CN111177050A - Temperature control method of constant-temperature cup - Google Patents

Temperature control method of constant-temperature cup Download PDF

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Publication number
CN111177050A
CN111177050A CN201911008397.8A CN201911008397A CN111177050A CN 111177050 A CN111177050 A CN 111177050A CN 201911008397 A CN201911008397 A CN 201911008397A CN 111177050 A CN111177050 A CN 111177050A
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cup
temperature
led lamp
thermostatic
pin
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CN201911008397.8A
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郑柳科
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Sguai Shenzhen Intelligent Technology Co ltd
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Sguai Shenzhen Intelligent Technology Co ltd
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38Information transfer, e.g. on bus
    • G06F13/40Bus structure
    • G06F13/4004Coupling between buses
    • G06F13/4022Coupling between buses using switching circuits, e.g. switching matrix, connection or expansion network
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00Digital computers in general; Data processing equipment in general
    • G06F15/76Architectures of general purpose stored program computers
    • G06F15/78Architectures of general purpose stored program computers comprising a single central processing unit
    • G06F15/7807System on chip, i.e. computer system on a single chip; System in package, i.e. computer system on one or more chips in a single package
    • G06F15/7817Specially adapted for signal processing, e.g. Harvard architectures

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  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computing Systems (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Mathematical Physics (AREA)
  • Cookers (AREA)
  • Dc Digital Transmission (AREA)
  • Table Equipment (AREA)

Abstract

The invention discloses a temperature control method of a constant temperature cup, wherein the constant temperature cup adopts an FPI film heating sheet as a temperature rise main device of a cup body, is controlled by MCU operation, and adopts an MOS tube as an electronic MOS switch of the FPI film heating sheet. The method comprises (S1) electrifying the cup pad at the beginning to make the control circuit in the cup pad in a standby working state; (S2) the temperature sensor detects the temperature of the water cup and enters different working steps according to different states; (S3) the temperature setting of the water cup is realized by the combination of the touch temperature sensing slide bar and the control circuit, and the LED lamp for displaying the set temperature is used for lighting and displaying; (S4) judging after comparing the temperatures of the MCU, adjusting the current flowing through the heating sheet to realize temperature control, and (S5) judging the state of the thermostatic cup according to the stable state of the LED lamp. Through the scheme, the temperature control of the constant temperature cup is sensitive and accurate, and the constant temperature cup has high practical value and popularization value.

Description

Temperature control method of constant-temperature cup
Technical Field
The invention relates to a constant temperature cup, in particular to a temperature control method of the constant temperature cup.
Background
The cup is usually a container for holding liquid, and can be used for drinking tea, drinking water, drinking coffee, drinking beverages and the like at ordinary times. Usually make with plastic, glass, porcelain or stainless steel, nevertheless because current people work busy, sometimes can not be timely will be fit for the drink of temperature and drink up, when this kind of problem appeared, what people often think is to use the thermos cup to carry out the splendid attire, nevertheless because thermos cup self characteristic, it is long limited to keep warm to the thermos cup is along with the increase of live time, and heat preservation efficiency also reduces gradually. According to the defects and shortcomings of the existing vacuum cups, what is needed is a cup assembly capable of achieving a heating function, a base with the heating function is usually added at the bottom of the cup assembly, heating can be achieved, but due to the fact that a physical switch (temperature control piece) is adopted for temperature control, the heating temperature is completely estimated by a person, and the temperature cannot be effectively adjusted, so that the intelligent degree is low, the required temperature cannot be maintained, and inconvenience is brought to daily life of people.
Disclosure of Invention
The invention aims to provide a temperature control method of a constant-temperature cup, which mainly solves the problem that the temperature of the cup cannot be effectively controlled according to requirements in the prior art.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a temperature control method of a thermostatic cup specifically comprises the following steps:
(S1) electrifying the cup mat when starting, so that the control circuit in the cup mat is in a standby working state;
(S2) detecting the water temperature in the cup body by using a temperature sensor, feeding back the water temperature in the cup body through a low-frequency communication circuit, displaying the water temperature in real time by using an LED lamp, and entering the step (S3), if the cup body does not exist, displaying that the state of the cup body is not detected by using the LED lamp;
(S3) setting the temperature of the water cup, and lighting up and displaying the water cup through an LED lamp;
(S4) comparing the set temperature in the step (S3) with the real-time temperature of the beverage in the cup in the step (S2); the judgment is made after the temperature comparison of the MCU, the control circuit adjusts the current flowing through the heating sheet to realize temperature control, and the state of the LED lamp changes;
(S5) after the LED lamp is in a stable state, judging the state of the thermostatic cup.
Further, the detection of the water temperature in the step (S2) is implemented by 3 thermistors, which are respectively arranged at the bottom of the very constant temperature cup, 5mm close to the bottom of the outer wall of the cup, and 10mm close to the bottom of the outer wall of the cup.
Further, in the step (S3), the temperature of the cup is set by touching a temperature sensing slide bar on the cup mat and combining with a control circuit.
Further, each of the LED lamps represents 1 ℃.
Furthermore, the MCU controls the current flowing through the FPI film heating sheet through the on-off of the MOS tube switch.
Furthermore, the low-frequency communication circuit adopts an MCU low-frequency communication circuit based on power line connection.
Further, four possible states exist after the LED lamp stably displays; the LED lamp slowly flashes to indicate that the heating base is being dried and the heating circuit is cut off; the LED lamp is in the positive direction and flickers the horse race lamp to indicate that the cup body is being heated; the LED lamp is in the flash of a reverse horse race lamp to indicate that the cup body is being cooled; the constant retention of the LED lamp indicates that the cup body is being thermostatically insulated.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the invention, the slide bar with temperature induction is arranged on the cup mat, the set value of the temperature can be changed by manually touching the slide bar, then the control circuit in the cup mat judges whether to continue heating or not or keep the temperature according to the temperature fed back by the cup body, and when the temperature is quickly raised due to the temperature change fed back, the cup mat judges that no liquid is in a dry-burning state in the cup body, so that the heating is cut off. And when the cup is placed on the cup mat again after the cup is taken away, if the heating temperature is not changed again, the control circuit in the cup mat heats or cools according to the temperature recorded before, so that intelligent control is realized.
(2) The temperature of the LED lamp is 1 ℃, so that the current temperature (the preset value plus the lighting numerical value) can be known through the number of the lighted LED lamps, the temperature of the LED lamp is changed at1 ℃, the design is more humanized, the LED lamp is closer to life, and the practicability is high.
(3) The LED cup reminds a user that water in the cup body is higher than, equal to or just reaches a preset value at the moment through different expression forms of the LED lamp, is clear, cannot be scalded when the user drinks, and is high in safety.
Drawings
FIG. 1 is a schematic flow chart of the present invention.
Fig. 2 is a schematic view of the structure of the cup mat of the present invention.
Fig. 3 is a schematic diagram of a communication circuit of the present invention during dc power supply.
Fig. 4 is a schematic diagram of a communication circuit of the present invention during ac power supply.
FIG. 5 is a schematic diagram of the master MCU1 circuit of the present invention.
Fig. 6 is a schematic diagram of a heating circuit of the present invention.
FIG. 7 is a schematic diagram of the LED display portion of the circuit of the present invention.
Fig. 8 is a schematic diagram of a power supply circuit of the present invention.
Detailed Description
The present invention will be further described with reference to the following description and examples, which include but are not limited to the following examples.
Examples
As shown in figure 1, the temperature control method of the constant temperature cup disclosed by the invention is characterized in that the constant temperature cup adopts an FPI thin film heating sheet as a temperature rise main device of a cup body, MCU (microprogrammed control unit) operation control is utilized, and an MOS (metal oxide semiconductor) tube is adopted as an electronic MOS (metal oxide semiconductor) switch of the FPI thin film heating sheet.
Three thermistors are respectively arranged at the bottom of the cup, at the position 5mm close to the bottom of the outer wall of the cup and at the position 10mm close to the bottom of the outer wall of the cup, and are used for detecting the real-time temperature of the beverage in the cup, and the detected temperature data are respectively transmitted to a microprocessor in the U3 through a pin 18, a pin 22 and a pin 23 of the U3 for temperature control. When the cup mat is started, the cup mat is electrified, so that a control circuit in the cup mat is in a standby working state. The intelligent control is carried out by adopting a three-point temperature detection technology and PID slope calculation, and dry burning can be rapidly judged within millisecond grade, so that the power supply is immediately turned off, the protection time is greatly prolonged, and the service life of the water cup is prolonged.
As shown in fig. 2, the cup mat controlled by touch temperature is adopted in the invention, the temperature setting of the cup is realized by combining the touch temperature sensing slide bar with the control circuit, and the LED lamp for displaying the set temperature is used for lighting and displaying. The temperature-sensing slide bar is provided with 20 LED lamps altogether, every LED lamp represents 1 ℃, according to the custom that masses drink beverage and drinking water, set up initial temperature to be 45 ℃ through the inside control circuit of coaster, a LED lamp is lighted in the sliding touch, the temperature value of setting then adds 1 ℃, for the convenient count, can set up a LED lamp of reminding in the position of 5 th, 10, 15 LED lamps, when the user touches the temperature-sensing slide bar with the hand, the quantity of lighting the lamp adds default (45 ℃) and is the temperature of setting for promptly.
As shown in fig. 3-8, the control circuit adopted in the temperature control method of the present invention includes a main control MCU1 circuit, a heating circuit connected to the main control MCU1, an LED display circuit, a power circuit for providing power to the main control MCU1 circuit, the heating circuit, and the LED display circuit, and a low frequency communication circuit connected to the MCU1 circuit through a power line.
Specifically, the low-frequency communication circuit comprises a communication control MCU2 circuit, a first communication circuit used for the MCU1 to send communication signals to the MCU2, and a second communication circuit used for the MCU2 to send communication signals to the MCU 1.
Specifically, first communication circuit includes control switch K1 that the control end is connected with MCU1 'S control signal output end to and a detection resistance R21 and a resistance R22 that an end connects at control switch K1' S output, other end ground connection after establishing ties, MCU2 'S power detection end is connected between resistance R21 and resistance R22, resistance R21 is connected with control switch K1' S output, control switch K1 'S input, MCU1 and MCU 2' S power supply positive pole input all is connected with the positive terminal VCC of power, MCU1 'S earthing terminal is connected with power S' S negative terminal GND.
Specifically, the second communication circuit includes a detection resistor R having one end connected to the power supply negative terminal GND and the other end connected to the ground terminal of the MCU2, a control switch K2 having a control terminal connected to the control signal output terminal of the MCU2, and a load resistor RL having one end connected to the ground terminal and the other end connected to the output terminal of the control switch K2, wherein the input terminal of the control switch K2 is connected to the output terminal of the control switch K1, and two ends of the resistor R are respectively connected to two current detection terminals of the MCU 1.
Specifically, when the power supply is a direct current power supply, the power supply is provided with two direct current power supplies, namely a direct current power supply S1 for supplying power to the MCU1 and a direct current power supply S2 for supplying power to the MCU2, voltage stabilizing circuits are respectively arranged at positive power supply input ends of the MCU1 and the MCU2, an input end of the control switch K1 is connected with a positive end VCC of the direct current power supply S1, and a diode D is arranged between an output end of the control switch K1 and an input end of the control switch K2.
Specifically, when the power supply is an alternating current power supply, the power supply is an alternating current power supply S3 which supplies power to the MCU1 and the MCU2, the positive input end of the power supply of the MCU2 is connected between the output end of the control switch K1 and the input end of the control switch K2, the positive input ends of the power supplies of the MCU1 and the MCU2 are both provided with a rectification, filtering and voltage stabilizing circuit, and a diode D is provided between the output end of the control switch K1 and the resistor R1.
Specifically, the master control MCU1 circuit comprises a single chip microcomputer chip U3, a capacitor C7, one end of which is connected with a VCC pin of the single chip microcomputer chip U3 and the other end of which is connected with a VSS pin of the single chip microcomputer chip U3; pins P3.6 and P1.7 of the single chip microcomputer chip U3 are connected with the heating circuit, pins P1.6, P1.2 and P1.3 of the single chip microcomputer chip U3 are connected with the LED display circuit, and pins P0.3, P3.4, P1.1 and P1.4 of the single chip microcomputer chip U3 are connected with the power supply circuit.
Specifically, the heating circuit comprises a PMOS tube Q2 with a source S connected with 8.4V voltage, a resistor R12 connected between the source S and a gate G of the PMOS tube Q2, an NMOS tube Q3 with a drain D connected with the gate G of the PMOS tube Q2, a resistor R13 with one end connected with the gate G of the NMOS tube Q3 and the other end connected with the P1.7 pin of the singlechip chip U3, a resistor R14 with one end connected with the source S of the NMOS tube Q3 and the other end connected with the P1.7 pin of the singlechip chip U3, a touch sensing element FTC with a 2 nd pin connected with the drain D of the PMOS tube Q2 and a 1 st pin grounded, a PMOS tube Q4 with a drain D connected with the 3 rd pin of the touch sensing element FTC, a resistor R15 connected between the source S of the PMOS tube Q4 and the gate G, an NMOS tube Q6 with a drain D connected with the gate G of the PMOS tube Q4, and a resistor R3627.3 pin of the singlechip chip U3, a resistor R17 with one end connected with the source S of the NMOS tube Q5 and the other end connected with the P3.6 pin of the singlechip chip U3; the source S of the PMOS transistor Q4 is also externally connected with 19V voltage, and the sources S of the NMOS transistors Q3 and Q5 are grounded.
Specifically, the LED display circuit includes a resistor R20 connected to a P1.6 pin of a monolithic chip U3, an NPN type triode Q6 having a gate G connected to the resistor R20, a resistor R5 connected to the triode Q6, a chip LED1 having a R pin connected to the other end of the resistor R5, a resistor R18 having one end connected to an R pin of the chip LED1 and the other end connected to the P1.6 pin of the monolithic chip U3, a resistor R27 connected to a P1.2 pin of the monolithic chip U3, an NPN type triode Q27 having a gate G connected to the resistor R27, a resistor R27 connected to the triode Q27, a resistor R27 having one end connected to a G pin of the chip LED 27 and the other end connected to the P1.2 pin of the monolithic chip U27, a resistor R27 having a gate G connected to the resistor R36q 27, a resistor R27 connected to the other end of the monolithic chip U27, and a resistor R27B of the monolithic chip 27 and a resistor R27 connected to the other end of the monolithic chip R27, the LED1, the LED2 and the LED3 are connected with the VCC pin of the chip LED1 through the negative electrodes and the positive electrodes respectively and correspondingly connected with the R, G, B pin of the chip LED1, wherein the R, G, B, VCC pin of the chip LED1 is connected with 3.3V voltage.
Specifically, the power supply circuit comprises a chip U2, a capacitor C5 with one end connected with a VCC pin of the chip U2 and the other end grounded, a diode D2 with the anode connected with a VCC pin of the chip U2, resistors R3 and R8 with one end connected with the cathode of the diode D2 and the other end grounded after series connection, a power interface chip BAT1 with the anode connected with the cathode of the diode D2 and the cathode grounded, a PMOS tube Q1 with the source S connected with a VG pin of the chip U2 and the gate G connected with a DRV pin of the chip U2, a diode D3 with the anode connected with the drain D of the PMOS tube Q1 and the cathode grounded, an inductor L1 with one end connected with the drain D of the PMOS tube Q1 and the other end connected with a pin of the chip U2, a resistor R1 with one end connected with the inductor L1 in series and the other end connected with a BAT pin of the chip U2, a resistor R2 with one end connected with the BAT pin of the chip U2 and the other end connected with the resistor R2 and the other end of the resistor R2, a battery BAT1 with an anode connected in series with a resistor R1 and a cathode grounded, a resistor R2 and a resistor R4 with one end connected with a resistor R1 and the other end grounded after the series connection, a diode D4 with a cathode connected with a VCC pin of a chip U2, a diode D5 with a cathode connected with an anode of the battery BAT1 and an anode connected with an anode of the diode D4, a chip U1 with a VIN pin connected with an anode of the diode D5, a capacitor C2 with one end connected with a VIN pin of the chip U1 and the other end grounded, and a capacitor C1 with one end connected with a VOUT pin of the chip U1 and the other end grounded; the connecting ends of the resistors R3 and R8 are connected with a P1.4 pin of a single chip microcomputer chip U3, a CHRG pin of the chip U2 is connected with a P3.4 pin of the single chip microcomputer chip U3, a DONE pin of the chip U2 is connected with a P0.3 pin of the single chip microcomputer chip U3, the negative electrode of the diode D2 is externally connected with 19V voltage, the connecting end of the capacitor C4 and the resistor R1 is externally connected with 8.4V voltage, the connecting ends of the resistors R2 and R4 are connected with a P1.1 pin of the single chip microcomputer chip U3, and the VOUT pin of the U1 is externally connected with 3.3V voltage.
U3 is MCU operation control IC, Q2 and Q4 are electronic MOS switches as heating sheets, wherein R20, R27 and R28 are three thermistors which are respectively arranged at the bottom of the cup, the position of the outer wall of the cup, which is 5mm close to the bottom, is 10mm close to the bottom, the three thermistors detect the real-time temperature of the beverage in the cup, and the detected temperature data are respectively transmitted to a microprocessor in the U3 through a pin 18, a pin 22 and a pin 23 of U3 to control the temperature. The U3 controls the heating sheet through the pin 16 and the pin 17, and the on-off of the Q2 and the Q4 is controlled by adopting PWM (pulse width modulation), so that the current flowing through the heating sheet is regulated, and the aim of controlling the temperature is fulfilled.
Four possible states exist after the LED lamp stably displays; the LED lamp slowly flashes and shows that the heating base is burning dry, and heating circuit has cut off, and the LED lamp presents forward horse race lamp scintillation and shows heating the cup, and the LED lamp presents reverse horse race lamp scintillation and shows cooling to the cup, and the LED lamp keeps constantly showing and is carrying out constant temperature heat preservation to the cup.
The electric energy of the invention is supplied by inputting direct current 19V by the adapter, flows to CN1 (base thimble) through Q1, and is directly connected to CN1 in figure 5, thereby achieving the purpose of supplying power to the electronic circuit in the cup. The low-frequency communication circuit adopts an MCU low-frequency communication circuit based on power line connection.
The above-mentioned embodiment is only one of the preferred embodiments of the present invention, and should not be used to limit the scope of the present invention, but all the insubstantial modifications or changes made within the spirit and scope of the main design of the present invention, which still solve the technical problems consistent with the present invention, should be included in the scope of the present invention.

Claims (7)

1. A temperature control method of a thermostatic cup is characterized by comprising the following steps:
(S1) electrifying the cup mat when starting, so that the control circuit in the cup mat is in a standby working state;
(S2) detecting the water temperature in the cup body by using a temperature sensor, feeding back the water temperature in the cup body through a low-frequency communication circuit, displaying the water temperature in real time by using an LED lamp, and entering the step (S3), if the cup body does not exist, displaying that the state of the cup body is not detected by using the LED lamp;
(S3) setting the temperature of the water cup, and lighting up and displaying the water cup through an LED lamp;
(S4) comparing the set temperature in the step (S3) with the real-time temperature of the beverage in the cup in the step (S2); the judgment is made after the temperature comparison of the MCU, the control circuit adjusts the current flowing through the heating sheet to realize temperature control, and the state of the LED lamp changes;
(S5) after the LED lamp is in a stable state, judging the state of the thermostatic cup.
2. The method for controlling the temperature of a thermostatic cup according to claim 1, wherein the detection of the water temperature in the step (S2) is performed by means of thermistors, and the number of the thermistors is 3, and the thermistors are respectively arranged at the bottom of the very thermostatic cup and 5mm near the bottom of the outer wall of the very thermostatic cup and 10mm near the bottom of the outer wall of the very thermostatic cup.
3. The method for controlling the temperature of a thermostatic cup according to claim 2, wherein the setting of the temperature of the cup is realized by touching a temperature sensing slide bar on a cup mat and combining a control circuit in the step (S3).
4. The method as claimed in claim 3, wherein each LED lamp represents 1 ℃.
5. The temperature control method of a thermostatic cup according to claim 4, wherein the MCU controls the current flowing through the FPI film heating plate through the on-off of the MOS tube switch.
6. The temperature control method of a thermostatic cup according to claim 5, characterized in that the low frequency communication circuit is an MCU low frequency communication circuit based on power line connection.
7. The method for controlling the temperature of a thermostatic cup according to claim 6, wherein four possible states exist after the LED lamp stably displays; the LED lamp slowly flashes to indicate that the heating base is being dried and the heating circuit is cut off; the LED lamp is in the positive direction and flickers the horse race lamp to indicate that the cup body is being heated; the LED lamp is in the flash of a reverse horse race lamp to indicate that the cup body is being cooled; the constant retention of the LED lamp indicates that the cup body is being thermostatically insulated.
CN201911008397.8A 2019-04-01 2019-10-22 Temperature control method of constant-temperature cup Pending CN111177050A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910256134.2A CN110196827A (en) 2019-04-01 2019-04-01 MCU low frequency communication circuit and its means of communication based on power supply line connection
CN2019102561342 2019-04-01

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Publication Number Publication Date
CN111177050A true CN111177050A (en) 2020-05-19

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Application Number Title Priority Date Filing Date
CN201910256134.2A Pending CN110196827A (en) 2019-04-01 2019-04-01 MCU low frequency communication circuit and its means of communication based on power supply line connection
CN201921784462.1U Active CN211087214U (en) 2019-04-01 2019-10-22 Temperature control circuit of constant temperature cup
CN201911008397.8A Pending CN111177050A (en) 2019-04-01 2019-10-22 Temperature control method of constant-temperature cup

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Application Number Title Priority Date Filing Date
CN201910256134.2A Pending CN110196827A (en) 2019-04-01 2019-04-01 MCU low frequency communication circuit and its means of communication based on power supply line connection
CN201921784462.1U Active CN211087214U (en) 2019-04-01 2019-10-22 Temperature control circuit of constant temperature cup

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113885601A (en) * 2021-10-25 2022-01-04 小水怪(深圳)智能科技有限公司 Control method of water cup

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113885601A (en) * 2021-10-25 2022-01-04 小水怪(深圳)智能科技有限公司 Control method of water cup

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CN110196827A (en) 2019-09-03
CN211087214U (en) 2020-07-24

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