CN111142627B - Io后窗 - Google Patents

Io后窗 Download PDF

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CN111142627B
CN111142627B CN201811314852.2A CN201811314852A CN111142627B CN 111142627 B CN111142627 B CN 111142627B CN 201811314852 A CN201811314852 A CN 201811314852A CN 111142627 B CN111142627 B CN 111142627B
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CN111142627A (zh
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李承赫
王凯东
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Fulian Precision Electronics Tianjin Co Ltd
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Hongfujin Precision Electronics Tianjin Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/44—Means for preventing access to live contacts
    • H01R13/447—Shutter or cover plate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H01R13/506—Bases; Cases composed of different pieces assembled by snap action of the parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/516—Means for holding or embracing insulating body, e.g. casing, hoods
    • H01R13/518—Means for holding or embracing insulating body, e.g. casing, hoods for holding or embracing several coupling parts, e.g. frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/627—Snap or like fastening
    • H01R13/6275—Latching arms not integral with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1461—Slidable card holders; Card stiffeners; Control or display means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures

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  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

一种IO后窗，能够连接于一机箱上，IO后窗包括窗壁，窗壁设有多个开口以装设不同的IO设备，IO后窗还包括至少一个盖板，至少一个盖板可拆卸地连接于窗壁上且能够遮盖开口。该IO后窗利用盖板遮盖或露出开口，适应配置多种IO设备的服务器系统，提高了IO后窗的通用性，降低了生产成本。

Description

IO后窗
技术领域
本发明涉及一种IO后窗结构，尤其是一种兼容多种IO设备的IO后窗。
背景技术
市场对服务器系统需求越来越多样化，需通过机箱的改装操作来实现适配多种不同服务器系统组装的需求，不同服务器系统的输入输出(IO)设备的种类、数量不同，每种服务器系统需相应地配置一种后窗与机箱连接，这导致后窗的制造模具不同，成本增加。
发明内容
鉴于上述状况，有必要提供一种能够兼容多种IO设备的IO后窗。
一种IO后窗，能够连接于一机箱上，该IO后窗包括窗壁，该窗壁设有多个开口以装设不同的IO设备，该IO后窗还包括至少一个盖板，至少一个该盖板可拆卸地连接于该窗壁上且能够遮盖该开口。
上述IO后窗利用至少一个该盖板遮盖或露出该开口，需要装设IO设备时即拆离该盖板于窗壁，适应配置多种IO设备的服务器系统，提高了该IO后窗的通用性。且该IO后窗结构简单，拆装方便，降低了生产成本。
附图说明
图1是本发明一实施例中IO后窗的立体示意图。
图2是图1所示的IO后窗的另一视角的立体示意图。
图3是图1所示的IO后窗的立体分解示意图。
主要元件符号说明
IO后窗 100
窗壁 10
开口 11
过孔 13
散热孔 15
盖板 20
本体 21
卡爪 23
连接部 231
卡持部 233
连接孔 25
抵持部 27
紧固件 30
遮板 40
如下具体实施方式将连接上述附图进一步说明本发明。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明的是，当一个组件被认为是“连接”另一个组件，它可以是直接连接到另一个组件或者可能同时存在居中设置的组件。当一个组件被认为是“设置在”另一个组件，它可以是直接设置在另一个组件上或者可能同时存在居中设置的组件。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体地实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
请同时参阅图1和图2，一种IO后窗100，能够连接于一机箱(图未示)上。IO后窗100包括窗壁10、至少一个盖板20和/或至少一个遮板40。窗壁10设有多个开口11以装设不同的IO设备(图未示)。每个开口11能够装设至少一个IO设备。盖板20和遮板40分别与窗壁10连接。一实施例中，开口11的数量为四个，但不限于此。一实施例中，盖板20和遮板40的数量分别为一个，但不限于此。一实施例中，一个盖板20和一个遮板40组合遮盖一个开口11以遮盖装设IO设备的开口11，提高防EMC(电磁干扰)的性能。当增加配置不同的IO设备时，将盖板20或遮板40拆离窗壁10露出开口11以装设IO设备。
请同时参阅图1和图3，盖板20包括本体21。本体21两侧的部分周壁朝向开口11延伸形成多个卡爪23。窗壁10上设有多个过孔13。每个过孔13与相应的开口11连通。一实施例中，过孔13和卡爪23的数量一致为两个，但不限于此。卡爪23能够穿过过孔13并沿窗壁10滑动，卡爪23和本体21分别贴合于窗壁10的两侧以使盖板20卡持于窗壁10上。
具体地，请参阅图3，卡爪23包括一连接部231。连接部231形成于本体21上，且位于本体21朝向过孔13的一侧。本体21朝向过孔13远离开口11的一侧延伸形成卡持部233。连接部231和卡持部233的宽度小于过孔13的宽度以使卡爪23能够通过过孔13至窗壁10背离本体21的一侧。卡持部233和本体21的间距略小于窗壁10的厚度以增加卡持部233和本体21卡持于窗壁10上的卡持力，使盖板20受外力不易脱离窗壁10。
可以理解，其他实施例中，卡持部233和本体21的间距也可以等于或大于窗壁10的厚度，卡持部233受窗壁10止挡使盖板20稳固于窗壁10上。其他实施例中，卡爪23的数量也可以为一个、三个或其他。只要卡爪23能够卡持于窗壁10上即可。
请参阅图3，盖板20上还设有至少一个连接孔25。IO后窗100还包括至少一个紧固件30。紧固件30抵持盖板20并能够穿过连接孔25与窗壁10连接。一实施例中，紧固件30为螺钉，但不限于此。可以理解，紧固件30也可以省略，卡持部233和本体21直接卡持于窗壁10上。
请参阅图3，遮板40采用冲孔连皮技术间隔连接于窗壁10上以使遮板40与窗壁10受冲击时易分离。遮板40位于盖板20朝向窗壁10的一侧。盖板20上设有抵持部27。抵持部27能够抵持于遮板40上以减小盖板20和遮板40的间隙，提高防EMC性能。
窗壁10上还设有多个散热孔15以利机箱内的元件运行时散热。
一实施例中，盖板20或遮板40与窗壁10分离时露出的开口11至少能够装设一个IO设备。开口11的尺寸可以设计为不同的尺寸以适应不同规格的IO设备。
可以理解，其他实施例中，遮板40可以省略，盖板20遮盖开口11，抵持部27抵持于窗壁10上。
可以理解，其他实施例中，盖板20和遮板40可以分别遮盖不同的开口11。
开口11及相应的盖板20和遮板40的数量和尺寸依据服务器系统(图未示)预留设置的IO设备规格设定。可以理解，其他实施例中，盖板20和遮板40的数量也可以为两个或其他。
当开口11未装设IO设备时，一实施例中，遮板40采用冲孔连皮技术连接于窗壁10上以遮盖开口11的部分。盖板20的本体21贴于窗壁10上；盖板20的抵持部27抵持于遮板40上；盖板20的卡持部233通过过孔13并沿窗壁10滑动使卡持部233和本体21分置于窗壁10的两侧；紧固件30穿过连接孔25与窗壁10连接。盖板20和遮板40遮盖一个开口11。
当开口11需装设IO时，利用外力敲向遮板40使遮板40与窗壁10分离以露出开口11装设IO设备；或拆离紧固件30，并使本体21沿窗壁10滑动使卡持部233从过孔13通过，盖板20脱离窗壁10以露出开口11装设IO设备。
IO后窗100利用至少一个盖板20和/或至少一个遮板40遮盖或露出开口11，需要装设IO设备时即拆离盖板20或遮板40于窗壁10，适应配置多种IO设备的服务器系统，提高了IO后窗100的通用性。且IO后窗100结构简单，拆装方便，降低了生产成本。
另外，本领域技术人员还可在本发明精神内做其它变化，当然，这些依据本发明精神所做的变化，都应包含在本发明所要求保护的范围。

Claims (7)

1.一种IO后窗，能够连接于一机箱上，该IO后窗包括窗壁，该窗壁设有多个开口以装设不同的IO设备，该IO后窗还包括至少一个盖板，至少一个该盖板可拆卸地连接于该窗壁上且能够遮盖该开口；
该IO后窗还包括至少一个遮板，该遮板连接于该窗壁上，且能够和该盖板组合遮盖该开口；
该遮板采用冲孔连皮技术与该窗壁间隔连接以使该遮板与该窗壁受冲击时易分离；
该遮板位于该盖板朝向该窗壁的一侧，该盖板上设有抵持部，该抵持部能够抵持于该遮板上。
2.如权利要求1所述的IO后窗，其特征在于：该盖板包括本体，该本体两侧的部分周壁朝向相应的该开口延伸形成多个卡爪，该窗壁上设有多个过孔，每个该过孔与该开口连通，该卡爪能够穿过该过孔以使该卡爪和该本体分别卡持于该窗壁的两侧。
3.如权利要求2所述的IO后窗，其特征在于：该卡爪包括一连接部，该连接部形成于该本体上，且位于该本体朝向该过孔的一侧，该本体朝向该过孔远离该开口的一侧延伸形成卡持部，该连接部和该卡持部的宽度小于该过孔的宽度以使该卡爪能够通过该过孔。
4.如权利要求3所述的IO后窗，其特征在于：该卡持部和该本体的间距小于该窗壁的厚度。
5.如权利要求1所述的IO后窗，其特征在于：该盖板上还设有至少一个连接孔，该IO后窗还包括至少一个紧固件，该紧固件抵持该盖板并能够穿过该连接孔与该窗壁连接。
6.如权利要求1所述的IO后窗，其特征在于：该开口至少能够装设一个IO设备。
7.如权利要求1所述的IO后窗，其特征在于：该窗壁上还设有多个散热孔。
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