CN111146110A - Monitoring system and automatic material conveying system - Google Patents
Monitoring system and automatic material conveying system Download PDFInfo
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- CN111146110A CN111146110A CN201811314539.9A CN201811314539A CN111146110A CN 111146110 A CN111146110 A CN 111146110A CN 201811314539 A CN201811314539 A CN 201811314539A CN 111146110 A CN111146110 A CN 111146110A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
Abstract
The invention relates to the technical field of automatic handling, and provides a monitoring system, which comprises: the device comprises a fault alarm device, an image acquisition device, a first processing unit and a control device. The fault alarm device is used for generating alarm information comprising identification information and fault time when the wafer transportation equipment breaks down; the image acquisition device is arranged on the wafer transportation equipment and used for acquiring track image information and capturing and releasing image information; the first processing unit is used for storing identification information of the wafer transportation equipment, is connected with the image acquisition device and is used for associating the track image information and the grabbing and releasing image information of the wafer transportation equipment with the identification information of the wafer transportation equipment and generating image information; the control device is used for receiving and storing the image information, and integrating and storing the image information and the alarm information according to the identification information and the fault time when receiving the alarm information sent by the fault alarm device. The monitoring system can help maintenance personnel to quickly find out the fault reason of the wafer transportation equipment, and the maintenance time is shortened.
Description
Technical Field
The invention relates to the technical field of automatic handling of semiconductor integrated circuits, in particular to a monitoring system and an automatic material conveying system.
Background
An Automated Material Handling System (AMHS) generally includes a plurality of OHTs (Overhead home Transport) for picking and placing a wafer cassette and driving the wafer cassette to move along a track. When the wafer transportation equipment fails, the whole automatic material conveying system can not operate normally.
In the related art, the operation state of each wafer transport device is usually monitored by a fault alarm device, and when any wafer transport device fails, the fault alarm device sends out alarm information, so that maintenance personnel can conveniently maintain the failed wafer transport device.
However, in the related art, when a maintenance worker performs maintenance on the faulty wafer transportation device, the faulty site needs to be investigated, and the investigation process is time-consuming and labor-consuming.
It is to be noted that the information invented in the above background section is only for enhancing the understanding of the background of the present invention, and therefore, may include information that does not constitute prior art known to those of ordinary skill in the art.
Disclosure of Invention
The invention aims to provide a monitoring system and an automatic material conveying system. The monitoring system can help maintenance personnel to quickly find out the fault reason of the wafer transportation equipment, and the maintenance time is shortened.
Additional features and advantages of the invention will be set forth in the detailed description which follows, or may be learned by practice of the invention.
According to an aspect of the present invention, there is provided a monitoring system for monitoring a plurality of wafer transportation devices, the wafer transportation devices being configured to pick and place a wafer cassette and move the wafer cassette along a track, the monitoring system comprising: the device comprises a fault alarm device, an image acquisition device, a first processing unit and a control device. The fault alarm device is used for generating alarm information comprising identification information and fault time when the wafer transportation equipment breaks down, and each wafer transportation equipment has unique identification information; the image acquisition device is arranged on the wafer transportation equipment and used for acquiring track image information of the wafer transportation equipment moving along the track and grabbing and releasing image information of a grabbing and releasing wafer box; the first processing unit is arranged on the wafer transportation equipment, stores identification information of the wafer transportation equipment, is connected with the image acquisition device, and is used for associating the track image information and the capture and release image information of the wafer transportation equipment with the identification information of the track image information and the capture and release image information and generating image information comprising the identification information, the track image information and the capture and release image information; the control device is used for receiving and storing the image information, and integrating and storing the image information and the alarm information according to the identification information and the fault time when receiving the alarm information sent by the fault alarm device.
In an exemplary embodiment of the present invention, the monitoring system further includes: a wireless signal transmitter and a bridge. The wireless signal transmitter is connected with the first processing unit and is used for wirelessly transmitting the image information; the bridge is connected with the wireless signal transmitter and used for wirelessly receiving the image information and forwarding the image information on line.
In an exemplary embodiment of the present invention, the monitoring system further includes: and a hub. The input end of the concentrator is connected with the bridge connector, and the output end of the concentrator is connected with the control device and used for transmitting the image information to the control device in a wired mode.
In an exemplary embodiment of the present invention, the malfunction alerting device includes: a fault detection unit and a second processing unit. The fault detection unit is used for detecting the operation state of the wafer transportation equipment and generating fault information comprising fault time according to the operation state; the second processing unit is arranged on the wafer transportation equipment, stores identification information of the wafer transportation equipment, is connected with the fault detection unit, and is used for associating the fault information of the wafer transportation equipment with the identification information of the wafer transportation equipment and generating the alarm information.
In an exemplary embodiment of the present invention, the alarm information further includes a fault code for recording a fault type, and the fault alarm apparatus further includes: and a fault type detection unit. The fault type detection unit is used for generating fault codes according to the running state of the wafer transportation equipment; the second processing unit is further used for associating the fault information of the wafer transportation equipment, the identification information and the fault code and generating the alarm information.
In an exemplary embodiment of the present invention, the alarm information further includes location information for recording a location of the wafer transportation device, and the fault alarm apparatus further includes: a position sensor. The position sensor is used for detecting the position information of the wafer transportation equipment; the second processing unit is further used for associating the fault information, the position information, the identification information and the fault code of the wafer transportation equipment and generating the alarm information.
In one exemplary embodiment of the present invention, the image pickup apparatus includes: the device comprises a first image acquisition device and a second image acquisition device. The first image acquisition device is used for acquiring the track image information; the second image acquisition device is used for acquiring the grabbing and releasing image information.
In an exemplary embodiment of the present invention, the bridge is one or more.
In an exemplary embodiment of the invention, the image acquisition device is a camera.
In an exemplary embodiment of the invention, the wafer transportation equipment includes a traveling part disposed above the rail and a grasping part disposed below the rail, the grasping part is used for grasping and releasing a wafer cassette, the traveling part is used for moving on the rail, the first image capturing device is disposed on the traveling part, and the second image capturing device is disposed on the grasping part.
In an exemplary embodiment of the present invention, the monitoring system further includes: a display device. And the display device is connected with the control device and is used for displaying the image information and the alarm information.
In an exemplary embodiment of the present invention, the wireless signal transmitter is a wireless network card.
According to one aspect of the present invention, an automated material handling system is provided, comprising a plurality of wafer transport apparatuses and the monitoring system described above.
The invention provides a monitoring system and an automatic material conveying system. The monitoring system includes: the device comprises a fault alarm device, an image acquisition device, a first processing unit and a control device. The fault alarm device is used for generating alarm information comprising identification information and fault time when the wafer transportation equipment breaks down; the image acquisition device is arranged on the wafer transportation equipment and used for acquiring track image information of the wafer transportation equipment moving along the track and grabbing and releasing image information of a grabbing and releasing wafer box; the first processing unit is arranged on the wafer transportation equipment, stores identification information of the wafer transportation equipment, is connected with the image acquisition device, and is used for associating the track image information and the capture and release image information of the wafer transportation equipment with the identification information of the track image information and the capture and release image information and generating image information comprising the identification information, the track image information and the capture and release image information; the control device is used for receiving and storing the image information, and integrating and storing the image information and the alarm information according to the identification information and the fault time when receiving the alarm information sent by the fault alarm device. On one hand, the monitoring system can integrate and store the image information and the alarm information, and maintenance personnel can quickly check the image information of the fault wafer transportation equipment according to the integrated information, so that the time and the labor power of the maintenance personnel for checking the track walking fault of the wafer transportation equipment and the fault of the wafer box are reduced, and the maintenance efficiency is improved; on the other hand, the monitoring system is simple in structure and low in cost.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
FIG. 1 is a functional block diagram of an exemplary embodiment of a monitoring system of the present disclosure;
FIG. 2 is a schematic diagram of a monitoring system according to the present disclosure;
FIG. 3 is a schematic diagram of a control device in an exemplary embodiment of a monitoring system of the present disclosure;
FIG. 4 is a functional block diagram of an exemplary embodiment of a monitoring system of the present disclosure;
FIG. 5 is a schematic diagram of an image capture device in an exemplary embodiment of a monitoring system of the present disclosure;
FIG. 6 is an enlarged view of a portion of a wafer transport apparatus in an exemplary embodiment of a monitoring system according to the present disclosure;
fig. 7 is a schematic diagram of a fault alarm device in an exemplary embodiment of a monitoring system of the present disclosure.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.
Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be appreciated that if the device of the icon were turned upside down, the element described as "upper" would become the element "lower". Other relative terms, such as "high," "low," "top," "bottom," "left," "right," and the like are also intended to have similar meanings. When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.
The terms "a," "an," "the," and the like are used to denote the presence of one or more elements/components/parts; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.
In the related art, the fault alarm device monitors the operation state of each wafer transportation device, when any wafer transportation device breaks down, the fault alarm device can send alarm information, and maintenance personnel maintain the fault wafer transportation device according to the alarm information. However, the distance between the wafer transportation equipment and the ground is generally more than 4.5 meters, the wafer transportation equipment needs to be lifted when being detected, and the wafer transportation equipment needs to be taken down from the track, which is time-consuming and labor-consuming.
Based on this, the present exemplary embodiment first provides a monitoring system, as shown in fig. 1 and 2, fig. 1 is a functional structure block diagram of an exemplary embodiment of the monitoring system of the present disclosure, and fig. 2 is a structural schematic diagram of the monitoring system of the present disclosure. This monitored control system is used for monitoring a plurality of wafer transportation equipment 1, wafer transportation equipment 1 is used for grabbing and putting wafer box 2 and drive wafer box 2 moves along a track 3, monitored control system includes: the device comprises a fault alarm device 4, an image acquisition device 5, a first processing unit 6 and a control device 7. The fault alarm device 4 is used for generating alarm information including identification information and fault time when the wafer transportation equipment 1 is in fault, and each wafer transportation equipment 1 has unique identification information; the image acquisition device 5 is arranged on the wafer transportation equipment 1 and is used for acquiring track image information of the wafer transportation equipment moving along the track and grabbing and releasing image information of a grabbing and releasing wafer box; the first processing unit 6 is arranged on the wafer transportation equipment 1, stores identification information of the wafer transportation equipment, is connected with the image acquisition device 5, and is used for associating the track image information and the pick-and-place image information of the wafer transportation equipment 1 with the identification information thereof and generating image information comprising the identification information, the track image information and the pick-and-place image information; and the control device 7 is used for receiving and storing the image information, and integrating and storing the image information and the alarm information according to the identification information and the fault time when receiving the alarm information sent by the fault alarm device.
The invention provides a monitoring system and an automatic material conveying system. The monitoring system includes: the device comprises a fault alarm device, an image acquisition device, a first processing unit and a control device. The fault alarm device is used for generating alarm information comprising identification information and fault time when the wafer transportation equipment breaks down; the image acquisition device is arranged on the wafer transportation equipment and used for acquiring track image information of the wafer transportation equipment moving along the track and grabbing and releasing image information of a grabbing and releasing wafer box; the first processing unit is arranged on the wafer transportation equipment, stores identification information of the wafer transportation equipment, is connected with the image acquisition device, and is used for associating the track image information and the capture and release image information of the wafer transportation equipment with the identification information of the track image information and the capture and release image information and generating image information comprising the identification information, the track image information and the capture and release image information; the control device is used for receiving and storing the image information, and integrating and storing the image information and the alarm information according to the identification information and the fault time when receiving the alarm information sent by the fault alarm device. On one hand, the monitoring system can integrate and store the image information and the alarm information, and maintenance personnel can quickly check the image information of the fault wafer transportation equipment according to the integrated information, so that the time and the labor power of the maintenance personnel for checking the track walking fault of the wafer transportation equipment and the fault of the wafer box are reduced, and the maintenance efficiency is improved; on the other hand, the monitoring system is simple in structure and low in cost.
In the present exemplary embodiment, the track image information and the capture-and-play image information include times corresponding to the captured images. Fig. 3 is a schematic diagram of a control device in an exemplary embodiment of a monitoring system according to the present disclosure. The control device 7 may include a determination unit 71 and a storage unit 72, and the determination unit 71 may associate the corresponding track image information and the capture-and-play image information in the image information according to the identification information and the time information in the alarm information, so as to integrate the image information and the alarm information. The integrated information comprises time information, identification information, track image information and capture and play image information. The storage unit may store the integrated information. And the maintenance personnel can quickly check the image information of the fault wafer transportation equipment according to the integrated information.
In the exemplary embodiment, as shown in fig. 4, a functional structure block diagram of an exemplary embodiment of the monitoring system of the present disclosure is shown. The monitoring system may further include: a wireless signal transmitter 8 and a bridge 9. The wireless signal transmitter 8 is connected with the first processing unit 6 and is used for wirelessly transmitting the image information; the bridge 9 is connected to the wireless signal transmitter 8, and is configured to wirelessly receive the image information and transmit the image information on line. The monitoring system may further include: a hub 10. The input end of the hub 10 is connected to the bridge 9, and the output end is connected to the control device 7, for transmitting the image information to the control device 7 by wire. The wireless signal transmitter 8 and the first processing unit 6 may be directly disposed on the wafer transportation device 1, and each wafer transportation device may have one first processing unit and one wireless transmitter disposed thereon. The wireless connection end of the bridge 9 can be wirelessly connected with one or more wireless signal transmitters 8 at the same time, and the wired connection end of the bridge 9 can be connected with the hub 10. The wireless signal transmitter 8, the bridge 9 and the hub 10 cooperate to transmit image information from the first processing unit 6 to the control device 7. The wireless signal transmitter 8 can be a wireless network card and is used for wirelessly transmitting the image information, so that the influence of a signal line on the normal transportation of the wafer transportation equipment is avoided; one or more bridges 9 may be provided, and each bridge 9 may be wirelessly connected to one or more wireless signal transmitters 8 for forwarding image information sent by the wireless signal transmitter 8 connected thereto; the hub 10 may be connected to a plurality of bridges 9 for increasing the distance of image information transmission.
In the present exemplary embodiment, as shown in fig. 2, 5 and 6, fig. 5 is a schematic structural diagram of an image capturing device in an exemplary embodiment of the monitoring system of the present disclosure, and fig. 6 is a partially enlarged view of a wafer transporting apparatus in an exemplary embodiment of the monitoring system of the present disclosure. The image acquisition device 5 may include: a first image capturing device 51 and a second image capturing device 52. The first image acquisition device 51 is used for acquiring the track image information; the second image acquisition device 52 is used for acquiring the pick-and-place image information. As shown in fig. 2, the wafer transportation apparatus includes a walking part 101 disposed above the track and a grabbing part 102 disposed below the track, the first image capturing device 51 may be disposed on the walking part 101, and the image capturing direction of the first image capturing device 51 is parallel to the extending direction of the track; the second image capturing device 52 is disposed on the grabbing component 102, and a shooting direction of the second image capturing device 52 is parallel to a grabbing and releasing direction of the wafer transporting apparatus. The first image capturing device 51 and the second image capturing device 52 may be disposed on the walking component 101 and the grabbing component 102 by screwing, welding, or the like. The first image capturing device 51 and the second image capturing device 52 may be cameras.
In this exemplary embodiment, as shown in fig. 7, a schematic structural diagram of a fault alarm device in an exemplary embodiment of a monitoring system of the present disclosure is shown. The malfunction alerting device may include: a failure detection unit 41 and a second processing unit 42. The fault detection unit 41 is configured to detect an operation state of the wafer transportation device, and generate fault information including fault time according to the operation state; the second processing unit 42 is disposed on the wafer transportation device, stores the identification information of the wafer transportation device, is connected to the fault detection unit 41, and is configured to associate the fault information of the wafer transportation device with the identification information of the wafer transportation device and generate the alarm information.
In the present exemplary embodiment, as shown in fig. 7, the alarm information may further include a fault code for recording a fault type, and the fault alarm apparatus may further include: a fault class detection unit 43. The fault type detection unit 43 is configured to generate a fault code according to the operation state of the wafer transportation device; the second processing unit is further used for associating the fault information of the wafer transportation equipment, the identification information and the fault code and generating the alarm information. Wherein the fault code may indicate the type of fault. In the exemplary embodiment, the maintenance personnel may retrieve the fault code of the faulty wafer transport apparatus while viewing the image information of the faulty wafer transport apparatus.
In the present exemplary embodiment, as shown in fig. 7, the alarm information may further include position information for recording the position of the faulty wafer transportation device, and the fault alarm apparatus 4 may further include a position sensor 44. The position sensor 44 is used for detecting the position information of the wafer transportation equipment; the second processing unit is further used for associating the fault information, the position information, the identification information and the fault code of the wafer transportation equipment and generating the alarm information. In the exemplary embodiment, the maintenance personnel may retrieve the position information of the faulty wafer transport apparatus while checking the image information of the faulty wafer transport apparatus.
In this exemplary embodiment, as shown in fig. 1, 2 and 3, the monitoring system further includes: a display device 11. A display device 11 may be connected to the control device 7 for displaying the image information and the alarm information.
The present exemplary embodiment also provides an automatic material conveying system, which includes a plurality of wafer transportation devices and the monitoring system.
The automatic material conveying system in the exemplary embodiment can also transport other goods, and the automatic material conveying system has the same technical features and working principle as the monitoring system, and the detailed description is omitted here.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is to be limited only by the terms of the appended claims.
Claims (12)
1. A monitoring system for monitoring a plurality of wafer transport devices, the wafer transport devices being configured to pick up and release a wafer cassette and to drive the wafer cassette to move along a track, the monitoring system comprising:
the fault alarm device is used for generating alarm information comprising identification information and fault time when the wafer transportation equipment breaks down, and each wafer transportation equipment has unique identification information;
the image acquisition device is arranged on the wafer transportation equipment and is used for acquiring track image information of the wafer transportation equipment moving along the track and grabbing and releasing image information of a grabbing and releasing wafer box;
the first processing unit is arranged on the wafer transportation equipment and stores the identification information of the wafer transportation equipment, and the first processing unit is connected with the image acquisition device and is used for associating the track image information and the pick-and-place image information of the wafer transportation equipment with the identification information of the track image information and the pick-and-place image information and generating image information comprising the identification information, the track image information and the pick-and-place image information;
and the control device is used for receiving and storing the image information, and integrating and storing the image information and the alarm information according to the identification information and the fault time when receiving the alarm information sent by the fault alarm device.
2. The monitoring system of claim 1, further comprising:
the wireless signal transmitter is connected with the first processing unit and is used for wirelessly transmitting the image information;
the bridge is connected with the wireless signal transmitter and used for wirelessly receiving the image information and forwarding the image information on line.
3. The monitoring system of claim 2, further comprising:
the input end of the concentrator is connected with the bridge connector, and the output end of the concentrator is connected with the control device and used for transmitting the image information to the control device in a wired mode.
4. The monitoring system of claim 1, wherein the fault warning device comprises:
the fault detection unit is used for detecting the operation state of the wafer transportation equipment and generating fault information comprising fault time according to the operation state;
the second processing unit is arranged on the wafer transportation equipment and stores the identification information of the wafer transportation equipment, and the second processing unit is connected with the fault detection unit and used for associating the fault information of the wafer transportation equipment with the identification information of the fault information and generating the alarm information.
5. The monitoring system of claim 4, wherein the alarm information further includes a fault code for recording a type of fault, the fault alarm device further comprising:
the fault type detection unit is used for generating a fault code according to the running state of the wafer transportation equipment;
the second processing unit is further configured to associate the fault information, the identification information, and the fault code of the wafer transport apparatus and generate the alarm information.
6. The monitoring system of claim 5, wherein the alarm information further includes location information for recording a location of the wafer transport equipment, the fault alarm device further comprising:
the position sensor is used for detecting the position information of the wafer transportation equipment;
the second processing unit is further configured to associate the fault information, the location information, the identification information, and the fault code of the wafer transport apparatus and generate the alarm information.
7. A monitoring system according to any one of claims 1-6, in which the image acquisition means comprise:
the first image acquisition device is used for acquiring the track image information;
and the second image acquisition device is used for acquiring the information of the grabbing and releasing images.
8. A monitoring system according to claim 7,
the wafer transportation equipment comprises a walking part arranged above the track and a grabbing part arranged below the track, wherein the first image acquisition device is arranged on the walking part, and the second image acquisition device is arranged on the grabbing part.
9. A monitoring system according to any one of claims 1-6, characterised in that the monitoring system further comprises:
and the display device is connected with the control device and is used for displaying the image information and the alarm information.
10. The monitoring system of claim 2, wherein the wireless signal transmitter is a wireless network card.
11. The monitoring system of claim 2, wherein the bridge is one or more.
12. An automated material handling system comprising a plurality of wafer transport apparatus and a monitoring system according to any of claims 1 to 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811314539.9A CN111146110A (en) | 2018-11-06 | 2018-11-06 | Monitoring system and automatic material conveying system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811314539.9A CN111146110A (en) | 2018-11-06 | 2018-11-06 | Monitoring system and automatic material conveying system |
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| CN111146110A true CN111146110A (en) | 2020-05-12 |
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| CN201811314539.9A Pending CN111146110A (en) | 2018-11-06 | 2018-11-06 | Monitoring system and automatic material conveying system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113947871A (en) * | 2020-07-17 | 2022-01-18 | 南亚科技股份有限公司 | Alarm device and alarm method thereof |
| CN114178971A (en) * | 2021-12-16 | 2022-03-15 | 北京烁科精微电子装备有限公司 | Polishing module fault processing method and device and polishing equipment |
-
2018
- 2018-11-06 CN CN201811314539.9A patent/CN111146110A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113947871A (en) * | 2020-07-17 | 2022-01-18 | 南亚科技股份有限公司 | Alarm device and alarm method thereof |
| CN114178971A (en) * | 2021-12-16 | 2022-03-15 | 北京烁科精微电子装备有限公司 | Polishing module fault processing method and device and polishing equipment |
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