CN111167724A - Flat BGA tin ball roundness screening device - Google Patents
Flat BGA tin ball roundness screening device Download PDFInfo
- Publication number
- CN111167724A CN111167724A CN202010141798.7A CN202010141798A CN111167724A CN 111167724 A CN111167724 A CN 111167724A CN 202010141798 A CN202010141798 A CN 202010141798A CN 111167724 A CN111167724 A CN 111167724A
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- Prior art keywords
- sieve plate
- plate
- sieve
- screening
- blanking
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- 238000012216 screening Methods 0.000 title claims abstract description 64
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 229910000679 solder Inorganic materials 0.000 claims abstract description 60
- 230000007246 mechanism Effects 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 26
- 230000002950 deficient Effects 0.000 claims abstract description 15
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000007873 sieving Methods 0.000 claims 1
- 238000005096 rolling process Methods 0.000 abstract description 7
- 238000012797 qualification Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
- B07B13/00—Grading or sorting solid materials by dry methods, not otherwise provided for; Sorting articles otherwise than by indirectly controlled devices
- B07B13/10—Grading or sorting solid materials by dry methods, not otherwise provided for; Sorting articles otherwise than by indirectly controlled devices using momentum effects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
- B07B13/00—Grading or sorting solid materials by dry methods, not otherwise provided for; Sorting articles otherwise than by indirectly controlled devices
- B07B13/14—Details or accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
- B07B13/00—Grading or sorting solid materials by dry methods, not otherwise provided for; Sorting articles otherwise than by indirectly controlled devices
- B07B13/14—Details or accessories
- B07B13/16—Feed or discharge arrangements
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a flat-plate BGA solder ball roundness screening device which comprises a blanking mechanism, a sieve plate, a material receiving plate, a finished product container and a defective product container, wherein the blanking mechanism is arranged on a blanking bracket; the sieve plates are sequentially arranged on the screening bracket between the blanking mechanism and the finished product container in an inclined manner, and the inclination of each sieve plate can be adjusted through the angle adjusting mechanism; among a plurality of sieves, first order sieve with unloading mechanism links up, the least significant end of last level sieve with the finished product container links up, and the least significant end of higher level sieve is higher than the highest point of subordinate's sieve, and leaves the screening interval between two adjacent sieves, and the not up to standard tin ball of circularity is when rolling to next level sieve, and speed is not enough to cross the screening interval, falls to the receipts flitch that the below slope set up from the screening interval on, receives flitch least significant end and substandard product container link up. The invention can improve the screening efficiency of the BGA solder balls and the qualification rate of the BGA solder balls, and the roundness screening device has wider application range.
Description
Technical Field
The invention belongs to the field of BGA solder ball screening, and particularly relates to a flat plate type BGA solder ball roundness screening device.
Background
The BGA solder ball is one of the main packaging materials used in BGA/CSP process. The main indexes of the BGA solder balls comprise ball diameter, tolerance control, roundness, oxidation resistance and the like, and roundness screening is a main process of the true sphericity of the BGA solder balls. However, the existing tin ball screening process generally has the problems of low screening efficiency, low screening precision and the like. Therefore, there is a need for improvement of the prior art to achieve the goal of improving the screening efficiency.
Disclosure of Invention
The invention aims to provide a flat-plate type BGA solder ball roundness screening device, which is used for improving the screening efficiency of the BGA solder balls and the qualification rate of the BGA solder balls and enabling the roundness screening device to be wider in application range.
In order to achieve the purpose, the invention adopts the technical scheme that: a flat plate type BGA solder ball roundness screening device comprises a blanking mechanism, a sieve plate, a material receiving plate, a finished product container and a defective product container, wherein the blanking mechanism is arranged on a blanking bracket, and the sieve plate is arranged on a screening bracket; the sieve plates are arranged on the screening support between the blanking mechanism and the finished product container in a sequentially downward inclined mode, and the inclination of each sieve plate can be adjusted through the angle adjusting mechanism; among the plurality of sieve plates, a first-stage sieve plate is connected with the blanking mechanism, the lowest end of the last-stage sieve plate is connected with the finished product container, the lowest end of a higher-stage sieve plate is higher than the highest end of a lower-stage sieve plate, a screening interval is reserved between every two adjacent sieve plates, when a solder ball with unqualified roundness rolls to the next-stage sieve plate, the speed is not enough to exceed the screening interval, the solder ball falls onto a material receiving plate which is obliquely arranged below the material receiving plate from the screening interval, and the lowest end of the material receiving plate is connected with a defective product container; the length and the width of the first stage sieve plate are both larger than those of other sieve plates at all stages; the length and the width of the upper stage are both larger than those of the lower stage sieve plates, and the central lines of the sieve plates in the length direction of each stage correspond to each other up and down.
The sieve plate is arranged into three stages, namely a first-stage sieve plate, a second-stage sieve plate and a third-stage sieve plate.
The width of the primary sieve plate is 30-40 cm, the length of the primary sieve plate is 40-70 cm, and the inclination adjustment range is 20-40 degrees; the width of the secondary sieve plate is 20-30 cm, the length of the secondary sieve plate is 30-40 cm, and the inclination adjustment range is 10-20 degrees; the width of the third-stage sieve plate is 10-20 cm, the length of the third-stage sieve plate is 30-40 cm, and the inclination adjusting range is 20-30 degrees.
The screening support have many pairs of standpipe and many pairs of violently pipes, every two pairs of standpipes correspond an installation sieve.
The angle adjusting mechanism comprises a sliding block and a fastening piece, the sliding block slides up and down along the vertical through groove of the vertical pipe, the position of the sliding block is fixed by the fastening piece, and the sliding block is used for supporting two ends of the supporting shaft of the sieve plate and is connected to the sliding block in a rotating mode.
The supporting shaft is provided with a supporting plane for supporting the sieve plate, and two ends of the supporting shaft are provided with cylindrical heads and are placed in the sliding block grooves of the sliding blocks.
And a threaded shaft is arranged on the sliding block and is used for penetrating through the vertical through groove and then being connected with the fastener.
The blanking mechanism comprises a blanking hopper, the blanking hopper is fixed on the blanking support, a flow control valve and a blanking hose are arranged at the bottom of the blanking hopper, and the lower opening of the blanking hose abuts against the highest end of the first-stage sieve plate.
The blanking hose is an anti-static hose.
The material receiving plate covers the whole bottom surface of the screening support, the inclined direction of the material receiving plate is opposite to that of the screen plate, the lower end of the material receiving plate is provided with a conical flow groove, and the conical flow groove is connected with the defective product container.
Compared with the prior art, the invention has the following beneficial effects: the tin balls can be screened step by adopting the multi-stage sieve plates, the length, the width and the inclination of each stage of sieve plates are different, the first stage sieve plate mainly has the function of improving the rolling speed of the tin balls, when the roundness of the tin balls is not enough, the rolling track can be deviated to two sides, the integral speed is lower, and the tin balls cannot fall on the second stage sieve plate, so that the tin balls can fall on a recovery plate below through the screening interval between the first stage sieve plate and the second stage sieve plate and enter a waste container, and the tin balls with the worst roundness can be screened out firstly; the second-stage sieve plate has smaller inclination, can properly reduce the speed of the solder balls and prolong the rolling time of the solder balls on the sieve plate, thereby screening the solder balls with small difference between the roundness and the standard roundness; the inclination of the third-stage sieve plate is larger than that of the second-stage sieve plate, so that the screened solder balls can quickly roll into a finished product container, and the solder balls are prevented from being piled on the sieve plate. Therefore, the invention can fully screen the solder balls with different circularities in the process of passing the solder balls once, and avoids screening again, thereby improving the screening efficiency and accuracy.
The length and the width of the upper-level sieve plate are larger than those of the lower-level sieve plates, and the center lines of each level of sieve plates in the length direction vertically correspond to each other, so that two ends of each lower-level sieve plate in the length direction are shorter than those of the upper-level sieve plates by one section. If individual solder balls with slightly poor roundness roll downwards along two ends of the length of the upper-level sieve plate, when the rolling speed can just exceed the screening interval and fall on the lower-level sieve plate, the solder balls cannot fall on the end part of the lower-level sieve plate because the length of the lower-level sieve plate is shorter than that of the upper-level sieve plate, and the unqualified solder balls are prevented from being mixed into finished solder balls.
The inclination angles of the sieve plates at all levels can be adjusted, so that the sieve plates can be adjusted according to actual requirements to meet different requirements, and the screening efficiency and the accuracy are improved.
The inclination direction of the material collecting plate is opposite to that of the sieve plate, so that the screened defective products can be quickly collected reversely, and the defective products are prevented from being mixed with the qualified products.
Drawings
FIG. 1 is a front view of a screening apparatus according to the present invention;
FIG. 2 is a top view of the screening apparatus of the present invention;
FIG. 3 is a schematic structural diagram of a slider in the angle adjustment mechanism of the present invention;
fig. 4 is a schematic structural view of a support shaft for supporting a screen plate according to the present invention;
the labels in the figure are: 1-1 parts of vertical rods, 1-2 parts of transverse rods, 2-1 parts of blanking hoppers, 2-2 parts of flow control valves, 2-3 parts of blanking hoses, 3-1 parts of first-stage sieve plates, 3-2 parts of second-stage sieve plates, 3-3 parts of third-stage sieve plates, 4-1 parts of vertical pipes, 4-2 parts of transverse pipes, 4-3 parts of fixing nuts, 4-4 parts of sliding blocks, 4-4-1 parts of sliding block grooves, 4-4-2 parts of threaded shafts, 4-5 parts of supporting shafts, 4-5-1 parts of cylindrical heads, 4-5-2 parts of supporting planes, 5 parts of material receiving plates, 6-1 parts of finished product containers, 6-2 parts of supporting seats, 7 parts of defective product containers, 8-1 parts of first intervals, 8-2 parts of second intervals.
Detailed Description
The present invention will be described in further detail with reference to the following drawings and examples, but the invention is not limited thereto.
Referring to the attached drawings, the flat plate type BGA solder ball roundness screening device comprises a blanking mechanism, a screen plate, a material receiving plate 5, a finished product container 6-1 and a defective product container 7, wherein the blanking mechanism is installed on a blanking support, and the screen plate is installed on a screening support.
The blanking support is formed by welding stainless steel round steel and comprises a vertical rod 1-1 and a horizontal rod 1-2, the blanking mechanism comprises a blanking hopper 2-1 fixed on the horizontal rod 1-2, a flow control valve 2-2 and a blanking hose 2-3 which are commercially available and used for powder are arranged at the bottom of the blanking hopper 2-1, the flow control valve 2-2 is used for controlling the flow speed of the BGA solder balls, and the blanking hose 2-3 adopts a commercially available anti-static hose, so that the generation of static electricity during the falling of the BGA solder balls is reduced.
The screening support is a frame structure shown in figure 1 and formed by welding six pairs of vertical pipes 4-1 and three pairs of transverse pipes 4-2, the periphery of the frame structure is sealed by stainless steel plates, the transverse pipes 4-2 are used for enhancing the stability of the screening support, and the vertical pipes 4-1 are used for installing a screen plate for screening BGA solder balls.
And respectively placing a finished product container 6-1 and a defective product container 7 on two opposite sides of the screening bracket, wherein the defective product container 7 and the blanking hopper 2-1 are positioned on the same side of the screening bracket, the finished product container 6-1 is arranged on the other side of the screening bracket, and the finished product container 6-1 can be placed on the support 6-2 as required.
A first-stage sieve plate 3-1, a second-stage sieve plate 3-2 and a third-stage sieve plate 3-3 are sequentially arranged from a discharging hopper 2-1 to a finished product container 6-1, all the sieve plates are arranged in a downward inclined mode, all the sieve plates are rectangular and fixed on two adjacent vertical pipes 4-1 through angle adjusting mechanisms, but the adjacent sieve plates do not share the vertical pipes 4-1. In the three arranged sieve plates, the length and the width of an upper sieve plate are both larger than or equal to those of a lower sieve plate, the central lines of the sieve plates in each stage in the length direction vertically correspond to each other, a screening interval is reserved between the adjacent sieve plates, screened inferior solder balls fall on a material receiving plate 5 arranged below through the screening interval, a first interval 8-1 is arranged between the first-stage sieve plate 3-1 and the second-stage sieve plate 3-2, and a second interval 8-2 is arranged between the second-stage sieve plate 3-2 and the third-stage sieve plate 3-2. The higher end of the first-stage sieve plate 3-1 is contacted with the lower opening of the blanking hose on the blanking hopper 2-1, the lower end is higher than the higher end of the second-stage sieve plate 3-2, the lower end of the second-stage sieve plate 3-2 is higher than the higher end of the third-stage sieve plate 3-3, the lower end of the third-stage sieve plate 3-3 is connected with the finished product container 6-1, and the BGA solder balls with qualified roundness and falling from the third-stage sieve plate 3-3 are received.
Preferably, the width of the primary sieve plate 3-1 is 30-40 cm, the length is 40-70 cm, and the inclination adjustment range is 20-40 degrees; the width of the secondary sieve plate 3-2 is 20-30 cm, the length is 30-40 cm, and the inclination adjustment range is 10-20 degrees; the width of the third-stage sieve plate 3-3 is 10-20 cm, the length is 30-40 cm, and the inclination adjusting range is 20-30 degrees.
Because the primary sieve plate 3-1 mainly aims at improving the speed of the BGA solder balls, the solder balls with qualified roundness can cross the first interval 8-1 and fall on the secondary sieve plate 3-2, and therefore, the primary sieve plate has larger width and inclination. And for the BGA solder balls with the worst roundness, compared with the solder balls with qualified roundness, the rolling track can be deflected transversely when the BGA solder balls roll, the larger the width of the first-stage sieve plate 3-1 is, the longer the transverse offset distance of the solder balls is, the smaller the speed is, and the solder balls are difficult to cross the first interval 8-1 between the first-stage sieve plate 3-2 and the second-stage sieve plate 3-2, so that the solder balls fall on the lower material collecting plate 5 to be recovered. For the tin balls with slightly poor roundness, the tin balls can still cross the first interval 8-1 and fall on the second-stage sieve plate 3-2 after being accelerated by the first-stage sieve plate 3-1, at the moment, the inclination of the second-stage sieve plate 3-2 is smaller, can properly reduce the speed of the solder balls and prolong the rolling time of the solder balls on the sieve plate, so that the solder balls with poor roundness have larger transverse deviation along with the time, the speed when leaving the second-level sieve plate 3-2 is obviously lower than that of the qualified solder balls, so that qualified solder balls can be flushed onto the third-level sieve plate 3-3, and solder balls with slightly poor roundness fall onto the material receiving plate 5 below from the second interval 8-2 between the second-level sieve plate 3-2 and the third-level sieve plate 3-3 due to insufficient speed, therefore, the tin balls with slightly poor roundness can be screened out, the tin balls are prevented from being mixed in a finished product container, and the roundness screening accuracy is improved. The inclination of the third-level sieve plate 3-3 is larger than that of the second-level sieve plate 3-2, so that the screened solder balls can quickly roll into the finished product container 6-1, and the solder balls are prevented from piling on the sieve plate and scattering from the side face of the sieve plate.
Each stage of sieve plate is subjected to inclination adjustment by a corresponding angle adjusting mechanism. The angle adjusting mechanism comprises a sliding block 4-4 and a fastening piece, the sliding block 4-4 slides up and down along the vertical through groove of the vertical pipe 4-1, the position of the sliding block 4-4 is fixed by the fastening piece, and two ends of a supporting shaft 4-5 for supporting the sieve plate are rotatably connected to the sliding block 4-4. The supporting shaft 4-5 is a square tube with two ends provided with cylindrical heads 4-5-1, one plane of the square tube is used as a supporting plane 4-5-2 for supporting the sieve plate, the cylindrical heads 4-5-1 are placed in the slider grooves 4-4-1 of the slider 4-4, and the slider grooves 4-4-1 are U-shaped blind grooves. The sliding block 4-4 is further provided with a threaded shaft 4-4-2, and the threaded shaft 4-4-2 is used for penetrating through the vertical through groove and then being connected with a fixing nut 4-3 serving as a fastening piece. When the inclination of the sieve plate needs to be adjusted, the sliding blocks 4-4 corresponding to the sieve plate slide up and down until reaching the required position, and then the fixing nuts 4-3 are locked and fixed. In order to adjust the angle quickly, a scale value is further arranged on one side of the vertical through groove, so that the sliding block 4-3 can move quickly and can be positioned accurately.
The material receiving plate 5 is made of a stainless steel plate, the area of the material receiving plate needs to cover the whole bottom surface of the screening support and is fixedly connected with the screening support and the blanking support, and the inclination direction of the material receiving plate 5 is opposite to that of the sieve plate. The lower end of the material receiving plate 5 is provided with a conical chute, and the front end of the conical chute is provided with a defective container 7.
The defective container 6-1 and the finished product container 7 are commercially available plastic baskets, and the height of the defective container 7 is lower than the bottom edge of the tapered runner on the material receiving plate 5 so as to receive unqualified solder balls rolled down along the material receiving plate 5, so that the solder balls can be collected and processed again, and the purpose of saving materials is achieved. The height of the finished product container 6-1 is lower than the bottom edge of the lower end of the third-stage sieve plate 3-3, and the finished product container 6-1 can be placed on a support 6-2 according to requirements.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.
Claims (10)
1. The utility model provides a flat BGA tin ball circularity sieving mechanism, includes unloading mechanism, sieve, receipts flitch (5), finished product container (6-1) and substandard product container (7), unloading mechanism installs on the unloading support, the sieve is installed on the screening support, its characterized in that: the sieve plates are arranged on the screening support which is arranged between the blanking mechanism and the finished product container (6-1) in a downward inclined mode in sequence, and the inclination of each sieve plate can be adjusted through the angle adjusting mechanism; in the sieve plates, a first-stage sieve plate is connected with the blanking mechanism, the lowest end of the last-stage sieve plate is connected with the finished product container (6-1), the lowest end of a higher-stage sieve plate is higher than the highest end of a lower-stage sieve plate, a screening interval is reserved between every two adjacent sieve plates, when a solder ball with unqualified roundness rolls to the next-stage sieve plate, the speed is not enough to exceed the screening interval, the solder ball falls onto a material receiving plate (5) obliquely arranged below from the screening interval, and the lowest end of the material receiving plate (5) is connected with a defective product container (7); the length and the width of the upper-level sieve plate are both larger than those of the lower-level sieve plate, and the central lines of the sieve plates in the length direction of each level correspond to each other up and down.
2. The flat plate type BGA solder ball roundness screening device of claim 1, wherein: the sieve plates are arranged into three stages, namely a first-stage sieve plate (3-1), a second-stage sieve plate (3-2) and a third-stage sieve plate (3-3) in sequence.
3. The flat BGA solder ball roundness screening device of claim 2, wherein: the width of the primary sieve plate (3-1) is 30-40 cm, the length of the primary sieve plate is 40-70 cm, and the inclination adjustment range is 20-40 degrees; the width of the secondary sieve plate (3-2) is 20-30 cm, the length of the secondary sieve plate is 30-40 cm, and the inclination adjustment range is 10-20 degrees; the width of the third-stage sieve plate (3-3) is 10-20 cm, the length of the third-stage sieve plate is 30-40 cm, and the inclination adjusting range is 20-30 degrees.
4. The flat plate type BGA solder ball roundness screening device of claim 1, wherein: the screening support is provided with a plurality of pairs of vertical pipes (4-1) and a plurality of pairs of transverse pipes (4-2), and each two pairs of vertical pipes (4-1) are correspondingly provided with a screen plate.
5. The flat BGA solder ball roundness screening device of claim 4, wherein: the angle adjusting mechanism comprises a sliding block (4-4) and a fastening piece, the sliding block (4-4) slides up and down along the vertical through groove of the vertical pipe (4-1), the position of the sliding block (4-4) is fixed by the fastening piece, and two ends of a supporting shaft (4-5) for supporting the sieve plate are rotatably connected to the sliding block (4-4).
6. The flat BGA solder ball roundness screening device of claim 5, wherein: the supporting shaft (4-5) is provided with a supporting plane (4-5-2) for supporting the sieve plate, and the two ends of the supporting shaft (4-5) are provided with cylindrical heads (4-5-1) which are placed in the slide block grooves (4-4-1) of the slide blocks (4-4).
7. The flat BGA solder ball roundness screening device of claim 5, wherein: the sliding block (4-4) is provided with a threaded shaft (4-4-2), and the threaded shaft (4-4-2) is used for penetrating through the vertical through groove and then is connected with the fastener.
8. The flat plate type BGA solder ball roundness screening device of claim 1, wherein: the blanking mechanism comprises a blanking hopper (2-1), the blanking hopper (2-1) is fixed on a blanking support, a flow control valve (2-2) and a blanking hose (2-3) are arranged at the bottom of the blanking hopper (2-1), and the lower opening of the blanking hose (2-3) abuts against the highest end of the first-stage sieve plate.
9. The flat BGA solder ball roundness screening device of claim 8, wherein: the blanking hose (2-3) is an anti-static hose.
10. The flat plate type BGA solder ball roundness screening device of claim 1, wherein: the material receiving plate (5) covers the whole bottom surface of the screening support, the inclined direction of the material receiving plate (5) is opposite to that of the screen plate, a conical flow groove is formed in the lower end of the material receiving plate (5), and the conical flow groove is connected with the defective product container (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010141798.7A CN111167724A (en) | 2020-03-04 | 2020-03-04 | Flat BGA tin ball roundness screening device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010141798.7A CN111167724A (en) | 2020-03-04 | 2020-03-04 | Flat BGA tin ball roundness screening device |
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| CN111167724A true CN111167724A (en) | 2020-05-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010141798.7A Pending CN111167724A (en) | 2020-03-04 | 2020-03-04 | Flat BGA tin ball roundness screening device |
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| CN112427316A (en) * | 2020-10-29 | 2021-03-02 | 江苏理工学院 | Light material spring sorting unit of building rubbish |
| CN113731820A (en) * | 2021-09-18 | 2021-12-03 | 广州海普电子材料科技有限公司 | BGA tin ball classification and collection device |
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|---|---|---|---|---|
| CN112427316A (en) * | 2020-10-29 | 2021-03-02 | 江苏理工学院 | Light material spring sorting unit of building rubbish |
| CN113731820A (en) * | 2021-09-18 | 2021-12-03 | 广州海普电子材料科技有限公司 | BGA tin ball classification and collection device |
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