CN111214931A - Condensing system - Google Patents
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- CN111214931A CN111214931A CN201811406329.2A CN201811406329A CN111214931A CN 111214931 A CN111214931 A CN 111214931A CN 201811406329 A CN201811406329 A CN 201811406329A CN 111214931 A CN111214931 A CN 111214931A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/26—Drying gases or vapours
- B01D53/265—Drying gases or vapours by refrigeration (condensation)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
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Abstract
A condensing system is used for generating a condensing layer on the surface of an object to be measured. The condensing system comprises an airflow generating device and a flow passage device. The airflow generating device is used for generating a condensed airflow. The condensed air flow has a dew point temperature which is higher than the temperature of the surface of the object to be measured. The flow channel device is communicated with the airflow generating device, and the condensed airflow flows into the flow channel device through the airflow generating device. The flow channel device comprises a flow equalizing module. The flow equalizing module is close to the airflow generating device and configured to receive the condensed airflow, and the flow equalizing module comprises at least one flow equalizing plate, and each flow equalizing plate is provided with at least one first hole. The condensing system can control various characteristics of the condensing air flow to promote the formation of a good-quality condensing layer on the surface of the object to be measured.
Description
Technical Field
The present disclosure relates to a condensing system, and more particularly, to a condensing system for forming a condensing layer on a surface of an object to be cooled.
Background
In order to generate a condensation layer on the surface of the object, the object must be placed in a low-temperature closed cavity to be cooled. And then, taking out the object after temperature reduction, and placing the object in high-humidity gas. When the temperature of the high humidity gas is lowered, the vapor contained in the gas will condense on the surface of the object and form a condensed layer.
The disadvantage of this approach is that the object must be moved into and out of the sealed chamber, which is difficult to automate. The manufacturing cost of the sealed cavity is high, and the low temperature environment in the cavity needs to be achieved in a time-consuming manner. Therefore, how to find a way to generate a condensation layer on the surface of an object in a simple, rapid and low-cost manner is one of the important problems in the art.
Disclosure of Invention
According to some embodiments of the present disclosure, a condensing system for generating a condensing layer on a surface of an object to be measured includes an airflow generating device and a flow passage device. The airflow generating device is used for generating a condensed airflow. The condensed air flow has a dew point temperature which is higher than the temperature of the surface of the object to be measured. The flow channel device is communicated with the airflow generating device, and the condensed airflow flows into the flow channel device through the airflow generating device. The flow channel device comprises a flow equalizing module. The flow equalizing module is close to the airflow generating device and configured to receive the condensed airflow, and the flow equalizing module comprises at least one flow equalizing plate, and each flow equalizing plate is provided with at least one first hole.
According to some embodiments of the present disclosure, a condensing system for generating a condensing layer on a surface of an object to be measured includes an airflow generating device and a flow passage device. The airflow generating device is used for generating a condensed airflow. The condensed air flow has a dew point temperature which is higher than the temperature of the surface of the object to be measured. The flow channel device comprises a flow channel body and at least one flow equalizing plate. The flow equalizing plates are arranged in the flow channel body in parallel and are configured to receive the condensed air flow. Each flow equalizing plate has at least one first hole.
In some embodiments, the flow equalization module further comprises a barrier. The blocking piece is arranged on one side of the flow equalizing plate, which is opposite to the airflow generating device, and the projection of the blocking piece on the flow equalizing plate partially covers the first hole.
In some embodiments, the flow conduit device further comprises a rectification module. The rectifying module is positioned on one side of the flow equalizing module relative to the airflow generating device and is configured to receive the condensed airflow passing through the flow equalizing module, the rectifying module comprises a rectifying plate, the rectifying plate is provided with at least one second hole, and the thickness of the rectifying plate is greater than that of any one of the flow equalizing plates.
In some embodiments, the airflow generating device further comprises an air inlet, a heater, a humidifier, a temperature and humidity control gas, an air outlet, and a fan. The air inlet is configured for entry of an ambient air flow. The heater is communicated with the air inlet and is configured to heat the ambient air flow to generate a first air flow. The humidifier is in communication with the heater and is configured to humidify the first gas stream to produce a second gas stream. And the temperature and humidity controller is communicated with the humidifier and is configured to control the temperature and the humidity of the second airflow according to the temperature of the surface of the object to be detected so as to generate condensed airflow. And the air outlet is communicated between the temperature and humidity controller and the flow channel device. The fan is arranged at the air inlet or the air outlet and is configured to forcibly transmit the condensed airflow.
In some embodiments, the number of the flow equalizing plates is multiple, and the number of the first holes increases the farther the flow equalizing plate is away from the airflow generating device.
In some embodiments, the number of the flow equalizing plates is multiple, and the aperture of the first hole of the flow equalizing plate is smaller as the flow equalizing plate is farther away from the gas flow generating device.
In some embodiments, the number of the flow equalizing plates is multiple, and the total area of the first holes of the flow equalizing plates is larger as the flow equalizing plates are farther away from the airflow generating device.
In summary, the condensing system provided in the present disclosure can control various characteristics of the condensing airflow to promote the formation of a good quality condensing layer on the surface of the object to be measured. For example, the condensing system may control the temperature and humidity of the condensing airflow (further determining the dew point temperature of the condensing airflow) through the airflow generating device, and control the wind speed, wind speed uniformity and directionality of the condensing airflow through the flow channel device.
Drawings
FIG. 1A illustrates a perspective view of a condensing system according to one embodiment of the present disclosure;
FIG. 1B is a cross-sectional view taken along line 1-1 of FIG. 1A;
FIG. 2A illustrates a perspective view of a condensing system according to another embodiment of the present disclosure;
FIG. 2B is a cross-sectional view taken along line 2-2 in FIG. 2A;
FIG. 3A illustrates a perspective view of a condensing system according to another embodiment of the present disclosure;
FIG. 3B is a cross-sectional view taken along line 3-3 of FIG. 3A.
Detailed Description
In the following description, for purposes of explanation, numerous implementation details are set forth in order to provide a thorough understanding of the various embodiments of the present invention. It should be understood, however, that these implementation details are not to be interpreted as limiting the invention. That is, in some embodiments of the invention, such implementation details are not necessary. In addition, for the sake of simplicity, some conventional structures and elements are shown in the drawings in a simple schematic manner. Also, unless otherwise indicated, like reference numerals may be used to identify corresponding elements in different figures. The drawings are for clarity of understanding, and do not show actual dimensions of the elements.
Referring to fig. 1A, a perspective view of a condensing system 100 according to an embodiment of the disclosure is shown. As shown in fig. 1A, the condensing system 100 is used to form a condensing layer 220 on the surface 210 of the object 200. The condensing system 100 includes a gas flow generating device 110 and a flow passage device 120.
The airflow generating device 110 is used for generating a condensed airflow 50, and the dew point temperature of the condensed airflow 50 is higher than the temperature of the surface 210 of the object 200. The flow conduit device 120 is connected to the airflow generating device 110, such that the condensed airflow 50 flows from the airflow generating device 110 into the flow conduit device 120.
The flow channel device 120 includes a flow equalizing module 121, and is disposed near the gas flow generating device 110 and configured to receive the condensed gas flow 50. Flow equalizing module 121 includes a flow equalizing plate 1211, a blocking member 1212, and a flow equalizing plate 1213, in which flow equalizing plate 1211 includes a hole 1211a, and flow equalizing plate 1213 includes a hole 1213 a. In one embodiment, the flow channel device 120 further includes a rectifying module 122 disposed on the other side of the flow equalizing module 121 opposite to the gas flow generating device 110, and configured to receive the uniform condensed gas flow 60 passing through the flow equalizing module 121. The rectifying module 122 includes a rectifying plate 1221, and the rectifying plate 1221 has a plurality of holes 1221 a.
As shown in fig. 1A, the airflow generating device 110 has an air inlet 110a and an air outlet 110 b. The air inlet 110a is configured to provide the ambient air flow 20 into the air flow generating device 110. The airflow generating device 110 is configured to change the temperature and humidity of the ambient airflow 20. That is, the ambient air stream 20 is converted to the condensed air stream 50 by the air stream generating device 110. Finally, the condensed gas stream 50 exits the gas stream generating means 110 via the gas outlet 110b of the gas stream generating means 110.
As shown in fig. 1A, the airflow generating device 110 further includes a fan 114 inside. In the present embodiment, the fan 114 is disposed at one end near the air outlet 110 b. In other embodiments, the fan 114 may be disposed near one end of the air inlet 110 a. The fan 114 is configured to provide a pressure differential to force the ambient air flow 20 into the air flow generating means 110 and to force the condensed air flow 50 from the air flow generating means 110 to the flow conduit means 120. That is, the fan 114 is configured to ensure that the airflow generating device 110 can continuously suck the ambient airflow 20 from the external environment and send the condensed airflow 50 out.
As shown in FIG. 1A, the airflow generating device 110 may include various components therein for changing the temperature and humidity of the ambient airflow 20. For example, in the present embodiment, the airflow generating device 110 includes a heater 111, a humidifier 112, and a temperature and humidity controller 113.
In the present embodiment, the ambient air flow 20 enters the air flow generating device 110 and then passes through the heater 111, the humidifier 112 and the temperature and humidity controller 113 in sequence. However, in other embodiments, the order of the heater 111, the humidifier 112 and the humidity controller 113 may be changed, and fig. 1A only illustrates one embodiment, which should not be construed as a limitation to the present disclosure.
As shown in fig. 1A, heater 111 communicates with inlet 110a and is configured to warm ambient air flow 20. The ambient air stream 20 is converted to a first air stream 30 by passing through a heater 111. The temperature of the first gas stream 30 is higher than the temperature of the ambient gas stream 20.
As shown in fig. 1A, the humidifier 112 is in communication with the heater 111 and is configured to humidify the first gas stream 30. The first gas flow 30 is converted to the second gas flow 40 after passing through the humidifier 112. The humidity of the second air stream 40 is higher than the humidity of the first air stream 30.
As shown in fig. 1A, the temperature and humidity controller 113 is in communication with the humidifier 112 and is configured to adjust the temperature and humidity of the second airflow 40. The second air flow 40 is converted into a condensed air flow 50 after passing through the temperature and humidity controller 113. The temperature and humidity controller 113 determines the final temperature and humidity of the condensed air stream 50. In the present embodiment, the temperature and humidity controller 113 may slightly lower the temperature and humidity of the second air flow 40, so that the temperature and humidity of the condensed air flow 50 are slightly lower than the temperature and humidity of the second air flow 40.
In some embodiments, the temperature and humidity of the condensed airflow 50 may be determined according to the temperature of the surface 210 of the object 200. For example, in order to form the condensation layer 220 on the surface 210 of the object 200, the temperature and humidity of the condensation airflow 50 are adjusted such that the dew point temperature of the condensation airflow 50 is higher than the temperature of the surface 210 of the object 200. When the condensed airflow 50 contacts the surface 210 of the object 200, it is cooled to generate a condensed layer 220.
In some embodiments, the dew point temperature of the condensed gas stream 50 generated by the gas stream generating device 110 can be accurately controlled by a combination of the heater 111, the humidifier 112, and the temperature and humidity controller 113. For example, the user may first determine a target temperature and a target humidity, and use the heater 111 to convert the ambient air flow 20 into the first air flow 30 having a temperature close to the target temperature, then use the humidifier 112 to convert the first air flow 30 into the second air flow 40 having a humidity close to the target humidity, and finally perform a fine adjustment on the second air flow 40 through the temperature and humidity controller 113 to convert the second air flow 40 into the condensed air flow 50 having the target temperature and the target humidity.
Specifically, please refer to the following table one, which lists a comparison table of the temperature and humidity of the ambient air stream 20, the first air stream 30, the second air stream 40, and the condensed air stream 50 in one embodiment.
Watch 1
As shown in Table one, the temperature of the first gas stream 30 is higher than the temperature of the ambient gas stream 20; the humidity of the second air stream 40 is higher than the humidity of the first air stream 30; while the temperature and humidity of the condensed airflow 50 is slightly lower than the temperature and humidity of the second airflow 40.
Referring back to fig. 1A, the condensed airflow 50 generated by the airflow generating device 110 is transmitted to the flow channel device 120. In the present embodiment, the airflow generating device 110 and the flow channel device 120 are communicated by the air duct 130, so that the condensed airflow 50 leaves the airflow generating device 110 and then flows into the flow channel device 120 through the air duct 130.
As shown in fig. 1A, the flow conduit device 120 has a flow conduit body 123, and the flow conduit body 123 has an inlet end 123a and an outlet end 123 b. The inlet end 123a receives the condensed gas stream 50 generated by the self-stream generating device 110. The condensed airflow 50 enters the flow channel device 120 and then sequentially passes through the flow equalizing module 121 and the rectifying module 122 therein. The flow equalization module 121 receives the condensed gas stream 50 and converts it to a uniform condensed gas stream 60. The rectification module 122 receives the uniform condensed gas stream 60 and converts it into a directed condensed gas stream 70. Directional condensed air flow 70 exits flow channel device 120 through outlet end 123b and is directed toward surface 210 of test object 200.
Referring to FIG. 1B, a cross-sectional view along line 1-1 of FIG. 1A is shown. As shown in fig. 1A and fig. 1B, the inlet end 123a of the flow channel device 120 has an aperture Ri, the aperture 1211A of the flow equalization plate 1211 has an aperture R1, the aperture 1213a of the flow equalization plate 1213 has an aperture R2, and the aperture 1221A of the current plate 1221 has an aperture Rf.
In the present embodiment, the number of the holes 1211a of the flow equalizing plate 1211 closer to the air flow generating device 110 is one, and the number of the holes 1213a of the flow equalizing plate 1213 farther from the air flow generating device 110 is five. That is, the closer to the flow equalization plate of the rectifier module 122, the greater the number of holes. In addition, the aperture R1 of the holes 1211a of the flow equalizing plate 1211 closer to the gas flow generating device 110 is larger than the aperture R2 of the holes 1213a of the flow equalizing plate 1213 farther from the gas flow generating device 110. The above arrangement enables the condensed gas stream 50 to be converted into a uniform condensed gas stream 60 after passing through the flow equalizing module 121, the principle of which will be explained below.
As shown in fig. 1A and 1B, after the condensed air flow 50 passes through the flow equalization plate 1211, the flow rate and the air flow distribution are changed, which is denoted as air flow 60 a. The air flow 60a is restricted to a small extent by the aperture R1 and therefore has a high velocity, but the wind velocity distribution is concentrated at the center.
The flow 60a then reaches the baffle 1212 and the flow rate and flow distribution are further altered, which is denoted as flow 60 b. The projection of the blocking member 1212 on the flow equalizing plate 1211 covers a partial range of the aperture 1211a, so that the air flow 60a collides with the blocking member 1212 and changes direction. That is, the flow velocity of the airflow 60b is slower than that of the airflow 60a, and the distribution of the wind speed is wider. In the present embodiment, the blocking member 1212 is cross-shaped, but the disclosure is not limited thereto.
The air flow 60b then passes through the flow equalization plate 1213, and its flow rate and air flow distribution are changed to become the uniform condensed air flow 60. Specifically, since the holes 1213a are uniformly distributed on the flow equalizing plate 1213, the uniform condensed air flow 60 is evenly discharged from each hole 1213a of the flow equalizing plate 1213, and the velocity of each uniform condensed air flow 60 is close to uniform.
In this embodiment, the area of holes 1211a on flow equalization plate 1211 is less than the total area of all holes 1213a on flow equalization plate 1213. That is, the open area (total open area) of the flow equalizing plate 1213 which is far from the air flow generating device 110 is larger, and it can be known from the law of endeavor that the flow rate of the uniform condensed air 60 passing through the flow equalizing plate 1213 is slower and uniform than the flow rate of the air 60a passing through the flow equalizing plate 1211. The slow and uniform gas flow characteristics help the condensing system 100 to form a uniform and flat condensing layer 220 on the object 200.
As shown in fig. 1A and 1B, before contacting the object 200, the uniform condensed airflow 60 passes through the rectification module 122, so as to further improve the directionality of the uniform condensed airflow 60, and make it become the directional condensed airflow 70.
In the present embodiment, the thickness t of the rectifying plate 1221 of the rectifying module 122 is greater than the thickness of each of the flow equalizing plate 1211, the blocking member 1212, and the flow equalizing plate 1213. That is, the holes 1221a in the rectifying plate 1221 can be regarded as separate small tubes. The direction of travel of the uniform condensate flow 60 after entering the aperture 1221a is limited such that it becomes a uniformly directed condensate flow 70 after exiting the aperture 1221 a.
In the present embodiment, the distance between the flow equalizing plate 1211 and the blocking member 1212, the distance between the blocking member 1212 and the flow equalizing plate 1213, and the distance between the flow equalizing plate 1213 and the flow regulating plate 1221 are assumed to be equal to each other, but the distance is not limited to this. That is, the pitches may be different from each other.
It should be understood that the flow conduit device 120 shown in fig. 1A and 1B is only an example, and those skilled in the art can modify the flow conduit device according to the design principles presented above. For example, the flow channel device 120 of the present embodiment includes two flow equalizing plates (1211, 1213), but other embodiments may include three, four or more flow equalizing plates.
Specifically, please refer to fig. 2A and fig. 2B. Fig. 2A illustrates a perspective view of a condensing system 300 according to another embodiment of the present disclosure. FIG. 2B is a cross-sectional view taken along line 2-2 in FIG. 2A. The difference between the condensing system 300 and the condensing system 100 is that the flow channel device 120 of the condensing system 300 includes three flow equalization plates 1211, 1213, 1214. That is, the flow channel device 120 of the condensing system 300 further includes a flow equalizing plate 1214 having thirteen holes 1214 a.
That is, compared to the flow field plate 1211 and the flow field plate 1213, the number of the holes 1214a of the flow field plate 1214 is larger, the aperture R3 of the holes 1214a is smaller, and the total area of all the holes 1214a is larger. By providing the flow channel device 120 with the flow equalizing plate 1214, the flow velocity of the air flow (see fig. 1B) passing through the flow equalizing plate 1214 can be further reduced and the wind speed uniformity can be increased to meet the practical requirement.
Please refer to fig. 3A and fig. 3B. Fig. 3A illustrates a perspective view of a condensing system 400 according to another embodiment of the present disclosure. FIG. 3B is a cross-sectional view taken along line 3-3 of FIG. 3A. The difference between the condensing system 400 and the condensing system 300 is that the flow channel device 120 of the condensing system 400 includes four flow equalizing plates 1211, 1213, 1214, 1215. That is, the flow channel device 120 of the condensing system 400 further includes a flow equalization plate 1215 having a plurality of (e.g., 169) holes 1215 a.
That is, the flow plate 1215 has a greater number of holes 1215a, a smaller aperture R4 of the holes 1215a and a greater total area of all of the holes 1215a than the flow plates 1211, 1213 and 1214. By providing the flow channel device 120 with the flow equalizing plate 1215, the flow velocity of the air flow passing through the flow channel device 1215 (refer to fig. 1B) can be further reduced and the wind speed uniformity can be increased to meet the practical requirements.
In summary, the condensing system provided in the present disclosure can control various characteristics of the condensing airflow to promote the formation of a good quality condensing layer on the surface of the object to be measured. For example, the condensing system may control the temperature and humidity of the condensing airflow (further determining the dew point temperature of the condensing airflow) through the airflow generating device, and control the wind speed, wind speed uniformity and directionality of the condensing airflow through the flow channel device.
The present disclosure has been described in terms of exemplary and preferred embodiments, and it is to be understood that the invention is not limited to the disclosed embodiments. On the contrary, the invention is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Accordingly, the appended claims are to be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
Claims (14)
1. A condensing system for generating a condensing layer on a surface of an object, the condensing system comprising:
an air flow generating device for generating a condensed air flow, wherein the condensed air flow has a dew point temperature which is higher than a temperature of the surface of the object to be measured; and
a flow channel device connected to the airflow generating device, wherein the condensed airflow flows from the airflow generating device into the flow channel device, and the flow channel device comprises:
and the flow equalizing module is close to the airflow generating device and is configured to receive the condensed airflow, and the flow equalizing module comprises at least one flow equalizing plate, and each flow equalizing plate is provided with at least one first hole.
2. The condensing system of claim 1, wherein the flow equalization module further comprises:
the blocking piece is arranged on one side of one of the flow equalizing plates, which is opposite to the airflow generating device, and the projection of the blocking piece on the one of the flow equalizing plates partially covers the at least one first hole.
3. The condensing system of claim 1, wherein the flow conduit device further comprises:
the rectifying module is positioned on one side of the flow equalizing module relative to the airflow generating device and is configured to receive the condensed airflow passing through the flow equalizing module, the rectifying module comprises a rectifying plate, the rectifying plate is provided with at least one second hole, and the thickness of the rectifying plate is greater than that of any one of the at least one flow equalizing plate.
4. A condensing system according to claim 1, wherein the gas flow generating means further comprises:
an air inlet configured for entry of an ambient air flow;
a heater connected to the air inlet and configured to heat the ambient air flow to generate a first air flow;
a humidifier, connected to the heater, and configured to humidify the first air flow to generate a second air flow;
a temperature and humidity controller, which is communicated with the humidifier and is configured to control a temperature and a humidity of the second air flow according to the temperature of the surface of the object to be detected so as to generate the condensed air flow;
the air outlet is communicated between the temperature and humidity controller and the flow channel device; and
and the fan is arranged at the air inlet or the air outlet and is configured to forcibly transmit the condensed airflow.
5. The condensing system of claim 1, wherein the number of the at least one flow equalizing plate is greater, and the number of the first holes increases the farther the flow equalizing plate is away from the gas flow generating device.
6. The condensing system of claim 1, wherein the number of the at least one flow-equalizing plate is plural, and the aperture of the first hole decreases as the flow-equalizing plate is farther away from the gas flow generating device.
7. The condensing system of claim 1, wherein the number of the at least one flow equalizing plate is plural, and the total area of the first holes increases as the flow equalizing plate is farther away from the gas flow generating device.
8. A condensing system for generating a condensing layer on a surface of an object, the condensing system comprising:
an air flow generating device for generating a condensed air flow, wherein the condensed air flow has a dew point temperature which is higher than a temperature of the surface of the object to be measured; and
a flow conduit device, comprising:
a flow channel body communicated with the airflow generating device;
at least one flow equalizing plate, which is arranged in parallel in the flow channel body and is configured to receive the condensed air flow, and the at least one flow equalizing plate is provided with at least one first hole.
9. The condensing system of claim 8, wherein the flow equalization module further comprises:
the blocking piece is arranged on one side of one of the flow equalizing plates, which is opposite to the airflow generating device, and the projection of the blocking piece on the one of the flow equalizing plates partially covers the at least one first hole.
10. The condensing system of claim 8, wherein said flow conduit means further comprises:
the rectifying plate is arranged on one side of the flow channel body far away from the airflow generating device and is configured to receive the condensed airflow passing through the flow equalizing module, the rectifying plate is provided with at least one second hole, and the thickness of the rectifying plate is greater than that of any one of the at least one flow equalizing plate.
11. A condensing system according to claim 8, wherein said gas flow generating means further comprises:
an air inlet configured for entry of an ambient air flow;
a heater connected to the air inlet and configured to heat the ambient air flow to generate a first air flow;
a humidifier, connected to the heater, and configured to humidify the first air flow to generate a second air flow;
a temperature and humidity controller, which is communicated with the humidifier and is configured to control a temperature and a humidity of the second air flow according to the temperature of the surface of the object to be detected so as to generate the condensed air flow;
the air outlet is communicated between the temperature and humidity controller and the flow channel body; and
and the fan is arranged at the air inlet or the air outlet and is configured to forcibly convey the condensed airflow to the flow channel device.
12. The condensing system of claim 8, wherein the number of the at least one flow equalizing plate is greater, and the number of the first holes increases the farther the flow equalizing plate is away from the gas flow generating device.
13. The condensing system of claim 8, wherein the number of the at least one flow-equalizing plate is plural, and the aperture of the first hole decreases as the flow-equalizing plate is farther away from the gas flow generating device.
14. The condensing system of claim 8, wherein the number of the at least one flow equalizing plate is plural, and the total area of the first holes increases as the flow equalizing plate is farther away from the gas flow generating device.
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| US20150020682A1 (en) * | 2012-03-31 | 2015-01-22 | Cheng Yuan Environmental Technology Co., Ltd. | Process and apparatus for treatment of volatile organic compounds |
| CN103305812A (en) * | 2013-06-08 | 2013-09-18 | 上海和辉光电有限公司 | Top electrode device |
| CN104676808A (en) * | 2015-03-10 | 2015-06-03 | 中国安全生产科学研究院 | Balanced ventilation device with rear-mounted blower in blowing and suction type ventilation system |
| CN107743572A (en) * | 2015-06-08 | 2018-02-27 | 株式会社高永科技 | Humid air forming apparatus including its check device and inspection method |
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