CN111162154A - 紫外发光元件及全无机封装方法 - Google Patents
紫外发光元件及全无机封装方法 Download PDFInfo
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- CN111162154A CN111162154A CN202010145168.7A CN202010145168A CN111162154A CN 111162154 A CN111162154 A CN 111162154A CN 202010145168 A CN202010145168 A CN 202010145168A CN 111162154 A CN111162154 A CN 111162154A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
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Priority Applications (1)
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CN202010145168.7A CN111162154B (zh) | 2020-03-05 | 2020-03-05 | 紫外发光元件及全无机封装方法 |
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CN111162154A true CN111162154A (zh) | 2020-05-15 |
CN111162154B CN111162154B (zh) | 2020-12-04 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113140663A (zh) * | 2021-04-19 | 2021-07-20 | 马鞍山杰生半导体有限公司 | Led发光元件及其制作方法 |
CN113341360A (zh) * | 2021-05-28 | 2021-09-03 | 广东利扬芯片测试股份有限公司 | 用于芯片测试的射频校准装置及其校准方法 |
CN117293248A (zh) * | 2023-11-27 | 2023-12-26 | 华引芯(武汉)科技有限公司 | 一种具有光能自反馈的uv led器件及其制备方法 |
CN117334795A (zh) * | 2023-09-30 | 2024-01-02 | 江苏富乐华功率半导体研究院有限公司 | 一种基于陶瓷围坝的高功率led封装结构的制备及应用 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103972378A (zh) * | 2014-05-29 | 2014-08-06 | 中山市秉一电子科技有限公司 | 一种led发光装置及其封装方法 |
CN105826458B (zh) * | 2016-04-26 | 2018-02-16 | 东莞市凯昶德电子科技股份有限公司 | 一种带金属围坝的dpc陶瓷基板制备方法 |
CN108598246A (zh) * | 2018-07-13 | 2018-09-28 | 广东格斯泰气密元件有限公司 | 一种真空气密封装的smd-uv-led |
CN109786537A (zh) * | 2018-12-27 | 2019-05-21 | 华中科技大学鄂州工业技术研究院 | 全无机led封装结构及其制备方法 |
CN209896097U (zh) * | 2019-04-11 | 2020-01-03 | 武汉高星紫外光电科技有限公司 | 一种深紫外led全无机气密封装结构 |
CN110707199A (zh) * | 2019-10-16 | 2020-01-17 | 五邑大学 | 一种深紫外led器件及其封装方法 |
CN210272423U (zh) * | 2020-03-05 | 2020-04-07 | 华引芯(武汉)科技有限公司 | 紫外发光元件 |
-
2020
- 2020-03-05 CN CN202010145168.7A patent/CN111162154B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103972378A (zh) * | 2014-05-29 | 2014-08-06 | 中山市秉一电子科技有限公司 | 一种led发光装置及其封装方法 |
CN105826458B (zh) * | 2016-04-26 | 2018-02-16 | 东莞市凯昶德电子科技股份有限公司 | 一种带金属围坝的dpc陶瓷基板制备方法 |
CN108598246A (zh) * | 2018-07-13 | 2018-09-28 | 广东格斯泰气密元件有限公司 | 一种真空气密封装的smd-uv-led |
CN109786537A (zh) * | 2018-12-27 | 2019-05-21 | 华中科技大学鄂州工业技术研究院 | 全无机led封装结构及其制备方法 |
CN209896097U (zh) * | 2019-04-11 | 2020-01-03 | 武汉高星紫外光电科技有限公司 | 一种深紫外led全无机气密封装结构 |
CN110707199A (zh) * | 2019-10-16 | 2020-01-17 | 五邑大学 | 一种深紫外led器件及其封装方法 |
CN210272423U (zh) * | 2020-03-05 | 2020-04-07 | 华引芯(武汉)科技有限公司 | 紫外发光元件 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113140663A (zh) * | 2021-04-19 | 2021-07-20 | 马鞍山杰生半导体有限公司 | Led发光元件及其制作方法 |
CN113341360A (zh) * | 2021-05-28 | 2021-09-03 | 广东利扬芯片测试股份有限公司 | 用于芯片测试的射频校准装置及其校准方法 |
CN117334795A (zh) * | 2023-09-30 | 2024-01-02 | 江苏富乐华功率半导体研究院有限公司 | 一种基于陶瓷围坝的高功率led封装结构的制备及应用 |
CN117334795B (zh) * | 2023-09-30 | 2024-02-20 | 江苏富乐华功率半导体研究院有限公司 | 一种基于陶瓷围坝的高功率led封装结构的制备及应用 |
CN117293248A (zh) * | 2023-11-27 | 2023-12-26 | 华引芯(武汉)科技有限公司 | 一种具有光能自反馈的uv led器件及其制备方法 |
CN117293248B (zh) * | 2023-11-27 | 2024-03-01 | 华引芯(武汉)科技有限公司 | 一种具有光能自反馈的uv led器件及其制备方法 |
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CN111162154B (zh) | 2020-12-04 |
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Denomination of invention: Ultraviolet light emitting element and all inorganic packaging method Effective date of registration: 20220620 Granted publication date: 20201204 Pledgee: Guanggu Branch of Wuhan Rural Commercial Bank Co.,Ltd. Pledgor: HUAYINXIN (WUHAN) TECHNOLOGY CO.,LTD. Registration number: Y2022420000170 |
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Date of cancellation: 20230621 Granted publication date: 20201204 Pledgee: Guanggu Branch of Wuhan Rural Commercial Bank Co.,Ltd. Pledgor: HUAYINXIN (WUHAN) TECHNOLOGY CO.,LTD. Registration number: Y2022420000170 |
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Denomination of invention: Ultraviolet luminescent elements and fully inorganic packaging methods Effective date of registration: 20231026 Granted publication date: 20201204 Pledgee: Guanggu Branch of Wuhan Rural Commercial Bank Co.,Ltd. Pledgor: HUAYINXIN (WUHAN) TECHNOLOGY CO.,LTD. Registration number: Y2023980062852 |