CN111194142A

CN111194142A - Printed circuit board and method for manufacturing the same

Info

Publication number: CN111194142A
Application number: CN201911111978.4A
Authority: CN
Inventors: 朴昌华
Original assignee: Samsung Electro Mechanics Co Ltd
Current assignee: Samsung Electro Mechanics Co Ltd
Priority date: 2018-11-14
Filing date: 2019-11-14
Publication date: 2020-05-22
Also published as: KR20200055989A; KR102561936B1; US11229118B2; US20200154570A1

Abstract

The invention provides a printed circuit board and a manufacturing method thereof, wherein the printed circuit board comprises a flexible insulating layer; a rigid insulating layer laminated on a portion of the flexible insulating layer; and a cover layer disposed on an upper surface of the rigid insulating layer, an upper surface of the flexible insulating layer, and a side surface of the rigid insulating layer between the upper surface of the rigid insulating layer and the upper surface of the flexible insulating layer.

Description

Printed circuit board and method for manufacturing the same

This application claims the benefit of priority of korean patent application No. 10-2018-.

Technical Field

The following description relates to a printed circuit board and a method of manufacturing the same.

Background

A Rigid Flexible Printed Circuit Board (RFPCB) including a rigid portion and a flexible portion may be used as a printed circuit board in a thin and miniaturized mobile device in order to effectively utilize an inner space of the mobile device.

Disclosure of Invention

This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

In one general aspect, a printed circuit board includes: a flexible insulating layer; a rigid insulating layer laminated on a portion of the flexible insulating layer; and a cover layer disposed on an upper surface of the rigid insulating layer, an upper surface of the flexible insulating layer, and a side surface of the rigid insulating layer between the upper surface of the rigid insulating layer and the upper surface of the flexible insulating layer.

The cover layer may be adhered to the upper surface of the rigid insulating layer, the upper surface of the flexible insulating layer, and the side surfaces of the rigid insulating layer by an adhesive layer.

The adhesive layer may be bonded to the upper surface of the rigid insulating layer, the upper surface of the flexible insulating layer, and the side surfaces of the rigid insulating layer between the upper surface of the rigid insulating layer and the upper surface of the flexible insulating layer.

The cover layer may be formed using any one of Polyimide (PI), Liquid Crystal Polymer (LCP), and polytetrafluoroethylene, or any combination of any two or more thereof.

The adhesive layer may have a thickness less than a thickness of the cover layer.

The printed circuit board may further include: a first circuit formed on the upper surface of the flexible insulating layer and covered by the cover layer; and a second circuit formed on the rigid insulating layer and covered by the cover layer.

Side surfaces of the second circuit may be exposed to side surfaces of the rigid insulating layer and covered by the cover layer.

The printed circuit board may further include a via hole penetrating the cover layer and the adhesive layer and electrically connected to the second circuit.

The rigid insulating layer may be formed using a plurality of layers, and the cover layer is bonded to an uppermost layer of the plurality of layers.

In another general aspect, a printed circuit board includes: a laminate comprising a flexible insulation layer and a rigid insulation layer; a cover layer disposed on an outermost surface of the laminate; and an adhesive layer disposed between the laminate and the cover layer. The cover layer may be disposed on the flexible insulating layer and the rigid insulating layer.

The cover layer may be disposed on a side surface of the rigid insulating layer.

The cover layer may be formed using a material including any one or any combination of any two or more of Polyimide (PI), Liquid Crystal Polymer (LCP), and polytetrafluoroethylene.

An electrical circuit may be formed on the outermost surface of the laminate, and the electrical circuit may be covered by the cover layer.

The printed circuit board may further include a via hole penetrating the cover layer and the adhesive layer and connected to the circuit.

In another general aspect, a method of manufacturing a printed circuit board includes: forming a flexible insulating layer; laminating a rigid insulating layer on a portion of the flexible insulating layer; and providing a cover layer on an upper surface of the rigid insulating layer, an upper surface of the flexible insulating layer, and a side surface of the rigid insulating layer between the upper surface of the rigid insulating layer and the upper surface of the flexible insulating layer.

The adhesive layer may be formed to have a thickness smaller than that of the cover layer.

The method of manufacturing a printed circuit board may further include: forming a first circuit on the upper surface of the flexible insulating layer; disposing the cover layer on the formed first circuit; and forming a second circuit on the rigid insulating layer and disposing the cover layer on the formed second circuit.

Other features and aspects will be apparent from the following detailed description, the accompanying drawings, and the claims.

Drawings

Fig. 1 shows an example of a printed circuit board.

Fig. 2 shows an example of a method for manufacturing a printed circuit board.

Fig. 3 shows an example of a method for manufacturing a printed circuit board.

Fig. 4 to 5 show examples of the printed circuit board.

Fig. 6 shows an example of a printed circuit board.

Like reference numerals refer to like elements throughout the drawings and detailed description. The figures may not be drawn to scale and the relative sizes, proportions and depictions of the elements in the figures may be exaggerated for clarity, illustration and convenience.

Detailed Description

The following detailed description is provided to assist the reader in obtaining a thorough understanding of the methods, devices, and/or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and/or systems described herein will be apparent to those skilled in the art upon review of the disclosure of this application. For example, the order of operations described herein is merely an example and is not limited to the order set forth herein, but rather, variations may be made in addition to operations that must occur in a particular order, which will be apparent upon understanding the disclosure of the present application. Moreover, descriptions of features known in the art may be omitted for the sake of clarity and conciseness.

The features described herein may be embodied in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many possible ways to implement the methods, devices, and/or systems described herein that will be apparent after understanding the disclosure of the present application.

Throughout the specification, when an element such as a layer, region or substrate is described as being "on," "connected to" or "coupled to" another element, it may be directly on, "connected to" or "coupled to" the other element or one or more other elements may be present therebetween. In contrast, when an element is referred to as being "directly on," "directly connected to" or "directly coupled to" another element, there may be no intervening elements present.

As used herein, the term "and/or" includes any one of the associated listed items and any combination of any two or more.

Although terms such as "first", "second", and "third" may be used herein to describe various elements, components, regions, layers or sections, these elements, components, regions, layers or sections should not be limited by these terms. Rather, these terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section referred to in the examples described herein could also be referred to as a second element, component, region, layer or section without departing from the teachings of the examples.

Spatially relative terms, such as "above," "upper," "lower," and "below," may be used herein for ease of description to describe one element's relationship to another element as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "upper" relative to another element would then be "below" or "lower" relative to the other element. Thus, the term "above" includes both an orientation of "above" and "below" depending on the spatial orientation of the device. The device may also be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative terms used herein should be interpreted accordingly.

The terminology used herein is for the purpose of describing various examples only and is not intended to be limiting of the disclosure. The singular is intended to include the plural unless the context clearly indicates otherwise. The terms "comprises," "comprising," and "having" specify the presence of stated features, quantities, operations, elements, components, and/or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and/or combinations thereof.

Due to manufacturing techniques and/or tolerances, the shapes shown in the drawings may vary. Accordingly, the examples described herein are not limited to the particular shapes shown in the drawings, but include changes in shapes that occur during manufacturing.

The features of the examples described herein may be combined in various ways that will be apparent after understanding the disclosure of the present application. Further, while the examples described herein have a variety of configurations, other configurations are possible that will be apparent after understanding the disclosure of this application.

Fig. 1 shows a printed circuit board.

Referring to fig. 1, the printed circuit board may include a flexible part F and rigid parts R1 and R2. The flexible portion F and the rigid portions R1 and R2 are integrally formed. Such an integrated rigid flexible board may be distinguished from a board formed by separately manufacturing the rigid board and the flexible board and then bonding the rigid board and the flexible board to each other by welding or the like.

The flexible portion F has relatively high flexibility and is bendable when the printed circuit board is mounted in the electronic device. The rigid portions R1 and R2 have relatively low flexibility. The thickness of each of the rigid portions R1 and R2 may be greater than the thickness of the flexible portion F. Further, the width of each of the rigid portions R1 and R2 may be larger than the width of the flexible portion F, and the length of each of the rigid portions R1 and R2 may be shorter than the length of the flexible portion F.

The printed circuit board may include a flexible insulation layer 100, a rigid insulation layer 200, a cover layer 300, and an adhesion layer AD.

The flexible insulating layer 100 may be included in the flexible portion F and the rigid portions R1 and R2, and may be an insulating layer formed using a material having flexibility and relatively high bendability. The flexible insulating layer 100 may be continuously formed on the flexible portion F and all of the rigid portions R1 and R2. The flexible insulating layer 100 may be formed using a resin having high flexibility. Such a resin may include at least one of Polyimide (PI) resin, Liquid Crystal Polymer (LCP) resin, and polytetrafluoroethylene (Teflon) resin.

The flexible insulating layer 100 may be formed using a single layer or multiple layers.

The rigid insulating layer 200 may be laminated on a portion of the region of the flexible insulating layer 100, and may be an insulating layer formed using a material having relatively low flexibility. The rigid insulation layer 200 may include a resin having low flexibility, and such a resin may include an epoxy resin. Further, the rigid insulation layer 200 may comprise a fiber-reinforced material such as glass fibers. In an example, the rigid insulation layer 200 may be a prepreg. The rigid insulation layer 200 may include an organic filler or an inorganic filler.

The rigid insulation layer 200 may be laminated on a portion of the area of the flexible insulation layer 100 such that the rigid insulation layer 200 is included in the rigid sections R1 and R2 and is not included in the flexible section F. That is, the rigid portions R1 and R2 are determined according to the region where the rigid insulating layer 200 is laminated. A plurality of rigid portions R1 and R2 may be formed. In this example, the flexible portion F may be located between a plurality of rigid portions R1 and R2; however, examples are not limited thereto. In another non-limiting example, a single rigid portion may also be formed. In this case, the flexible portion F extends from the rigid portion.

When the rigid insulating layer 200 is laminated on only one surface of the flexible insulating layer 100, an asymmetric printed circuit board can be realized. In addition, the rigid insulating layer 200 may be formed using a plurality of

layers

210 and 220. Referring to fig. 1, in the printed circuit board, a rigid insulating layer 200 is formed using two

layers

210 and 220, but is not limited thereto.

In an example in which the flexible insulating layer 100 and the rigid insulating layer 200 are both formed using a plurality of layers, the plurality of flexible insulating layers 100 and the plurality of rigid insulating layers 200 may be alternately laminated.

The laminate may be formed by laminating the flexible insulation layer 100 and the rigid insulation layer 200 together. That is, a product obtained by laminating the flexible insulation layer 100 and the rigid insulation layer 200 may be referred to as a laminate.

The circuit may be formed on the flexible insulating layer 100 and the rigid insulating layer 200. The circuit is a conductive line providing a path for transmitting an electrical signal and has a pattern according to the path of the electrical signal. The circuit may be formed using a material including a metal. The metal of the circuit may include at least one selected from the group consisting of copper (Cu), nickel (Ni), silver (Ag), and palladium (Pd), but is not limited thereto. Any metal may be used in the circuit.

The circuit formed on one surface or both surfaces of the flexible insulating layer 100 may be referred to as a first circuit C1. A first circuit C1 may be included in the flexible portion F and the rigid portions R1 and R2. The portion of the first electric circuit C1 located in the rigid portions R1 and R2 is covered with the rigid insulating layer 200, and the portion of the first electric circuit C1 located in the flexible portion F is not covered with the rigid insulating layer 200. The first circuit C1 may have a wire-type conductive line formed on all of the flexible part F and the rigid parts R1 and R2, but is not limited thereto. The first circuit C1 may include a plurality of line-type conductive lines, and the plurality of line-type conductive lines may be arranged in parallel to each other to be separated from each other.

In the case where the first circuits C1 are respectively formed on both surfaces of the flexible insulating layer 100, vias (not shown) that penetrate the flexible insulating layer 100 and make electrical connection between the first circuits C1 may be formed in the flexible insulating layer 100.

The circuit formed on one surface of the rigid insulating layer 200 may be referred to as a second circuit C2. In the case where the rigid insulating layer 200 is formed using a plurality of layers, the second circuit C2 may be formed on one surface of each of the rigid insulating layers 200. The portion of the second circuit C2 formed on one surface of the outermost layer of the plurality of layers of the rigid insulating layer 200 may be used as a pad.

The first circuit C1 and the second circuit C2 may be electrically connected to each other through the internal via IV. The second circuits C2 disposed on different layers of the rigid insulating layer 200 may be electrically connected to each other through internal vias IV (see fig. 2).

Further, end surfaces of at least some of the second circuits C2 may be exposed to the end surface of the rigid insulating layer 200. Specifically, the end surfaces of at least some of the second circuits C2 may be exposed to the end surfaces of the rigid insulating layer 200 between the upper surface of the rigid insulating layer 200 and the upper surface of the flexible insulating layer 100.

The cover layer 300 may be a layer bonded to the outermost surface of the laminate and may protect the outermost surface. In examples where the electrical circuit (outermost circuit) is formed on the outermost surface of the laminate, the cover layer 300 may cover and protect the outermost circuit. The cover layer 300 may collectively cover the flexible portion F and the rigid portions R1 and R2.

The cover layer 300 may be bonded to the upper surface of the rigid insulating layer 200, the upper surface of the flexible insulating layer 100, and the side surfaces of the rigid insulating layer 200. In an example where the rigid insulation layer 200 is formed using the plurality of

layers

210 and 220, the cover layer 300 is bonded to the layer 220 located at the uppermost layer of the plurality of

layers

210 and 220. Further, the cover layer 300 may be bonded to a side surface of the rigid insulating layer 200 between the upper surface of the rigid insulating layer 200 and the upper surface of the flexible insulating layer 100. Here, the cover layer 300 is continuously and commonly bonded to the upper surface of the rigid insulation layer 200, the upper surface of the flexible insulation layer 100, and the side surface of the rigid insulation layer 200. Therefore, since the interface between the rigid insulating layer 200 and the flexible insulating layer 100 is covered by the capping layer 300, foreign objects can be prevented from being introduced into the rigid insulating layer 200 and the flexible insulating layer 100 through the interface. Further, in the case where the rigid insulating layer 200 is formed using the plurality of

layers

210 and 220, since the interface between the plurality of

layers

210 and 220 of the rigid insulating layer 200 is also covered by the cover layer 300, foreign objects can be prevented from being introduced into the rigid insulating layer 200 by the cover layer 300.

Further, as described above, the end surfaces of at least some of the second circuits C2 may be exposed to the end surface of the rigid insulating layer 200. Specifically, the end surfaces of at least some of the second circuits C2 may be exposed to the end surfaces of the rigid insulating layer 200 between the upper surface of the rigid insulating layer 200 and the upper surface of the flexible insulating layer 100. In this example, the exposed side surface of the second circuit C2 may be covered by the adhesive layer AD and the cover layer 300. Therefore, the side surface of the second circuit C2 can be protected from foreign objects.

In an example, the cover layer 300 may be formed not only on the upper surface of the laminate but also on the lower surface of the laminate. The cover layer 300 may cover the side surfaces of the laminate and may also cover the entire outermost surface of the laminate.

The cover layer 300 may be formed using a material including at least one of Polyimide (PI), Liquid Crystal Polymer (LCP), and Teflon, and may be formed using the same material as that of the flexible insulating layer 100. In this example, the cover layer 300 may be formed using the same material as that of the flexible portion F, which has high flexibility. In an example, the cover layer 300 may be a thin film type cover layer and may be distinguished from a liquid type cover layer. Specifically, the vacuum lamination described below may be performed on the film-type cover layer 300. However, in the example of a liquid-type overlay layer, a coating and curing process may be required instead of a vacuum lamination process.

The cover layer 300 may be bonded by the adhesive layer AD. The adhesion layer AD may be formed using a material having high flexibility. The material for the adhesion layer AD may be selected without limitation as long as it has a sufficiently high adhesion for use in a printed circuit board.

The adhesive layer AD may be formed on the entire area of the cover layer 300. That is, the adhesive layer AD may be commonly bonded to the flexible portion F and the rigid portions R1 and R2. The adhesive layer AD may be commonly bonded to the upper surface of the rigid insulating layer 200, the upper surface of the flexible insulating layer 100, and the side surface of the rigid insulating layer 200. Specifically, the adhesive layer AD may be bonded to a side surface of the rigid insulating layer 200 between the upper surface of the rigid insulating layer 200 and the upper surface of the flexible insulating layer 100. The adhesive layer AD may be formed not only on the upper surface of the laminate but also on the lower surface of the laminate. The cover layer 300 may even cover the side surfaces of the laminate and may also cover the entire outermost surface of the laminate.

The adhesion layer AD serves to adhere the cover layer 300 while covering the interface between the rigid insulation layer 200 and the flexible insulation layer 100, thereby enabling the adhesion layer AD to prevent foreign objects from being introduced into the interface.

Further, when the adhesion layer AD and the cover layer 300 are laminated on the rigid insulation layer 200, a solder resist used as a protective layer in the related art may be omitted. Therefore, in the method for manufacturing the printed circuit board, a process of coating and curing the solder resist may be omitted.

The thickness of the adhesion layer AD may be less than that of the cover layer 300, but is not limited thereto. Further, in fig. 1, the thicknesses of the adhesion layer AD and the cover layer 300 are shown to be small at the side surface of the rigid insulation layer 200, but are not limited thereto. The thickness of the adhesive layer AD and the cover layer 300 may be uniform over the entire area of the laminate.

The printed circuit board may further include a via hole (i.e., an outer via hole V) penetrating the adhesive layer AD and the cover layer 300. Vias (i.e., outer vias V) may be formed in the rigid portions R1 and R2, and may be in contact with the second circuit C2 and electrically connected to the second circuit C2. In particular, the outer via V may contact a pad of the second circuit C2.

The external via V passing through the adhesive layer AD and the cover layer 300 may be formed by processing a via hole using laser processing and then filling the via hole with a conductive material. The upper surface of the outer via V may be exposed through the adhesive layer AD and the cover layer 300.

The horizontal cross-sectional area of the outer via V may decrease toward the inside of the printed circuit board.

Fig. 2 shows an example of a method for manufacturing a printed circuit board.

Referring to diagram (a) of fig. 2, a first circuit C1 is formed on the flexible insulating layer 100. The first circuit C1 may be formed by a hole sealing process or a modified semi-additive process (mSAP).

Referring to diagram (b) of fig. 2, a cover layer 300 (lower cover layer) is bonded to the lower surface of the flexible insulating layer 100, and an adhesive layer AD is interposed between the cover layer 300 and the flexible insulating layer 100. The cover layer 300 may be bonded to the flexible insulation layer 100 by vacuum lamination.

Referring to diagram (c) in fig. 2, the rigid insulating layer 200 is laminated on a part of the region of the flexible insulating layer 100, and the rigid portions R1 and R2 are determined according to the region where the rigid insulating layer 200 is laminated. In an example, the rigid insulating layer 200 may be formed by sequentially laminating a plurality of layers. Here, the second circuit C2 and the Internal Via (IV) are formed. The second circuit C2 may be formed by a hole sealing process or a modified semi-additive process (mSAP).

Referring to diagram (d) in fig. 2, after all of the second circuits C2 are formed (specifically, after the outermost second circuit is formed), the cover layer 300 (upper cover layer) is bonded to the upper surface of the rigid insulating layer 200 and the upper surface of the flexible insulating layer 100, and the adhesive layer AD is interposed between the cover layer 300 and the flexible insulating layer 100 and between the cover layer 300 and the rigid insulating layer 200. In an example, the process in diagram (b) in fig. 2 is described first, but the order of the processes may be changed if necessary. The process in diagram (b) in fig. 2 may be performed after the process in diagram (d) in fig. 2.

Referring to diagram (e) in fig. 2, via holes may be formed in the adhesion layer AD and the capping layer 300 by laser processing or the like, and the via holes may be filled with a conductive material by plating or the like, thereby forming external via holes.

Fig. 3 shows an example of a method for manufacturing a printed circuit board.

Referring to fig. 3, a laminate is first prepared, and then a cover layer 300 is bonded to the laminate. Here, the upper and lower cover layers 300 and 300 are simultaneously bonded, unlike the case where the upper and lower cover layers 300 and 300 are sequentially bonded in fig. 2 (a) to (e). In this example, the upper and lower cover layers 300 and 300 are respectively disposed on both surfaces of the laminate using the adhesive layers AD, and the upper and lower cover layers 300 and 300 may be respectively bonded to both surfaces of the laminate by performing vacuum lamination.

Fig. 4 to 5 show examples of the printed circuit board.

Referring to fig. 4, unlike the asymmetric printed circuit board of fig. 1, the printed circuit board may have a symmetric structure.

The printed circuit board may include a flexible insulation layer 100, a rigid insulation layer 200, a cover layer 300, and an adhesion layer AD. The rigid insulating layers 200 are laminated on both surfaces of the flexible insulating layer 100, respectively. The cover layer 300 is bonded to the upper surface of the rigid insulating layer 200, the upper surface of the flexible insulating layer 100, and the side surfaces of the rigid insulating layer 200 between the upper surface of the rigid insulating layer 200 and the upper surface of the flexible insulating layer 100. Further, the cover layer 300 is bonded to the lower surface of the rigid insulating layer 200, the lower surface of the flexible insulating layer 100, and the side surface of the rigid insulating layer 200 between the lower surface of the rigid insulating layer 200 and the lower surface of the flexible insulating layer 100.

Other components are the same as those described with reference to fig. 1, and thus, description thereof will be omitted.

Fig. 5 (a) and 5 (b) are examples of cross-sectional views taken along the line a in the flexible portion F of fig. 4.

Referring to diagram (a) of fig. 5, the adhesive layer AD and the cover layer 300 cover the first circuit C1 formed on the flexible insulating layer 100. The adhesive layer AD and the cover layer 300 may not cover the side surface of the flexible insulating layer 100.

Referring to diagram (b) of fig. 5, unlike diagram (a) of fig. 5, the adhesive layer AD and the cover layer 300 may cover the side surface of the flexible insulating layer 100.

Further, diagram (c) in fig. 5 is an example of a sectional view taken along line B in the flexible portion F of fig. 4. Referring to diagram (c) of fig. 5, the adhesive layer AD and the cover layer 300 may cover the entire area of the side surface of the rigid insulating layer 200 between the upper surface of the rigid insulating layer 200 and the upper surface of the flexible insulating layer 100. Further, the adhesive layer AD and the cover layer 300 may cover the entire area of the side surface of the rigid insulating layer 200 between the lower surface of the rigid insulating layer 200 and the lower surface of the flexible insulating layer 100. Here, although the side surface of the second circuit C2 is exposed to the side surface of the rigid insulating layer 200, the second circuit C2 is covered by the adhesive layer AD and the cover layer 300. Further, the adhesive layer AD and the cover layer 300 may cover the entire surfaces of the rigid parts R1 and R2. In an example, the region indicated by a broken line in diagram (c) in fig. 5 is a cross section taken along line a in fig. 4, that is, the region of diagram (b) in fig. 5.

Fig. 6 shows an example of a printed circuit board.

In this example, the printed circuit board includes three rigid portions R1, R2, and R3 and one flexible portion F. All surfaces of the rigid parts R1, R2 and R3 and the flexible part F are covered by the cover layer 300, and the upper surfaces of the vias V of the rigid parts R1, R2 and R3 may be exposed. The exposed upper surface of the via may be bonded to an external component or an external board. In the present example, the width of each of the rigid portions R1, R2, and R3 may be greater than the width of the flexible portion F, and the length of each of the rigid portions R1, R2, and R3 may be shorter than the length of the flexible portion F.

In the present example, since only the number of rigid portions is different from the above example, the same description as that in the above example can be applied.

While the present disclosure includes specific examples, it will be apparent upon an understanding of the present disclosure that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered in a descriptive sense only and not for purposes of limitation. The description of features or aspects in each example will be considered applicable to similar features or aspects in other examples. Suitable results may be obtained if the described techniques were performed in a different order and/or if components in the described systems, architectures, devices, or circuits were combined in a different manner and/or replaced or added by other components or their equivalents. Therefore, the scope of the present disclosure is defined not by the detailed description but by the claims and their equivalents, and all modifications within the scope of the claims and their equivalents are to be construed as being included in the present disclosure.

Claims

1. A printed circuit board, the printed circuit board comprising:

a flexible insulating layer;

a rigid insulating layer laminated on a portion of the flexible insulating layer; and

a cover layer disposed on an upper surface of the rigid insulating layer, an upper surface of the flexible insulating layer, and a side surface of the rigid insulating layer between the upper surface of the rigid insulating layer and the upper surface of the flexible insulating layer.

2. The printed circuit board of claim 1, wherein the cover layer is adhered to the upper surface of the rigid insulating layer, the upper surface of the flexible insulating layer, and the side surfaces of the rigid insulating layer by an adhesive layer.

3. The printed circuit board of claim 2, wherein the adhesive layer is bonded to the upper surface of the rigid insulating layer, the upper surface of the flexible insulating layer, and the side surfaces of the rigid insulating layer between the upper surface of the rigid insulating layer and the upper surface of the flexible insulating layer.

4. The printed circuit board of claim 1, wherein the coverlay is formed using any one of polyimide, liquid crystal polymer, and polytetrafluoroethylene, or any combination of any two or more thereof.

5. The printed circuit board of claim 2, wherein the adhesion layer has a thickness less than a thickness of the cover layer.

6. The printed circuit board of claim 2, further comprising:

a first circuit formed on the upper surface of the flexible insulating layer and covered by the cover layer; and

a second circuit formed on the rigid insulating layer and covered by the cover layer.

7. The printed circuit board of claim 6, wherein a side surface of the second circuit is exposed to a side surface of the rigid insulating layer and covered by the cover layer.

8. The printed circuit board of claim 6, further comprising:

a via extending through the cover layer and the adhesive layer and electrically connected to the second circuit.

9. The printed circuit board of claim 1, wherein the rigid insulating layer is formed with a plurality of layers and the cover layer is bonded to an uppermost layer of the plurality of layers.

10. A printed circuit board, the printed circuit board comprising:

a laminate comprising a flexible insulation layer and a rigid insulation layer;

a cover layer disposed on an outermost surface of the laminate; and

an adhesive layer disposed between the laminate and the cover layer,

wherein the cover layer is disposed on the flexible insulating layer and the rigid insulating layer.

11. The printed circuit board of claim 10, wherein the cover layer is disposed on a side surface of the rigid insulating layer.

12. The printed circuit board of claim 10, wherein the cover layer is formed using a material comprising any one of polyimide, liquid crystal polymer, and polytetrafluoroethylene, or any combination of any two or more thereof.

13. The printed circuit board of claim 10, wherein the adhesion layer has a thickness less than a thickness of the cover layer.

14. The printed circuit board of claim 10, wherein an electrical circuit is formed on the outermost surface of the laminate and the electrical circuit is covered by the cover layer.

15. The printed circuit board of claim 14, further comprising:

a via hole penetrating the cover layer and the adhesive layer and connected to the circuit.

16. A method of manufacturing a printed circuit board, the method of manufacturing a printed circuit board comprising:

forming a flexible insulating layer;

forming a rigid insulating layer on a portion of the flexible insulating layer; and

disposing a cover layer on an upper surface of the rigid insulating layer, an upper surface of the flexible insulating layer, and a side surface of the rigid insulating layer between the upper surface of the rigid insulating layer and the upper surface of the flexible insulating layer.

17. The method of manufacturing a printed circuit board according to claim 16, wherein the cover layer is adhered to the upper surface of the rigid insulating layer, the upper surface of the flexible insulating layer, and the side surface of the rigid insulating layer by an adhesive layer.

18. The method of manufacturing a printed circuit board according to claim 17, wherein the cover layer is formed using any one of polyimide, liquid crystal polymer, and polytetrafluoroethylene, or any combination of any two or more thereof.

19. The method of manufacturing a printed circuit board according to claim 18, wherein a thickness of the adhesive layer is formed to be smaller than a thickness of the cover layer.

20. The method of manufacturing a printed circuit board according to claim 17, further comprising:

forming a first circuit on the upper surface of the flexible insulating layer;

disposing the cover layer on the formed first circuit; and

forming a second circuit on the rigid insulating layer and disposing the cover layer on the formed second circuit.