CN111159914B - Template thermocouple development system for satellite thermal test - Google Patents

Template thermocouple development system for satellite thermal test Download PDF

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Publication number
CN111159914B
CN111159914B CN202010004517.3A CN202010004517A CN111159914B CN 111159914 B CN111159914 B CN 111159914B CN 202010004517 A CN202010004517 A CN 202010004517A CN 111159914 B CN111159914 B CN 111159914B
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China
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thermocouple
model
template
information
module
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CN111159914A (en
Inventor
刘广通
杨佳鑫
郭涛
樊友高
王冬梅
唐赖颖
张洁
李新宇
刘孟周
张伟
魏鹏
夏丹
王欢
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Beijing Institute of Spacecraft Environment Engineering
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Beijing Institute of Spacecraft Environment Engineering
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples

Abstract

The application discloses a template thermocouple development system for satellite thermal test, the system includes curved surface assembly module, thermocouple design module and thermocouple wire harness creation module, wherein curved surface assembly module is used for assembling the thermocouple to the thermocouple model of setting up in advance, and thermocouple design module is used for establishing the multizone group to the thermocouple model to generate the connection data between the thermocouple, and thermocouple wire harness creation module is used for carrying out network route construction and wiring according to the port information in the connection data, and generates nail board diagram. According to the embodiment of the application, the on-board pasting position of the thermocouple is integrated in the three-dimensional visual thermocouple model according to the design file and the technological requirements, the thermocouple information database and the mapping relation between the two-dimensional nail plate diagram of the thermocouple and the three-dimensional network path are established through the template tool, and therefore the rapid arrangement of the thermocouple on the satellite is realized by adopting a parallel mode of a main line technology and an auxiliary line technology and on-board operation and under-board operation.

Description

Template thermocouple development system for satellite thermal test
Technical Field
The invention relates to the technical field of spacecraft assembly, in particular to a template thermocouple development system for satellite thermal test.
Background
Thermocouples (thermocouples) are commonly used temperature measuring elements in temperature measuring instruments that directly measure temperature and convert the temperature signal into a thermoelectromotive signal, which in turn is converted by an electrical instrument into the temperature of the medium being measured. The external forms of the thermocouples are very different according to the needs, but the basic structures of the thermocouples are almost the same, and the thermocouples are usually composed of main parts such as a hot electrode, an insulating sleeve protection tube, a junction box and the like, and are matched with a display instrument, a recording instrument and an electronic regulator.
In view of the advantages of small mass, high response speed, small disturbance to the environment, no damage to the structure of the measured part and the like of the thermocouple, the thermocouple temperature measurement is widely applied to the temperature measurement of the vacuum thermal test of the spacecraft so as to comprehensively analyze and evaluate the temperature states of satellite equipment and the cabin board. At present, the implementation of the thermocouple in the final assembly stage of the spacecraft is mainly finished by manual operation, namely, a final assembly operator pastes the thermocouple according to the process word expression and combs hundreds of wires thrown out of the star.
In the process of implementing the present invention, the inventor finds that at least the following problems exist in the prior art: because spacecraft development quantity is numerous, the period is short and the requirement is high, the implementation of the thermocouple is carried out manually, a great deal of cost such as manpower and material resources are consumed, and the thermocouple lead wire is easy to damage when the field environment is changeable. Meanwhile, after the development mode of the spacecraft is changed from two dimensions to three dimensions, the traditional thermal control process file is inconvenient or even can not convey the auxiliary information such as a product model, specific thermocouple distribution, wiring paths and the like due to simple expression design intention, and further flexible association of the three can not be realized, so that consistency of implementation quality of thermocouple products is difficult to ensure, design and check are inconvenient, and a data packet for implementation record of the thermocouple products is formed.
Disclosure of Invention
In view of the above-mentioned drawbacks or shortcomings in the prior art, it is desirable to provide a template thermocouple development system for satellite thermal test, which can implement a thermocouple rapidly while ensuring the thermocouple temperature measurement accuracy, and improve the working efficiency.
The application provides a template thermocouple development system for satellite thermal test, which comprises a curved surface assembly module, a thermocouple design module and a thermocouple wire harness creation module;
the curved surface assembly module is used for assembling the thermocouple to a preset thermocouple model;
the thermocouple design module is used for establishing multi-partition grouping for the thermocouple model and generating connection data between the thermocouples;
the thermocouple wire harness creation module is used for constructing and wiring a network path according to the port information in the connection data and generating a nail plate diagram.
Optionally, the curved surface assembling module includes:
a layout model setting unit for setting an installation coordinate system of the thermocouple model;
and the installation curved surface setting unit is used for setting the curved surface on which the thermocouple is arranged according to the installation coordinate system.
Optionally, the curved surface assembly module further includes:
and the intelligent layout unit is used for arranging the thermocouple and the thermocouple plug on the temporarily-replenished equipment to the thermocouple model.
Optionally, the thermocouple design module includes an element partition management unit;
the element partition management unit is used for performing partition management on the thermocouple model and associating bundling points in a partition with the thermocouples.
Optionally, the element partition management unit is further configured to add a corresponding partition according to the cabin board, perform partition association on the thermocouples in each partition in batches to obtain a wire harness model, wherein a starting end port of the wire harness model is a bundling point corresponding to one of the partitions, and a terminal end port of the wire harness model is a bundling point corresponding to the last partition in the group;
after writing the harness model into the cable design, data export is performed through connection data.
Optionally, the partition is a single curved surface or a double curved surface.
Optionally, the thermocouple wire harness creation module includes a network path setting unit;
the network path setting unit is used for arranging a network path of the thermocouple trend in the three-dimensional thermocouple model, correlating the network path with two-dimensional nail plate data, and obtaining the network path according to port information of the thermocouples and cable information among the thermocouples.
Optionally, the network path setting unit is further configured to set a control point on the selected cable installation curved surface, and sequentially connect the port of the thermocouple, the control point, and the cable bracket to form a path.
Optionally, the network path setting unit is further used for checking a path, and generating a two-dimensional nail plate diagram according to the three-dimensional cable routing when the path connection is normal;
and displaying the harness information of the two-dimensional nail plate graph for modification and editing, wherein the harness information comprises bundling point information, branch point information and auxiliary information.
Optionally, the thermocouple wire harness creation module further includes a wiring environment setting unit and a wiring reference setting unit for collecting information of the electrical connector to supplement and check whether the information is complete, the information including port information of the bundling point.
In summary, the template thermocouple development system for satellite thermal test provided by the embodiment of the application comprises a curved surface assembly module, a thermocouple design module and a thermocouple harness creation module, wherein the curved surface assembly module is used for assembling thermocouples to a preset thermocouple model, the thermocouple design module is used for establishing multi-partition grouping for the thermocouple model and generating connection data among the thermocouples, and the thermocouple harness creation module is used for constructing and wiring network paths according to port information in the connection data and generating a nail plate diagram. According to the embodiment of the application, the on-board pasting position of the thermocouple is integrated in the three-dimensional visual thermocouple model according to the design file and the technological requirements, the thermocouple information database and the mapping relation between the two-dimensional nail plate diagram of the thermocouple and the three-dimensional network path are established through the template tool, and therefore the rapid arrangement of the thermocouple on the satellite is realized by adopting a parallel mode of a main line technology and an auxiliary line technology and on-board operation and under-board operation.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the following drawings, in which:
FIG. 1 is a schematic diagram of a basic structure of a template thermocouple development system for satellite thermal testing according to an embodiment of the present application;
FIG. 2 is a schematic diagram of another template thermocouple development system for satellite thermal testing according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a template thermocouple development system for satellite thermal testing according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a template thermocouple development system for satellite thermal testing according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a template thermocouple development system for satellite thermal testing according to another embodiment of the present application;
fig. 6 is a schematic structural diagram of a template thermocouple development system for satellite thermal testing according to another embodiment of the present application.
Reference numerals:
the system comprises a template thermocouple development system for satellite thermal test, an 11-curved surface assembly module, a 111-layout model setting unit, a 112-installation curved surface setting unit, a 113-intelligent layout unit, a 12-thermocouple design module, a 121-element partition management unit, a 13-thermocouple wire harness creation module, a 131-network path setting unit, a 132-wiring environment setting unit and a 133-wiring reference setting unit.
Detailed Description
In order to make the present application solution better understood by those skilled in the art, the following description will clearly and completely describe the technical solution in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
The terms "first," "second," "third," "fourth" and the like in the description and in the claims of this application and in the above-described figures, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the described embodiments of the present application may be implemented in sequences other than those illustrated or described herein.
Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or modules is not necessarily limited to those steps or modules that are expressly listed or inherent to such process, method, article, or apparatus.
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
For ease of understanding and explanation, the template thermocouple development system for satellite thermal testing provided in the embodiments of the present application is described in detail below with reference to fig. 1-6.
Referring to fig. 1, which is a schematic diagram of a basic structure of a template thermocouple development system for satellite thermal test according to an embodiment of the present application, the system 1 includes a curved surface assembly module 11, a thermocouple design module 12, and a thermocouple harness creation module 13.
The curved surface assembling module 11 is used for assembling thermocouples to a preset thermocouple model, the thermocouple design module 12 is used for establishing multi-partition grouping for the thermocouple model and generating connection data between thermocouples, and the thermocouple wire harness creating module 13 is used for constructing and wiring network paths according to port information in the connection data and generating a nail plate diagram. For example, the curved surface assembling module 11 assembles thermocouples into a thermocouple model according to design requirements, the thermocouple designing module 12 completes the association management of the thermocouples in each partition and the partition through the custom partition design, creates a cluster point model in the partition, creates multi-partition groups, generates design data of thermocouple connection, and the thermocouple wire harness creating module 13 is composed of a cable design module, realizes port setting, network path building and quick wiring of the thermocouple wire harness model, collects partition information and wire harness data, and quickly generates a nail plate diagram.
According to the embodiment of the application, the thermocouple model is used as a data source, the close association between a three-dimensional network path and a two-dimensional wiring nail plate diagram of the thermal control implementation on the thermocouple device is realized, multiple points are converged into a beam through partition management according to thermocouple position distribution, the trend of the cluster points is reasonably arranged, the data information of the wire harness intersection point is collected, and meanwhile, the two-dimensional auxiliary line operation process output is realized through network path parameterization, so that an operation basis is provided for the implementation of auxiliary line thermocouples, the implementation efficiency on the satellite is greatly improved, and visual reference is provided for the data query of the on-satellite thermocouples.
Alternatively, as shown in fig. 2, the surface mounting module 11 in the embodiment of the present application includes a layout model setting unit 111 for setting an installation coordinate system of the thermocouple model; and a curved surface setting unit 112 for setting a curved surface of the layout thermocouple according to the installation coordinate system.
Optionally, in other embodiments of the present application, please refer to fig. 3, the surface assembly module 11 further comprises an intelligent layout unit 113 for arranging thermocouples and thermocouple plugs on the temporarily replenished device to the thermocouple model.
Alternatively, as shown in fig. 4, the thermocouple design module 12 in the embodiment of the present application includes an element partition management unit 121, and the element partition management unit 121 is configured to perform partition management on the thermocouple model and associate the intra-partition cluster points with the thermocouples.
Specifically, the element partition management unit 121 adds corresponding partitions according to the cabin board, performs partition association on the thermocouples in each partition in batches to obtain a wire harness model, wherein a starting end port of the wire harness model is a bundling point corresponding to one of the partitions, and a terminal end port of the wire harness model is a bundling point corresponding to the last partition in the group; thus, after writing the harness model into the cable design, data export is performed by connecting the data. It should be noted that, in the embodiment of the present application, the partition is a single curved surface or a hyperboloid.
Optionally, as shown in fig. 5, the thermocouple wire harness creation module 13 in the embodiment of the present application includes a network path setting unit 131, where the network path setting unit 131 is configured to arrange a network path of thermocouple strike in a three-dimensional thermocouple model, and associate the network path with two-dimensional nail plate data, where the network path is obtained according to port information of the thermocouples and cable information between the thermocouples. It should be noted that, the network path setting unit 131 is a key for constructing a cable model, and adds a main control part, selects a mounting surface, i.e. a curved surface of a layout cable, and sets a control point in the curved surface to control the trend of the cable.
Specifically, the network path setting unit 131 sets a control point on the selected cable installation curved surface, and sequentially connects the port of the thermocouple, the control point, and the cable bracket to form a path. In other embodiments of the present application, the network path setting unit 131 is further configured to check a path, and generate a two-dimensional nail plate diagram according to the three-dimensional cable routing when the path connection is normal; further, harness information of the two-dimensional nail plate map is displayed for modification and editing, wherein the harness information includes bundling point information, branching point information, and accessory information. According to the embodiment of the application, the three-dimensional model after the thermocouple partition wiring is subjected to data acquisition, the thermocouple parameterized nail plate diagram is generated, and the consistency of the implementation quality of thermocouple products is realized.
Optionally, referring to fig. 6, the thermocouple harness creation module 13 in the embodiment of the present application further includes a wiring environment setting unit 132 and a wiring reference setting unit 133, where the wiring environment setting unit 132 and the wiring reference setting unit 133 are used to collect information of the electrical connector to supplement and check whether the information is complete, and the information includes port information of the bundling point.
The template thermocouple development system for the satellite thermal test comprises a curved surface assembly module, a thermocouple design module and a thermocouple harness creation module, wherein the curved surface assembly module is used for assembling thermocouples to a preset thermocouple model, the thermocouple design module is used for establishing multi-partition grouping for the thermocouple model and generating connection data among thermocouples, and the thermocouple harness creation module is used for carrying out network path construction and wiring according to port information in the connection data and generating a nail plate diagram. According to the embodiment of the application, the on-board pasting position of the thermocouple is integrated in the three-dimensional visual thermocouple model according to the design file and the technological requirements, the thermocouple information database and the mapping relation between the two-dimensional nail plate diagram of the thermocouple and the three-dimensional network path are established through the template tool, and therefore the rapid arrangement of the thermocouple on the satellite is realized by adopting a parallel mode of a main line technology and an auxiliary line technology and on-board operation and under-board operation.
From the above description of embodiments, those skilled in the art will readily appreciate that the example embodiments described herein may be implemented in software, or may be implemented in software in combination with the necessary hardware.
The foregoing description is only of the preferred embodiments of the present application and is presented as a description of the principles of the technology being utilized. It will be appreciated by persons skilled in the art that the scope of the invention referred to in this application is not limited to the specific combinations of features described above, but it is intended to cover other embodiments in which any combination of features described above or equivalents thereof is possible without departing from the spirit of the invention. Such as the above-described features and technical features having similar functions (but not limited to) disclosed in the present application are replaced with each other.

Claims (8)

1. The template thermocouple development system for the satellite thermal test is characterized by comprising a curved surface assembly module, a thermocouple design module and a thermocouple wire harness creation module;
the curved surface assembly module is used for assembling the thermocouple to a preset thermocouple model;
the thermocouple design module is used for establishing multi-partition grouping for the thermocouple model and generating connection data between the thermocouples;
the thermocouple wire harness creation module is used for constructing and wiring a network path according to port information in the connection data and generating a nail plate diagram;
wherein the thermocouple design module comprises an element partition management unit;
the element partition management unit is used for performing partition management on the thermocouple model and associating bundling points in a partition with the thermocouples;
according to the method, corresponding subareas are added to the cabin plate, the thermocouples in the subareas are subjected to subarea association in batches to obtain a wire harness model, a starting end port of the wire harness model is a bundling point corresponding to one subarea, and a terminal end port of the wire harness model is a bundling point corresponding to the last subarea in the group; after writing the harness model into the cable design, data export is performed through connection data.
2. The template thermocouple development system for satellite thermal testing according to claim 1, wherein the curved assembly module comprises:
a layout model setting unit for setting an installation coordinate system of the thermocouple model;
and the installation curved surface setting unit is used for setting the curved surface on which the thermocouple is arranged according to the installation coordinate system.
3. The template thermocouple development system for satellite thermal testing according to claim 2, wherein the curved assembly module further comprises:
and the intelligent layout unit is used for arranging the thermocouple and the thermocouple plug on the temporarily-replenished equipment to the thermocouple model.
4. The template thermocouple development system for satellite thermal testing according to claim 1, wherein the partitions are either single curved or hyperboloid.
5. The template thermocouple development system for satellite thermal testing according to claim 1, wherein the thermocouple harness creation module comprises a network path setting unit;
the network path setting unit is used for arranging a network path of the thermocouple trend in the three-dimensional thermocouple model, correlating the network path with two-dimensional nail plate data, and obtaining the network path according to port information of the thermocouples and cable information among the thermocouples.
6. The template thermocouple development system for satellite thermal testing according to claim 5, wherein the network path setting unit is further configured to set a control point on a selected cable installation curved surface and sequentially connect the port of the thermocouple, the control point, and the cable bracket to form a passageway.
7. The template thermocouple development system for satellite thermal testing according to claim 6, wherein said network path setting unit is further configured to check a via and generate a two-dimensional nail plate map from a three-dimensional cable run when said via connection is normal;
and displaying the harness information of the two-dimensional nail plate graph for modification and editing, wherein the harness information comprises bundling point information, branch point information and auxiliary information.
8. The template thermocouple development system for satellite thermal testing according to any one of claims 5 to 7, wherein the thermocouple harness creation module further comprises a wiring environment setting unit and a wiring reference setting unit for collecting information of an electrical connector to supplement and check whether the information is complete, the information including port information of a bundling point.
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CN111859705B (en) * 2020-07-30 2024-02-06 北京无线电测量研究所 Visual wire harness manufacturing method and system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4466749A (en) * 1982-04-15 1984-08-21 Ectron Corporation Microprocessor controlled thermocouple simulator system
EP1197970A1 (en) * 2000-10-11 2002-04-17 Westinghouse Electric Company LLC A method of calibrating exit thermocouples in a nuclear reactor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9698579B2 (en) * 2014-10-24 2017-07-04 General Electric Company Method for routing wire bundles from a rotor shaft of a turbomachine

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4466749A (en) * 1982-04-15 1984-08-21 Ectron Corporation Microprocessor controlled thermocouple simulator system
EP1197970A1 (en) * 2000-10-11 2002-04-17 Westinghouse Electric Company LLC A method of calibrating exit thermocouples in a nuclear reactor

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
基于逆向思维的卫星热真空试验热电偶实施工艺方法;郭涛;贾瑞金;王冬梅;肖正懿;方志开;蔡玮;;装备环境工程(第04期);第2-3节 *
真空热试验温度参考点热响应测试系统设计与实现;朱熙;韩放;申彬;李西园;梁硕;;计算机测量与控制(05);全文 *
航天器真空热试验测控系统应用现状及发展趋势;张景川;谢吉慧;王奕荣;裴一飞;;航天器环境工程(第03期);全文 *
通信卫星真空热试验测试电缆集中控温方法;简亚彬;毕研强;周艳;吴越;杜春林;;航天器环境工程(03);引言,第2,4节 *

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