected grid cells, and selecting the operation with the maximum total cell mass of all the grid cells after the operation as an optimization operation, wherein the operation comprises moving, deleting and/or adding grid nodes.
Specifically, the preset range is about 3-4 cell sizes in thickness, and the grid nodes are moved, deleted and added, so that the optimized grid cells have high cell quality.
The above detailed description is specific to one possible embodiment of the present invention, and the embodiment is not intended to limit the scope of the present invention, and all equivalent implementations or modifications that do not depart from the scope of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A method for mesh-based geometric cutting and mesh optimization, comprising:
determining a geometric surface needing to be cut in the grid;
based on a given geometric surface, marking the grid cells of the grid outside the geometric surface as cutting grid cells, and deleting the cutting grid cells;
and projecting the nodes which are newly changed into boundaries in the grid after the grid unit cutting is deleted to the geometric surface to obtain a new grid.
2. The method of mesh-based geometric cut and mesh optimization of claim 1, further comprising:
one or more grid cells are selected from the formed new grid for optimization.
3. The method of mesh-based geometric cutting and mesh optimization according to claim 2, wherein the selecting one or more mesh cells from the formed new mesh for optimization specifically comprises:
and selecting grid cells in a preset range facing the inside of the grid from the geometric surface as a starting surface from the formed new grid for optimization.
4. The method of claim 3, wherein the selecting the mesh cells within a preset range facing the inside of the mesh from the geometric surface is optimized by:
the optimization is performed by selecting grid cells within a range of 3-4 cell sizes starting from the geometric surface and facing towards the interior of the grid.
5. The method of mesh-based geometric cutting and mesh optimization according to claim 3, wherein the performing optimization operations specifically comprises: and performing multiple operations on the selected grid cells, and selecting the operation with the maximum total cell mass of all the grid cells after the operation as an optimization operation, wherein the operation comprises moving, deleting and/or adding grid nodes.
6. An electronic device for mesh-based geometric cutting and mesh optimization, comprising:
at least one processor; and the number of the first and second groups,
a memory communicatively coupled to the at least one processor; wherein the content of the first and second substances,
the memory stores instructions executable by the one processor to cause the at least one processor to:
determining a geometric surface needing to be cut in the grid;
based on a given geometric surface, marking the grid cells of the grid outside the geometric surface as cutting grid cells, and deleting the cutting grid cells;
and projecting the nodes which are newly changed into boundaries in the grid after the grid unit cutting is deleted to the geometric surface to obtain a new grid.
7. The mesh-based geometry cutting and mesh optimization electronic device of claim 6, wherein the processor is further capable of:
one or more grid cells are selected from the formed new grid for optimization.
8. The mesh-based geometric cut and mesh optimization electronic device of claim 7, wherein the selecting one or more mesh cells from the formed new mesh for optimization comprises:
and selecting grid cells in a preset range facing the inside of the grid from the geometric surface as a starting surface from the formed new grid for optimization.
9. The electronic device for geometry based mesh cutting and mesh optimization according to claim 8, wherein the selecting mesh cells within a preset range facing the inside of the mesh starting from the geometric surface for optimization comprises:
the optimization is performed by selecting grid cells within a range of 3-4 cell sizes starting from the geometric surface and facing towards the interior of the grid.
10. The electronic device for mesh-based geometric cutting and mesh optimization according to claim 8, wherein the performing optimization operations specifically comprises: and performing multiple operations on the selected grid cells, and selecting the operation with the maximum total cell mass of all the grid cells after the operation as an optimization operation, wherein the operation comprises moving, deleting and/or adding grid nodes.
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Application publication date: 20200602 |