CN111186040A - Device capable of ensuring that silicon wafer cutting cannot be broken with multidirectional limiting - Google Patents
Device capable of ensuring that silicon wafer cutting cannot be broken with multidirectional limiting Download PDFInfo
- Publication number
- CN111186040A CN111186040A CN202010060760.7A CN202010060760A CN111186040A CN 111186040 A CN111186040 A CN 111186040A CN 202010060760 A CN202010060760 A CN 202010060760A CN 111186040 A CN111186040 A CN 111186040A
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- Prior art keywords
- silicon
- ball
- limiting
- plate body
- multidirectional
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 83
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 83
- 239000010703 silicon Substances 0.000 title claims abstract description 83
- 238000005520 cutting process Methods 0.000 title claims abstract description 28
- 238000005452 bending Methods 0.000 claims description 2
- 230000008859 change Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 26
- 238000000034 method Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 6
- 230000033001 locomotion Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000036541 health Effects 0.000 description 3
- 239000004570 mortar (masonry) Substances 0.000 description 3
- 208000004350 Strabismus Diseases 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model provides a can guarantee that silicon chip cutting can not collapse limit device with multidirectional spacing, includes the set casing, the inside groove fixed mounting of set casing has the feed inlet, and the below fixed mounting of feed inlet has a material gathering storehouse, the equal fixed mounting in both ends of material gathering storehouse has the receipts material ball, the both ends of material gathering storehouse and the handing-over department fixed mounting of receipts material ball have the telescopic link, and the one end fixed mounting that the receipts material ball was kept away from to the telescopic link has the arc board, the upper end fixed mounting of feed inlet has the baffle, and the upper end fixed case of baffle installs the fixed ball, and the groove overlap joint of fixed ball has the silicon board body. Through the cooperation of collection feed bin, receipts material ball, telescopic link and arc board, can be effectual when cutting silicon plate body carelessly, when the silicon plate body that leads to collapses the limit or is broken, guaranteed to give with its leftover bits and pieces and collected, avoided silicon piece to spatter four times, the troublesome process that people were still swept in the later stage.
Description
Technical Field
The invention relates to the technical field of new fluorosilicone materials, in particular to a device with multidirectional limiting function and capable of guaranteeing that a silicon wafer is not broken during cutting.
Background
In the processing of silicon chip, it is at present generally used to cut into the silicon material of different thickness or diameter with silicon piece or silicon rod through dedicated wire-electrode cutting equipment, however, the silicon piece is at the in-process of processing into the silicon chip through the line of cut, highly moving copper wire drives the mortar and can form certain impact to the silicon piece, this kind of impact force makes the head and the afterbody of silicon piece take place the displacement swing easily, thereby there is some deviation when producing the cutting, and also produce easily to the cutting edge of silicon chip and break the limit unfilled corner, the percentage of breakage that leads to the silicon chip is very high, and simultaneously, when the silicon chip is broken, can jump people on one's body, because the piece is very little, speed at the breakout is very big, stab into user's skin very easily, inconvenience has been brought for the user.
Disclosure of Invention
Technical scheme (I)
In order to realize the purpose of fixing the head and the tail, the invention provides the following technical scheme: a device with multi-directional limiting function and capable of ensuring that the silicon wafer cutting cannot break edges comprises a fixed shell, wherein a feed inlet is fixedly arranged at a groove in the fixed shell, a material collecting bin is fixedly arranged below the feed inlet, the two ends of the material collecting bin are both fixedly provided with the material collecting balls, the joint of the two ends of the material collecting bin and the material collecting balls is fixedly provided with a telescopic rod, one end of the telescopic rod far away from the material collecting balls is fixedly provided with an arc plate, the upper end fixed mounting of feed inlet has the baffle, and the upper end fixed case of baffle installs fixed ball, and the groove department overlap joint of fixed ball has the silicon plate body, and the upper surface overlap joint of silicon plate body has spacing soft piece, and the inside overlap joint of spacing soft piece has the stopper, and the last fixed surface of stopper installs the screw thread post, and the upper end threaded connection of screw thread post has the apron, and the upper end of screw thread post runs through and extends to the outside fixed mounting of apron and twists the piece, the upper end and the apron fixed connection of spacing soft piece.
Further, the right side of apron is articulated with the upper surface of set casing, and the middle part of apron has been seted up and has been cut the hole, cuts the rear side that the hole is located spacing soft piece, cuts the hole and mainly can not squint in order to let during the cutting, has the effect of supplementary cutting.
Furthermore, the fixed ball is semi-circular, has seted up on the fixed ball and is no less than two sets of standing grooves, and the standing groove that mainly utilizes the radian of semicircle to set up on the semicircle can be used for placing the silicon plate body of different specifications.
Furthermore, the radian of the arc plate on the left side is opposite to that of the arc plate on the right side, the arc plate on the left side is bent leftwards, and the radian change of the right side is bent rightwards.
Furthermore, the limiting block is in a semicircular shape with an upward bending shape, has the same radian as the limiting soft block, and is mainly used for limiting by being attached to the limiting soft block.
Further, the fixing ball is positioned on the side wall of the groove of the fixing shell.
(II) advantageous effects
Compared with the prior art, the invention provides the device with multidirectional limiting function and capable of ensuring that the silicon wafer is cut without edge breakage, and the device has the following beneficial effects:
1. the device with multidirectional limiting function and capable of guaranteeing that the silicon wafer is not cracked is characterized in that the silicon plate body can be effectively limited by the matching use of the fixing balls and the limiting soft blocks, the silicon plate bodies with different sizes can be placed on the fixing balls, so that the device can effectively guarantee that the silicon plate body can be placed in a position corresponding to the size when in use, and the friction coefficient of the limiting soft blocks made of rubber is larger, so that the friction force of the cabinet plate is larger, the silicon plate body can be effectively limited, and the silicon plate body can be guaranteed not to be damaged, so that the fixity of the head and the tail of the silicon plate body is guaranteed when the silicon plate body is cut, the silicon plate body can not move when the silicon plate body is cut, and the deviation caused by the movement of the silicon plate body can not occur when the silicon plate body is cut, the edge of the silicon plate body is cut, edge breakage occurs, and health of people is protected.
2. This have multidirectional spacing can guarantee that the silicon chip cutting can not collapse limit device, uses through the cooperation of collection feed bin, receipts material ball, telescopic link and arc board, when can effectually cutting the silicon board body carelessly, the silicon board body that leads to collapses the limit or when broken, has guaranteed to give its leftover bits and pieces to collect, has avoided silicon piece to spatter four times, and the trouble process that people still cleaned in the later stage.
3. This have multidirectional spacing can guarantee that the silicon chip cutting can not collapse limit device, through the screw thread post, twist the cooperation of piece and stopper and use, can effectually fix the head and the afterbody of silicon plate body, when having guaranteed that highly moving copper wire drives the mortar and can form certain impact when to the silicon block body, this kind of impact force can not take place the displacement swing to the head and the afterbody that make the silicon block, when further having guaranteed the cutting, can not produce the deviation to and collapse the condition of limit unfilled corner.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a detailed view of the internal structure of the material collecting bin and the material inlet of the present invention;
FIG. 3 is a schematic view of a structural anchoring ball of the present invention;
FIG. 4 is a schematic top view of a cover plate according to the present invention.
In the figure: the device comprises a fixed shell 1, a material collecting bin 2, a feed inlet 201, a material collecting ball 3, a telescopic rod 4, an arc plate 5, a baffle 6, a fixed ball 7, a silicon plate body 8, a limiting soft block 9, a cover plate 10, a threaded column 11, a screwing block 12 and a limiting block 13.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Please refer to fig. 1-4, a device with multidirectional spacing for ensuring that the silicon wafer cutting will not collapse edge, comprising a fixed shell 1, a feed inlet 201 is fixedly installed at the groove inside the fixed shell 1, a material collecting bin 2 is fixedly installed below the feed inlet 201, a material collecting ball 3 is fixedly installed at both ends of the material collecting bin 2, an expansion link 4 is fixedly installed at both ends of the material collecting bin 2 and the connection part of the material collecting ball 3, an arc plate 5 is fixedly installed at one end of the expansion link 4 far away from the material collecting ball 3, the radian of the arc plate 5 on the left side is opposite to that of the arc plate 5 on the right side, the arc plate 5 on the left side is bent to the left side, and.
Through the cooperation of collecting bin 2, receiving material ball 3, telescopic link 4 and arc board 5, can be effectual when cutting silicon plate body 8 carelessly, when the silicon plate body 8 that leads to collapses limit or breakage, guaranteed to give with its leftover bits and pieces and collect, avoided silicon piece to spatter all around, the troublesome process that people cleaned is still had in the later stage.
The upper end fixed mounting of feed inlet 201 has baffle 6, fixing ball 7 is installed to the upper end fixed plan of baffle 6, fixing ball 7 is located the lateral wall of 1 recess of set casing, fixing ball 7 is semi-circular, it is no less than two sets of standing grooves to have seted up on fixing ball 7, the standing groove that mainly utilizes semicircular radian to set up on the semicircle can be used for placing the silicon plate body 8 of different specifications, the groove department overlap joint of fixing ball 7 has silicon plate body 8, silicon plate body 8's upper surface overlap joint has spacing soft piece 9.
The silicon plate body can be effectively limited by matching the fixed ball 7 with the limiting soft block 9, and the silicon plate bodies 8 with different sizes can be placed on the fixed ball 7, so that the friction force on the cabinet plate is large, the silicon plate body 8 can be effectively limited while the silicon plate body 8 is effectively limited, and the silicon plate body 8 can not be damaged due to the large friction coefficient of the limiting soft block 9 made of rubber, so that the fixity of the head and the tail of the silicon plate body 8 is effectively ensured when the silicon plate body 8 is cut, the silicon plate body 8 can not move when the silicon plate is cut, the deviation caused by the movement of the silicon plate body 8 when the silicon plate is cut is ensured, and the edge of the silicon plate body 8 when the silicon plate is cut is avoided, the edge breakage condition is generated, and the health of people is protected.
Spacing soft piece 9's inside overlap joint has stopper 13, stopper 13 is crooked ascending semicircle, the radian is the same with spacing soft piece 9, it is mainly spacing for laminating spacing soft piece 9, stopper 13's last fixed surface installs screw post 11, screw post 11's upper end threaded connection has apron 10, apron 10's right side is articulated with the upper surface of set casing 1, the middle part of apron 10 has been seted up cuts cut hole, cut hole site in spacing soft piece 9's rear side, cut hole mainly can not squint in order to let when cutting, there is the effect of supplementary cutting, the outside fixed mounting that the upper end of screw post 11 runs through and extend to apron 10 has wrong piece 12, the upper end and the apron 10 fixed connection of spacing soft piece 9.
Through the screw thread post 11, twist the cooperation of piece 12 and stopper 13 and use, can effectually fix the head and the afterbody of silicon plate body 8, when having guaranteed that highly moving copper wire drives the mortar and can form certain impact to silicon block body 1, this kind of impact force can not take place the displacement swing to the head and the afterbody that make the silicon block, when further having guaranteed the cutting, can not produce the deviation to and the condition of collapsing the limit unfilled corner.
When in use:
example 1: open apron 10 earlier, put into silicon plate body 8 on fixed ball 7, rotate again and twist piece 12, then, at this moment, threaded post 11 can the spiral and rotate downwards, drive stopper 13 and support spacing soft piece 9 on silicon plate body 8's upper surface, because spacing soft piece 9 is made by soft rubber, and because the hardness of rubber is less, when contacting with rigid object, real area of contact is great, and real area of contact's size is the important factor of deciding the friction, so the coefficient of friction of rubber is great, can effectually fix silicon plate body 8 under the condition of not scratching, when having guaranteed the cutting, silicon plate body 8 can not move, thereby the deviation that leads to, and also can not be because during the cutting, silicon plate body 8's motion, the edge to silicon plate body 8 cutting that leads to, the condition that the edge collapses is produced, people's health has been protected.
Example 2: if in case, in the cutting process, silicon plate body 8 is because of the cutting carelessly, take place to collapse under limit or the broken condition, at first cover apron 10 the cutting back, can avoid the piece to splash out, simultaneously in this moment, the piece that is blocked can be because of gravity reason, can toward the whereabouts, there is baffle 6 to keep off this moment, fall to and on collecting bin 2, this moment, can smash on the arc board 5 because of having the piece above that, under the condition of telescopic link 4 with external power source switch-on, can start 4 side-to-side motions of telescopic link, the piece of collecting in the bin 2 is given and is transported in collecting ball 3, later unified clearance can.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a can guarantee that silicon chip cutting can not collapse limit device with it is spacing to multidirectional, includes set casing (1), its characterized in that: the feed inlet (201) is fixedly installed at the groove inside the fixed shell (1), the collecting bin (2) is fixedly installed below the feed inlet (201), the collecting balls (3) are fixedly installed at the two ends of the collecting bin (2), the telescopic rod (4) is fixedly installed at the joint of the two ends of the collecting bin (2) and the collecting balls (3), the arc plate (5) is fixedly installed at one end, far away from the collecting balls (3), of the telescopic rod (4), the baffle (6) is fixedly installed at the upper end of the feed inlet (201), the fixing ball (7) is installed at the upper end of the baffle (6), the silicon plate body (8) is lapped at the groove of the fixing ball (7), the limiting soft block (9) is lapped on the upper surface of the silicon plate body (8), the limiting block (13) is lapped inside the limiting soft block (9), and the threaded column (11) is fixedly installed on the upper surface of the limiting block (13), the upper end threaded connection of screw thread post (11) has apron (10), and the outside fixed mounting that runs through and extend to apron (10) in the upper end of screw thread post (11) has wrong piece (12), the upper end and apron (10) fixed connection of spacing soft piece (9).
2. The device with the multidirectional limiting function and capable of guaranteeing that the silicon wafer is cut without edge breakage according to claim 1, is characterized in that: the right side of apron (10) is articulated with the upper surface of set casing (1), and the cutting hole has been seted up at the middle part of apron (10), cuts the rear side that the hole is located spacing soft block (9).
3. The device with the multidirectional limiting function and capable of guaranteeing that the silicon wafer is cut without edge breakage according to claim 1, is characterized in that: the fixing ball (7) is semicircular, and at least two groups of placing grooves are formed in the fixing ball (7).
4. The device with the multidirectional limiting function and capable of guaranteeing that the silicon wafer is cut without edge breakage according to claim 1, is characterized in that: the radian of the arc plate (5) on the left side is opposite to that of the arc plate (5) on the right side, the arc plate (5) on the left side is bent leftwards, and the radian change on the right side is bent rightwards.
5. The device with the multidirectional limiting function and capable of guaranteeing that the silicon wafer is cut without edge breakage according to claim 1, is characterized in that: the limiting block (13) is in a semicircular shape with an upward bending and has the same radian as the limiting soft block (9).
6. The device with the multidirectional limiting function and capable of guaranteeing that the silicon wafer is cut without edge breakage according to claim 1, is characterized in that: the fixing ball (7) is positioned on the side wall of the groove of the fixing shell (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010060760.7A CN111186040B (en) | 2020-01-19 | 2020-01-19 | Device capable of ensuring that silicon wafer cutting cannot be broken with multidirectional limiting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010060760.7A CN111186040B (en) | 2020-01-19 | 2020-01-19 | Device capable of ensuring that silicon wafer cutting cannot be broken with multidirectional limiting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111186040A true CN111186040A (en) | 2020-05-22 |
| CN111186040B CN111186040B (en) | 2021-11-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010060760.7A Active CN111186040B (en) | 2020-01-19 | 2020-01-19 | Device capable of ensuring that silicon wafer cutting cannot be broken with multidirectional limiting |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5123636A (en) * | 1991-01-25 | 1992-06-23 | Dow Corning Corporation | Low-contaminate work surface for processing semiconductor grade silicon |
| CN206351495U (en) * | 2017-01-04 | 2017-07-25 | 宜城市泳瑞玻璃科技有限公司 | The glass clipping machine that a kind of anti-glass dregs splash |
| CN107009532A (en) * | 2017-06-10 | 2017-08-04 | 福建鑫隆光伏科技有限公司 | A kind of monocrystal silicon cutter device |
| CN107672070A (en) * | 2017-10-13 | 2018-02-09 | 江苏秉宸科技有限公司 | One kind energy-conservation silicon rod cutting device |
| CN108527697A (en) * | 2018-04-09 | 2018-09-14 | 绍兴文理学院 | A kind of photovoltaic panel silicon chip cutting device for processing |
| CN109049374A (en) * | 2018-09-10 | 2018-12-21 | 张玉锦 | A kind of LED light production monocrystal rod cutter device |
| CN209256326U (en) * | 2019-01-12 | 2019-08-16 | 黄杰峰 | It is a kind of for processing the work box of objects made from precious metals |
| CN209824140U (en) * | 2018-11-15 | 2019-12-20 | 天津亿为特电子科技有限公司 | Workbench for processing printed circuit board |
-
2020
- 2020-01-19 CN CN202010060760.7A patent/CN111186040B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5123636A (en) * | 1991-01-25 | 1992-06-23 | Dow Corning Corporation | Low-contaminate work surface for processing semiconductor grade silicon |
| CN206351495U (en) * | 2017-01-04 | 2017-07-25 | 宜城市泳瑞玻璃科技有限公司 | The glass clipping machine that a kind of anti-glass dregs splash |
| CN107009532A (en) * | 2017-06-10 | 2017-08-04 | 福建鑫隆光伏科技有限公司 | A kind of monocrystal silicon cutter device |
| CN107672070A (en) * | 2017-10-13 | 2018-02-09 | 江苏秉宸科技有限公司 | One kind energy-conservation silicon rod cutting device |
| CN108527697A (en) * | 2018-04-09 | 2018-09-14 | 绍兴文理学院 | A kind of photovoltaic panel silicon chip cutting device for processing |
| CN109049374A (en) * | 2018-09-10 | 2018-12-21 | 张玉锦 | A kind of LED light production monocrystal rod cutter device |
| CN209824140U (en) * | 2018-11-15 | 2019-12-20 | 天津亿为特电子科技有限公司 | Workbench for processing printed circuit board |
| CN209256326U (en) * | 2019-01-12 | 2019-08-16 | 黄杰峰 | It is a kind of for processing the work box of objects made from precious metals |
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| CN111186040B (en) | 2021-11-19 |
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Effective date of registration: 20211105 Address after: 211100 two, B unit 300, Zhihui Road, Qilin science and Technology Innovation Park, Nanjing, Jiangsu. Applicant after: NANJING XUANSHI QIYUAN SOFTWARE TECHNOLOGY Co.,Ltd. Address before: 311812 No.10, zhuangyuxia village, Caota Town, Zhuji City, Shaoxing City, Zhejiang Province Applicant before: OuYang Xianmei |
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Effective date of registration: 20240620 Address after: No. 20, Environmental Protection 10th Road, Xinbei District, Changzhou City, Jiangsu Province, 213002 Patentee after: Changzhou Xuanyue Photovoltaic Technology Co.,Ltd. Country or region after: China Address before: 211100 two, B unit 300, Zhihui Road, Qilin science and Technology Innovation Park, Nanjing, Jiangsu. Patentee before: NANJING XUANSHI QIYUAN SOFTWARE TECHNOLOGY Co.,Ltd. Country or region before: China |