CN111211238A - Thin film packaging structure, thin film packaging method and design method of concave hole - Google Patents
Thin film packaging structure, thin film packaging method and design method of concave hole Download PDFInfo
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- CN111211238A CN111211238A CN201811393535.4A CN201811393535A CN111211238A CN 111211238 A CN111211238 A CN 111211238A CN 201811393535 A CN201811393535 A CN 201811393535A CN 111211238 A CN111211238 A CN 111211238A
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10K50/00—Organic light-emitting devices
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- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
Abstract
The invention relates to a film packaging structure, a film packaging method and a design method of concave holes, wherein the film packaging structure comprises the following components: the first inorganic packaging layer is arranged at the lower end of the thin film packaging structure, and the upper surface of the first inorganic packaging layer is provided with a plurality of concave holes; the organic packaging layer is arranged on the first inorganic packaging layer, and organic ink is taken as a material of the organic packaging layer, and the organic packaging layer is formed by coating the organic packaging layer on the first inorganic packaging layer and standing the organic packaging layer to flatten the organic ink; and a second inorganic encapsulation layer disposed on the organic encapsulation layer. When the first inorganic packaging layer is formed, the first inorganic packaging layer is provided with a plurality of concave holes, the plurality of concave holes are designed, the contact angle between the organic ink and the first inorganic packaging layer is reduced by changing the aperture of each concave hole and the pitch between two adjacent concave holes, the wettability of the organic ink is improved, and the planarization effect of the organic ink is further improved.
Description
Technical Field
The invention relates to the technical field of thin film packaging, in particular to a thin film packaging structure, a thin film packaging method and a design method of a concave hole on an inorganic packaging layer applied to thin film packaging.
Background
Currently, a thin film package of an Organic Light-Emitting Diode (OLED) device is usually packaged in a stack manner of an inorganic layer/an Organic layer/an inorganic layer, and a film formation manner of the Organic layer is to coat an Organic ink on the inorganic layer by an inkjet printing manner and then to stand the inorganic layer, so that the Organic ink is planarized and formed on the inorganic layer.
In the prior art, during the design of thin film package, the contact surface between the inorganic layer and the organic layer is usually designed as a smooth plane, that is, an intrinsic contact angle is used for design, and during actual production, various irregular concave holes are usually formed in the inorganic layer, so that the apparent contact angle between the organic ink and the concave holes in the inorganic layer is larger than the intrinsic contact angle, which results in poor fluidity of the organic ink, and further pits often appear on the upper surface of the organic ink during the planarization process on the inorganic layer, which results in poor planarization effect, that is, uneven brightness of the display can be found in appearance, causing various traces (Mura), or uneven spots like orange peel surfaces are found, and uneven areas are often found in pits of a Pixel Definition Layer (PDL).
In order to solve the problem caused by the unevenness of the organic layer during coating, the prior art generally adopts the following improvement methods: increasing the thickness of the organic ink or increasing the rest time for planarization. However, increasing the thickness of the organic ink affects the bending radius of the flexible panel, and increases material loss and processing time; the current practice of increasing the planarization latency also increases the process time, resulting in poor production efficiency.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a film packaging structure, a film packaging method and a design method of concave holes, so as to solve the technical problems, and the specific technical scheme is as follows:
a thin film encapsulation structure is provided, which is applied to thin film encapsulation of an organic light emitting diode device, wherein the thin film encapsulation structure comprises: the first inorganic packaging layer is arranged at the lower end of the thin film packaging structure, and the upper surface of the first inorganic packaging layer is provided with a plurality of concave holes; the organic packaging layer is arranged on the first inorganic packaging layer, and organic ink is taken as a material of the organic packaging layer, and the organic packaging layer is formed by coating the organic packaging layer on the first inorganic packaging layer and standing the organic packaging layer to flatten the organic ink; and a second inorganic encapsulation layer disposed on the organic encapsulation layer. Wherein a relationship between the plurality of recesses and the organic ink satisfies:
wherein
Theta is the intrinsic contact angle, h is the hole depth of the concave hole, D is the hole diameter of the concave hole, P is the hole distance between two adjacent concave holes, theta1To show the contact angle, fsIs the fraction of the total area occupied by the plane on the first inorganic encapsulation layer.
In one possible design, the organic ink is applied to the first inorganic encapsulation layer by inkjet printing.
In one possible design, the contact angle θ is expressed1Is less than or equal to the intrinsic contact angle theta.
Also provided is a thin film encapsulation method applied to thin film encapsulation of an organic light emitting diode device, wherein the thin film encapsulation method comprises the following steps: forming a first inorganic packaging layer, wherein the upper surface of the formed first inorganic packaging layer is provided with a plurality of concave holes; coating the organic ink on the first inorganic packaging layer, standing the coated organic ink to flatten the organic ink to form an organic packaging layer; and forming a second inorganic encapsulation layer on the organic encapsulation layer. Wherein a relationship between the plurality of recesses and the organic ink satisfies:
wherein
Theta is the intrinsic contact angle, h is the hole depth of the concave hole, D is the hole diameter of the concave hole, P is the hole distance between two adjacent concave holes, theta1To show the contact angle, fsIs the fraction of the total area occupied by the plane on the first inorganic encapsulation layer.
In one possible design, the organic ink is applied to the first inorganic encapsulation layer by inkjet printing.
In one possible design, the contact angle θ is expressed1Is less than or equal to the intrinsic contact angle theta.
Also provides a design method of concave hole, and is used for inorganic material in thin film packagingAnd designing a packaging layer, wherein the design method of the concave hole comprises the following steps: providing an inorganic packaging layer, and forming a plurality of concave holes with fixed hole depths on the inorganic packaging layer; and changing the aperture of the concave holes and the pitch between two adjacent concave holes so as to ensure that the upper surface of the organic packaging layer formed by flattening the inorganic packaging layer by the organic ink is smooth. Wherein the relation between the pore size of a plurality of shrinkage pools and pitch between two adjacent shrinkage pools and organic ink satisfies:
wherein
Theta is the intrinsic contact angle, h is the hole depth of the concave hole, D is the hole diameter of the concave hole, P is the hole distance between two adjacent concave holes, theta1To show the contact angle, fsIs a fraction of the total area occupied by the plane and represents the contact angle theta1Is 0 degrees.
Compared with the prior art, the invention has the advantages that:
when the first inorganic packaging layer is formed, the first inorganic packaging layer is provided with a plurality of concave holes, the plurality of concave holes are designed, the contact angle between the organic ink and the first inorganic packaging layer is reduced by changing the aperture of each concave hole and the pitch between two adjacent concave holes, the wettability of the organic ink is improved, the planarization effect of the organic ink is further improved, and the problem that pits often appear on the upper surface of the organic ink in the planarization process is solved.
Drawings
The invention is further illustrated by means of the attached drawings, the content of which is not in any way limitative of the invention.
Fig. 1 is a schematic structural diagram of a thin film encapsulation structure according to an embodiment of the invention.
Fig. 2 is a schematic structural diagram of an Organic Light Emitting Diode (OLED) device encapsulated by a thin film encapsulation structure according to an embodiment of the invention.
Fig. 3 is a schematic top view of a first inorganic encapsulation layer according to an embodiment of the invention.
Fig. 4 is a schematic top view of a first inorganic encapsulation layer according to another embodiment of the invention.
Fig. 5 is a flowchart illustrating a thin film encapsulation method according to an embodiment of the invention.
Fig. 6 is a schematic flow chart illustrating a method for designing a recess according to an embodiment of the invention.
Detailed Description
The terms "first," "second," and the like, as used herein, do not denote any order or importance, nor do they denote any order or importance, but rather are used to distinguish one element from another.
In an embodiment of the present invention, a thin film encapsulation structure 1 is disclosed, and as shown in fig. 1 to 4, the thin film encapsulation structure 1 is applied to thin film encapsulation of an Organic Light Emitting Diode (OLED) device 5, and the thin film encapsulation structure 1 includes a first inorganic encapsulation layer 2, an organic encapsulation layer 3, and a second inorganic encapsulation layer 4, where:
referring to fig. 1, the first inorganic encapsulation layer 2 is disposed at the lower end of the film encapsulation structure 1, and there is no special requirement for selecting the material of the first inorganic encapsulation layer 2 in the present invention, and the material may be selected conventionally in the art, such as a silicon nitride film.
Referring to fig. 1 to 4, the upper surface of the first inorganic encapsulation layer 2 has a plurality of concave holes 21, the plurality of concave holes 21 in the present invention may be formed directly on the first inorganic encapsulation layer 2 when the first inorganic encapsulation layer 2 is formed, but not limited thereto, and those skilled in the art may select other forming methods according to the teachings of the present invention, such as forming the first inorganic encapsulation layer 2 and then processing the first inorganic encapsulation layer 2.
In a preferred embodiment, the plurality of cavities 21 are regular cavities, as shown in fig. 3, preferably cavities with uniform intervals and the same aperture and depth, so as to facilitate the design of the cavities in actual production, but not limited thereto, and those skilled in the art can select other suitable regular cavities according to the teachings of the present invention, as shown in fig. 4, for example, cavities with the same pitch and depth and different aperture.
In a preferred embodiment, referring to fig. 2, the first inorganic encapsulation layer 2 is disposed on the substrate 501 of the Organic Light Emitting Diode (OLED) device 5 and surrounds the Organic Light Emitting Diode (OLED) layer 502 of the Organic Light Emitting Diode (OLED) device 5, so as to implement thin film encapsulation of the Organic Light Emitting Diode (OLED) device 5.
Referring to fig. 1, the organic encapsulation layer 3 is disposed on the first inorganic encapsulation layer 2, the organic encapsulation layer 3 is formed by coating the organic ink on the first inorganic encapsulation layer 2 and standing to planarize the organic ink, and the organic encapsulation layer 3 is formed by selecting the material of the organic ink according to the present invention, and the material of the organic ink may be selected according to the conventional selection in the art, such as acrylate.
The relationship between the plurality of concave holes 21 and the organic ink in the present invention satisfies:
wherein
Theta is the intrinsic contact angle, h is the hole depth of the concave hole 21, D is the hole diameter of the concave hole 21, P is the pitch between two adjacent concave holes 21, and theta1To show the contact angle, fsIs a fraction of the total area occupied by the plane on the first inorganic encapsulation layer 2.
In a preferred embodiment, the organic ink is allowed to stand still on the first inorganic encapsulation layer 2, so that the planarization effect is better, and the upper surface of the organic encapsulation layer 3 is a horizontal surface and shows a contact angle θ1Is less than or equal to the intrinsic contact angle theta, preferably the apparent contact angle theta1The degree of (2) is equal to the intrinsic contact angle theta, so that the flowability of the organic ink on the first inorganic encapsulation layer 2 in actual production is equal to the flowability of the organic ink on the first inorganic encapsulation layer 2 in design, and the problems that pits appear on the upper surface of the organic ink in the planarization process, the planarization effect is poor, the brightness of a display is not uniform in appearance, various marks are caused (Mura), or concave and convex points are formed on the surface of an orange peel are solved.
In a preferred embodiment, the organic ink is coated on the first inorganic encapsulation layer 2 by inkjet printing, but not limited thereto, and those skilled in the art can select other coating methods according to actual production requirements.
Referring to fig. 1, the second inorganic sealing layer 4 is disposed on the organic sealing layer 3, and there is no special requirement for selecting the material of the second inorganic sealing layer 4 in the present invention, and the material may be selected conventionally in the art, such as a silicon nitride film.
In a preferred embodiment, please refer to fig. 1 and 2, the second inorganic encapsulation layer 4 and the first inorganic encapsulation layer 2 jointly cover the organic encapsulation layer 3, so as to prevent moisture from invading the organic encapsulation layer 3, thereby improving the reliability of the package.
The first inorganic packaging layer 2 on the thin film packaging structure 1 is provided with the plurality of concave holes 21, and the concave holes 21 and the organic ink meet the formula, so that the apparent contact angle between the organic ink and the concave holes 21 is close to or equal to the intrinsic contact angle, the contact angle between the organic ink and the concave holes 21 on the first inorganic packaging layer 2 can be reduced, the wettability of the organic ink is improved, the planarization effect of the organic ink is further improved, and the problem that pits often appear on the upper surface of the organic ink in the planarization process is solved.
Accordingly, referring to fig. 5 and fig. 1-4, an embodiment of the present invention further discloses a film encapsulation method 6 for implementing the film encapsulation structure 1, which is applied to film encapsulation of an Organic Light Emitting Diode (OLED) device 5, wherein the film encapsulation method 6 includes the following steps 601 to 603.
Specifically, the first inorganic encapsulation layer 2 is formed on the substrate 501 of the Organic Light Emitting Diode (OLED) device 5 and surrounds the Organic Light Emitting Diode (OLED) layer of the Organic Light Emitting Diode (OLED) device 5 to realize thin film encapsulation of the Organic Light Emitting Diode (OLED) device 5.
Specifically, the first inorganic encapsulation layer 2 is a silicon nitride film, but not limited thereto, and those skilled in the art can select other suitable materials as the first inorganic encapsulation layer 2 according to actual production requirements.
Specifically, the plurality of concave holes 21 may be formed directly on the first inorganic encapsulation layer 2 when the first inorganic encapsulation layer 2 is formed, or may be formed by processing the first inorganic encapsulation layer 2 after the first inorganic encapsulation layer 2 is formed, but not limited thereto.
Specifically, the plurality of concave holes 21 are holes with uniform intervals and the same hole diameter and hole depth, so as to facilitate the design of the concave holes in actual production, but not limited thereto, and those skilled in the art can select other holes with suitable rules according to the teachings of the present invention, for example, holes with the same hole pitch and hole depth and different hole diameters.
wherein
Theta is the intrinsic contact angle, h is the hole depth of the concave hole, D is the hole diameter of the concave hole, P is the hole distance between two adjacent concave holes, theta1To show the contact angle, fsIs a fraction of the total area occupied by the plane on the first inorganic encapsulation layer 2.
Specifically, in order to allow the organic ink to stand still on the first inorganic encapsulation layer 2, the planarization effect is better, and further, the upper surface of the organic encapsulation layer 3 is a horizontal surface, and the contact angle θ is expressed1Is less than or equal to the intrinsic contact angle theta, preferably the apparent contact angle theta1Is equal to the intrinsic contact angle theta, so that the fluidity of the organic ink on the first inorganic encapsulation layer 2 at the time of actual production is equal to the fluidity of the organic ink on the first inorganic encapsulation layer 2 at the time of design,the problems that pits appear on the upper surface of the organic ink in the flattening process, the flattening effect is poor, the brightness of the display is uneven in appearance, various marks are caused (Mura), or concave-convex points are formed on the surface of the orange peel are solved.
Specifically, the organic ink is coated on the first inorganic encapsulation layer 2 by inkjet printing, but not limited thereto, and those skilled in the art can select other coating methods according to actual production requirements.
Specifically, the organic encapsulation layer 3 is an acrylate film, but not limited thereto, and those skilled in the art can select other suitable materials as the organic encapsulation layer 3 according to actual production requirements.
Specifically, the second inorganic encapsulation layer 4 is a silicon nitride film, but not limited thereto, and those skilled in the art can select other suitable materials as the second inorganic encapsulation layer 4 according to actual production requirements.
Specifically, the second inorganic encapsulation layer 4 and the first inorganic encapsulation layer 2 together cover the organic encapsulation layer 3, so as to prevent water and oxygen from invading the organic encapsulation layer 3, thereby improving the reliability of the encapsulation.
According to the thin film packaging method 6, when the first inorganic packaging layer 2 is formed, the plurality of concave holes 21 are formed in the first inorganic packaging layer 2, so that the contact angle between the organic ink and the first inorganic packaging layer 2 can be reduced, the wettability of the organic ink is improved, the planarization effect of the organic ink is further improved, and the problem that pits often appear on the upper surface of the organic ink in the planarization process is solved.
Accordingly, referring to fig. 6 and fig. 1-4, an embodiment of the present invention further discloses a method 7 for designing the cavity 21 in the thin film encapsulation structure 1 and the thin film encapsulation method 6, which is applied to an inorganic encapsulation layer design in thin film encapsulation, that is, the design of the first inorganic encapsulation layer 2 in the embodiment, wherein the method 7 for designing the cavity 21 includes the following steps 701 to 702.
Step 701: an inorganic encapsulation layer (first inorganic encapsulation layer 2) is provided, and a plurality of concave holes 21 with fixed hole depth are formed on the inorganic encapsulation layer (first inorganic encapsulation layer 2).
Specifically, the inorganic encapsulation layer (the first inorganic encapsulation layer 2) is a silicon nitride film, but not limited thereto, and those skilled in the art can select other suitable materials as the inorganic encapsulation layer (the first inorganic encapsulation layer 2) according to actual production requirements.
Specifically, the plurality of concave holes 21 having the fixed hole depth are formed directly on the first inorganic encapsulation layer 2 when the inorganic encapsulation layer (the first inorganic encapsulation layer 2) is formed, but not limited thereto.
Step 701: the aperture of a plurality of shrinkage pools 21 and the pitch between two adjacent shrinkage pools 21 are changed to make the organic ink form after the inorganic packaging layer is flattened, the upper surface of the organic packaging layer 3 is smooth, wherein, the relationship between the aperture of a plurality of shrinkage pools 21 and the pitch between two adjacent shrinkage pools 21 and the organic ink satisfies:
wherein
Theta is the intrinsic contact angle, h is the hole depth of the concave hole 21, D is the hole diameter of the concave hole 21, P is the pitch between two adjacent concave holes 21, and theta1To show the contact angle, fsIs a fraction of the total area occupied by the plane and represents the contact angle theta1Is less than or equal to the intrinsic contact angle theta, preferably the apparent contact angle theta1The number of degrees of (a) is equal to the intrinsic contact angle θ, so that the fluidity of the organic ink on the inorganic encapsulating layer (first inorganic encapsulating layer 2) at the time of actual production is equal to the fluidity of the organic ink on the inorganic encapsulating layer (first inorganic encapsulating layer 2) at the time of design, so that the upper surface of the organic ink after the inorganic encapsulating layer is planarized is a horizontal plane.
Specifically, as shown in fig. 3, the holes 21 have the same depth, so that the hole diameter and pitch of each hole 21 can be designed to be the same size when designing the hole 21, so as to facilitate the design and formation of the hole 21 during actual production, but not limited thereto, and those skilled in the art can select other holes with suitable rules according to the teachings of the present invention, as shown in fig. 4, for example, holes with the same pitch and different hole diameters.
The method 7 for designing the concave holes 21 of the present invention is to design the plurality of concave holes 21 when the plurality of concave holes 21 are formed on the first inorganic encapsulation layer 2, so that the relationship between the plurality of concave holes 21 and the organic ink satisfies the above formula, and by changing the aperture of each concave hole 21 and the pitch between two adjacent concave holes 21, the contact angle between the organic ink and the first inorganic encapsulation layer 2 is reduced, the wettability of the organic ink is improved, the planarization effect of the organic ink is further improved, and the problem that pits often appear on the upper surface of the organic ink in the planarization process is solved. For example, if the hole depth h of one or more concave holes 21 is 3 μm and the intrinsic contact angle θ is 10 degrees, the ratio of the pitch P between two adjacent concave holes 21 to the hole diameter D of the concave hole 21 is greater than or equal to 2.3 by changing the hole diameter D of the corresponding concave hole 21 and the pitch P between two adjacent concave holes 21, so as to show the contact angle θ1Close to or equal to the intrinsic contact angle θ so that the mobility of the organic ink on the first inorganic encapsulation layer 2 at the time of actual production is close to or equal to the mobility of the organic ink on the first inorganic encapsulation layer 2 at the time of design, preventing the problem that the upper surface of the organic ink often pits during planarization.
The foregoing description shows and describes several preferred embodiments of the invention, but as aforementioned, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (7)
1. A thin film encapsulation structure applied to thin film encapsulation of an organic light emitting diode device, the thin film encapsulation structure comprising:
the first inorganic packaging layer is arranged at the lower end of the thin film packaging structure, and the upper surface of the first inorganic packaging layer is provided with a plurality of concave holes;
an organic encapsulation layer disposed on the first inorganic encapsulation layer, wherein the organic encapsulation layer is formed by coating organic ink on the first inorganic encapsulation layer and standing to planarize the organic ink; and
a second inorganic encapsulation layer disposed on the organic encapsulation layer;
wherein a relationship between the plurality of recesses and the organic ink satisfies:
wherein
Theta is an intrinsic contact angle, h is the hole depth of the concave hole, D is the hole diameter of the concave hole, P is the hole distance between two adjacent concave holes, and theta1To show the contact angle, fsIs the fraction of the total area occupied by the plane on the first inorganic encapsulation layer.
2. The thin film encapsulation structure according to claim 1, wherein the organic ink is coated on the first inorganic encapsulation layer by inkjet printing.
3. The film encapsulation structure of claim 1, wherein the apparent contact angle θ1Is less than or equal to the intrinsic contact angle theta.
4. A thin film packaging method is applied to thin film packaging of an organic light emitting diode device, and is characterized by comprising the following steps:
forming a first inorganic packaging layer, wherein the upper surface of the first inorganic packaging layer is provided with a plurality of concave holes;
coating organic ink on the first inorganic packaging layer, and standing the coated organic ink to flatten the organic ink to form an organic packaging layer; and
forming the second inorganic encapsulation layer on the organic encapsulation layer;
wherein a relationship between the plurality of recesses and the organic ink satisfies:
wherein
Theta is an intrinsic contact angle, h is the hole depth of the concave hole, D is the hole diameter of the concave hole, P is the hole distance between two adjacent concave holes, and theta1To show the contact angle, fsIs the fraction of the total area occupied by the plane on the first inorganic encapsulation layer.
5. The thin film encapsulation structure according to claim 4, wherein the organic ink is applied to the first inorganic encapsulation layer by inkjet printing.
6. The film encapsulation structure of claim 4, wherein the apparent contact angle θ1Is less than or equal to the intrinsic contact angle theta.
7. A design method of a concave hole is applied to design of an inorganic packaging layer during thin film packaging, and is characterized by comprising the following steps:
providing the inorganic packaging layer, and forming a plurality of concave holes with fixed hole depths on the inorganic packaging layer; and
changing the aperture of the concave holes and the pitch between two adjacent concave holes so as to enable the upper surface of the organic packaging layer formed by flattening the inorganic packaging layer to be smooth by the organic ink;
wherein the relationship between the aperture of the plurality of concave holes, the pitch between two adjacent concave holes and the organic ink satisfies:
wherein
Theta is an intrinsic contact angle, h is the hole depth of the concave hole, D is the hole diameter of the concave hole, P is the hole distance between two adjacent concave holes, and theta1To show the contact angle, fsIs a fraction of the total area occupied by the plane, and the apparent contact angle θ1Is less than or equal to the intrinsic contact angle theta.
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