CN111169104A - Flexible substrate, flexible electronic device, and method for adjusting rigidity of flexible substrate and application - Google Patents

Flexible substrate, flexible electronic device, and method for adjusting rigidity of flexible substrate and application Download PDF

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Publication number
CN111169104A
CN111169104A CN201911425253.2A CN201911425253A CN111169104A CN 111169104 A CN111169104 A CN 111169104A CN 201911425253 A CN201911425253 A CN 201911425253A CN 111169104 A CN111169104 A CN 111169104A
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China
Prior art keywords
flexible substrate
state
groove
fluid
flexible
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CN201911425253.2A
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Chinese (zh)
Inventor
冯雪
唐瑞涛
付浩然
陈颖
陆方圆
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Tsinghua University
Institute of Flexible Electronics Technology of THU Zhejiang
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Tsinghua University
Institute of Flexible Electronics Technology of THU Zhejiang
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Application filed by Tsinghua University, Institute of Flexible Electronics Technology of THU Zhejiang filed Critical Tsinghua University
Priority to CN201911425253.2A priority Critical patent/CN111169104A/en
Publication of CN111169104A publication Critical patent/CN111169104A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays

Abstract

The invention relates to a flexible substrate, a flexible electronic device, a method for adjusting the rigidity of the flexible substrate and application thereof, wherein the flexible substrate comprises a base body and a packaging layer which are arranged in a stacked mode, a groove is formed in the end face, opposite to the packaging layer, of the base body, and the groove penetrates through at least one side face of the base body; a rigidity adjusting structure is arranged in the groove, the flexible substrate forms a first state and a second state with different rigidities through the rigidity adjusting structure, and the rigidity of the flexible substrate in the first state is larger than that in the second state; in the first state, the rigidity of the flexible substrate can realize a supportable function, and in the second state, the rigidity of the flexible substrate can realize a portable folding function, so that the problem that the flexible substrate loses the foldability after being combined with the hard substrate is solved.

Description

Flexible substrate, flexible electronic device, and method for adjusting rigidity of flexible substrate and application
Technical Field
The invention relates to the technical field of flexible electronics, in particular to a flexible substrate, a flexible electronic device, a method for adjusting the rigidity of the flexible substrate and application of the flexible substrate.
Background
With the development of flexible electronic technology, the application of the flexible substrate is more and more extensive, and the flexible substrate has wide application prospect in the fields of information, energy, medical treatment, national defense and the like by virtue of unique ductility and efficient and low-cost manufacturing process.
In the related art, when the flexible substrate is applied to a flexible display device, the content needs to be written during the use process, which requires that the flexible substrate needs to be combined with a hard base hard substrate, and the addition of the hard base hard substrate enables the flexible substrate to have support during the writing process, but simultaneously loses the folding performance.
In the related art, no effective solution is provided at present for the problem that the flexible substrate and the rigid substrate lose foldability after being combined.
Disclosure of Invention
The invention provides a flexible substrate, a flexible electronic device, a method for adjusting the rigidity of the flexible substrate and application, aiming at the problem that the foldability of the flexible substrate is lost after the flexible substrate is combined with a hard substrate in the related art, so as to at least solve the problem.
According to an aspect of the present invention, there is provided a method for adjusting the rigidity of a flexible substrate, the method being applied to a flexible substrate including a base and an encapsulation layer, the method including the steps of:
forming a groove on the end face of the substrate opposite to the packaging layer, and enabling the groove to penetrate through at least one side face of the substrate;
and arranging a rigidity adjusting structure in the groove so that the flexible substrate forms a first state and a second state with different rigidities through the rigidity adjusting structure, wherein the rigidity of the flexible substrate in the first state is greater than that in the second state.
In one embodiment, the flexible substrate further comprises a seal, the stiffness adjusting structure comprises a filling medium, and the step of providing the stiffness adjusting structure in the groove comprises:
and filling the filling medium in the groove and sealing the opening of the groove on the side face of the base body through the sealing element so as to enable the flexible substrate to form the first state.
In one embodiment, the flexible substrate further comprises a seal, the stiffness adjusting structure comprises a filling medium, and the step of providing the stiffness adjusting structure in the groove comprises:
and removing the filling medium in the groove and enabling the flexible substrate to form the second state.
In one embodiment, the flexible substrate further comprises a seal, the stiffness adjusting structure comprises magnetorheological fluid received in the groove, and the step of providing the stiffness adjusting structure in the groove comprises:
filling the magnetorheological fluid in the groove, and sealing the opening of the groove on the side surface of the base body through the sealing element;
adjusting fluid properties of the magnetorheological fluid with an external magnetic field and switching the flexible substrate between the first state and the second state.
In one embodiment, the step of adjusting the fluid properties of the magnetorheological fluid by the external magnetic field and switching the flexible substrate between the first state and the second state comprises:
adjusting fluid properties of the magnetorheological fluid by the presence or absence of an external magnetic field or a change in strength, and switching the flexible substrate between the first state and the second state.
In one embodiment, the flexible substrate further comprises a sealing member, the stiffness adjusting structure comprises a flexible conductive wire and an electro-rheological fluid, and the step of disposing the stiffness adjusting structure in the groove comprises:
filling the electrorheological fluid in the groove, arranging a flexible lead electrically connected with the electrorheological fluid in the groove, and sealing the opening of the groove on the side surface of the base body through the sealing element;
adjusting a fluid property of the electro-rheological fluid by the energized state of the flexible conductive wire and causing the flexible substrate to switch between the first state and the second state.
In one embodiment, the step of adjusting the fluid property of the electro-rheological fluid by the energization state of the flexible conductive wire and switching the flexible substrate between the first state and the second state includes:
and adjusting the fluid property of the electro-rheological fluid through the on-off or the current magnitude of the current on the flexible lead, and switching the flexible substrate between the first state and the second state.
In one embodiment, the stiffness adjusting structure includes a temperature control element and a thermally-induced deformation element, and the step of disposing the stiffness adjusting structure in the groove includes:
arranging the temperature control element and the thermally-induced deformation element in the groove, and enabling the temperature control element and the thermally-induced deformation element to be in heat conduction contact;
and adjusting the deformation of the thermally-induced deformation element through the temperature change of the temperature control element, and switching the flexible substrate between the first state and the second state.
According to another aspect of the invention, an application of the method for adjusting the rigidity of the flexible substrate is provided, and the method for adjusting the rigidity of the flexible substrate is applied to electronic paper and a flexible detection patch.
According to another aspect of the invention, a flexible substrate is provided, which includes a base body and a package layer, wherein the base body and the package layer are stacked, the base body is provided with a groove relative to an end face of the package layer, and the groove penetrates at least one side face of the base body; a rigidity adjusting structure is arranged in the groove, the flexible substrate forms a first state and a second state with different rigidities through the rigidity adjusting structure, and the rigidity of the flexible substrate in the first state is larger than that in the second state.
In one embodiment, the stiffness adjusting structure comprises a filling medium, the flexible substrate further comprises a sealing member for sealing an opening of the groove on the base side; in the first state, the filling medium is filled into the groove; in the second state, the filling medium is drawn out of the groove.
In one embodiment, the flexible substrate further comprises a sealing member for sealing an opening of the groove on the base side; the rigidity adjusting structure comprises magnetorheological fluid contained in the groove;
the flexible substrate adjusts the fluid characteristics of the magnetorheological fluid through the control action of the external magnetic field on the magnetorheological fluid and switches between the first state and the second state.
In one embodiment, the flexible substrate adjusts the fluid properties of the magnetorheological fluid by the presence or absence of an external magnetic field and switches between the first state and the second state; alternatively, the first and second electrodes may be,
the flexible substrate adjusts the fluid characteristics of the magnetorheological fluid through different magnitudes of the external magnetic field and is switched between the first state and the second state.
In one embodiment, the flexible substrate further comprises a sealing member for sealing an opening of the groove on the base side; the rigidity adjusting structure comprises a flexible lead arranged in the groove and electrorheological fluid accommodated in the groove, and the flexible lead is electrically connected with the electrorheological fluid;
the flexible substrate adjusts the fluid characteristics of the electro-rheological fluid through the energized state of the flexible lead and switches between the first state and the second state.
In one embodiment, the flexible substrate adjusts the fluid property of the electrorheological fluid by switching the current on and off the flexible lead, and switches between the first state and the second state; alternatively, the first and second electrodes may be,
the flexible substrate adjusts the fluid property of the electro-rheological fluid by the magnitude of the current on the flexible lead and switches between the first state and the second state.
In one embodiment, the stiffness adjustment structure comprises a temperature control element and a thermally-induced deformation element, and the temperature control element is in heat-conducting contact with the thermally-induced deformation element; the flexible substrate adjusts the deformation of the thermal deformation element through the temperature change of the temperature control element and is switched between the first state and the second state.
In one embodiment, the first end and the second end of the thermally-induced deformation element are oppositely bent, and the first end and the second end respectively abut against two opposite side walls of the groove.
In one embodiment, the number of the grooves is multiple, and the grooves are arranged in a staggered manner transversely and longitudinally and are communicated with each other to form a grid;
or the number of the grooves is at least two, and the two grooves are arranged in a staggered mode and are communicated with each other.
According to another aspect of the present invention, there is provided a flexible electronic device comprising a flexible substrate, the flexible substrate being the flexible substrate of any one of the above embodiments.
The flexible substrate, the flexible electronic device, the method for adjusting the rigidity of the flexible substrate and the application thereof comprise a base body and a packaging layer which are arranged in a stacked mode, wherein a groove is formed in the end face, opposite to the packaging layer, of the base body, and penetrates through at least one side face of the base body; the groove is internally provided with a rigidity adjusting structure, the flexible substrate forms a first state and a second state with different rigidities through the rigidity adjusting structure, the rigidity of the flexible substrate in the first state is larger than that in the second state, and the problem that the flexible substrate loses the foldability after being combined with a hard substrate is solved.
Drawings
FIG. 1 is a first flowchart of a method for adjusting the stiffness of a flexible substrate according to an embodiment of the invention;
FIG. 2 is a second flowchart of a method for adjusting the stiffness of a flexible substrate according to an embodiment of the invention;
FIG. 3 is a flow chart III of a method for adjusting the stiffness of a flexible substrate according to an embodiment of the invention;
FIG. 4 is a fourth flowchart of a method for adjusting the stiffness of a flexible substrate according to an embodiment of the invention;
FIG. 5 is a flow chart diagram of a fifth method for adjusting the stiffness of a flexible substrate according to an embodiment of the invention;
FIG. 6 is a sixth flowchart of a method for stiffness adjustment of a flexible substrate according to an embodiment of the invention;
FIG. 7 is a seventh flowchart of a method for adjusting the stiffness of a flexible substrate according to an embodiment of the invention;
FIG. 8 is an eighth flowchart of a method for stiffness adjustment of a flexible substrate in accordance with an embodiment of the present invention;
FIG. 9 is a first schematic diagram of a flexible substrate according to an embodiment of the present invention;
FIG. 10 is a second schematic structural view of a flexible substrate in accordance with an embodiment of the present invention;
FIG. 11 is a schematic diagram of the structure of a flexible substrate in an embodiment in accordance with the invention;
FIG. 12 is a fourth schematic structural view of a flexible substrate in accordance with an embodiment of the present invention;
FIG. 13 is a schematic diagram of a fifth configuration of a flexible substrate in accordance with an embodiment of the present invention;
fig. 14 is a schematic diagram six of the structure of a flexible substrate in an embodiment in accordance with the invention.
Description of the main elements
Base body 10
Encapsulation layer 20
Groove 11
Rigidity adjusting structure 12
Opening of the container 14
Flexible wire 121
Temperature control element 122
Thermally deformable element 123
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It should be noted that the terms "first", "second" and "third" related to the embodiments of the present invention only distinguish similar objects, and do not represent specific ordering for the objects, and the terms "first", "second" and "third" may be interchanged with specific order or sequence, where permitted. It is to be understood that the terms "first," "second," and "third" are used interchangeably where appropriate to enable embodiments of the present invention described herein to be practiced in sequences other than those illustrated or described herein.
Fig. 1 is a first flowchart of a method for adjusting the stiffness of a flexible substrate according to an embodiment of the present invention, and as shown in fig. 1, the present invention provides a method for adjusting the stiffness of a flexible substrate, which is applied to a flexible substrate, where the flexible substrate includes a base and an encapsulation layer that are stacked, and the method includes the following steps:
step S110, forming a groove on the end face of the substrate opposite to the packaging layer, and enabling the groove to penetrate through at least one side face of the substrate.
Wherein the material of the substrate comprises at least one of the following: polydimethylsiloxane (PDMS), Polyurethane (PU) and aliphatic aromatic random copolyester Ecoflex, wherein the material of the substrate is required to have good elasticity, can resist bending and folding for many times and has certain tensile property, and the preparation method of the packaging layer comprises one of the following steps: reverse mold casting and 3D printing technology; the preparation method of the groove comprises one of the following steps: a reverse mold process, a photolithography process, and a 3D printing technique.
Step S120, a stiffness adjusting structure is disposed in the groove, so that the flexible substrate forms a first state and a second state with different stiffnesses through the stiffness adjusting structure, and the stiffness of the flexible substrate in the first state is greater than the stiffness in the second state.
According to the method for adjusting the rigidity of the flexible substrate, the groove is formed in the end face, opposite to the packaging layer, of the base body, the rigidity adjusting structure is arranged in the groove, so that the flexible substrate can be in the first state and the second state with different rigidities through the rigidity adjusting structure, the flexible substrate can be switched between the first state and the second state with different rigidities, and the problem that the flexible substrate loses the foldability after being combined with the hard substrate is solved.
In one embodiment, fig. 2 is a second flowchart of a method for adjusting the stiffness of a flexible substrate according to an embodiment of the present invention, and as shown in fig. 2, there is provided a method for adjusting the stiffness of a flexible substrate, the flexible substrate further includes a sealing member, the stiffness adjusting structure includes a filling medium, and further includes step S220, and step S220 is after step S120:
step S220, a rigidity adjusting structure is arranged in the groove, filling media are filled in the groove, and the opening of the groove on the side face of the base body is sealed through a sealing piece, so that the flexible base is in a first state.
It should be further noted that, when there is no filling medium in the groove, the flexible substrate is in the second state, the filling medium is filled in the groove and the opening of the groove on the side surface of the base body is sealed by the sealing member, so that the flexible substrate is in the first state, and the rigidity of the flexible substrate in the first state is greater than that in the second state.
Further, the filling medium is gas or liquid, wherein, when the filling medium is gas, air is introduced into the groove through the opening to fill the groove on the base body with the air, but the material of the base body is preferably not deformed, and the opening is sealed by the sealing member after the air is injected, so that the flexible substrate has certain supporting rigidity.
According to the method for adjusting the rigidity of the flexible substrate, the rigidity adjusting structure is arranged in the groove, the filling medium is filled in the groove, and the opening of the groove on the side face of the base body is sealed through the sealing element, so that the flexible substrate is in the first state, the flexible substrate is converted from the second state to the first state, and the problem that the flexible substrate loses the foldability after being combined with the hard substrate is solved.
In one embodiment, fig. 3 is a flowchart three of a method for adjusting the stiffness of a flexible substrate according to an embodiment of the present invention, as shown in fig. 3, there is provided a method for adjusting the stiffness of a flexible substrate, the flexible substrate further includes a sealing member, the stiffness adjusting structure includes a filling medium, including step S330, step S330 is after step S220:
step S330, the filling medium in the groove is removed, and the flexible substrate is enabled to form a second state.
It should be further noted that, when the filling medium is in the groove, the flexible substrate is in the second state, the filling medium in the groove is removed, and the flexible substrate is in the second state, and the rigidity of the flexible substrate in the first state is greater than that in the second state.
Further, the filling medium is gas or liquid, wherein, when the filling medium is gas, air is introduced into the groove through the opening to fill the groove on the base body with the air, but the material of the base body is preferably not deformed, and the opening is sealed by the sealing member after the air is injected, so that the flexible substrate has certain supporting rigidity.
According to the method for adjusting the rigidity of the flexible substrate, the flexible substrate is converted from the first state to the second state by removing the filling medium in the groove and enabling the flexible substrate to form the second state, and the problem that the flexible substrate loses the foldability after being combined with the hard substrate is solved.
In one embodiment, fig. 4 is a fourth flowchart of a stiffness adjusting method for a flexible substrate according to an embodiment of the present invention, and as shown in fig. 4, there is provided a stiffness adjusting method for a flexible substrate, the flexible substrate further including a sealing member, the stiffness adjusting structure including a magnetorheological fluid accommodated in a groove, including the steps of:
step S420, filling magnetorheological fluid in the groove, and sealing the opening of the groove on the side face of the base body through a sealing piece.
And step S430, adjusting the fluid property of the magnetorheological fluid through an external magnetic field, and switching the flexible substrate between the first state and the second state through the flexible substrate rigidity adjusting method.
It should be noted that the stiffness of the flexible substrate in the first state is greater than the stiffness in the second state.
According to the method for adjusting the rigidity of the flexible substrate, the flexible substrate further comprises a sealing element, the sealing element is used for sealing an opening of the groove on the side face of the base body, the rigidity adjusting structure comprises magnetorheological fluid contained in the groove, the fluid characteristics of the magnetorheological fluid are adjusted through the control effect of an external magnetic field on the magnetorheological fluid, a first state and a second state with different rigidity are formed, the flexible substrate is switched between the first state and the second state, and the problem that the flexible substrate loses the foldability after being combined with the hard substrate is solved.
In one embodiment, fig. 5 is a flowchart five of a method for adjusting the stiffness of a flexible substrate according to an embodiment of the present invention, and as shown in fig. 5, there is provided a method for adjusting the stiffness of a flexible substrate, including step S530, where step S530 is after step S420:
step S530, adjusting the fluid characteristics of the magnetorheological fluid by the presence or absence of the external magnetic field or the strength variation, and switching the flexible substrate between the first state and the second state.
According to the method for adjusting the rigidity of the flexible substrate, the fluid characteristics of the magnetorheological fluid are adjusted through the existence or nonexistence of the external magnetic field or the difference of the magnitude of the external magnetic field, a first state and a second state with different rigidity are formed, the flexible substrate is switched between the first state and the second state, the rigidity of the flexible substrate can realize a supportable function in the first state, the rigidity of the flexible substrate can realize a portable folding function in the second state, and the problem that the flexible substrate loses the foldability after being combined with the hard substrate is solved.
In one embodiment, fig. 6 is a flowchart of a method for adjusting the stiffness of a flexible substrate according to an embodiment of the present invention, and as shown in fig. 6, there is provided a method for adjusting the stiffness of a flexible substrate, the flexible substrate further including a sealing member, the stiffness adjusting structure including a flexible conductive wire and an electro-rheological fluid, including the steps of:
step S620, filling the groove with electrorheological fluid, arranging a flexible lead electrically connected with the electrorheological fluid in the groove, and sealing the opening of the groove on the side surface of the substrate through a sealing element.
It should be noted that an electrorheological fluid is a complex fluid formed by mixing dielectric particles and an insulating liquid. In the absence of an external electric field, its appearance is very similar to that of a lubricating oil for a machine, and generally consists of a base liquid, solid particles and additives. The base liquid can be formed by physically and chemically treated objects such as kerosene, mineral oil, vegetable oil, silicone oil and the like, and has the properties of good insulating property, high pressure resistance, low viscosity and good fluidity under the action of no electric field; the additive is composed of water, acid, alkali, salt and surfactant, and has the functions of enhancing the stability of suspension and electrorheological effect; the solid particle material can be made of various materials, and can be inorganic material, high polymer material and composite ER material, wherein the inorganic material comprises one of silica gel, aluminosilicate, composite metal oxide and composite metal hydroxide, and the composite ER material comprises one of the composition of different inorganic materials, the composition of different high polymer materials and the composition of the inorganic materials and the high polymer materials.
Step S630, adjusting the fluid property of the electro-rheological fluid through the energization state of the flexible conductive wire, and switching the flexible substrate between the first state and the second state.
It should be noted that the flexible substrate further includes a sealing member for sealing the opening of the groove on the side surface of the base body; the rigidity adjusting structure comprises a flexible lead arranged in the groove and electrorheological fluid accommodated in the groove, the flexible lead is electrically connected with the electrorheological fluid, and the fluid characteristics of the electrorheological fluid are adjusted through the electrified state of the flexible lead to form a first state and a second state with different rigidity.
According to the method for adjusting the rigidity of the flexible substrate, the fluid characteristics of the electrorheological fluid are adjusted through the electrifying state of the flexible lead, the first state and the second state which are different in rigidity are formed, the flexible substrate is switched between the first state and the second state, the rigidity of the flexible substrate can realize a supportable function in the first state, the rigidity of the flexible substrate can realize a portable folding function in the second state, and the problem that the flexible substrate loses the foldability after being combined with the hard substrate is solved.
In one embodiment, fig. 7 is a seventh flowchart of a method for adjusting the stiffness of a flexible substrate according to an embodiment of the present invention, and as shown in fig. 7, there is provided a method for adjusting the stiffness of a flexible substrate, including step S720, step S730 is after step S620:
step S730, adjusting the fluid characteristics of the electrorheological fluid by on-off or magnitude of the current on the flexible conductive wire, and switching the flexible substrate between the first state and the second state.
It should be further explained that the electrorheological fluid is in a fluid state under the condition of no power supply, and can generate phase change under the condition of power supply, so that the strength of the material is enhanced, and further, the overall rigidity of the flexible matrix structure is improved, and the flexible substrate has certain support rigidity.
According to the method for adjusting the rigidity of the flexible substrate, the fluid characteristics of the electrorheological fluid are adjusted through the on-off of the current on the flexible wire or the magnitude of the current on the flexible wire, a first state and a second state with different rigidity are formed, the flexible substrate is switched between the first state and the second state, the rigidity of the flexible substrate can realize a supportable function in the first state, the rigidity of the flexible substrate can realize a portable folding function in the second state, and the problem that the flexible substrate loses the foldability after being combined with the hard substrate is solved.
In one embodiment, fig. 8 is a flowchart eight of a method for adjusting the stiffness of a flexible substrate according to an embodiment of the present invention, and as shown in fig. 8, there is provided a method for adjusting the stiffness of a flexible substrate, in which a stiffness adjusting structure includes a temperature control element and a thermally-induced deformation element, and the method includes the following steps:
step S820, a temperature control element and a thermally deformable element are disposed in the groove, and the temperature control element is in thermal conductive contact with the thermally deformable element.
The stiffness adjusting structure includes a temperature control element and a thermal deformation element, the temperature control element is in thermal conduction contact with the thermal deformation element, the flexible substrate adjusts deformation of the thermal deformation element through temperature change of the temperature control element, and is switched between a first state and a second state, wherein the temperature control element is an electric heating wire, and the thermal conduction contact means that the electric heating wire is in contact with the thermal deformation element to heat the thermal deformation element and adjust deformation of the thermal deformation element.
In step S830, the deformation of the thermally deformable element is adjusted by the temperature change of the temperature control element, and the flexible substrate is switched between the first state and the second state.
According to the method for adjusting the rigidity of the flexible substrate, the deformation of the thermally-induced deformation element is adjusted through the temperature change of the temperature control element, a first state and a second state with different rigidities are formed, the flexible substrate is switched between the first state and the second state, the rigidity of the flexible substrate can realize a supportable function in the first state, the rigidity of the flexible substrate can realize a portable folding function in the second state, and the problem that the flexible substrate loses the foldability after being combined with the hard substrate is solved.
Furthermore, the first end and the second end of the thermally-induced deformation element are oppositely bent, and the first end and the second end respectively abut against two opposite side walls of the groove, so that the flexible substrate has stable performance.
Furthermore, the thermally-induced deformation elements are arranged in the same groove at equal intervals, so that the thermally-induced deformation elements are uniformly distributed in the groove, the matrix has uniform integral rigidity, and the flexible substrate has better performance.
Further, the thermally-induced deformation element is made of a shape memory material, so that the base body has uniform overall rigidity, and the flexible substrate has better performance.
Further, the shape memory material includes a shape memory polymer or a shape memory alloy, wherein the shape memory polymer has a strong shape memory property, and the shape memory polymer can generate specific shape transformation under a temperature condition. The shape memory polymer is a structure which keeps flexibility at normal temperature, can be bent and the like to deform greatly, sets a state at a certain temperature, and when the temperature reaches the set temperature, the shape of the shape memory polymer also reaches a preset shape.
The method for adjusting the rigidity of the flexible substrate is applied to the electronic paper and the flexible detection patch, the electronic paper and the flexible detection patch are switched between a first state and a second state with different rigidities through the rigidity adjusting structure, and the problem that the electronic paper and the flexible detection patch lose foldability after being combined with a hard substrate is solved.
The flexible substrate 100 provided by the invention can be applied to flexible electronic displays, Organic Light-Emitting diodes (OLEDs), printing (Radio Frequency Identification (RFID), thin-film solar panels and surface pastes for electronics (Skin Patches).
In an embodiment, fig. 9 is a schematic structural diagram of a flexible substrate according to an embodiment of the present invention, and as shown in fig. 9, there is provided a flexible substrate 100 including a base 10 and an encapsulation layer 20, which are stacked, where a material of the base 10 includes at least one of: polydimethylsiloxane PDMS, polyurethane PU and aliphatic aromatic random copolyester Ecoflex, the material of the substrate 10 is required to have good elasticity, can resist bending and folding for many times, and has certain tensile property, and the preparation method of the packaging layer 20 comprises one of the following steps: reverse mold casting and 3D printing techniques.
The end face of the substrate 10 opposite to the encapsulation layer 20 is provided with a groove 11, and the groove 11 penetrates through at least one side face of the substrate 10, wherein the preparation method of the groove 11 comprises one of the following steps: a reverse mold process, a photolithography process, and a 3D printing technique.
The groove 11 is provided with a stiffness adjusting structure 12 therein, and the flexible substrate 100 is formed into a first state and a second state by the stiffness adjusting structure 12, wherein the stiffness of the flexible substrate 100 in the first state is greater than the stiffness in the second state, and the flexible substrate 100 has a supportable stiffness in the first state and a foldable stiffness in the second state.
Through the flexible substrate 100, the groove 11 is formed in the base body 10, the rigidity adjusting structure 12 is arranged in the groove 11, the flexible substrate 100 forms a first state and a second state with different rigidities through the rigidity adjusting structure 12, switching of the flexible substrate 100 between the first state and the second state is achieved, the rigidity of the flexible substrate 100 can achieve a supportable function in the first state, the rigidity of the flexible substrate 100 can achieve a portable folding function in the second state, and the problem that the flexible substrate 100 loses foldability after being combined with a hard substrate is solved.
In one embodiment, fig. 10 is a schematic structural diagram of a flexible substrate according to an embodiment of the present invention, as shown in fig. 10, the stiffness adjusting structure 12 includes a filling medium (not shown), and the flexible substrate 100 further includes a sealing member (not shown) for sealing the opening 14 of the groove 11 on the side surface of the base body 10; in the first state, the filling medium is filled into the groove 11; in a second state, the filling medium is drawn out of the recess 11, wherein the material of the base body 10 comprises at least one of the following: polydimethylsiloxane PDMS, polyurethane PU and aliphatic aromatic random copolyester Ecoflex, the material of the matrix 10 is required to have good elasticity, can resist bending and folding for many times, and has certain tensile property.
It should be further noted that the substrate 10 may be prepared by using a mold for preparing the substrate 10, and placing the TPU: the mixed solution of PDMS 1:10 was stirred uniformly, introduced into a mold, heated on a heating table at 100 degrees for 1 hour, and the structure was cured and removed, and the preparation method of the substrate 10 was not exclusive, but the preparation of the substrate 10 may be carried out by other methods, for example, by mixing TPU: the PDMS-1: 10 mixed solution was stirred uniformly, introduced into a mold, heated on a heating table at 150 ℃ for 2h, and the structure was cured and removed.
Preparation of the encapsulation layer 20 the TPU: the mixed solution of PDMS 1:10 was stirred uniformly, introduced into a mold, heated on a heating table at 100 ℃ for 1 hour, and the structure was cured and removed, and the preparation method of the encapsulating layer 20 was not exclusive, and the preparation of the encapsulating layer 20 may be carried out by other methods, for example, by mixing TPU: the PDMS mixed solution is uniformly stirred, introduced into a mold, heated on a heating table for 2 hours at a certain temperature, and the structure is solidified and then taken down.
The base body 10 and the packaging layer 20 can be arranged in a stacked manner by flatly laying the base body 10 on an operation table, brushing a mixed solution of TPU and PDMS on the upper surface of the base body 10, wherein the brushing thickness ensures uniformity, laying the packaging layer 20 on the base body 10, and placing the base body on a heating table for half an hour, so that the structure can be cured. Air is introduced into the groove 11 through the opening 14 to fill the groove 11 on the substrate 10, but the PDMS material is preferably not deformed, and the opening 14 is sealed with a sealing member after the air is injected. The overall structure is now unfolded and has a certain supporting stiffness.
Through the flexible substrate 100, the flexible substrate 100 further comprises a sealing member for sealing the opening 14 of the groove 11 on the side surface of the base body 10, the flexible substrate 100 is switched between a first state and a second state by controlling whether the filling medium is filled into the groove 11 or not, and the rigidity of the flexible substrate 100 can realize a supportable function; in the second state, the filling medium is drawn out of the groove 11, the rigidity of the flexible substrate 100 can realize the portable folding function, and the problem that the flexible substrate 100 loses the foldability after being combined with a hard substrate is solved.
Further, the filling medium is gas or liquid, wherein, when the filling medium is gas, air is introduced into the groove 11 through the opening 14 to fill the groove 11 on the base body 10 with air, but preferably, the material of the base body 10 is not deformed, and the opening 14 is sealed by a sealing member after the air is injected, so that the flexible substrate 100 has a certain supporting rigidity.
In one embodiment, fig. 10 is a schematic structural diagram of a flexible substrate according to an embodiment of the present invention, as shown in fig. 10, the flexible substrate 100 further includes a sealing member (not shown) for sealing the opening 14 of the groove 11 on the side surface of the base body 10, the stiffness adjusting structure 12 includes a magnetorheological fluid (not shown) accommodated in the groove 11, and the flexible substrate 100 adjusts a fluid property of the magnetorheological fluid by a control effect of an external magnetic field on the magnetorheological fluid and is switched between the first state and the second state.
Through the flexible substrate 100, the flexible substrate 100 further comprises a sealing element, the sealing element is used for sealing the opening 14 of the groove 11 on the side surface of the base body 10, the rigidity adjusting structure 12 comprises magnetorheological fluid contained in the groove 11, the fluid characteristics of the magnetorheological fluid are adjusted through the control effect of an external magnetic field on the magnetorheological fluid, a first state and a second state with different rigidity are formed, the flexible substrate 100 is switched between the first state and the second state, in the first state, the rigidity of the flexible substrate 100 can achieve a supportable function, in the second state, the rigidity of the flexible substrate 100 can achieve a portable folding function, and the problem that the flexible substrate 100 loses foldability after being combined with a hard substrate is solved.
Further, the flexible substrate 100 adjusts the fluid characteristics of the magnetorheological fluid by the presence or absence of the external magnetic field, and switches between the first state and the second state; alternatively, the first and second electrodes may be,
the flexible substrate 100 adjusts the fluid properties of the magnetorheological fluid and switches between the first state and the second state by varying the magnitude of the external magnetic field.
Through the flexible substrate 100, the flexible substrate 100 further includes a sealing member, the sealing member is used for sealing the opening 14 of the groove 11 on the side surface of the base 10, the rigidity adjusting structure 12 includes magnetorheological fluid accommodated in the groove 11, and the fluid characteristics of the magnetorheological fluid are adjusted through the presence or absence of an external magnetic field or the difference in magnitude of the external magnetic field to form a first state and a second state with different rigidities, so that the flexible substrate 100 is switched between the first state and the second state, in the first state, the rigidity of the flexible substrate 100 can realize a supportable function, in the second state, the rigidity of the flexible substrate 100 can realize a portable folding function, and the problem that the flexible substrate 100 loses the foldability after being combined with a hard substrate is solved.
In one embodiment, fig. 11 is a schematic structural diagram three of a flexible substrate according to an embodiment of the present invention, and as shown in fig. 11, the flexible substrate 100 further includes a sealing member (not shown) for sealing the opening 14 of the groove 11 on the side of the base body 10; the stiffness adjusting structure 12 includes a flexible conductive wire 121 disposed in the groove 11 and an electro-rheological fluid (not shown) accommodated in the groove 11, and the flexible conductive wire 121 is electrically connected to the electro-rheological fluid.
The flexible substrate 100 adjusts the fluid characteristics of the electro-rheological fluid by the energized state of the flexible conductive wires 121 and switches between the first state and the second state.
It should be noted that an electrorheological fluid is a complex fluid formed by mixing dielectric particles and an insulating liquid. In the absence of an external electric field, its appearance is very similar to that of a lubricating oil for a machine, and generally consists of a base liquid, solid particles and additives. The base liquid can be formed by physically and chemically treated objects such as kerosene, mineral oil, vegetable oil, silicone oil and the like, and has the properties of good insulating property, high pressure resistance, low viscosity and good fluidity under the action of no electric field; the additive is composed of water, acid, alkali, salt and surfactant, and has the functions of enhancing the stability of suspension and electrorheological effect; the solid particle material can be made of various materials, and can be inorganic material, high polymer material and composite ER material, wherein the inorganic material comprises one of silica gel, aluminosilicate, composite metal oxide and composite metal hydroxide, and the composite ER material comprises one of the composition of different inorganic materials, the composition of different high polymer materials and the composition of the inorganic materials and the high polymer materials.
With the above-described flexible substrate 100, the flexible substrate 100 further includes a sealing member for sealing the opening 14 of the groove 11 on the side of the base body 10; the rigidity adjusting structure 12 comprises a flexible lead 121 arranged in the groove 11 and electrorheological fluid accommodated in the groove 11, the flexible lead 121 is electrically connected with the electrorheological fluid, the fluid characteristics of the electrorheological fluid are adjusted through the electrified state of the flexible lead 121 to form a first state and a second state with different rigidities, so that the flexible substrate 100 is switched between the first state and the second state, the rigidity of the flexible substrate 100 can realize a supportable function in the first state, the rigidity of the flexible substrate 100 can realize a portable folding function in the second state, and the problem that the flexible substrate 100 loses the foldability after being combined with a hard substrate is solved.
Further, the flexible substrate 100 adjusts the fluid property of the electro-rheological fluid by switching on and off the current on the flexible lead 121, and switches between the first state and the second state; alternatively, the first and second electrodes may be,
the flexible substrate 100 adjusts the fluid property of the electrorheological fluid by the magnitude of the current on the flexible lead 121, and switches between a first state and a second state, it needs to be further explained that the electrorheological fluid is in a fluid state under the condition of no power supply, and under the condition of power supply, the electrorheological fluid can undergo phase change, the strength of the material is enhanced, and further the overall rigidity of the flexible matrix 10 structure is improved, so that the flexible substrate 100 has a certain supporting rigidity.
According to the flexible substrate 100, the fluid characteristics of the electrorheological fluid are adjusted through the on-off of the current on the flexible lead 121 or the magnitude of the current on the flexible lead 121, a first state and a second state with different rigidity are formed, the flexible substrate 100 is switched between the first state and the second state, the rigidity of the flexible substrate 100 can realize a supportable function in the first state, the rigidity of the flexible substrate 100 can realize a portable folding function in the second state, and the problem that the flexible substrate 100 loses the foldability after being combined with a hard substrate is solved.
Further, the flexible conductive line 121 of the flexible substrate 100 is a wavy flexible conductive line 121, so that the flexible conductive line 121 does not affect the bending characteristics of the substrate 10.
In an embodiment, fig. 12 is a schematic structural diagram of a flexible substrate according to an embodiment of the present invention, as shown in fig. 12, the stiffness adjusting structure 12 includes a temperature control element 122 and a thermally-induced deformation element 123, the temperature control element 122 is in thermal contact with the thermally-induced deformation element 123, and the flexible substrate 100 adjusts deformation of the thermally-induced deformation element 123 through temperature change of the temperature control element 122 and switches between a first state and a second state, where the temperature control element 122 is a heating wire, and the thermal contact means that the heating wire is in contact with the thermally-induced deformation element 123 to heat the thermally-induced deformation element 123 to adjust deformation of the thermally-induced deformation element 123.
According to the flexible substrate 100, the deformation of the thermal deformation element 123 is adjusted through the temperature change of the temperature control element 122, a first state and a second state with different rigidities are formed, the flexible substrate 100 is switched between the first state and the second state, the rigidity of the flexible substrate 100 can realize a supportable function in the first state, and the rigidity of the flexible substrate 100 can realize a portable folding function in the second state, so that the problem that the flexible substrate 100 loses the foldability after being combined with a hard substrate is solved.
Further, the thermally-induced deformation element 123 has a first end and a second end bent relatively, and the first end and the second end respectively abut against two opposite sidewalls of the groove 11.
In the flexible substrate 100, the first end and the second end of the thermally-induced deformation element 123 are bent relatively, and the first end and the second end respectively abut against two opposite side walls of the groove 11, so that the thermally-induced deformation element 123 is fixed in the groove 11, and the flexible substrate 100 has stable performance.
Further, the thermally-induced deformation elements 123 are arranged in the same groove 11 at equal intervals, so that the thermally-induced deformation elements 123 are uniformly distributed in the groove 11, the base 10 has uniform overall rigidity, and the flexible substrate 100 has better performance.
Further, fig. 13 is a schematic structural diagram of a flexible substrate according to an embodiment of the present invention, as shown in fig. 13, the number of the grooves 11 is multiple, and the multiple grooves 11 are arranged in a staggered manner in a horizontal and vertical direction and are communicated with each other to form a grid;
alternatively, fig. 14 is a schematic structural diagram six of the flexible substrate according to the embodiment of the invention, as shown in fig. 14, the number of the grooves 11 is at least two, and the two grooves 11 are alternately arranged and communicated with each other, so that stable performance of the flexible substrate 100 is realized.
Further, the thermally-induced deformation element 123 is made of a shape memory material, so that the base body 10 has uniform overall rigidity, resulting in more excellent performance of the flexible substrate 100.
Further, the shape memory material includes a shape memory polymer or a shape memory alloy, wherein the shape memory polymer has a strong shape memory property, and the shape memory polymer can generate specific shape transformation under a temperature condition. The shape memory polymer is a structure which keeps flexibility at normal temperature, can be bent and the like to deform greatly, sets a state at a certain temperature, and when the temperature reaches the set temperature, the shape of the shape memory polymer also reaches a preset shape.
The invention also provides a flexible electronic device comprising a flexible substrate, the flexible substrate being any of the above
The flexible substrate in one embodiment comprises a base body and an encapsulation layer which are arranged in a stacked mode, wherein a groove is formed in the end face, opposite to the encapsulation layer, of the base body, and penetrates through at least one side face of the base body; a rigidity adjusting structure is arranged in the groove, the flexible electronic device is switched between a first state and a second state through the rigidity adjusting structure, and the problem that the flexible electronic device loses foldability after being combined with the hard substrate is solved.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (19)

1. A method for adjusting the rigidity of a flexible substrate is applied to the flexible substrate, and the flexible substrate comprises a base body and an encapsulation layer which are arranged in a stacked mode; the method for adjusting the rigidity of the flexible substrate is characterized by comprising the following steps:
forming a groove on the end face of the substrate opposite to the packaging layer, and enabling the groove to penetrate through at least one side face of the substrate;
and arranging a rigidity adjusting structure in the groove so that the flexible substrate forms a first state and a second state with different rigidities through the rigidity adjusting structure, wherein the rigidity of the flexible substrate in the first state is greater than that in the second state.
2. The method of claim 1, wherein the flexible substrate further comprises a seal, the stiffness adjusting structure comprises a filler medium, and the step of disposing the stiffness adjusting structure within the groove comprises:
and filling the filling medium in the groove and sealing the opening of the groove on the side face of the base body through the sealing element so as to enable the flexible substrate to form the first state.
3. The method of claim 1, wherein the flexible substrate further comprises a seal, the stiffness adjusting structure comprises a filler medium, and the step of disposing the stiffness adjusting structure within the groove comprises:
and removing the filling medium in the groove and enabling the flexible substrate to form the second state.
4. The method of claim 1, wherein the flexible substrate further comprises a seal, the stiffness adjusting structure comprises a magnetorheological fluid received in the groove, and the step of providing the stiffness adjusting structure in the groove comprises:
filling the magnetorheological fluid in the groove, and sealing the opening of the groove on the side surface of the base body through the sealing element;
adjusting fluid properties of the magnetorheological fluid with an external magnetic field and switching the flexible substrate between the first state and the second state.
5. The method of claim 4, wherein the step of adjusting the fluid properties of the magnetorheological fluid by an external magnetic field and switching the flexible substrate between the first state and the second state comprises:
adjusting fluid properties of the magnetorheological fluid by the presence or absence of an external magnetic field or a change in strength, and switching the flexible substrate between the first state and the second state.
6. The method of claim 1, wherein the flexible substrate further comprises a sealing member, the stiffness adjusting structure comprises a flexible conductive wire and an electro-rheological fluid, and the step of disposing the stiffness adjusting structure in the groove comprises:
filling the electrorheological fluid in the groove, arranging a flexible lead electrically connected with the electrorheological fluid in the groove, and sealing the opening of the groove on the side surface of the base body through the sealing element;
adjusting a fluid property of the electro-rheological fluid by the energized state of the flexible conductive wire and causing the flexible substrate to switch between the first state and the second state.
7. The method of claim 6, wherein the step of adjusting the fluid property of the electro-rheological fluid by the energized state of the flexible conductive wire and switching the flexible substrate between the first state and the second state comprises:
and adjusting the fluid property of the electro-rheological fluid through the on-off or the current magnitude of the current on the flexible lead, and switching the flexible substrate between the first state and the second state.
8. The method of claim 1, wherein the stiffness adjusting structure comprises a temperature control element and a thermally-induced deformation element, and the step of disposing the stiffness adjusting structure within the groove comprises:
arranging the temperature control element and the thermally-induced deformation element in the groove, and enabling the temperature control element and the thermally-induced deformation element to be in heat conduction contact;
and adjusting the deformation of the thermally-induced deformation element through the temperature change of the temperature control element, and switching the flexible substrate between the first state and the second state.
9. The application of the method for adjusting the rigidity of the flexible substrate is characterized in that the method for adjusting the rigidity of the flexible substrate according to any one of claims 1 to 8 is applied to electronic paper and flexible detection patches.
10. The flexible substrate is characterized by comprising a base body and a packaging layer which are stacked, wherein a groove is formed in the end face of the base body opposite to the packaging layer, and penetrates through at least one side face of the base body; a rigidity adjusting structure is arranged in the groove, the flexible substrate forms a first state and a second state with different rigidities through the rigidity adjusting structure, and the rigidity of the flexible substrate in the first state is larger than that in the second state.
11. The flexible substrate of claim 10, wherein the stiffness modifying structure comprises a filler medium, the flexible substrate further comprising a seal for sealing an opening of the groove on the base side; in the first state, the filling medium is filled into the groove; in the second state, the filling medium is drawn out of the groove.
12. The flexible substrate of claim 10, further comprising a seal for sealing an opening of the groove on the base side; the rigidity adjusting structure comprises magnetorheological fluid contained in the groove;
the flexible substrate adjusts the fluid characteristics of the magnetorheological fluid through the control action of the external magnetic field on the magnetorheological fluid and switches between the first state and the second state.
13. The flexible substrate of claim 12, wherein the flexible substrate is adapted to adjust a fluid property of the magnetorheological fluid by the presence or absence of an external magnetic field and to switch between the first state and the second state; alternatively, the first and second electrodes may be,
the flexible substrate adjusts the fluid characteristics of the magnetorheological fluid through different magnitudes of the external magnetic field and is switched between the first state and the second state.
14. The flexible substrate of claim 10, further comprising a seal for sealing an opening of the groove on the base side; the rigidity adjusting structure comprises a flexible lead arranged in the groove and electrorheological fluid accommodated in the groove, and the flexible lead is electrically connected with the electrorheological fluid;
the flexible substrate adjusts the fluid characteristics of the electro-rheological fluid through the energized state of the flexible lead and switches between the first state and the second state.
15. The flexible substrate of claim 14, wherein the flexible substrate adjusts a fluidic characteristic of the electrorheological fluid by switching an electrical current on the flexible wire and switches between the first state and the second state; alternatively, the first and second electrodes may be,
the flexible substrate adjusts the fluid property of the electro-rheological fluid by the magnitude of the current on the flexible lead and switches between the first state and the second state.
16. The flexible substrate of claim 10, wherein the stiffness-adjusting structure comprises a temperature-controlling element and a thermally-induced deformation element, the temperature-controlling element in thermally-conductive contact with the thermally-induced deformation element; the flexible substrate adjusts the deformation of the thermal deformation element through the temperature change of the temperature control element and is switched between the first state and the second state.
17. The flexible substrate of claim 16, wherein the thermally-induced deformation element has a first end and a second end bent relative to each other, and the first end and the second end respectively abut against two opposite sidewalls of the groove.
18. The flexible substrate according to claim 10, wherein the number of the grooves is plural, and the plural grooves are arranged in a staggered manner and are communicated with each other in a grid shape;
or the number of the grooves is at least two, and the two grooves are arranged in a staggered mode and are communicated with each other.
19. A flexible electronic device comprising a flexible substrate, characterized in that the flexible substrate is a flexible substrate according to any one of claims 10 to 18.
CN201911425253.2A 2019-12-31 2019-12-31 Flexible substrate, flexible electronic device, and method for adjusting rigidity of flexible substrate and application Pending CN111169104A (en)

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