CN111212486A - Film heating device and film curing method - Google Patents
Film heating device and film curing method Download PDFInfo
- Publication number
- CN111212486A CN111212486A CN202010014887.5A CN202010014887A CN111212486A CN 111212486 A CN111212486 A CN 111212486A CN 202010014887 A CN202010014887 A CN 202010014887A CN 111212486 A CN111212486 A CN 111212486A
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- Prior art keywords
- film layer
- light source
- edge
- temperature
- film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
Abstract
The embodiment of the application provides a film layer heating device and a film layer curing method. The circuit board has relative first face and the second face that sets up, and light source portion includes a plurality of, light source portion is the matrix setting and is in first face, wherein, each light source portion can the independent control for the light source portion of different regions on the circuit board is luminous. This application rete heating device is luminous through the light source portion that the thick uneven district of control membrane, and regulation and control marginal solution curing temperature reaches the thick even purpose of solidification rete membrane.
Description
Technical Field
The application relates to the technical field of display, in particular to a film layer heating device and a film layer curing method.
Background
The solution solidification process is often involved in the industry, because the temperature of the outer edge of the drop film layer is higher than that of the inner portion, so that the solvent at the edge is evaporated relatively quickly, and the solute flows from the inner portion to the outer portion, so that the thickness of the edge film is different from that of the in-plane film, and the film layer is not uniform.
Therefore, the film layer heating device capable of enabling the film layer to be uniform when the film layer is cured is provided.
Disclosure of Invention
The embodiment of the application provides a film layer heating device and a film layer curing method, which can enable a film layer to be uniform when the film layer is cured.
The present application provides a film layer heating apparatus comprising:
the circuit board is provided with a first surface and a second surface which are oppositely arranged;
the light source parts comprise a plurality of light source parts, and the light source parts are arranged on the first surface in a matrix manner;
wherein, each light source part can be controlled separately, so that the light source parts in different areas on the circuit board emit light.
In some embodiments, the light source unit includes a micro light emitting diode disposed on the first surface and a micro lens covering the micro light emitting diode.
In some embodiments, the micro light emitting diode has a diameter of 8um to 50 um.
In some embodiments, the thermal radiation power of the micro light emitting diode is adjustable.
In some embodiments, a side of the micro lens away from the circuit board is arc-shaped.
The embodiment of the application also provides a film layer curing method, which comprises the following steps:
acquiring the temperature of the edge of the film layer;
respectively controlling the light source parts of all areas in the film layer heating device to emit light according to the temperature of the edge of the film layer to form curing of different light types;
wherein, the film layer heating device is the heating device.
In some embodiments, said obtaining the temperature of the edge of the film layer comprises:
acquiring the length of a film layer;
a temperature profile of the edge of the film layer is formed based on the length of the film layer and the temperature of the edge of the film layer.
In some embodiments, the light source units of the respective areas of the film layer heating apparatus emitting light respectively include:
and respectively controlling the light source parts of all the areas in the film layer heating device to emit light according to the temperature curve of the edge of the film layer.
In some embodiments, the individually controlling the light source units of each area in the film layer heating apparatus to emit light according to the temperature profile of the edge of the film layer includes:
and analyzing according to the temperature curve of the edge of the film layer, and when the edge temperature of the partial area of the film layer is lower, controlling the light source part of the corresponding area in the film layer heating device to emit light.
In some embodiments, the obtaining the temperature of the edge of the film layer includes:
obtaining the temperature of the film edge by the temperature sensor in some embodiments, the sealant layer is located between the hole wall of the through hole and the light-transmitting area.
The film layer heating device provided by the embodiment of the application comprises a circuit board and a light source part. The circuit board has relative first face and the second face that sets up, and light source portion includes a plurality of, light source portion is the matrix setting and is in first face, wherein, each light source portion can the independent control for the light source portion of different regions on the circuit board is luminous. This application heating device is luminous through the light source portion of the uneven district of control membrane thickness, and regulation and control marginal solution curing temperature reaches the even purpose of solidification rete membrane thickness.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a film layer heating device according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of another film layer heating device according to an embodiment of the present application.
Fig. 3 is a schematic flow chart of a film curing method implemented in the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that in the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the present application.
The embodiments of the present application provide a film heating apparatus and a film curing method, and the film heating apparatus is described in detail below.
Referring to fig. 1 to 2, fig. 1 is a schematic structural diagram of a film heating apparatus according to an embodiment of the present disclosure. Fig. 2 is a schematic structural diagram of another film layer heating device according to an embodiment of the present application.
The film layer heating apparatus 100 provided by the embodiment of the present application includes a circuit board 10 and a light source unit 20. The circuit board 10 has a first surface 10a and a second surface 10b which are oppositely arranged, the light source part 20 and the light source part 20 comprise a plurality of light sources, the light source parts 20 are arranged on the first surface 10a in a matrix manner, wherein each light source part 20 can be controlled individually, so that the light source parts 20 in different areas on the circuit board 10 emit light.
The first surface 10a may be an upper surface of the circuit board 10, and the first surface 10a may be a lower surface of the circuit board 10. Of course, the first surface 10a may be a lower surface of the circuit board 10, and the first surface 10a may be an upper surface of the circuit board 10. In the embodiment of the present application, without specific description, the default is that the first surface 10a is the upper surface of the circuit board 10, and the second surface 10b is the lower surface of the circuit board 10.
Wherein each light source part 20 can be controlled individually, so that different areas on the circuit board 10 can be controlled individually to turn on or off the light source part 20. Thereby adjusting the temperature of different areas of the circuit board 10.
The light source unit 20 includes a micro light emitting diode 21 and a micro lens 22, the micro light emitting diode 21 is disposed on the first surface 10a, and the micro lens 22 covers the micro light emitting diode 21. The temperature can be supplied by emitting light through the micro light emitting diodes 21. Meanwhile, the temperature radiation capability of the micro light emitting diode 21 can be enhanced by the micro lens 22.
Wherein, the diameter of the micro light emitting diode 21 is 8um to 50 um. That is, the diameters of the micro light emitting diodes 21 are 8um, 10um, 20um, 30um, and 50 um. The specific size of the micro light emitting diode 21 is not limited in the embodiment of the present application. Of course because of the small size of the micro-leds 21. Therefore, the position of the temperature on the circuit board 10 can be controlled more accurately.
Wherein the heat radiation power of the micro light emitting diode 21 is adjustable. This enables better temperature regulation.
Wherein, one side of the micro lens 22 far away from the circuit board 10 is arc-shaped. Of course, the side of the micro-lens 22 away from the circuit board 10 may have other shapes. Such as a diamond shape. Because the side of the micro lens 22 away from the circuit board 10 is arc-shaped, the micro light emitting diode 21 can be enabled to gather more heat.
The film layer heating apparatus 100 provided by the embodiment of the present application includes a circuit board 10 and a light source unit 20. The circuit board 10 has a first surface 10a and a second surface 10b which are oppositely arranged, the light source part 20 and the light source part 20 comprise a plurality of light sources, the light source parts 20 are arranged on the first surface 10a in a matrix manner, wherein each light source part 20 can be controlled individually, so that the light source parts 20 in different areas on the circuit board 10 emit light. This application heating device is luminous through the light source portion 20 of the thick uneven district of control membrane, and regulation and control marginal solution curing temperature reaches the even purpose of solidification rete membrane thickness.
Referring to fig. 3, fig. 3 is a schematic flow chart illustrating a film curing method according to the present application.
The film layer curing method provided by the embodiment of the application comprises the following steps:
201. and acquiring the temperature of the edge of the film layer.
Wherein, the temperature of the film layer edge is the temperature of the solution edge in the solution curing process.
In some embodiments, "obtaining the temperature of the edge of the film layer" specifically includes:
and acquiring the temperature of the edge of the film layer through a temperature sensor.
In some embodiments, "obtaining the temperature of the edge of the film layer" specifically includes:
(1) and acquiring the length of the film layer.
(2) A temperature profile of the edge of the film layer is formed based on the length of the film layer and the temperature of the edge of the film layer.
202. And respectively controlling the light source parts of all the areas in the film layer heating device to emit light according to the temperature of the edge of the film layer, so as to form curing of different light types.
It should be noted that, in the solution curing process, the lengths of the formed films are also uneven due to uneven temperature, and therefore, in the process of forming the films by solution curing, the light source portions in each area of the film layer heating device are controlled to emit light, the curing temperature of the solution at the edge is regulated and controlled, curing with different light types is formed, and the purpose of uniform film thickness of the cured films is achieved.
In some embodiments, the "light source section of each region in the individual control film layer heating apparatus emits light" specifically includes:
and respectively controlling the light source parts of all the areas in the film layer heating device to emit light according to the temperature curve of the edge of the film layer.
It should be noted that the temperature curve of the film edge shows the relationship between the length of the film end and the temperature of the film edge. According to the relationship between the length relationship between the ends of the film layers and the temperature relationship between the edges of the film layers, which is shown by the temperature curve of the edges of the film layers, the heating of the area needing to be heated by the control film layer heating device can be determined.
In some embodiments, the acquiring the temperature of the edge of the film layer specifically includes:
(1) and analyzing according to the temperature curve of the edge of the film layer, and when the edge temperature of the partial area of the film layer is lower, controlling the light source part of the corresponding area in the film layer heating device to emit light.
It should be noted that, when the edge temperature of the partial area of the film layer is low, the light source part corresponding to the area in the film layer heating device emits light to regulate and control the curing temperature of the edge of the film layer, so as to form curing with different light types, and achieve the purpose of uniform film thickness of the cured film layer.
Wherein, the heating device is the above film layer heating device. The film heating apparatus and the embodiments described above are described in detail. In the embodiment of the present application, the film layer heating device is not described in detail.
The method is adopted in the application, the light source part in the area with uneven film thickness is controlled to emit light, the curing temperature of the edge solution is regulated, and the purpose of uniform film thickness of the cured film is achieved.
The film heating device and the film curing method provided in the embodiments of the present application are described in detail above, and the principles and embodiments of the present application are explained in the present application by using specific examples, which are only used to help understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A membrane layer heating apparatus, comprising:
the circuit board is provided with a first surface and a second surface which are oppositely arranged;
the light source parts comprise a plurality of light source parts, and the light source parts are arranged on the first surface in a matrix manner;
wherein, each light source part can be controlled separately, so that the light source parts in different areas on the circuit board emit light.
2. The film layer heating apparatus according to claim 1, wherein the light source portion includes a micro light emitting diode and a micro lens, the micro light emitting diode is disposed on the first surface, and the micro lens covers the micro light emitting diode.
3. The film-layer heating apparatus of claim 2, wherein the diameter of the micro light emitting diode is 8um to 50 um.
4. The film heating apparatus of claim 2, wherein the micro-leds have adjustable thermal radiation power.
5. The film heater of claim 2, wherein the side of the micro-lens away from the circuit board is curved.
6. A method of curing a film, comprising:
acquiring the temperature of the edge of the film layer;
respectively controlling the light source parts of all areas in the film layer heating device to emit light according to the temperature of the edge of the film layer to form curing of different light types;
wherein the film layer heating apparatus is the heating apparatus of any one of claims 1 to 5.
7. The film layer curing method of claim 6, wherein after obtaining the temperature of the edge of the film layer, the method comprises:
acquiring the length of a film layer;
a temperature profile of the edge of the film layer is formed based on the length of the film layer and the temperature of the edge of the film layer.
8. The film layer curing method of claim 7, wherein the light source units of the respective areas of the film layer heating device are respectively controlled to emit light, and the method comprises the following steps:
and respectively controlling the light source parts of all the areas in the film layer heating device to emit light according to the temperature curve of the edge of the film layer.
9. The film layer curing method of claim 8, wherein the controlling the light source units of the respective areas of the film layer heating device to emit light according to the temperature profile of the edge of the film layer comprises:
and analyzing according to the temperature curve of the edge of the film layer, and when the edge temperature of the partial area of the film layer is lower, controlling the light source part of the corresponding area in the film layer heating device to emit light.
10. The film layer curing method of claim 6, wherein the obtaining the temperature of the film layer edge comprises:
and acquiring the temperature of the edge of the film layer through a temperature sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010014887.5A CN111212486A (en) | 2020-01-07 | 2020-01-07 | Film heating device and film curing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010014887.5A CN111212486A (en) | 2020-01-07 | 2020-01-07 | Film heating device and film curing method |
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| Publication Number | Publication Date |
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| CN111212486A true CN111212486A (en) | 2020-05-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010014887.5A Pending CN111212486A (en) | 2020-01-07 | 2020-01-07 | Film heating device and film curing method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1731250A (en) * | 2005-08-31 | 2006-02-08 | 友达光电股份有限公司 | Direct type backlight module |
| CN104216146A (en) * | 2014-08-01 | 2014-12-17 | 京东方科技集团股份有限公司 | Display panel, display device and preparation method of display panel |
| CN104820316A (en) * | 2015-05-13 | 2015-08-05 | 合肥京东方光电科技有限公司 | Light alignment device and method and alignment film preparation system |
| CN109326729A (en) * | 2017-08-01 | 2019-02-12 | Tcl集团股份有限公司 | A kind of QLED device and preparation method thereof |
| US20190196092A1 (en) * | 2017-12-27 | 2019-06-27 | Beijing Xiaomi Mobile Software Co., Ltd. | Backlight source and liquid crystal display |
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2020
- 2020-01-07 CN CN202010014887.5A patent/CN111212486A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1731250A (en) * | 2005-08-31 | 2006-02-08 | 友达光电股份有限公司 | Direct type backlight module |
| CN104216146A (en) * | 2014-08-01 | 2014-12-17 | 京东方科技集团股份有限公司 | Display panel, display device and preparation method of display panel |
| CN104820316A (en) * | 2015-05-13 | 2015-08-05 | 合肥京东方光电科技有限公司 | Light alignment device and method and alignment film preparation system |
| CN109326729A (en) * | 2017-08-01 | 2019-02-12 | Tcl集团股份有限公司 | A kind of QLED device and preparation method thereof |
| US20190196092A1 (en) * | 2017-12-27 | 2019-06-27 | Beijing Xiaomi Mobile Software Co., Ltd. | Backlight source and liquid crystal display |
Non-Patent Citations (1)
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| 曾庆珠等: "《光纤通信技术与设备》", 31 January 2019, 西安电子科技大学出版社 * |
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Application publication date: 20200529 |
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