CN111187963B - Hastelloy suitable for eliminating selective laser melting forming thermal cracks and method and application thereof - Google Patents

Hastelloy suitable for eliminating selective laser melting forming thermal cracks and method and application thereof Download PDF

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CN111187963B
CN111187963B CN202010095132.2A CN202010095132A CN111187963B CN 111187963 B CN111187963 B CN 111187963B CN 202010095132 A CN202010095132 A CN 202010095132A CN 111187963 B CN111187963 B CN 111187963B
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powder
hastelloy
selective laser
tib
laser melting
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CN111187963A (en
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韩泉泉
杨圣钊
张振华
尹瀛月
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Beijing Amc Powder Metallurgy Technology Co ltd
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Shandong University
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    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/34—Process control of powder characteristics, e.g. density, oxidation or flowability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/05—Mixtures of metal powder with non-metallic powder
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C22C19/05—Alloys based on nickel or cobalt based on nickel with chromium
    • C22C19/051—Alloys based on nickel or cobalt based on nickel with chromium and Mo or W
    • C22C19/055—Alloys based on nickel or cobalt based on nickel with chromium and Mo or W with the maximum Cr content being at least 20% but less than 30%
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
    • C22C32/0073—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only borides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
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    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/36—Process control of energy beam parameters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/36—Process control of energy beam parameters
    • B22F10/366—Scanning parameters, e.g. hatch distance or scanning strategy
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Abstract

The invention relates to the technical field of 3D printing forming of Hastelloy, in particular to Hastelloy suitable for eliminating selective laser melting forming thermal cracks and a method and application thereof. The method is characterized in that TiB is added into Hastelloy powder when the Hastelloy powder is formed by adopting a selective laser melting technology to prepare the Hastelloy2And (3) powder. The invention uses TiB2After the powder is introduced into the hastelloy powder, TiB2The existence of the powder can effectively eliminate the elimination of thermal cracks, so that the bonding force between crystal grains is stronger, and on the other hand, the added TiB2The powder can enhance the bearing capacity of the two-phase interface, so that the mechanical strength of the formed hastelloy is remarkably improved. And the obtained hastelloy has no detected thermal cracks, and only a small amount of holes are generated.

Description

Hastelloy suitable for eliminating selective laser melting forming thermal cracks and method and application thereof
Technical Field
The invention relates to the technical field of 3D printing forming of Hastelloy, in particular to Hastelloy suitable for eliminating selective laser melting forming thermal cracks and a method and application thereof.
Background
The information in this background section is only for enhancement of understanding of the general background of the invention and is not necessarily to be construed as an admission or any form of suggestion that this information forms the prior art that is already known to a person of ordinary skill in the art.
Hastelloy-X (HX) alloys have moderate creep and endurance strengths below 900 ℃ and are used primarily in the manufacture of aircraft engine combustor parts and other high temperature parts. Because the structures of parts of the aircraft engine are generally complex, the parts are processed based on HX alloy by adopting the traditional manufacturing processes of precision casting, forging and pressing and the like, and the problems of long research and development period, high manufacturing cost and the like exist. Compared with the traditional process, the Selective Laser Melting (SLM) technology has the advantages of fast response, flexible forming, unlimited forming structure and the like, and is particularly suitable for processing parts with complex structures of aeroengines. Therefore, the high-performance HX aviation combustion chamber component processed and formed by adopting the selective laser melting technology has great strategic significance for improving the service performance of the aviation engine and reducing the development cost of the aviation engine. Scientific problems and key technical researches on high-quality forming of SLM (selective laser melting) of HX alloy parts are competitively developed in various countries in the world, and research results show that the compactness and the room-temperature mechanical property of the HX alloy can be effectively improved through optimization of forming process parameters. However, even HX samples formed under optimal process conditions still have a large number of micro-cracks, and such cracks cannot be eliminated by means of process parameter optimization. This crack is also called thermal cracking because it is formed during rapid solidification, which is directly related to internal thermal stress and low melting eutectic content. The hot cracking defect reduces the strength and the toughness of the formed member and remarkably reduces the service performance of the member, and the hot cracking defect becomes a key technology of 'neck clamping' which is urgently needed to be overcome in the research of SLM forming high-performance HX in various countries in the world at present.
Disclosure of Invention
Aiming at the problems, the invention provides a hastelloy alloy suitable for eliminating selective laser melting forming thermal cracks and a method and application thereof. The method can effectively inhibit the hot cracks generated in the SLM forming HX alloy, and finally remarkably improves the strength and the service performance of the Hastelloy forming component.
The first object of the present invention: harderian alloys suitable for eliminating selective laser melting hot forming cracks are provided.
The second object of the present invention: a method is provided that is adapted to eliminate selective laser meltforming thermal cracking.
The third object of the present invention: the application of the hastelloy suitable for eliminating the selective laser melting forming thermal cracking and the method is provided.
In order to achieve the above purpose, the invention specifically discloses the following technical scheme:
firstly, the invention discloses a method for eliminating hot cracks of selective laser melting formationThe method of (1): when the Hastelloy powder is formed by adopting a selective laser melting technology to prepare the Hastelloy, TiB is added into the Hastelloy powder2And (3) powder.
Further, the technological parameters of the selective laser melting technology are as follows: laser power 100-: 20-50 μm, scan pitch: 70-130 μm.
Secondly, the invention discloses a hastelloy suitable for eliminating hot cracks of selective laser melting forming, which comprises hastelloy powder for selective laser melting forming and TiB (titanium-boron) with the mass not less than 0.5 percent of the hastelloy powder2And (3) powder.
Further, the hastelloy powder comprises the following components in percentage by mass: 22.5-23% of Cr, 17-20% of Fe, 8-10% of Mo, 0.5-2.5% of Co, 0.2-1.0% of W, and Si<1.0％，Mn<1%, 0.05-0.15% of C, and the balance of Ni and inevitable impurities; the TiB2The content of the powder is 0.5-5.0% of the hastelloy powder by mass. TiB2The content of (A) does not exceed 5%, because when TiB is used2When the content of (A) is too high, the specific surface area of the fine powder is large, and particularly for the nano TiB with the powder size of less than 100nm2Particles are easy to agglomerate, and TiB is difficult to be mixed in a high-speed mixing process2Uniformly distributed in the hastelloy powder, the agglomerated powder may cause the generation of new cracks, therefore, the TiB is preferred in the invention2The content range of the powder is 0.5-5%
Preferably, the hastelloy powder consists of the following components in percentage by mass: 22.2% of Cr, 19.1% of Fe, 8.9% of Mo, 2.0% of Co, 0.7% of W, 0.18% of Si, 0.17% of Mn, 0.13% of C, and the balance of Ni and inevitable impurities; the TiB2The content of the powder is 0.5-5.0% of the hastelloy powder by mass. Selecting the above alloy system and TiB2When the powder is added, no thermal cracks are detected in the formed alloy, and only a small amount of holes are generated, so that the thermal cracks in the Hastelloy are effectively eliminated, and the alloy strength and the service performance are remarkably improved.
Go toStep a, the TiB2The particle size range of the powder is 50nm-10 mu m. By adding TiB to Hastelloy2And 3, the powder can effectively inhibit hot cracks generated in the SLM forming hastelloy. TiB2The smaller the particle size of the powder, the better the effect of eliminating hot cracks, and the better the effect of improving the strength of the formed member. Then, the smaller the particle size, the larger the specific surface area of the powder, and the more easily the powder is agglomerated, resulting in uniform mixing of Haehler and TiB2The difficulty of the powder increases. Otherwise, TiB2The larger the particle size of the powder is, the more easily the powder is uniformly mixed with the hastelloy powder, but the plasticity of the formed hastelloy is remarkably reduced, and TiB2The interface bonding with the hastelloy substrate is poor, and defects such as holes are easy to occur. Thus, TiB is preferred in the present invention2The size range of the powder is 50nm-10 mu m.
Further, the average particle size of the hastelloy powder was 32.5 μm.
Further, the TiB2The powder is prepared by a double-centrifugal high-speed mixing technology. Optionally, the TiB2The preparation method of the powder comprises the following steps: the mixing speed was 1200rpm and the mixing time was 5 minutes, and in order to avoid excessive heat generation during high speed mixing and excessive equipment temperature, the powder was cooled at room temperature for 10 minutes after 2.5 minutes of mixing, and then mixed again at the same speed for 2.5 minutes.
Finally, the hastelloy prepared by the method for eliminating the selective laser melting forming thermal cracks has good corrosion resistance and thermal stability, and can be applied to the aerospace field, such as the manufacturing of hot end parts of engine combustion chambers. In addition, the formed crack-free Hastelloy has wide application in the industries of petrochemical industry, nuclear energy industry and the like, and the Hastelloy is applied to heat exchangers, corrugated pipe compensators and chemical equipment.
Compared with the prior art, the invention has the beneficial effects that: experiments show that the invention uses TiB2After the powder is introduced into the hastelloy powder, the powder can be introduced into the hastelloy powder under certain conditionsThe yield strength of the hastelloy is improved by about 50%, and the obtained hastelloy has no detected thermal cracks and only a small amount of holes are generated. This is because TiB2The existence of the powder can effectively eliminate the elimination of thermal cracks, so that the bonding force between crystal grains is stronger, and on the other hand, the added TiB2The powder can enhance the bearing capacity of the two-phase interface. The mechanical strength of the formed hastelloy is remarkably improved by the factors.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.
FIG. 1 is a SEM image of Hastelloy powder (HX) prepared by the first embodiment of the present invention. Wherein: graph a is original hastelloy powder, graph b is added with 2% TiB2Composite hastelloy powder of powder.
FIG. 2 is an SEM of a formed Hastelloy alloy of a first embodiment of the present invention. Wherein: graph a is formed by original hastelloy powder, graph b is formed by adding 2% TiB2The composite hastelloy powder of the powder is obtained by forming.
FIG. 3 is a graph of the room temperature stress-strain curves of two groups of hastelloy prepared in accordance with the first embodiment of the present invention.
FIG. 4 shows the addition of 5% TiB prepared by the second embodiment of the present invention2Composite hastelloy powder of powder.
FIG. 5 shows the addition of TiB according to the present invention2The powder can eliminate thermal cracks.
Detailed Description
It is to be understood that the following detailed description is exemplary and is intended to provide further explanation of the invention as claimed. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
Description of related terms
The term "hastelloy": namely, the nickel-based high-temperature alloy, which is a typical solid solution strengthening nickel-based alloy, takes chromium and molybdenum as main solid solution strengthening elements and has excellent high-temperature oxidation resistance, corrosion resistance and welding performance.
The term "selective laser melting technique": is a main technical approach in the additive manufacturing of metal materials. The technology selects laser as an energy source, scans layer by layer on a metal powder bed layer according to a planned path in a three-dimensional CAD slicing model, achieves the effect of metallurgical bonding by melting and solidifying the scanned metal powder, and finally obtains the metal part designed by the model.
The term "thermal cracking": during the high-temperature forming process, microcracks distributed along the grain boundary during crystallization can cause crystal cracking and destroy the mechanical properties of the alloy.
The term "yield strength": is the yield limit at which the metal material yields, i.e., the stress that resists micro plastic deformation.
The term "non-equilibrium coagulation": the method is characterized in that in the process of crystallizing and separating out solids from liquid, because the temperature reduction speed is too high, the solid molecules separated out from the liquid are not uniformly diffused, the concentration of the solid molecules in the crystals is not uniform, and when the temperature is reduced to a solidus line, the phenomenon of non-uniform crystallization of a liquid phase still exists.
The term "low melting eutectic": in the invention, the Cr and Mo elements of the Hastelloy alloy form low-melting-point carbide during rapid non-equilibrium solidification, and form eutectic with a matrix with lower melting point, because the melting point is low, the eutectic is often gathered at a crystal boundary, and the high-temperature performance and the hot working process performance of the alloy are deteriorated.
The term "grain boundary": in a polycrystalline body, because of the difference in orientation of crystal grains, interfaces, which are called grain boundaries, exist between crystal grains.
As described above, the hot crack defect reduces the strength and toughness of the formed member and significantly reduces the service performance of the member, and has become a key technology of 'neck clamping' which is urgently needed to be overcome in the study of SLM forming high-performance HX in various countries in the world at present. Therefore, the present invention provides a hastelloy alloy and a method suitable for eliminating selective laser melting hot cracks, and the present invention is further described with reference to the accompanying drawings and the detailed description.
First embodiment
1. A method adapted to eliminate selective laser meltforming hot cracks comprising the steps of:
(1)TiB2preparation of powder: adopting a double-centrifugation high-speed mixing technology, wherein the mixing speed is 1200rpm, the mixing time is 5 minutes, after the powder is mixed for 2.5 minutes, the powder is cooled for 10 minutes at room temperature, and then the powder is mixed for 2.5 minutes at the same speed to obtain TiB with the particle size range of 50nm-10 mu m2。
(2) Compounding hastelloy powder: weighing the components of the hastelloy powder according to the following proportions by mass percent: 22.2% of Cr, 19.1% of Fe, 8.9% of Mo, 2.0% of Co, 0.7% of W, 0.18% of Si, 0.17% of Mn, 0.13% of C, the balance being Ni and inevitable impurities, and the average particle size of the Hastelloy powder being 32.5. mu.m. And the TiB prepared in the step (1) with the mass of 2.0 percent is added into the Hastelloy powder2And uniformly mixing the powder to obtain the composite hastelloy powder for later use.
(3) And (3) carrying out selective laser melting forming processing on the composite powder obtained in the step (2) by using RenishawAM250 metal additive manufacturing equipment, wherein the detailed process parameters are as follows: laser power 200W, scanning speed 650mm/s, powder layer thickness: 40 μm, scanning pitch: 100 μm.
2. A method for melting and forming hastelloy by adopting selective laser comprises the following steps: in order to react with the non-addition of TiB2The above-mentioned Hastelloy powder (original Hastelloy powder) of the powder is subjected toIn contrast, the forming test is also performed by using the process and parameters in the step (3).
The virgin HX powder prepared in this example was supplemented with TiB2The composite hastelloy powder (HX-2%) and hastelloy were used as examples, and the results of testing the properties are shown in FIGS. 1 to 3.
Fig. 1 is an SEM image of the hastelloy powder (HX). Wherein: graph a is original hastelloy powder, graph b is added with TiB2Composite hastelloy powder of powder. As can be seen from the figure, TiB2The powder is uniformly mixed in the hastelloy powder.
FIG. 2 is an SEM image of a formed Hastelloy alloy of the present invention. Wherein: graph a is formed by original hastelloy powder, graph b is formed by adding 2% TiB2And forming the Hastelloy powder of the powder. It can be seen from the figure that there are a large number of hot cracks in the original hastelloy, with a density of about 0.6%, the length of the cracks varying from tens of microns to one hundred microns (fig. 2a), and the cracks propagate in the stacking direction. For adding TiB2The hastelloy powder showed no thermal cracking and a small amount of pores (fig. 2 b).
FIG. 3 is a graph of the room temperature stress-strain curves of two groups of hastelloy prepared in accordance with the first embodiment of the present invention. The results show that: the yield strength of the original hastelloy is about 700 MPa. While adding TiB2The yield strength of the Hastelloy of the powder is 1050 MPa. The yield strength is significantly improved (350MPa), which can be mainly attributed to two factors: firstly, internal thermal cracks are eliminated, so that the bonding force between crystal grains is stronger; on the other hand, added TiB2The particles are uniformly distributed in the Hastelloy matrix, and the interface is free of defects, so that the bearing capacity of the two-phase interface is enhanced, and the mechanical strength is further improved.
Second embodiment
A method adapted to eliminate selective laser meltforming hot cracks, as in the first embodiment, except that: TiB2The amount of powder added was 5%. FIG. 4 is a scanning electron micrograph of the composite hastelloy powder of this example showing a portion thereofTiB2The powder is agglomerated together to form agglomerates with different sizes of 1-5 μm, and the agglomerates are not uniformly distributed in the HX powder. This is because when TiB2When the content of (A) is too high, the specific surface area of the fine powder is large, and particularly for the nano TiB with the powder size of less than 100nm2Particles are easy to agglomerate, and TiB is difficult to be mixed in a high-speed mixing process2Uniformly distributed in the hastelloy powder, and the agglomerated powder can cause the generation of new cracks.
Third embodiment
A method adapted to eliminate selective laser meltforming hot cracks comprising the steps of:
(1)TiB2preparation of powder: as in the first embodiment.
(2) Compounding hastelloy powder: weighing the components of the hastelloy powder according to the following proportions by mass percent: 23% of Cr, 20% of Fe, 8.0% of Mo, 2.5% of Co, 0.2% of W, 0.48% of Si, 1.0% of Mn, 0.05% of C, and the balance of Ni and inevitable impurities, and the average particle size of the Hastelloy powder is 32.5 μm. And the TiB prepared in the step (1) with the mass of 1.5 percent is added into the Hastelloy powder2And uniformly mixing the powder to obtain the composite hastelloy powder for later use.
(3) And (3) carrying out selective laser melting forming processing on the composite powder obtained in the step (2) by using RenishawAM250 metal additive manufacturing equipment, wherein the detailed process parameters are as follows: laser power 150W, scanning speed 300mm/s, powder layer thickness: 20 μm, scanning pitch: 70 μm.
The yield strength of the original hastelloy alloy of the embodiment is about 674MPa after testing. And 1.5 percent of TiB is added2The yield strength of the Hastelloy of the powder is 981 MPa.
Fourth embodiment
A method adapted to eliminate selective laser meltforming hot cracks comprising the steps of:
(1)TiB2preparation of powder: as in the first embodiment.
(2) Compounding hastelloy powder: in percentage by mass, according to the following proportionTaking the components of hastelloy powder: 22.5% of Cr, 17% of Fe, 10% of Mo, 0.5% of Co, 1.0% of W, 1.0% of Si, 0.36% of Mn, 0.15% of C, and the balance of Ni and inevitable impurities, and the average particle size of the Hastelloy powder is 32.5 μm. And 0.5 mass percent of the TiB prepared in the step (1) is added into the Hastelloy powder2And uniformly mixing the powder to obtain the composite hastelloy powder for later use.
(3) And (3) carrying out selective laser melting forming processing on the composite powder obtained in the step (2) by using RenishawAM250 metal additive manufacturing equipment, wherein the detailed process parameters are as follows: laser power 100W, scanning speed 1000mm/s, powder layer thickness: 50 μm, scanning pitch: 130 μm.
The yield strength of the original hastelloy alloy of the embodiment is about 736MPa after testing. And 1.5 percent of TiB is added2The yield strength of the Hastelloy of the powder is 1028 MPa.
Further, the analysis and research of the invention find that: addition of TiB2The principle of the particles eliminating thermal cracks in the formed member can be illustrated by fig. 5. For no addition of TiB2The hastelloy of (a) grows into columnar crystals along the stacking direction due to the temperature gradient. On the other hand, in the rapid non-equilibrium solidification process, the carbide rich in chromium and molybdenum elements is segregated at the grain boundary to form a low-melting-point eutectic, so that the brittleness of the grain boundary is enhanced. During the forming process, the residual thermal stress is gradually accumulated along with the increase of the forming height, and when the thermal stress exceeds the strength which can be borne by the grain boundary, the grain boundary is pulled apart, and thermal cracks distributed along the grain boundary are formed. For adding TiB2The reinforced hastelloy of powder is characterized by that its thermal expansion coefficient (TiB)2Is 6 x 10-6The alloy is 14 multiplied by 10 per K-6K) and elastic modulus, hastelloy base material and TiB in a rapid solidification process2Mismatch in coefficient of thermal expansion and elastic modulus, resulting in TiB2The dislocation density and the sub-grain number of the surrounding area are increased, and then the number of the grain boundaries is increased, a large number of the grain boundaries obviously improve the bonding force among the grains, and the increased grain boundaries disperse heat stress in the layer-by-layer accumulation processThe strain brought by the force, thereby effectively avoiding the formation of thermal cracks along the grain boundary.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A method suitable for eliminating hot cracks of selective laser melting forming is characterized in that TiB is added into Hastelloy powder when the Hastelloy powder is formed by selective laser melting technology to prepare the Hastelloy2Powder;
the TiB2The addition amount of the powder is 0.5-5.0% of the mass of the hastelloy powder;
the technological parameters of the selective laser melting technology are as follows: laser power 100-: 20-50 μm, scanning interval: 70-130 mu m.
2. The method for eliminating selective laser melting hot cracks of claim 1, wherein the TiB is2The addition amount of the powder is 2.0 percent of the mass of the hastelloy powder.
3. The method for eliminating selective laser melting hot cracks as claimed in claim 1, wherein the hastelloy powder composition comprises the following components in mass percent: 22.5 to 23 percent of Cr, 17 to 20 percent of Fe, 8 to 10 percent of Mo, 0.5 to 2.5 percent of Co, 0.2 to 1.0 percent of W, less than 1.0 percent of Si, less than 1 percent of Mn, 0.05 to 0.15 percent of C, and the balance of Ni and inevitable impurities.
4. The method for eliminating selective laser melting hot cracks as claimed in claim 1, wherein the hastelloy powder consists of, in mass percent: 22.2% of Cr, 19.1% of Fe, 8.9% of Mo, 2.0% of Co, 0.7% of W, 0.18% of Si, 0.17% of Mn, 0.13% of C and the balance of Ni and unavoidable impurities; the TiB2The content of the powder is 2.0 percent of the mass of the hastelloy powder.
5. The method for eliminating selective laser melting hot cracks of claim 1, wherein the TiB is2The particle size range of the powder is 50nm-10 mu m; or the average grain size of the hastelloy powder is 32.5 mu m.
6. The method for eliminating selective laser melting hot cracks of claim 1, wherein the TiB is2The powder is prepared by a double-centrifugal high-speed mixing technology.
7. The method for eliminating selective laser melting hot cracks of claim 6, wherein the TiB2The preparation method of the powder comprises the following steps: the mixing speed was 1200rpm and the mixing time was 5 minutes, and in order to avoid excessive heat generation during high speed mixing and excessive equipment temperature, the powder was cooled at room temperature for 10 minutes after 2.5 minutes of mixing, and then mixed again at the same speed for 2.5 minutes.
8. The hastelloy for eliminating the selective laser melting forming thermal cracks prepared by the method for eliminating the selective laser melting forming thermal cracks as claimed in any one of claims 1-7.
9. Use of the method for eliminating selective laser melting thermal cracking according to any one of claims 1 to 7 and/or the hastelloy alloy for eliminating selective laser melting thermal cracking according to claim 8 in the fields of aerospace, petrochemical and nuclear energy industries.
10. The use according to claim 9, in the manufacture of hot end parts of engine combustion chambers, in exchangers, in bellows compensators, in chemical plants.
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