CN111154126A - Preparation method of nano-diamond modified boron nitride high-flexibility high-thermal-conductivity composite film - Google Patents
Preparation method of nano-diamond modified boron nitride high-flexibility high-thermal-conductivity composite film Download PDFInfo
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- CN111154126A CN111154126A CN202010047126.XA CN202010047126A CN111154126A CN 111154126 A CN111154126 A CN 111154126A CN 202010047126 A CN202010047126 A CN 202010047126A CN 111154126 A CN111154126 A CN 111154126A
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- boron nitride
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2329/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Derivatives of such polymer
- C08J2329/02—Homopolymers or copolymers of unsaturated alcohols
- C08J2329/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
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- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
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Abstract
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Priority Applications (1)
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CN202010047126.XA CN111154126B (en) | 2020-01-16 | 2020-01-16 | Preparation method of nano-diamond modified boron nitride high-flexibility high-thermal conductivity composite film |
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CN202010047126.XA CN111154126B (en) | 2020-01-16 | 2020-01-16 | Preparation method of nano-diamond modified boron nitride high-flexibility high-thermal conductivity composite film |
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CN111154126A true CN111154126A (en) | 2020-05-15 |
CN111154126B CN111154126B (en) | 2022-05-24 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112143143A (en) * | 2020-09-02 | 2020-12-29 | 哈尔滨理工大学 | Preparation method of PVDF (polyvinylidene fluoride) -based composite material film with high thermal conductivity |
CN114250064A (en) * | 2022-01-17 | 2022-03-29 | 湖南大学 | Flexible high-thermal-conductivity polymer-based composite material and preparation method thereof |
CN114702825A (en) * | 2022-03-30 | 2022-07-05 | 黑龙江省科学院石油化学研究院 | Repairable organic silicon thermal interface material with high repair efficiency and high heat conductivity coefficient and preparation method thereof |
CN114805925A (en) * | 2022-04-25 | 2022-07-29 | 西安理工大学 | Preparation method of h-BN/HQ/GO heat-conducting composite material |
CN115748244A (en) * | 2022-11-07 | 2023-03-07 | 哈尔滨工业大学 | High-interface bonding sizing agent, preparation thereof, modified carbon fiber reinforced polyether-ether-ketone composite material based on sizing agent and preparation method of modified carbon fiber reinforced polyether-ether-ketone composite material |
CN115850751A (en) * | 2022-12-01 | 2023-03-28 | 深圳市佑明光电有限公司 | LED packaging material and preparation method thereof |
CN116289296A (en) * | 2023-03-29 | 2023-06-23 | 华南理工大学 | Heat-conducting and insulating industrial aramid paper and preparation method thereof |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070034512A1 (en) * | 2003-10-30 | 2007-02-15 | Arkray, Inc. | Biosensor and method for producing the same |
US20090218276A1 (en) * | 2008-02-29 | 2009-09-03 | Brigham Young University | Functionalized diamond particles and methods for preparing the same |
WO2012101988A1 (en) * | 2011-01-28 | 2012-08-02 | 日東電工株式会社 | Heat-conductive film and production method therefor |
US20130075276A1 (en) * | 2011-09-26 | 2013-03-28 | Arkray, Inc. | Glucose Sensor |
WO2017101540A1 (en) * | 2015-12-17 | 2017-06-22 | 广东生益科技股份有限公司 | Thermosetting resin composition and prepreg containing same, and laminated plate and printed circuit board |
CN109181312A (en) * | 2018-09-11 | 2019-01-11 | 中国科学院金属研究所 | The boron nitride of vertical orientation and organosilicon composite heat-conducting thin-film material and preparation method thereof under a kind of magnetic field |
KR20190004192A (en) * | 2017-07-03 | 2019-01-11 | 김성규 | Multi-layered coating structure for a cutting tool and method of manufacturing the same |
-
2020
- 2020-01-16 CN CN202010047126.XA patent/CN111154126B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070034512A1 (en) * | 2003-10-30 | 2007-02-15 | Arkray, Inc. | Biosensor and method for producing the same |
US20090218276A1 (en) * | 2008-02-29 | 2009-09-03 | Brigham Young University | Functionalized diamond particles and methods for preparing the same |
WO2012101988A1 (en) * | 2011-01-28 | 2012-08-02 | 日東電工株式会社 | Heat-conductive film and production method therefor |
US20130075276A1 (en) * | 2011-09-26 | 2013-03-28 | Arkray, Inc. | Glucose Sensor |
WO2017101540A1 (en) * | 2015-12-17 | 2017-06-22 | 广东生益科技股份有限公司 | Thermosetting resin composition and prepreg containing same, and laminated plate and printed circuit board |
KR20190004192A (en) * | 2017-07-03 | 2019-01-11 | 김성규 | Multi-layered coating structure for a cutting tool and method of manufacturing the same |
CN109181312A (en) * | 2018-09-11 | 2019-01-11 | 中国科学院金属研究所 | The boron nitride of vertical orientation and organosilicon composite heat-conducting thin-film material and preparation method thereof under a kind of magnetic field |
Non-Patent Citations (2)
Title |
---|
KOZAKO, MASAHIRO等: ""A combination of nanodiamond and boron nitride for the preparation of polyvinyl alcoholcomposite film with high thermal conductivity"", 《POLYMER》 * |
邢荣芬等: ""填充型导热高分子复合材料的研究进展"", 《塑料工业》 * |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112143143A (en) * | 2020-09-02 | 2020-12-29 | 哈尔滨理工大学 | Preparation method of PVDF (polyvinylidene fluoride) -based composite material film with high thermal conductivity |
CN114250064A (en) * | 2022-01-17 | 2022-03-29 | 湖南大学 | Flexible high-thermal-conductivity polymer-based composite material and preparation method thereof |
CN114702825A (en) * | 2022-03-30 | 2022-07-05 | 黑龙江省科学院石油化学研究院 | Repairable organic silicon thermal interface material with high repair efficiency and high heat conductivity coefficient and preparation method thereof |
CN114805925A (en) * | 2022-04-25 | 2022-07-29 | 西安理工大学 | Preparation method of h-BN/HQ/GO heat-conducting composite material |
CN115748244A (en) * | 2022-11-07 | 2023-03-07 | 哈尔滨工业大学 | High-interface bonding sizing agent, preparation thereof, modified carbon fiber reinforced polyether-ether-ketone composite material based on sizing agent and preparation method of modified carbon fiber reinforced polyether-ether-ketone composite material |
CN115748244B (en) * | 2022-11-07 | 2024-04-12 | 哈尔滨工业大学 | High-interface bonding sizing agent, preparation thereof, modified carbon fiber reinforced polyether-ether-ketone composite material based on high-interface bonding sizing agent and preparation method of modified carbon fiber reinforced polyether-ether-ketone composite material |
CN115850751A (en) * | 2022-12-01 | 2023-03-28 | 深圳市佑明光电有限公司 | LED packaging material and preparation method thereof |
CN115850751B (en) * | 2022-12-01 | 2023-09-01 | 深圳市佑明光电有限公司 | LED packaging material and preparation method thereof |
CN116289296A (en) * | 2023-03-29 | 2023-06-23 | 华南理工大学 | Heat-conducting and insulating industrial aramid paper and preparation method thereof |
CN116289296B (en) * | 2023-03-29 | 2024-04-05 | 华南理工大学 | Heat-conducting and insulating industrial aramid paper and preparation method thereof |
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CN111154126B (en) | 2022-05-24 |
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Inventor after: Zhu Jiaqi Inventor after: Substitute troops Inventor after: Zhao Kechen Inventor after: Cao Kangli Inventor after: Liu Gang Inventor after: Cao Wenxin Inventor after: Sun Mingqi Inventor after: Su Zhenhua Inventor before: Zhu Jiaqi Inventor before: Substitute troops Inventor before: Zhao Kechen Inventor before: Cao Kangli Inventor before: Liu Gang Inventor before: Sun Mingqi |
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