CN111220289B - Test method for testing internal temperature field of power switch cabinet - Google Patents
Test method for testing internal temperature field of power switch cabinet Download PDFInfo
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- 238000012360 testing method Methods 0.000 title claims abstract description 47
- 238000010998 test method Methods 0.000 title claims abstract description 28
- 238000012546 transfer Methods 0.000 claims abstract description 27
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- 238000005485 electric heating Methods 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
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- 238000013461 design Methods 0.000 abstract description 5
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- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract 1
- 238000009529 body temperature measurement Methods 0.000 description 13
- 230000017525 heat dissipation Effects 0.000 description 11
- 229910052573 porcelain Inorganic materials 0.000 description 9
- 239000012212 insulator Substances 0.000 description 7
- 238000009423 ventilation Methods 0.000 description 6
- 239000000523 sample Substances 0.000 description 5
- 238000011160 research Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
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- 238000004458 analytical method Methods 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
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- 238000005457 optimization Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K3/00—Thermometers giving results other than momentary value of temperature
- G01K3/08—Thermometers giving results other than momentary value of temperature giving differences of values; giving differentiated values
- G01K3/14—Thermometers giving results other than momentary value of temperature giving differences of values; giving differentiated values in respect of space
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
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Abstract
The invention discloses a test method for testing an internal temperature field of a power switch cabinet, and belongs to the field of power temperature detection. The invention comprises the following steps: s1, selecting a panel; s2, mounting left and right panels; s3, installing a bus in the cabinet body; s4, mounting a patch type thermocouple bundle on the surface of the bus, and mounting a mesh thermocouple unit in the cabinet body; s5, mounting front and rear panels; s6, placing the temperature controller and the electric heating plate outside the cabinet body, and arranging a temperature sensor in the middle of each panel; s7, connecting the patch type thermocouple bundle and the mesh type thermocouple unit to a computer; and S8, calculating a convection heat transfer coefficient and radiation heat transfer coefficient table by using the temperature data detected under the variable condition. The invention overcomes the defects of high cost and incomplete measurement data of the power switch cabinet under different factors in the prior art, is beneficial to measuring the internal temperature field distribution of the power switch cabinet under different factor conditions, and provides reference opinions for later-stage design and researchers.
Description
Technical Field
The invention relates to the technical field of temperature detection in the power industry, in particular to a test method for an internal temperature field of a power switch cabinet.
Background
The power switch cabinet is a basic component of a power system, mainly comprises devices such as an isolating switch, a fuse, a breaker, a bus and the like, and is used for transmitting and distributing current, the safe and stable operation of the power switch cabinet is the key for ensuring the safe electricity utilization and continuous and stable transmission, the bus generates heat due to the existence of bus resistance, the bus transmits heat to the power switch cabinet in a convection and radiation mode, and then the heat is transmitted to the external environment by the power switch cabinet body, but if the heat generated by the bus cannot be timely discharged, the service life of the power switch cabinet can be seriously damaged, the temperature rise of the bus can be caused to be overlarge, even exceeds the allowable temperature rise of the bus, the bus system is finally caused to break down, and equipment can be caused to fire disaster in serious. Therefore, according to the distribution of the temperature field in the power switch cabinet, the heat dissipation capacity of the power switch cabinet is improved, and the safe and stable operation of the power switch cabinet is a basic subject of the research of the power switch cabinet. The electric current size, the outside environment temperature of power switch cabinet, the external dimensions of power switch cabinet, vent quantity and position on the power switch cabinet, bus interval and height and other factors all show and influence the distribution of temperature field in the power switch cabinet, and the distribution of temperature field in the current power switch cabinet is studied most of students and is not comprehensive to the temperature data collection in the power switch cabinet, and need test above-mentioned factor in the power switch cabinet of different specifications, and the test cost is high like this, and can't explore above-mentioned factor and influence each other. Therefore, how to comprehensively research the influence of the factors on the temperature field in the power switch cabinet is a technical problem which needs to be solved urgently by designing a simple and effective test method.
Through retrieval, a patent with publication number CN203705053U discloses an on-line temperature monitoring system for a power switch cabinet, which comprises a data processing device, a temperature acquisition device, a temperature data display device and a power supply device; the temperature acquisition device is a non-contact infrared probe, and the measurement step is to align the temperature measurement acquisition device with a bus close to a bus joint, transmit a temperature acquisition signal to the data processing device, convert an analog signal acquired by the infrared probe into a digital signal and transmit the digital signal to the display device. This application has avoided the influence to the normal work of power switch cabinet, but infrared measurement easily receives environmental factor to influence, and can't be under the condition of unknown generating line emissivity, measures the generating line temperature, and service condition is limited, and infrared temperature measurement theoretical basis is lagged behind.
The patent with publication number CN208568114U discloses a temperature detection device for an electric power switch cabinet, which is composed of a rear cover plate, a front cabinet door, a left cover plate and a right cover plate, wherein the top of the rear cover plate is provided with a plurality of heat dissipation holes distributed in an array manner, the rear cover plate is provided with a temperature measurement unit, and the front cabinet door and the left and right cover plates are arranged on the top of the rear; the temperature measuring unit is a temperature collecting probe, and the temperature measuring method is that the temperature collecting probe collects temperature signals and then transmits the temperature signals to the mobile terminal through the signal transmitting module to display the temperature signals. This application case lamina tecti trompil can effectively probe into power switch cabinet's radiating effect, and the temperature measurement data of temperature measurement unit department at the back shroud is comparatively comprehensive, nevertheless too limits to its temperature measurement method of temperature measurement of whole power switch cabinet temperature field, and the temperature measurement data is incomplete, and the analysis of top louvre to power switch cabinet heat dissipation influence is oversimplified, and top louvre specification type and position can't compare to power switch cabinet temperature distribution influence.
The patent with publication number CN206340867U discloses a heat dissipation and shock resistance cubical switchboard, including the power switch cabinet body, antidetonation device, the fan, the connecting block, the fixed block, temperature sensor, baffle and elevating gear, the antidetonation device is fixed on the switch cabinet body, plays the cushioning effect, and temperature sensor arranges in the cabinet body middle part, and when the temperature rose, temperature sensor transmitted signal for fan work and elevating gear decline baffle, when the temperature reduced to a definite value, fan work stopped, and elevating gear rose the baffle. The baffle that this power switch cabinet designed has prevented when reducing the cubical switchboard temperature that mechanical draft from arousing inside the dust gets into the cubical switchboard, but power switch cabinet's temperature measurement data is not comprehensive, and mechanical draft's reliability is poor simultaneously, and safety and stability nature is low, needs to improve power switch cabinet mechanical draft reliability and stability, therefore the preferred natural draft heat dissipation that still dispels heat of common power switch cabinet ventilation.
In conclusion, the design of the test method for testing the internal temperature field of the power switch cabinet is still crucial to the improvement of the heat dissipation capacity of the power switch cabinet and the safe and stable operation of a power system, and the research on the technology in the industry is never stopped.
Disclosure of Invention
1. Technical problem to be solved by the invention
The invention aims to solve the problems of high cost and incomplete measurement data of temperature field distribution research of the power switch cabinet under different factors in the prior art, and provides a test method for testing the internal temperature field of the power switch cabinet, which is beneficial to comprehensively and effectively measuring the internal temperature field distribution of the power switch cabinet under different factor conditions in the power switch cabinet and can also provide an optimization design idea with excellent heat dissipation for development and development of the power switch cabinet.
2. Technical scheme
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
the invention discloses a test method for testing an internal temperature field of a power switch cabinet, which adopts a temperature field comprehensive test device and comprises the following steps:
s1, selecting each panel with the size meeting the test requirement;
s2, sleeving the left panel and the right panel at proper positions on two sides of the lower panel and fastening;
s3, mounting the fixing frame on the lower panel, fixing the bus on the fixing frame according to the bus test height requirement, and fixing the upper panel on the tops of the left panel and the right panel;
s4, mounting surface-mount thermocouples at different positions on the surface of the bus to form surface-mount thermocouple bundles, hanging the mesh thermocouple units between the upper panel and the lower panel, and leading out all thermocouple wires to the outside of the cabinet body;
s5, mounting the front and rear panels and filling gaps generated in the cabinet body assembling process with insulating materials;
s6, placing the temperature controller and the electric heating plate outside the cabinet body, and arranging a temperature sensor in the middle of each panel;
s7, connecting the patch type thermocouple bundle and the mesh type thermocouple unit to a computer;
and S8, calculating a convection heat transfer coefficient and radiation heat transfer coefficient table by using the temperature data detected under the variable condition.
Further, the convective heat transfer coefficient h in S8cObtained by the formula 1-5
Ra ═ Gr · pr formula 3
T-mean surface temperature of the busbar at DEG C;
Tf-ambient temperature, ° c;
l-characteristic dimension of bus bar, m;
Gr-GravaXiaofu number;
g-acceleration of gravity, m/s2；
Beta-coefficient of thermal expansion of air, as can be seen from the thermal expansion coefficient table;
v-hydrodynamic viscosity, m2(s), which can be checked by an air viscosity meter;
Pr-Plantt number;
a-thermal diffusivity, m2S according to
Wherein k is air heat conductivity coefficient, which can be known by looking up the air heat conductivity coefficient table, ρ is air density, which can be known by looking up the air density table, cpThe specific heat capacity of air is known by looking up a specific heat capacity table;
Ra-Rey number;
Nu-Nussels number;
k is the air heat conductivity coefficient, W/(m.K), and can be known by looking up an air heat conductivity coefficient table;
heat transfer coefficient of radiation hrObtained by the following formula 6-7
Φr-radiation heat removal, W;
1the radiation emissivity is that the surface emissivity of copper is 0.07-0.15, and the surface emissivity of aluminum is 0.04-0.06;
the Stefan-Boltzmann constant having a value of 5.678 x 10-8W/(m2·K4)。
Furthermore, the comprehensive temperature field testing device comprises a cabinet body defined by panels with movably matched peripheries, wherein a plurality of rows of buses which are mutually insulated and connected are arranged in the cabinet body, patch type thermocouple bundles are arranged on each row of buses along the length direction, the plurality of rows of buses are distributed in parallel and are positioned on the same plane, a reticular thermocouple unit is also arranged in the cabinet body, the reticular thermocouple units are distributed in a planar latticed manner, and the plane formed by the reticular thermocouple units is vertical to the plane where the plurality of rows of buses are positioned; the surface-mounted thermocouple bundle and the mesh thermocouple unit are respectively connected with a computer; and the outer sides of the panels are respectively provided with a temperature sensor and an electric heating plate.
Furthermore, the cabinet body consists of six insulating panels, namely a lower panel, a front panel, a left panel, an upper panel, a rear panel and a right panel, and each panel is prefabricated with different sizes and specifications; the height of the buses and the distance between the buses can be adjusted, and the distance between the mesh thermocouple unit and the rear panel can be adjusted.
Furthermore, at least one mounting rack is arranged on the lower panel of the cabinet body along the length direction, sleeve holes matched with the mounting racks are correspondingly formed in the bottoms of the left panel and the right panel, and the left panel and the right panel slide on the lower panel through the matching of the mounting racks and the sleeve holes; the front side and the rear side of the left panel and the right panel are both provided with sliding grooves along the height direction, and the two sides of the front panel and the two sides of the rear panel are respectively correspondingly embedded into the sliding grooves for installation.
Furthermore, a fixed frame is arranged in the cabinet body, the fixed frame is connected with a row of buses through an insulating connecting frame, and the front side and the rear side of each row of buses are respectively connected with other rows of buses through the insulating connecting frames; an adjusting groove for the insulating connecting frame to slide is formed in the fixing frame along the height direction; the insulating connecting frame is prefabricated with different specifications.
Furthermore, the insulating connecting frame is an insulating porcelain bottle, an internal thread is arranged in the insulating porcelain bottle, connecting through holes are formed in the bus and the fixing frame, the insulating porcelain bottle and the bus and the insulating porcelain bottle and the fixing frame are fastened through screws, and the screws penetrate through the connecting through holes and are fastened with the insulating porcelain bottle.
Furthermore, the bus is a three-phase bus, the bus at the middle position is fixed on the fixing frame through the insulating connecting frame, and the other two-phase bus is fixed in the front and back direction of the bus at the middle position through the two insulating connecting frames respectively.
Furthermore, the mesh thermocouple units are distributed in a mesh shape, a thermocouple is uniformly distributed on each mesh node, the edges of the upper end and the lower end of each mesh thermocouple unit are respectively provided with an insulating piece, and the upper end and the lower end of each mesh thermocouple unit are respectively fixed on the upper panel and the lower panel through the insulating pieces.
Furthermore, the upper panel and the lower panel are provided with brackets for connecting and fixing the insulating parts, and the upper panel and the lower panel are correspondingly provided with a plurality of rows of brackets for connection along the front-back direction; the insulating part is an insulating connecting rope or an insulating connecting plate, and the insulating part is provided with a hook which is directly hooked on the support.
3. Advantageous effects
Compared with the prior art, the technical scheme provided by the invention has the following beneficial effects:
(1) the internal temperature field test method for the power switch cabinet is simple to operate, low in test cost, capable of simulating the internal temperature field distribution of the power switch cabinet under the condition of multiple factors, high in reliability of test results and wide in application prospect.
(2) According to the test method for the internal temperature field of the power switch cabinet, the mesh thermocouple units are vertically arranged in the cabinet body, so that the temperature distribution on the vertical plane in the cabinet body can be comprehensively and effectively measured, the distribution of the internal temperature field of the cabinet body can be comprehensively measured by matching with the surface-mounted thermocouple bundle, the temperature measurement principle is simple, the anti-interference capability is high, and the temperature measurement point can realize continuous and stable measurement.
(3) According to the test method for testing the internal temperature field of the power switch cabinet, the electric heating plate and the temperature sensor are arranged on the outer side of the cabinet body, so that the influence on the power switch cabinet under a high-temperature condition can be simulated.
Drawings
FIG. 1 is a schematic structural diagram of a comprehensive test device for a temperature field used in the present invention;
FIG. 2 is a schematic structural view of a lower panel according to the present invention;
FIG. 3 is a schematic structural view of a left panel according to the present invention;
FIG. 4 is a schematic view of the structure of the upper panel of the present invention;
FIG. 5 is a schematic structural view of the fixing frame of the present invention;
FIG. 6 is a schematic diagram of the distribution structure of the mesh thermocouple units in the present invention;
FIG. 7 is a schematic diagram of a distribution structure of a surface mount type thermocouple bundle in accordance with the present invention;
fig. 8 is a schematic flow chart of a test method for testing an internal temperature field of a power switch cabinet according to the present invention.
The reference numerals in the schematic drawings illustrate:
100. a base; 201. a mounting frame; 202. an outlet; 203. a wire inlet; 204. a chute; 205. trepanning; 210. a lower panel; 211. a front panel; 212. a left panel; 213. an upper panel; 214. a rear panel; 215. a right panel; 220. a fixed mount; 221. a card slot; 222. an adjustment groove; 230. a bus bar; 231. a surface mount type thermocouple bundle; 232. an insulating connecting frame; 233. a load; 234. a transformer; 235. a patrol instrument; 236. a computer; 240. a mesh thermocouple unit; 241. a temperature sensor; 250. an electrical heating plate; 251. a temperature controller.
Detailed Description
For a further understanding of the invention, reference should be made to the following detailed description taken in conjunction with the accompanying drawings.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The present invention will be further described with reference to the following examples.
Example 1
The test method for testing the internal temperature field of the power switch cabinet is specifically performed by adopting the comprehensive test device for testing the temperature field of the embodiment, as shown in fig. 1-7, the comprehensive test device for testing the temperature field of the embodiment comprises a cabinet body surrounded by panels with movably matched peripheries, wherein the cabinet body is specifically composed of six insulating panels, namely a lower panel 210, a front panel 211, a left panel 212, an upper panel 213, a rear panel 214 and a right panel 215, and each panel is prefabricated with different sizes and specifications, so that the size and the dimension of the cabinet body can be adjusted and changed; a plurality of rows of buses 230 which are mutually insulated and connected are arranged in the cabinet body, specifically bus copper bars, a surface-mounted thermocouple bundle 231 is arranged on each row of buses 230 along the length direction, the plurality of rows of buses 230 are distributed in parallel and are positioned on the same plane, namely a plurality of bus copper bars are positioned on the same plane; the cabinet body is also internally provided with a reticular thermocouple unit 240, the reticular thermocouple units 240 are distributed in a planar latticed manner, and the plane formed by the reticular thermocouple units 240 is vertical to the plane where the plurality of rows of bus bars 230 are located; specifically, the mesh thermocouple units 240 are vertically arranged in the cabinet body, and the multiple rows of bus bars 230 are horizontally arranged; the bus bars 230 are detachably designed, the height of the bus bars 230 in the cabinet body and the distance between the bus bars 230 can be adjusted, and the distance between the mesh thermocouple unit 240 and the rear panel 214 can be adjusted. The patch type thermocouple bundle 231 and the mesh type thermocouple unit 240 are respectively connected with the computer 236, and are specifically connected with the patrol instrument 235 and then connected with the computer 236, so that data acquisition of a computer system is realized; the outside of each panel is provided with temperature sensor 241 and electric heating plate 250 respectively, and the panel outside still is provided with temperature controller 251, and temperature sensor 241 and electric heating plate 250 link to each other with temperature controller 251 respectively, control the operating condition of electric heating plate 250 through temperature controller 251 to monitor external environment temperature through temperature sensor 241, realize that the external environment temperature of power switch cabinet is variable. Specifically, the electric heating plates 250 are respectively disposed at middle positions outside the respective panels through the brackets, and the temperature controllers 251 are also respectively disposed at middle positions on the respective panels.
In the cabinet body structure of the power switch cabinet in this embodiment, variable cabinet bodies with different sizes and structures can be formed by selecting insulation panels with different specifications and assembling, the bus 230 is a detachable bus unit, and can realize the changes in the specification, the spacing and the height of the bus, two ends of the bus 230 are respectively connected with the load 233 and the transformer 234, and the transformer 234 is connected with an alternating current power supply to control the current size change of the bus 230; the temperature field detection unit realizes comprehensive and effective measurement and recording of the temperature field in the switch cabinet body and the bus through the patch type thermocouple bundle 231 and the mesh type thermocouple unit 240, and the environment temperature control unit can realize the change of the external environment of the switch cabinet within the range from normal temperature to 120 ℃ through the temperature sensor 241 and the electric heating plate 250. Still seted up a plurality of vents on each panel in this embodiment, can realize the adjustment to ventilation position and draught area through the vent of opening or blockking up different positions, it is therefore visible, the device of this embodiment can be explored power switch cabinet draught area, the generating line interval, the generating line height, the influence of ambient temperature to the inside temperature field, thereby can be according to the distribution law in the inside temperature field of power switch cabinet of measuring, for reasonable part of power switch cabinet selection, operating temperature environment and equipment arrangement form, improve power switch cabinet's whole heat dissipation capacity, promote power switch cabinet safe and stable operation.
Specifically, the present embodiment further includes a movable base 100, specifically, a concrete base may be adopted, the lower panel 210 is placed on the bases 100 on both sides, the lower panel 210 is further provided with a wire inlet 203 and a wire outlet 202 for a wire to enter and exit, as shown in fig. 2, at least one mounting rack 201 is arranged on the lower panel 210 of the cabinet body along the length direction; as shown in fig. 3, the bottom of the left panel 212 and the right panel 215 are correspondingly provided with a sleeve hole 205 matched with the mounting rack 201, and the left panel 212 and the right panel 215 slide on the lower panel 210 through the matching of the mounting rack 201 and the sleeve hole 205; specifically, the mounting bracket 201 is a T-shaped bracket and is provided with three, the sleeve holes 205 at the bottoms of the left panel 212 and the right panel 215 are correspondingly arranged to form T-shaped through grooves, the mounting bracket 201 penetrates through the sleeve holes 205 and can be placed at different positions, the length change of the cabinet body is realized, gaskets are arranged at the edge positions of the sleeve holes 205 on the left panel 212 and the right panel 215, and the gaskets and the mounting bracket 201 are fastened through screws, so that the mounting bracket is convenient to detach and replace different specifications. The front and rear sides of the left panel 212 and the right panel 215 are both provided with sliding grooves 204 along the height direction, and the two sides of the front panel 211 and the rear panel 214 are respectively and correspondingly embedded into the sliding grooves 204 for installation. The upper panel 213 is left with cover plates extending downward on the left and right sides and is fastened to the left and right panels by screws, respectively, as shown in fig. 4.
In this embodiment, a fixing frame 220 is disposed in the cabinet body, the fixing frame 220 is connected to a row of bus bars 230 through an insulating connecting frame 232, and the front side and the rear side of the row of bus bars 230 are respectively connected to other rows of bus bars 230 through the insulating connecting frame 232; an adjusting groove 222 for the insulating connecting frame 232 to slide is formed in the fixing frame 220 along the height direction, specifically, as shown in fig. 5, a three-section adjusting groove 222 can be formed in the fixing frame 220, the middle section is long, and the two end sections are short, so that the insulating connecting frame 232 can be fastened and stably supported; the insulating link 232 is pre-fabricated with different length specifications. Specifically, the fixing frame 220 is made of angle steel, a clamping groove 221 is reserved at the bottom of the angle steel, the clamping groove 221 is matched with the T-shaped support, so that the bottom of the angle steel is clamped on the mounting frame 201 of the lower panel 210 in a clamping manner, a gasket is further arranged at the edge of the clamping groove 221, the gasket is in contact with the T-shaped support and is fastened and locked through screws, and the fixing frame 220 is fastened; insulating link 232 is the insulator, has seted up the internal thread in the insulator, has all seted up connect hole on generating line 230 and the mount 220, all through the screw-up between insulator and the generating line 230, between insulator and the mount 220, the screw passes connect hole and fastens with the insulator. In this embodiment, the bus 230 is a three-phase bus, the bus at the middle position is fixed on the fixing frame 220 through the insulating connecting frame 232, and the other two-phase bus is fixed in the front-back direction of the bus at the middle position through two insulating connecting frames 232. Specifically, as shown in fig. 1, two sides of the intermediate position bus bar are both provided with a connecting through hole, the fixing frame 220 is provided with an adjusting groove 222, i.e., a connecting through hole, the connecting through holes on the two sides of the intermediate position bus bar are respectively provided with an insulating porcelain bottle by a screw, and the other end of the insulating porcelain bottle is locked in the adjusting groove 222 by a screw, so as to realize the installation and fixation of the intermediate position bus bar; other connecting through holes are further formed in the bus copper bar at the middle position, two insulating porcelain bottles are connected to the front of the bus copper bar, another bus copper bar is connected to the front of the bus copper bar in a screw fastening mode, two insulating porcelain bottles are connected to the rear of the bus copper bar, and another bus copper bar is connected to the rear of the bus copper bar in a screw fastening mode. The three-phase bus is located the coplanar parallel with lower panel 210, and the intermediate position bus can realize the nimble adjustment of direction of height through the fastening position of adjustment insulator in adjustment tank 222 to realize the altitude variation of whole three-phase bus, through adopting the insulator of prefabricated different specification length, realize the nimble adjustment of bus interval.
In this embodiment, patch thermocouples are installed at different positions on the surface of the bus 230 to form patch thermocouple bundles 231, as shown in fig. 7, the mesh thermocouple units 240 are distributed in a grid shape, as shown in fig. 6, a thermocouple is uniformly distributed on each grid node, the edges of the upper and lower ends of the mesh thermocouple units 240 are provided with insulating members, and the upper and lower ends of the mesh thermocouple units 240 are respectively fixed on the upper panel 213 and the lower panel 210 through the insulating members. Specifically, the upper panel 213 and the lower panel 210 are provided with supports for connecting and fixing the insulating members, and the upper panel 213 and the lower panel 210 are correspondingly provided with a plurality of rows of supports for connection in the front-back direction, so that the mesh thermocouple unit 240 can be integrally adjusted and placed at different positions in the front-back direction of the cabinet body, and comprehensive collection and simulation of an internal temperature field can be realized; the insulating part can adopt to be insulating connection rope or insulating connecting plate, is provided with the couple on the insulating part and directly hooks on the support, and direct through with the couple hook on the support of different positions during the in-service use, can realize the position adjustment to netted thermocouple unit 240.
The method for testing the internal temperature field of the power switch cabinet in the embodiment utilizes the temperature field comprehensive testing device and comprises the following steps:
s1, selecting each panel with the size and the ventilation mode meeting the test requirements, adjusting the two movable bases 100 to a proper distance according to the width of the lower panel 210, and placing the lower panel 210 on the two bases 100;
s2, sleeving the left panel 212 and the right panel 215 at proper positions on two sides of the lower panel 210 and fastening; specifically, a left panel 212 and a right panel 215 are sleeved on the lower panel 210 through a welded mounting frame 201 on the lower panel 210 and a sleeve hole 205 reserved on the left panel and the right panel, and are fastened through screws;
s3, mounting the fixing frame 220 on the lower panel 210, fixing the bus 230 on the fixing frame 220 according to the bus test height requirement, and fixing the upper panel 213 on the top of the left panel and the right panel; specifically, the fixing frame 220 with the reserved clamping groove 221 is sleeved on the mounting frame 201 through the clamping groove 221 and fastened through screws, the middle-position bus 230 is fixed on the fixing frame 220 at a selected height through the insulating connecting frame 232 according to the bus test height requirement, the other two phases of buses 230 are fixed in the front-back direction of the middle-position bus 230 through the insulating connecting frame 232, and then the upper panel 213 is fixed on the tops of the left panel and the right panel;
s4, mounting patch type thermocouples at different positions on the surface of the bus 230 to form a patch type thermocouple bundle 231, hanging the mesh type thermocouple unit 240 between the upper panel and the lower panel, and leading out all thermocouple wires to the outside of the cabinet body;
s5, sliding the front and rear panels from top to bottom through the sliding grooves 204 reserved on the front and rear sides of the left and right panels, and filling gaps generated in the cabinet body assembling process with insulating materials;
s6, placing the temperature controller 251 and the electric heating plate 250 near the cabinet body, and arranging the temperature sensor 241 in the middle of each panel to realize the simulation of the cabinet body environment temperature;
s7, connecting the patch type thermocouple bundle 231 and the mesh type thermocouple unit 240 to a computer 236 through a patrol instrument 235, and completing computer system acquisition;
s8, calculating a convection heat transfer coefficient and radiation heat transfer coefficient table by using the temperature data detected under the above variable conditions, wherein the calculation flow is as shown in fig. 8:
convective heat transfer coefficient hcObtained by the formula 1-5
Ra ═ Gr · pr formula 3
T-mean surface temperature of the busbar at DEG C;
Tf-ambient temperature, ° c;
l-characteristic dimension of bus bar, m;
Gr-GravaXiaofu number;
g-acceleration of gravity, m/s2；
Beta-coefficient of thermal expansion of air, as can be seen from the thermal expansion coefficient table;
v-hydrodynamic viscosity, m2S, from air viscosityThe table can be looked up;
Pr-Plantt number;
a-thermal diffusivity, m2S according to
Wherein k is air heat conductivity coefficient, which can be known by looking up the air heat conductivity coefficient table, ρ is air density, which can be known by looking up the air density table, cpThe specific heat capacity of air is known by looking up a specific heat capacity table;
Ra-Rey number;
Nu-Nussels number;
k is the air heat conductivity coefficient, W/(m.K), and can be known by looking up an air heat conductivity coefficient table.
Heat transfer coefficient of radiation hrObtained by the following formula 6-7
Φr-radiation heat removal, W;
1the radiation emissivity is that the surface emissivity of copper is 0.07-0.15, and the surface emissivity of aluminum is 0.04-0.06;
the Stefan-Boltzmann constant having a value of 5.678 x 10-8W/(m2·K4)。
The test method of the embodiment is simple and easy to operate, the obtained convection heat transfer coefficient and radiation heat transfer coefficient can effectively predict the heat dissipation performance of the switch cabinet in the power industry, and the actual application prospect is wide; the test cost is low, the distribution of the temperature field in the power switch cabinet under the multi-factor condition can be simulated, and the reliability of the test result is high; the reticular thermocouple units 240 are vertically arranged in the cabinet body, so that the temperature distribution on the vertical plane in the cabinet body can be comprehensively and effectively measured, the distribution of the temperature field in the cabinet body can be comprehensively measured by matching with the surface-mounted thermocouple bundle 231, the temperature measurement principle is simple, the anti-interference capability is high, and the temperature measurement point can be continuously and stably measured. The radiation convection heat transfer coefficient table is obtained by the test method of the embodiment, reference opinions can be provided for later stage design and researchers, and corresponding related parameters are obtained according to table look-up.
Example 2
The method for testing the internal temperature field of the power switch cabinet in this embodiment is basically the same as that in embodiment 1, and specifically in this embodiment, according to the temperature field distribution conditions in the power switch cabinet under different current conditions, the distribution rule of the power switch cabinet, the convective heat transfer coefficient and the radiative heat transfer coefficient table are obtained.
Example 3
The method for testing the internal temperature field of the power switch cabinet is basically the same as that in embodiment 1, and further, in this embodiment, different numbers of ventilation openings on the six side panels are blocked, the influence of the numbers and positions of the ventilation openings on the temperature field in the power switch cabinet is explored, corresponding convection heat transfer coefficient and radiation heat transfer coefficient tables are obtained, and a ventilation opening scheme with good heat dissipation is conveniently provided for the power switch cabinet.
Example 4
The method for testing the internal temperature field of the power switch cabinet in the embodiment is basically the same as that in embodiment 1, and further, in the embodiment, the distance between the left panel and the right panel is changed through the mounting rack 201 on the lower panel 210, so that the specification of the power switch cabinet is changed, the distribution rule of the temperature field of the power switch cabinet without the specification is researched, and a corresponding convective heat transfer coefficient table and a corresponding radiative heat transfer coefficient table are obtained.
Example 5
The method for testing the internal temperature field of the power switchgear in this embodiment is substantially the same as that in embodiment 1, and further, in this embodiment, by changing different fixing positions of the bus 230 on the fixing frame 220 and selecting the insulating connecting frames 232 with different length specifications, influences of the height and the distance of the bus 230 on the internal temperature field of the power switchgear are explored, and corresponding convective heat transfer coefficient and radiative heat transfer coefficient tables are obtained.
Example 6
The method for testing the internal temperature field of the power switch cabinet in this embodiment is basically the same as that in embodiment 1, and further, in this embodiment, the simulation of the environmental temperature of the cabinet body is realized by arranging the electric heating plate 250 and the temperature sensor 241, the operation of the power switch cabinet under a high temperature condition is simulated, a heat dissipation scheme for prolonging the working time of the power switch cabinet under the high temperature condition is explored, and a corresponding convective heat transfer coefficient and radiative heat transfer coefficient table is obtained.
The present invention and its embodiments have been described above schematically, without limitation, and what is shown in the drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. Therefore, if the person skilled in the art receives the teaching, without departing from the spirit of the invention, the person skilled in the art shall not inventively design the similar structural modes and embodiments to the technical solution, but shall fall within the scope of the invention.
Claims (9)
1. A test method for testing an internal temperature field of a power switch cabinet is characterized by comprising the following steps: the comprehensive testing device for the temperature field is adopted, the comprehensive testing device for the temperature field comprises a cabinet body formed by panels with movably matched peripheries in a surrounding mode, a plurality of rows of buses (230) which are connected in an insulated mode are arranged in the cabinet body, patch type thermocouple bundles (231) are arranged on each row of buses (230) along the length direction, the plurality of rows of buses (230) are distributed in parallel and located on the same plane, a mesh thermocouple unit (240) is further arranged in the cabinet body, the mesh thermocouple units (240) are distributed in a planar mesh mode, and the plane formed by the mesh thermocouple units (240) is perpendicular to the plane where the plurality of rows of buses (230) are located; the patch type thermocouple bundle (231) and the mesh type thermocouple unit (240) are respectively connected with a computer (236); the outer side of each panel is respectively provided with a temperature sensor (241) and an electric heating plate (250);
the method comprises the following steps:
s1, selecting each panel with the size meeting the test requirement;
s2, sleeving the left panel (212) and the right panel (215) at proper positions on two sides of the lower panel (210) and fastening;
s3, mounting the fixing frame (220) on the lower panel (210), fixing the bus (230) on the fixing frame (220) according to the bus test height requirement, and fixing the upper panel (213) on the tops of the left panel and the right panel;
s4, mounting patch type thermocouples at different positions on the surface of the bus (230) to form a patch type thermocouple bundle (231), hanging the mesh type thermocouple unit (240) between the upper panel and the lower panel, and leading out all thermocouple wires to the outside of the cabinet body;
s5, mounting the front and rear panels and filling gaps generated in the cabinet body assembling process with insulating materials;
s6, placing a temperature controller (251) and an electric heating plate (250) outside the cabinet body, and arranging a temperature sensor (241) in the middle of each panel;
s7, connecting the patch type thermocouple bundle (231) and the mesh type thermocouple unit (240) to a computer (236);
and S8, calculating a convection heat transfer coefficient and radiation heat transfer coefficient table by using the temperature data detected under the variable condition.
2. The test method for testing the internal temperature field of the power switch cabinet according to claim 1, characterized in that: convective heat transfer coefficient h in S8cObtained by the formula 1-5
Ra-Gr. Pr equation 3
T-mean surface temperature of the busbar at DEG C;
Tf-ambient temperature, ° c;
l-bus characteristic dimension, m;
Gr-GravaXiaofu number;
g-acceleration of gravity, m/s2；
Beta-coefficient of thermal expansion of air, as can be seen from the thermal expansion coefficient table;
v-hydrodynamic viscosity, m2(s), which can be checked by an air viscosity meter;
Pr-Plantt number;
a-thermal diffusivity, m2S according to
Wherein k is an air heat conductivity coefficient, the lookup of an air heat conductivity coefficient table can be known, rho is air density, the lookup of an air density table can be known, cp is air specific heat capacity, and the lookup of a specific heat capacity table can be known;
Ra-Rey number;
Nu-Nussels number;
k is the air heat conductivity coefficient, W/(m.K), and can be known by looking up an air heat conductivity coefficient table;
heat transfer coefficient of radiation hrObtained by the following formula 6-7
Φr-radiation heat removal, W;
1the radiation emissivity is that the surface emissivity of copper is 0.07-0.15, and the surface emissivity of aluminum is 0.04-0.06;
the Stefan-Boltzmann constant having a value of 5.678 x 10-8W/(m2·K4)。
3. The test method for testing the internal temperature field of the power switch cabinet according to claim 1, characterized in that: the cabinet body consists of six insulating panels, namely a lower panel (210), a front panel (211), a left panel (212), an upper panel (213), a rear panel (214) and a right panel (215), wherein the panels are prefabricated into different sizes; the height of the bus bars (230) and the distance between the bus bars (230) can be adjusted, and the distance between the mesh thermocouple unit (240) and the rear panel (214) can be adjusted.
4. The test method for testing the internal temperature field of the power switch cabinet according to claim 3, wherein the test method comprises the following steps: at least one mounting rack (201) is arranged on a lower panel (210) of the cabinet body along the length direction, sleeve holes (205) matched with the mounting rack (201) are correspondingly formed in the bottoms of a left panel (212) and a right panel (215), and the left panel (212) and the right panel (215) slide on the lower panel (210) through the matching of the mounting rack (201) and the sleeve holes (205); the front side and the rear side of the left panel (212) and the right panel (215) are both provided with sliding grooves (204) along the height direction, and the two sides of the front panel (211) and the rear panel (214) are respectively correspondingly embedded into the sliding grooves (204) for installation.
5. The test method for testing the internal temperature field of the power switch cabinet according to claim 1, characterized in that: a fixed frame (220) is arranged in the cabinet body, the fixed frame (220) is connected with a row of buses (230) through an insulating connecting frame (232), and the front side and the rear side of the row of buses (230) are respectively connected with other rows of buses (230) through the insulating connecting frame (232); an adjusting groove (222) for the insulating connecting frame (232) to slide is formed in the fixing frame (220) along the height direction; the insulating connecting frames (232) are prefabricated with different specifications.
6. The test method for testing the internal temperature field of the power switch cabinet as claimed in claim 5, wherein the test method comprises the following steps: insulating link (232) are insulating vase, have seted up the internal thread in the insulating vase, have all seted up connect the hole on generating line (230) and mount (220), between insulating vase and generating line (230), all through the screw-up between insulating vase and mount (220), the screw passes connect the hole and fastens with insulating vase.
7. The test method for testing the internal temperature field of the power switch cabinet as claimed in claim 5, wherein the test method comprises the following steps: the bus (230) is a three-phase bus, the bus at the middle position is fixed on the fixing frame (220) through the insulating connecting frame (232), and the other two-phase bus is fixed in the front-back direction of the bus at the middle position through the two insulating connecting frames (232).
8. The test method for testing the internal temperature field of the power switch cabinet according to claim 3, wherein the test method comprises the following steps: the mesh thermocouple units (240) are distributed in a mesh shape, a thermocouple is uniformly distributed on each mesh node, the edges of the upper end and the lower end of each mesh thermocouple unit (240) are respectively provided with an insulating piece, and the upper end and the lower end of each mesh thermocouple unit (240) are respectively fixed on the upper panel (213) and the lower panel (210) through the insulating pieces.
9. The test method for testing the internal temperature field of the power switch cabinet as claimed in claim 8, wherein: the upper panel (213) and the lower panel (210) are provided with brackets for connecting and fixing the insulating parts, and the upper panel (213) and the lower panel (210) are correspondingly provided with a plurality of rows of brackets for connection along the front-back direction; the insulating part is an insulating connecting rope or an insulating connecting plate, and the insulating part is provided with a hook which is directly hooked on the support.
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| CN201532262U (en) * | 2009-11-09 | 2010-07-21 | 厦门立林高压电气有限公司 | High-voltage switch contact and bus on-line temperature measuring device |
| CN102035143B (en) * | 2010-11-02 | 2013-01-09 | 浙江大学 | High-temperature resistant low-voltage switch cabinet |
| CN202994318U (en) * | 2012-11-30 | 2013-06-12 | 天水长城开关厂有限公司 | Switch cabinet temperature-rise test data acquisition system |
| CN207850547U (en) * | 2018-01-23 | 2018-09-11 | 永煤集团股份有限公司新桥煤矿 | High-tension switch cabinet temp measuring system |
| CN109508502B (en) * | 2018-11-22 | 2023-06-30 | 国家电网有限公司 | Three-dimensional switch cabinet temperature and humidity distribution calculation method based on electromagnetic-temperature and humidity coupling |
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