CN111218220A - Frame glue composition and liquid crystal display panel using same - Google Patents

Frame glue composition and liquid crystal display panel using same Download PDF

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Publication number
CN111218220A
CN111218220A CN201911113326.4A CN201911113326A CN111218220A CN 111218220 A CN111218220 A CN 111218220A CN 201911113326 A CN201911113326 A CN 201911113326A CN 111218220 A CN111218220 A CN 111218220A
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Prior art keywords
liquid crystal
sealant composition
epoxy resin
crystal structure
substrate
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CN201911113326.4A
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韦宏权
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TCL China Star Optoelectronics Technology Co Ltd
TCL Huaxing Photoelectric Technology Co Ltd
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TCL Huaxing Photoelectric Technology Co Ltd
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Priority to CN201911113326.4A priority Critical patent/CN111218220A/en
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1339Gaskets; Spacers; Sealing of cells

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Sealing Material Composition (AREA)

Abstract

The application provides a frame sealant composition and a liquid crystal display panel using the same. The frame glue composition comprises: 10-60% of acrylic resin, 10-50% of epoxy resin containing a liquid crystal structure, 1-3% of light curing initiator and 1-3% of heat curing initiator by mass, wherein the liquid crystal structure is a nematic rod-shaped liquid crystal structure.

Description

Frame glue composition and liquid crystal display panel using same
Technical Field
The present disclosure relates to display technologies, and in particular, to a sealant composition and a liquid crystal display panel using the sealant composition.
Background
The liquid crystal display panel comprises a color film substrate, a thin film transistor array substrate, liquid crystal sandwiched between the color film substrate and the thin film transistor array substrate, and sealant (sealant) for sealing the liquid crystal and connecting the color film substrate and the thin film transistor array substrate. In order to make the sealant have good adhesion performance, the sealant needs to be cured by light and then further cured by heat. One known sealant includes an epoxy resin. Epoxy resins are slow to cure, consume a lot of energy, and have a slow heat transfer rate (thermal conductivity is generally in the range of 0.2W/(m.K) -0.5W/(m.K)). This results in a large temperature gradient between the outside and the inside of the sealant, which causes the following problems: (1) the heat curing time is long, the production efficiency is reduced, and the production cost is increased; (2) the liquid crystal is polluted by the frame glue which is not uniformly and incompletely cured, and the residual image appears. In a known improvement method, fillers with excellent thermal conductivity, such as graphene and carbon fibers, are added to the sealant to shorten the thermal curing time and reduce the thermal curing temperature. However, the method can cause the viscosity of the frame glue to be increased sharply, the frame glue is not easy to coat, the bonding force of the frame glue is reduced, and the frame glue is easy to peel.
Content of application
In view of the above, the present disclosure provides a sealant composition with good thermal conductivity, easy coating and strong bonding force, and a liquid crystal display panel using the sealant composition.
A sealant composition, comprising: 10-60% of acrylic resin, 10-50% of epoxy resin containing a liquid crystal structure, 1-3% of light curing initiator and 1-3% of heat curing initiator by mass, wherein the liquid crystal structure is a nematic rod-shaped liquid crystal structure.
In one embodiment of the present application, the epoxy resin containing a liquid crystal structure has a formula of R1-Z1-A-Z2-B-Z3-R2Wherein R is1、R2Are the same as
Figure BDA0002273372090000021
Or one is
Figure BDA0002273372090000022
The other is C1-C5 alkyl, -Z1-A-Z2-B-Z3-represents a liquid crystal structure, said Z1、Z2、Z3Identical or different, is a spacer selected from the group consisting of a single bond, -O-, -OCH2Any of the alkyl chains, unsaturated alkyl chains, A, B, which are identical or different, comprise one or more six-membered rings connected by single bonds.
In one embodiment of the present application, the number of the six-membered ring is 1 to 3.
In an embodiment of the present application, the A, B is:
Figure BDA0002273372090000023
Figure BDA0002273372090000024
Figure BDA0002273372090000025
any one of (1).
In one embodiment of the present application, the thermal conductivity of the liquid crystal structure-containing epoxy resin is 0.8W/(m · K) -5.2W/(m · K).
In one embodiment of the present application, the thermal conductivity of the liquid crystal structure-containing epoxy resin is 1W/(m · K) -5W/(m · K).
In an embodiment of the present application, the sealant composition further includes: 0-50% of epoxy resin.
In an embodiment of the present application, the acrylic resin is 20% to 50% by mass, the epoxy resin is 10% to 30% by mass, and the epoxy resin having a liquid crystal structure is 20% to 30% by mass.
In an embodiment of the present application, the mass percentage of the acrylic resin is 25% to 30%, the mass percentage of the epoxy resin is 20% to 30%, and the mass percentage of the epoxy resin containing a liquid crystal structure is 25% to 50%.
A liquid crystal display panel comprising: a first substrate; a second substrate disposed opposite to the first substrate; the liquid crystal layer is positioned between the first substrate and the second substrate; the frame glue is used for bonding the first substrate and the second substrate and sealing the liquid crystal layer; the sealant is formed by curing the sealant composition of any one of the above.
The sealant composition can enhance the heat-conducting property of the sealant composition by using the epoxy oligomer containing the liquid crystal structure, thereby reducing the temperature and time of thermal curing and improving the production efficiency. In addition, the coating property, the adhesiveness and the like of the sealant composition can be improved.
Drawings
In order to more clearly illustrate the technical solutions in the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a cross-sectional view of a liquid crystal display panel according to an embodiment of the present application.
Detailed Description
The technical solution in the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any inventive step based on the embodiments in the present application, are within the scope of protection of the present application.
Referring to fig. 1, a liquid crystal display panel 100 according to an embodiment of the present disclosure includes a first substrate 10, a second substrate 20 disposed opposite to the first substrate 10, a liquid crystal layer 30 filled between the first substrate 10 and the second substrate 20, and a sealant 40 adhering the first substrate 10 and the second substrate 20.
The liquid crystal display panel 100 includes a display area AA and a non-display area NAA surrounding the display area AA. The sealant 40 is located in the non-display area NAA of the display device 100. The sealant 40 is formed of a sealant composition by photo-curing and thermal-curing. The frame glue composition comprises 10-60% of acrylic resin, 0-50% of epoxy resin, 10-50% of epoxy resin containing a liquid crystal structure, 1-3% of a light curing initiator, 1-3% of a heat curing initiator, 5-20% of a filler and 0.1-1% of an auxiliary additive by mass. The frame glue composition is prepared by mixing the materials in percentage by mass. The acrylic resin may be an acrylic monomer or an acrylic oligomer. The epoxy resin can be a monomer epoxy resin or an oligomer epoxy resin. The oligomer has a molecular weight in the range of 300 to 1000.
In an embodiment of the present application, the sealant composition includes, by mass, 20% to 50% of an acrylic resin, 10% to 30% of an epoxy resin, 20% to 30% of an epoxy resin containing a liquid crystal structure, 1% to 3% of a photo-curing initiator, 1% to 3% of a thermal-curing initiator, 10% to 20% of a filler, and 0.1% to 1% of an auxiliary additive.
In another embodiment of the present application, the sealant composition includes, by mass, 25% to 30% of an acrylic resin, 20% to 30% of an epoxy resin, 25% to 50% of an epoxy resin containing a liquid crystal structure, 1% to 3% of a photo-curing initiator, 1% to 3% of a thermal-curing initiator, 5% to 15% of a filler, and 0.1% to 1% of an auxiliary additive.
In the frame glue composition, if the content of the acrylic resin is too high and the content of the epoxy resin is too low, the hardness and the adhesive force of the frame glue 40 formed after curing are small; if the content of the acrylic resin is too low and the content of the epoxy resin is too high, the frame glue 40 formed after curing has high hardness and brittleness and is easy to damage.
In addition, the epoxy resin containing a liquid crystal structure has good heat conductive characteristics due to its multi-domain structure formed macroscopically and anisotropic liquid crystal structure formed microscopically. Epoxy resin monomers containing liquid crystalline structures can spontaneously form mesogenic nuclei derived from liquid crystal order. During crosslinking with the curing agent, the liquid crystal order is maintained or developed, and phonon scattering can be suppressed, i.e., the order is maintained, thereby improving thermal conductivity. The more the content of the epoxy resin containing a liquid crystal structure is, i.e., the more the ordered structure is, the better the thermal conductivity is. However, when the content of the epoxy resin containing the liquid crystal structure is too high, the curing of the epoxy resin is affected, so that the curing of the sealant 40 is not uniform or complete.
The acrylic resin includes at least one selected from the group consisting of ethylene glycol diacrylate, 2-hydroxy acrylate, trimethylolpropane triacrylate, dipentaerythritol hexaacrylate.
The molecular formula of the epoxy resin containing the liquid crystal structure is R1-Z1-A-Z2-B-Z3-R2. The liquid crystal structure is a nematic rod-shaped liquid crystal structure.
Wherein R is1、R2Identical or different, R1、R2Can be simultaneously used as
Figure BDA0002273372090000051
Or one is
Figure BDA0002273372090000052
The other is C1-C5 alkyl.
-Z1-A-Z2-B-Z3-represents a liquid crystal structure. In particular, Z1、Z2、Z3Identical or different, is a spacer selected from the group consisting of a single bond, -O-, -OCH2-, alkyl chain, unsaturated alkyl chain. A. B is the same or different and comprises one or more six-membered rings, and the six-membered rings are connected by single bonds. In one embodiment of the present application. The number of the six-membered rings is 1 to 3. Specifically, it may be:
Figure BDA0002273372090000061
Figure BDA0002273372090000062
Figure BDA0002273372090000063
any one of them. The H atom on the six-membered ring in the above compounds may be substituted with an alkyl group, a halogen group, a nitro group, a carboxyl group, an alkoxy group or the like.
The epoxy resin containing a liquid crystal structure according to one embodiment of the present invention may be, for example, an epoxy resin containing a liquid crystal structure
Figure BDA0002273372090000064
It can be prepared by the following chemical reactions:
Figure BDA0002273372090000071
the epoxy resin containing a liquid crystal structure according to another embodiment of the present application may be
Figure BDA0002273372090000072
It can be prepared by the following chemical reactions:
Figure BDA0002273372090000081
the thermal conductivity of the epoxy resin containing a liquid crystal structure is in the range of 0.8W/(m.K) -5.2W/(m.K), and in one embodiment of the present invention, in the range of 1W/(m.K) -5W/(m.K).
the photoinitiator is an ultraviolet photoinitiator, the absorption wavelength of the photoinitiator is 300nm-400nm, and the photoinitiator comprises one or more of benzophenone, acetophenone, α -hydroxy ketone or α -amino ketone.
The thermal initiator comprises one or more of ethylenediamine, ethylene polyamines or aromatic polyamines.
The filler comprises: inorganic fillers and organic fillers. The inorganic filler comprises one or more of calcium carbonate powder, kaolin powder or glass fiber. The organic filling material comprises one or more of nylon powder or plant fiber.
The auxiliary additive comprises one or more of a viscosity regulator, a silane coupling agent, a surfactant or a plasticizer and the like.
The thermal conductivity of the amorphous polymer used in the known sealant composition is in the range of 0.1W/(mK) -0.5W/(mK), while the thermal conductivity of the epoxy oligomer containing a liquid crystal structure provided by the present application can be increased to 0.8W/(mK) -5.2W/(mK) because of the nematic state. The sealant composition can enhance the heat-conducting property of the sealant composition by using the epoxy oligomer containing the liquid crystal structure, thereby reducing the temperature and time of thermal curing and improving the production efficiency. In addition, the coating property, the adhesiveness and the like of the sealant composition can be improved.
The foregoing provides a detailed description of embodiments of the present application, and the principles and embodiments of the present application have been described herein using specific examples, which are presented solely to aid in the understanding of the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (10)

1. A sealant composition, comprising:
10 to 60 percent of acrylic resin,
10-50% of epoxy resin with liquid crystal structure,
1-3% by mass of a photocuring initiator, and
1-3% of a thermal curing initiator by mass;
the liquid crystal structure is a nematic rod-shaped liquid crystal structure.
2. The sealant composition of claim 1, wherein the sealant composition,
the molecular formula of the epoxy resin containing the liquid crystal structure is R1-Z1-A-Z2-B-Z3-R2
Wherein R is1、R2Are the same as
Figure FDA0002273372080000011
Or one is
Figure FDA0002273372080000012
The other is C1-C5 alkyl,
-Z1-A-Z2-B-Z3-represents a liquid crystal structure, said Z1、Z2、Z3Identical or different, is a spacer selected from the group consisting of a single bond, -O-, -OCH2Any of alkyl chains, unsaturated alkyl chains,
A. b is the same or different and comprises one or more six-membered rings, and the six-membered rings are connected by single bonds.
3. The sealant composition of claim 2, wherein the number of the six-membered rings is 1 to 3.
4. The sealant composition of claim 3, wherein the A, B is:
Figure FDA0002273372080000013
Figure FDA0002273372080000021
Figure FDA0002273372080000022
any one of (1).
5. The sealant composition of claim 1, wherein the thermal conductivity of the liquid crystal structure-containing epoxy resin ranges from 0.8W/(m-K) to 5.2W/(m-K).
6. The sealant composition according to claim 5, wherein the thermal conductivity of the liquid crystal structure-containing epoxy resin ranges from 1W/(m.K) to 5W/(m.K).
7. The sealant composition of claim 1, wherein the sealant composition further comprises: 0-50% of epoxy resin.
8. The sealant composition of claim 7, wherein the sealant composition,
the mass percentage of the acrylic resin is 20-50 percent,
The mass percentage of the epoxy resin is 10-30 percent,
The mass percentage of the epoxy resin containing the liquid crystal structure is 20-30%.
9. The sealant composition of claim 8, wherein the sealant composition,
the mass percentage of the acrylic resin is 25-30 percent,
The mass percentage of the epoxy resin is 20-30 percent,
The mass percentage of the epoxy resin containing the liquid crystal structure is 25-50%.
10. A liquid crystal display panel comprising:
a first substrate;
a second substrate disposed opposite to the first substrate;
the liquid crystal layer is positioned between the first substrate and the second substrate;
the frame glue is used for bonding the first substrate and the second substrate and sealing the liquid crystal layer;
the sealant is formed by curing the sealant composition according to any one of claims 1 to 9.
CN201911113326.4A 2019-11-14 2019-11-14 Frame glue composition and liquid crystal display panel using same Pending CN111218220A (en)

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