CN111211452B - Electronic device - Google Patents
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- CN111211452B CN111211452B CN201811392017.0A CN201811392017A CN111211452B CN 111211452 B CN111211452 B CN 111211452B CN 201811392017 A CN201811392017 A CN 201811392017A CN 111211452 B CN111211452 B CN 111211452B
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- metal frame
- abutting
- elastic
- abutting portion
- grounding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
Abstract
An electronic device is provided. The electronic device comprises a substrate, a connector, a grounding bracket and a conductive structure; the substrate comprises a grounding layer; the connector is arranged on the substrate, wherein the connector comprises a metal frame; the grounding support is fixedly arranged on the substrate and is coupled with the grounding layer, wherein at least part of the connector is positioned in the grounding support; the conductive structure is suitable for being elastically abutted between the metal frame and the grounding support, and when the conductive structure is connected with the metal frame and the grounding support, the conductive structure is electrically connected with the grounding support and the metal frame. The connector is covered by the grounding bracket, so that the noise interference condition of the connector is reduced; the metal frame and the grounding support of the connector are coupled through the conductive structure, so that the resistance between the metal frame and the grounding support is reduced, redundant surface current on the metal frame can be quickly guided to the grounding support, the noise interference is reduced, and the specific signal attenuation proportion is reduced from 40% to 20%.
Description
Technical Field
Embodiments of the present invention relate to an electronic device, and more particularly, to an electronic device having a connector.
Background
As the amount of data transmission increases, when a known High Definition Multimedia Interface (HDMI) connector performs high-traffic transmission, a problem of signal interference occurs due to generation of electromagnetic waves, resulting in a great drop in the amount of signal transmission. In the prior art, although the surrounding of the High Definition Multimedia Interface (HDMI) connector is covered by a metal shell, the problem of signal interference still cannot be solved.
Therefore, it is desirable to provide an electronic device to solve the above problems.
Disclosure of Invention
Embodiments of the present invention provide an electronic device to solve the problems of the prior art, the electronic device includes a substrate, a connector, a ground bracket and a conductive structure; the substrate comprises a grounding layer; the connector is arranged on the substrate, wherein the connector comprises a metal frame; the grounding support is fixedly arranged on the substrate and is coupled with the grounding layer, wherein at least part of the connector is positioned in the grounding support; the conductive structure is suitable for being elastically abutted between the metal frame and the grounding support, and when the conductive structure is connected with the metal frame and the grounding support, the conductive structure is electrically connected with the grounding support and the metal frame.
In one embodiment, the grounding bracket includes at least one grounding bracket wall surface, the metal frame includes at least one metal frame side surface, the grounding bracket wall surface faces the metal frame side surface, the conductive structure includes at least one first elastic abutting unit, when the conductive structure connects the metal frame and the grounding bracket, the first elastic abutting unit is located between the metal frame and the grounding bracket, and the first elastic abutting unit connects the grounding bracket wall surface and the metal frame side surface at the same time.
In an embodiment, the first elastic abutting unit includes a first abutting portion, a first arc portion and a second abutting portion, the first abutting portion is disposed at one end of the first arc portion, the second abutting portion is disposed at the other end of the first arc portion, when the first elastic abutting unit is located between the metal frame and the ground bracket, the first abutting portion is connected to a side surface of the metal frame, and the second abutting portion is connected to a wall surface of the ground bracket.
In an embodiment, the first elastic abutting unit further includes a second arc portion, one end of the second abutting portion is connected to the first arc portion, the second arc portion is connected to the other end of the second abutting portion, the first arc portion forms a first notch, the second arc portion forms a second notch, and the first notch and the second notch face each other.
In an embodiment, when the conductive structure is separated from the metal frame and the grounding bracket, the second arc portion is separated from the first abutting portion, and when the first elastic abutting unit is located between the metal frame and the grounding bracket, the first arc portion has a first radius of curvature, the second arc portion has a second radius of curvature, and the second radius of curvature is greater than the first radius of curvature.
In an embodiment, when the conductive structure connects the metal frame and the ground bracket, a virtual extension line of the first abutting portion and a virtual extension line of the second abutting portion are parallel to each other.
In an embodiment, the first elastic abutting unit includes a first abutting portion, a bending portion, an extending portion and a second abutting portion, the bending portion is connected to the first abutting portion and the extending portion, the extending portion is connected to the bending portion and the second abutting portion, the first elastic abutting unit is in a V shape, when the first elastic abutting unit is located between the metal frame and the grounding support, the first abutting portion is connected to the side of the metal frame, and the second abutting portion is connected to the wall of the grounding support.
In one embodiment, the metal frame includes a metal frame bottom surface facing the substrate, the conductive structure includes a second elastic abutting unit, the second elastic abutting unit is connected to the first elastic abutting unit, when the conductive structure connects the metal frame and the ground bracket, the second elastic abutting unit is located between the metal frame bottom surface and the substrate, the second elastic abutting unit simultaneously connects the metal frame bottom surface and the substrate, and the second elastic abutting unit electrically connects the metal frame bottom surface and the first elastic abutting unit.
In an embodiment, the bottom surface of the metal frame includes at least a first notch and at least a first metal frame elastic arm, the first metal frame elastic arm is located in the first notch, the second elastic abutting unit includes a third abutting portion, a fourth abutting portion and at least a spring, the third abutting portion is connected to the fourth abutting portion, the spring is located in the fourth abutting portion, when the second elastic abutting unit is located between the bottom surface of the metal frame and the substrate, the third abutting portion abuts the substrate, and the spring is located in the first notch and adapted to abut the first metal frame elastic arm.
In one embodiment, when the second elastic abutting unit is located between the bottom surface of the metal frame and the substrate, the fourth abutting portion abuts against the bottom surface of the metal frame, the fourth abutting portion has an abutting portion gap, and the elastic piece is located in the abutting portion gap.
In one embodiment, the third abutting portion is in a sheet shape, the fourth abutting portion is in a sheet shape, the first elastic abutting unit is connected with the fourth abutting portion, and the cross section of the second elastic abutting unit is in a V shape.
In one embodiment, the metal frame has an abutting portion, one side of the abutting portion abuts against the substrate, and the vertex of the V-shape of the second elastic abutting unit abuts against the other side of the abutting portion.
In an embodiment, the first elastic abutting unit includes a first abutting portion, a first arc portion and a second abutting portion, the first abutting portion is disposed at one end of the first arc portion, the second abutting portion is disposed at the other end of the first arc portion, when the first elastic abutting unit is located between the metal frame and the ground bracket, the first abutting portion is connected to a side surface of the metal frame, the second abutting portion is connected to a wall surface of the ground bracket, and the conductive structure is integrally formed.
In one embodiment, when the second elastic abutting unit is located between the bottom surface of the metal frame and the substrate, the second elastic abutting unit covers the first notch.
In one embodiment, the metal frame includes a metal frame top surface opposite to the metal frame bottom surface, and the grounding support includes a support covering portion correspondingly covering at least a portion of the metal frame top surface.
In one embodiment, the metal frame top surface includes at least one second notch and at least one second metal frame elastic arm, the second metal frame elastic arm is located inside the second notch, and the support covering portion includes a support elastic arm adapted to abut against the second metal frame elastic arm to electrically connect the metal frame and the grounding support.
In an embodiment, the electronic device further includes an outer cover, the outer cover is connected to the grounding bracket, and the outer cover pushes the bracket elastic arm to make the bracket elastic arm abut against the second metal frame elastic arm.
In one embodiment, the electronic device further includes a connecting wire, the connecting wire includes a connecting head adapted to connect to the connector, the connector includes a plate and a plurality of connector electrical contacts disposed on the plate, the connecting head includes a plurality of connecting head electrical contacts adapted to electrically connect to the connecting head electrical contacts.
In one embodiment, the connector is a high definition multimedia interface connector.
In embodiments of the present invention, the connector is covered by a grounding bracket to reduce noise interference conditions of the connector. In particular, the embodiment of the invention also couples the metal frame of the connector and the grounding bracket through the conductive structure. Because the resistance between the metal frame and the grounding support is reduced by the conductive structure, redundant surface current on the metal frame can be quickly guided to the grounding support, and noise interference is reduced. According to the experimental result, the signal attenuation ratio of the electronic device is reduced from 40% to 20%.
Drawings
Fig. 1A is an exploded view of a part of an electronic device according to an embodiment of the invention.
Fig. 1B is a diagram showing a combination of parts of an electronic device according to an embodiment of the invention.
Fig. 1C is a combination diagram of an electronic device according to an embodiment of the invention.
Fig. 2A shows a perspective view of a conductive structure according to an embodiment of the invention.
Fig. 2B shows a top view of a conductive structure according to an embodiment of the invention.
Fig. 3A shows an embodiment of the present invention in which the first elastic abutting unit is electrically connected to the grounding bracket and the metal frame.
Fig. 3B shows an embodiment of the present invention in which the second elastic abutting unit is electrically connected to the grounding bracket and the metal frame.
Fig. 3C shows a detailed structure of the metal frame according to the embodiment of the present invention.
Fig. 4A shows a partially exploded view of a conductive structure according to another embodiment of the present invention.
Fig. 4B is a partial structure assembly diagram of a conductive structure according to another embodiment of the invention.
Description of the main component symbols:
e electronic device 413 first arc portion
1 second arc part of substrate 414
11 ground plane 415 first recess
2 second recess of connector 416
21 metal frame 42 first elastic force abutting unit
211 metal frame side 421 third contact part
212 metal frame bottom surface 422 fourth abutting portion
213 Metal frame top surface 423 spring plate
214 abutting part 424 abutting part notch
221 first notch 425 apex
222 first metal frame elastic arm r1 first radius of curvature
231 second notch r2 second radius of curvature
232 second metal frame elastic arm 5 conductive structure
24 first elastic force abutting unit of plate 51
3 first abutting portion of grounding bracket 511
31 ground bracket wall 512 second abutting part
32 support covering part 513 bending part
321 support elastic arm 514 extension
4 conductive structure 515 conductive foam
41 first elastic force abutting unit 6 outer cover
411 first abutting portion 7 connecting line
412 second abutting portion 71 connecting head
Detailed Description
Fig. 1A is an exploded view of a part of an electronic device according to an embodiment of the invention. Fig. 1B is a diagram showing a combination of parts of an electronic device according to an embodiment of the invention. Referring to fig. 1A and 1B, an electronic device E according to a first embodiment of the invention includes a substrate 1, a connector 2, a grounding frame 3, and a conductive structure 4. The substrate 1 includes a ground layer 11. The connector 2 is disposed on the substrate 1, wherein the connector 2 includes a metal frame 21. The grounding bracket 3 is fixed on the substrate 1 and coupled to the grounding layer 11, wherein the connector 2 is located inside the grounding bracket 3, i.e. the metal frame 21 of the connector 2 is aligned with or retracted into one side of the grounding bracket 3. In some embodiments, the connector 2 may only be partially located within the frame of the grounding bracket 3. The conductive structure 4 is suitable for being inserted (elastically abutted) between the metal frame 21 and the grounding bracket 3, and when the conductive structure 4 connects the metal frame 21 and the grounding bracket 3, the conductive structure 4 is abutted to both the grounding bracket 3 and the metal frame 21 at the same time so as to electrically connect the grounding bracket 3 and the metal frame 21.
Fig. 2A shows a detailed structure of the conductive structure according to the embodiment of the invention. The conductive structure 4 includes at least one first elastic abutting unit 41. Referring to fig. 3A, a situation of the first elastic abutting unit electrically connecting the grounding bracket and the metal frame is shown in the embodiment of the present invention. With reference to fig. 2A and 3A, in an embodiment, the grounding bracket 3 includes at least one grounding bracket wall surface 31, the metal frame 21 includes at least one metal frame side surface 211, the grounding bracket wall surface 31 faces the metal frame side surface 211, when the conductive structure 4 connects the metal frame 21 and the grounding bracket 3, the first elastic force abutting unit 41 is located between the metal frame 21 and the grounding bracket 3, and the first elastic force abutting unit 41 connects the grounding bracket wall surface 31 and the metal frame side surface 211 at the same time. Thereby, the first elastic force abutting unit 41 reduces the resistance between the grounding bracket wall surface 31 and the metal frame side surface 211.
Referring to fig. 2A, in an embodiment, the first elastic abutting unit 41 includes a first abutting portion 411, a first arc portion 413, and a second abutting portion 412, the first abutting portion 411 is disposed at one end of the first arc portion 413, and the second abutting portion 412 is disposed at the other end of the first arc portion 413. When the first elastic abutting unit 41 is located between the metal frame 21 and the grounding frame 3, the first abutting portion 411 is connected to the metal frame side 211, and the second abutting portion 412 is connected to the grounding frame wall 31.
Referring to fig. 2A, in an embodiment, the first elastic abutting unit 41 further includes a second arc portion 414, one end of the second abutting portion 412 is connected to the first arc portion 413, and the second arc portion 414 is connected to the other end of the second abutting portion 412. Referring to fig. 2B, the first arc portion 413 forms a first notch 415, the second arc portion 414 forms a second notch 416, and the first notch 415 and the second notch 416 face each other.
Referring to fig. 2A, fig. 2B and fig. 3A, in an embodiment, when the conductive structure 4 is separated from the metal frame 21 and the grounding bracket 3, the second arc portion 414 is separated from the first abutting portion 411. When the first elastic force abutting unit 41 is located between the metal frame 21 and the grounding bracket 3, the second arc portion 414 abuts against the first abutting portion 411. In this embodiment, the first arc portion 413 has a first radius of curvature r1, the second arc portion 414 has a second radius of curvature r2, and the second radius of curvature r2 is greater than the first radius of curvature r 1. By designing the second curvature radius r2 to be larger than the first curvature radius r1, the first elastic abutting unit 41 can easily provide a turning function at the first arc portion 413 and can provide an elastic abutting function at the second arc portion 414. In particular, the elastic force provided by the second arc portion 414 enables the first elastic force abutting unit 41 to contact the grounding bracket wall 31 and the metal frame side surface 211 more fully, so as to reduce the resistance between the grounding bracket wall 31 and the metal frame side surface 211.
When the conductive structure connects the metal frame and the grounding bracket, a virtual extension line of the first abutting portion and a virtual extension line of the second abutting portion are parallel to each other. However, the above disclosure is not intended to limit the present invention, and the above definition of parallel may be extended to the case where the included angle of extension is less than 5 degrees.
Fig. 4A and 4B show a conductive structure 5 according to another embodiment of the present invention, in this embodiment, the first elastic abutting unit 51 includes a first abutting portion 511, a bending portion 513, an extending portion 514 and a second abutting portion 512, the bending portion 513 connects the first abutting portion 511 and the extending portion 514, the extending portion 514 connects the bending portion 513 and the second abutting portion 512, the first elastic abutting unit 51 is substantially V-shaped, one end of the second abutting portion 512 is substantially parallel to the first abutting portion 511, when the first elastic abutting unit 51 is located between the metal frame 21 and the grounding frame 3, the first abutting portion 511 connects the metal frame side 211, and the second abutting portion 512 connects the grounding frame wall 31.
Referring to fig. 4A and 4B, in an embodiment, the first elastic abutting unit 51 further includes a conductive foam 515, the conductive foam 515 is suitable for being attached to the first abutting portion 511 and the second abutting portion 512, and the conductive foam 515 can increase a conductive area and reduce a resistance.
In an embodiment, the first elastic abutting unit 41 may also be provided with a conductive foam, and is connected to the grounding frame wall 31 and the metal frame side 211 through the conductive foam. In another embodiment, the conductive foam of the first elastic abutting unit 51 can be removed, the first abutting portion 511 directly abuts against the metal frame side 211, and the second abutting portion 512 directly abuts against the grounding frame wall 31. The above disclosure does not limit the present invention.
Referring to fig. 1A and 1B again, in an embodiment, the metal frame 21 includes a metal frame bottom surface 212, the metal frame bottom surface 212 faces the substrate 1, the conductive structure 4 includes a second elastic abutting unit 42, the second elastic abutting unit 42 is connected to the first elastic abutting unit 41, when the conductive structure 4 is connected to the metal frame 21 and the grounding bracket 3, the second elastic abutting unit 42 is located between the metal frame bottom surface 212 and the substrate 1, the second elastic abutting unit 42 is simultaneously connected to the metal frame bottom surface 212 and the substrate 1, and the second elastic abutting unit 42 is electrically connected to the metal frame bottom surface 212 and the first elastic abutting unit 41. Thus, the second elastic abutting unit 42 reduces the resistance between the bottom surface 212 of the metal frame and the wall surface 31 of the grounding bracket.
In this embodiment, the number of the first elastic abutment units 41 is two, and the first elastic abutment units 41 are connected to both sides of the second elastic abutment unit 42. Wherein each of the first elastic abutting units 41 and the second elastic abutting units 42 is connected by a bending portion, and the bending angle of the bending portion is about 90 degrees.
Referring to fig. 1A and 1B again, in an embodiment, the metal frame bottom surface 212 includes at least one first notch 221 and at least one first metal frame elastic arm 222, and the first metal frame elastic arm 222 is located in the first notch 221. Referring to fig. 2A, the second elastic abutting unit 42 includes a third abutting portion 421, a fourth abutting portion 422 and at least one elastic piece 423, the third abutting portion 421 is connected to the fourth abutting portion 422, and the elastic piece 423 is disposed on the fourth abutting portion 422. Referring to fig. 3B, when the second elastic abutting unit 42 is located between the metal frame bottom surface 212 and the substrate 1, the third abutting portion 421 abuts the substrate 1, and the elastic piece 423 is located in the first slot 221 and adapted to abut the first metal frame elastic arm 222. Thus, the elastic piece 423 can fully contact the first metal frame elastic arm 222, thereby reducing the resistance between the metal frame bottom surface 212 and the grounding frame wall surface 31.
Referring to fig. 2A and 3B again, in an embodiment, when the second elastic abutting unit 42 is located between the metal frame bottom surface 212 and the substrate 1, the fourth abutting portion 422 abuts against the metal frame bottom surface 212, the fourth abutting portion 422 has an abutting portion notch 424, and the elastic piece 423 is located in the abutting portion notch 424.
Referring to fig. 2A and 3B again, in an embodiment, the third abutting portion 421 is sheet-shaped, the fourth abutting portion 422 is sheet-shaped, the first elastic abutting units 41 are connected with the fourth abutting portion 422, and the cross section of the second elastic abutting unit 42 is V-shaped (fig. 3B).
Fig. 3C shows a detailed structure of the metal frame according to the embodiment of the present invention. With reference to fig. 3B and fig. 3C, in an embodiment, the metal frame 21 has an abutting portion 214, one side of the abutting portion 214 abuts against the substrate 1, and a V-shaped vertex 425 of the second elastic abutting unit 42 abuts against the other side of the abutting portion 214, so as to prevent the conductive structure 4 from being pushed too deep.
Referring to fig. 2A and 3B again, in an embodiment, when the second elastic abutting unit 42 is located between the bottom surface 212 of the metal frame and the substrate 1, the second elastic abutting unit 42 covers the first notch 221, thereby preventing noise from leaking.
Referring to fig. 2A, in an embodiment of the present invention, the conductive structure 4 is integrally formed, and may be manufactured by stamping or the like. However, the disclosure is not limited to the invention, and the conductive structure 4 may be formed by assembling a plurality of components.
Referring to fig. 1A and 1B, in an embodiment, the metal frame 21 includes a metal frame top surface 213, the metal frame top surface 213 is opposite to the metal frame bottom surface 212, and the grounding frame 3 includes a frame covering portion 32, and the frame covering portion 32 correspondingly covers at least a portion of the metal frame top surface 213.
Referring to fig. 1A and 1B, in an embodiment, the metal frame top surface 213 includes at least one second slot 231 and at least one second metal frame elastic arm 232, the second metal frame elastic arm 232 is located inside the second slot 231, the support covering portion 32 includes a support elastic arm 321, and the support elastic arm 321 is adapted to abut against the second metal frame elastic arm 232 to electrically connect the metal frame 21 and the grounding support 3. Thereby, the resistance between the metal frame 21 and the grounding bracket 3 is reduced.
Referring to fig. 1A, 1B and 1C, in an embodiment, the electronic device further includes a cover 6 (shown by a dotted line), the cover 6 is connected to the grounding bracket 3, and the cover 6 pushes the bracket elastic arm 321 to make the bracket elastic arm 321 abut against the second metal frame elastic arm 232.
Referring again to fig. 1C, in one embodiment, the electronic device E further includes a connecting wire 7, the connecting wire 7 includes a connecting head 71, the connecting head 71 is adapted to connect to the connector 2, the connector 2 includes a board 24 and a plurality of connector electrical contacts (not shown), the connector electrical contacts (not shown) are disposed on the board 24, and the connector electrical contacts (not shown) are adapted to electrically connect to the connecting head 71.
In one embodiment, the connector 2 is a High Definition Multimedia Interface (HDMI) connector.
In embodiments of the present invention, the connector is covered by a grounding bracket to reduce noise interference conditions of the connector. In particular, the embodiment of the invention also couples the metal frame of the connector and the grounding bracket through the conductive structure. Because the resistance between the metal frame and the grounding support is reduced by the conductive structure, redundant surface current on the metal frame can be quickly guided to the grounding support, and noise interference is reduced. According to the experimental result, the signal attenuation ratio of the electronic device is reduced from 40% to 20%.
Although the present invention has been described with respect to the preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (17)
1. An electronic device, comprising:
a substrate including a ground layer;
the connector is arranged on the substrate and comprises a metal frame;
a grounding support fixed on the substrate and coupled to the grounding layer, wherein at least part of the connector is located in the grounding support; and
the conductive structure is suitable for being elastically abutted between the metal frame and the grounding support, and when the conductive structure is connected with the metal frame and the grounding support, the conductive structure is electrically connected with the grounding support and the metal frame;
the conductive structure comprises at least one first elastic abutting unit, when the conductive structure is connected with the metal frame and the grounding support, the first elastic abutting unit is positioned between the metal frame and the grounding support, and the first elastic abutting unit is simultaneously connected with the grounding support wall and the metal frame side;
the metal frame comprises a metal frame bottom surface facing the substrate, the conductive structure comprises a second elastic abutting unit, the second elastic abutting unit is connected with the first elastic abutting unit, when the conductive structure is connected with the metal frame and the grounding support, the second elastic abutting unit is located between the metal frame bottom surface and the substrate, the second elastic abutting unit is simultaneously connected with the metal frame bottom surface and the substrate, and the second elastic abutting unit is electrically connected with the metal frame bottom surface and the first elastic abutting unit.
2. The electronic device according to claim 1, wherein the first elastic abutting unit comprises a first abutting portion, a first arc portion and a second abutting portion, the first abutting portion is disposed at one end of the first arc portion, the second abutting portion is disposed at the other end of the first arc portion, when the first elastic abutting unit is disposed between the metal frame and the ground bracket, the first abutting portion is connected to a side surface of the metal frame, and the second abutting portion is connected to the wall surface of the ground bracket.
3. The electronic device of claim 2, wherein the first elastic abutting unit further comprises a second arc portion, one end of the second abutting portion is connected to the first arc portion, the second arc portion is connected to the other end of the second abutting portion, the first arc portion forms a first notch, the second arc portion forms a second notch, and the first notch and the second notch face each other.
4. The electronic device of claim 3, wherein when the conductive structure is separated from the metal frame and the grounding bracket, the second arc portion is separated from the first abutting portion, the first arc portion has a first radius of curvature, the second arc portion has a second radius of curvature, and the second radius of curvature is greater than the first radius of curvature.
5. The electronic device of claim 4, wherein a virtual extension line of the first contact portion and a virtual extension line of the second contact portion are parallel to each other when the conductive structure connects the metal frame and the ground bracket.
6. The electronic device according to claim 1, wherein the first elastic abutting unit comprises a first abutting portion, a bending portion, an extending portion and a second abutting portion, the bending portion is connected with the first abutting portion and the extending portion, the extending portion is connected with the bending portion and the second abutting portion, the first elastic abutting unit is in a V shape, when the first elastic abutting unit is located between the metal frame and the grounding bracket, the first abutting portion is connected with the side surface of the metal frame, and the second abutting portion is connected with the wall surface of the grounding bracket.
7. The electronic device of claim 1, wherein the bottom surface of the metal frame includes at least a first notch and at least a first metal frame elastic arm, the first metal frame elastic arm is located in the first notch, the second elastic abutting unit includes a third abutting portion, a fourth abutting portion and at least a spring, the third abutting portion is connected to the fourth abutting portion, the spring is located in the fourth abutting portion, when the second elastic abutting unit is located between the bottom surface of the metal frame and the substrate, the third abutting portion abuts the substrate, and the spring is located in the first notch and is suitable for abutting the first metal frame elastic arm.
8. The electronic device of claim 7, wherein when the second elastic abutting unit is located between the bottom surface of the metal frame and the substrate, the fourth abutting portion abuts against the bottom surface of the metal frame, the fourth abutting portion has an abutting portion gap, and the elastic piece is located in the abutting portion gap.
9. The electronic device according to claim 8, wherein the third abutting portion is shaped like a sheet, the fourth abutting portion is shaped like a sheet, the first elastic abutting unit is connected with the fourth abutting portion, and the cross section of the second elastic abutting unit is shaped like a V.
10. The electronic device of claim 9, wherein the metal frame has an abutting portion, one side of the abutting portion abuts against the substrate, and the vertex of the V-shape of the second elastic abutting unit abuts against the other side of the abutting portion.
11. The electronic device according to claim 7, wherein the first elastic abutting unit comprises a first abutting portion, a first arc portion and a second abutting portion, the first abutting portion is disposed at one end of the first arc portion, the second abutting portion is disposed at the other end of the first arc portion, when the first elastic abutting unit is located between the metal frame and the ground bracket, the first abutting portion is connected to a side surface of the metal frame, the second abutting portion is connected to a wall surface of the ground bracket, and the conductive structure is integrally formed.
12. The electronic device of claim 7, wherein the second elastic abutting unit covers the first notch when the second elastic abutting unit is located between the bottom surface of the metal frame and the substrate.
13. The electronic device of claim 1, wherein the metal frame comprises a top metal frame surface opposite to the bottom metal frame surface, and the grounding bracket comprises a bracket covering portion correspondingly covering at least a part of the top metal frame surface.
14. The electronic device of claim 13, wherein the top metal frame includes at least a second notch and at least a second metal frame elastic arm, the second metal frame elastic arm is located inside the second notch, the support covering portion includes a support elastic arm, and the support elastic arm is adapted to abut against the second metal frame elastic arm to electrically connect the metal frame and the grounding support.
15. The electronic device of claim 14, further comprising a cover, the cover being connected to the grounding bracket, the cover pushing the bracket elastic arm to make the bracket elastic arm abut against the second metal frame elastic arm.
16. The electronic device of claim 1, further comprising a connecting wire, the connecting wire comprising a connecting head adapted to connect to the connector, the connector comprising a plate and a plurality of connector electrical contacts disposed on the plate, the connecting head comprising a plurality of connecting head electrical contacts adapted to electrically connect to the plurality of connecting head electrical contacts.
17. The electronic device of claim 1, wherein the connector is a high definition multimedia interface connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811392017.0A CN111211452B (en) | 2018-11-21 | 2018-11-21 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811392017.0A CN111211452B (en) | 2018-11-21 | 2018-11-21 | Electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111211452A CN111211452A (en) | 2020-05-29 |
| CN111211452B true CN111211452B (en) | 2021-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811392017.0A Active CN111211452B (en) | 2018-11-21 | 2018-11-21 | Electronic device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6351394B1 (en) * | 1999-02-12 | 2002-02-26 | Tyco Electronics Corporation | Conductive frame for receiving an electronic module |
| US7828598B2 (en) * | 2008-08-05 | 2010-11-09 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector with clips for connecting an outer shell and an inner shell |
| CN204857982U (en) * | 2015-08-05 | 2015-12-09 | 温州海通通讯电子有限公司 | Cell -phone shell fragment |
| TWM517932U (en) * | 2015-07-22 | 2016-02-21 | Nextronics Engineering Corp | High frequency connector continuously grounding to improve crosstalk |
| CN206412508U (en) * | 2016-11-07 | 2017-08-15 | 深圳市信维通信股份有限公司 | A kind of contact flat spring |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5525227B2 (en) * | 2009-10-13 | 2014-06-18 | ホシデン株式会社 | Board module |
| CN102623853B (en) * | 2011-01-28 | 2015-05-27 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
-
2018
- 2018-11-21 CN CN201811392017.0A patent/CN111211452B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6351394B1 (en) * | 1999-02-12 | 2002-02-26 | Tyco Electronics Corporation | Conductive frame for receiving an electronic module |
| US7828598B2 (en) * | 2008-08-05 | 2010-11-09 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector with clips for connecting an outer shell and an inner shell |
| TWM517932U (en) * | 2015-07-22 | 2016-02-21 | Nextronics Engineering Corp | High frequency connector continuously grounding to improve crosstalk |
| CN204857982U (en) * | 2015-08-05 | 2015-12-09 | 温州海通通讯电子有限公司 | Cell -phone shell fragment |
| CN206412508U (en) * | 2016-11-07 | 2017-08-15 | 深圳市信维通信股份有限公司 | A kind of contact flat spring |
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| CN111211452A (en) | 2020-05-29 |
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