CN111142198A - Optical transceiver module package - Google Patents
Optical transceiver module package Download PDFInfo
- Publication number
- CN111142198A CN111142198A CN201910432313.7A CN201910432313A CN111142198A CN 111142198 A CN111142198 A CN 111142198A CN 201910432313 A CN201910432313 A CN 201910432313A CN 111142198 A CN111142198 A CN 111142198A
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- CN
- China
- Prior art keywords
- board
- optical
- light emitting
- light receiving
- transceiver module
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
- H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/501—Structural aspects
- H04B10/503—Laser transmitters
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The present invention relates to an optical transceiver module package, and more particularly, to an optical transceiver module package characterized by comprising: a plate (110) on which an electrode line is formed; a first integration space (111) formed at a predetermined portion in one face of the board and used for integrating a light emitting part (120) for transmitting an optical signal to the outside; a second integration space (112) formed in other predetermined portion in one face of the board and used for integrating a light receiving section (130) receiving a light signal from the outside; an upper case (140) of the board into which the light emitting part and the light receiving part are integrated; a lower case (150) of the board into which the light emitting part and the light receiving part are integrated; a latch (160) for preventing the upper box from separating from the lower box under the state that the upper box and the lower box are connected; and a socket (170) connected to one ends of the light emitting part and the light receiving part.
Description
Technical Field
The present invention relates to an optical transceiver module package, and more particularly, to an optical transceiver module package which forms a three-dimensional integration space on a board on which electrode lines are formed, so that a light emitting part and a light receiving part can be directly integrated without an additional package structure, and an electrical signal is directly transmitted to an inner layer of the board, so that high speed can be achieved and an electrical interface can be reduced.
Background
With the advent of the information age, the role of optical communication that can transmit a large amount of information has gradually increased, and it has been proposed that an optical module, which is a core component of optical communication, needs to be high-speed, integrated, and miniaturized.
An optical module that needs to satisfy these conditions needs to have not only excellent characteristics of the module itself but also high reliability in maintaining the operation characteristics for a long time.
In particular, with the increase in the capacity of optical transmission systems, efforts are being made to increase the number of modules that can be mounted per unit area by reducing the size of optical modules mounted on the optical transmission systems.
However, in order to promote the spread of optical modules for realizing large-capacity optical connection, an inexpensive technology capable of manufacturing optical modules at low cost is currently the most demanding item in the optical communication market.
On the other hand, the conventional optical module has a gold box (gold box) or Butterfly (Butterfly) structure in which an optical element and an electronic element are integrated on the upper surface of a Platform (Platform) -shaped substrate and are placed in a metal box (case), and a TO-CAN package structure covering the upper surface of a transistor socket into which a main component (for example, a photodiode, a laser diode, or the like) capable of performing functions such as light emission and reception is integrated, and the like.
The existing gold box or butterfly package structure is suitable for forming multiple channels and has high reliability, but is not suitable for low-priced since the number of packages manufactured per unit time is small due to the price of the package itself or the complexity of the process.
On the other hand, the TO-CAN package structure is widely used in various forms of ultra high speed optical communication systems because of its simple structure, automation, and low manufacturing cost, but it is difficult TO manufacture multiple channels, which are important from the viewpoint of integration for large capacity optical transmission, and therefore, TO increase transmission capacity, it is difficult TO use a plurality of independent products of a single channel, thereby making miniaturization difficult. And this is also because there is a limitation in reducing the volume of the TO-CAN package itself.
In addition, since the above-mentioned package uses a plurality of components in order to constitute the package, a plurality of interfaces are formed in a viewpoint of executing an electric signal, and thus it is disadvantageous in terms of bandwidth (bandwith) for high speed.
Therefore, an optical module having a structure to which a new concept is applied is required for the high speed, integration, miniaturization, and cost reduction of the optical module.
Disclosure of Invention
Technical problem to be solved
The present invention has been made in view of the above-mentioned needs, and it is an object of the present invention to provide an optical transceiver module package which first forms a three-dimensional integration space on a board on which electrode lines are formed, so that a light emitting part and a light receiving part can be directly integrated without an additional package structure.
Another object of the present invention is to provide an optical transceiver module package in which an electrical signal is directly transmitted to an inner layer of a board, thereby achieving high speed and reducing an electrical interface.
And, still another object of the present invention is to provide an optical transceiver module package that can integrate a Planar Lightwave Circuit (PLC) directly on a board without an additional component and can simultaneously manufacture a light emitting part and a light receiving part through a process, so that a process time can be greatly shortened.
On the other hand, the object of the present invention is not limited to the above-mentioned object, and other objects not mentioned can be clearly understood by those skilled in the art to which the present invention pertains from the contents described below.
(II) technical scheme
First, in order to achieve the above object, the optical transceiver module package of the present invention may include: a plate formed with an electrode line; a first integration space formed at a predetermined portion in one face of the board and used for integrating a light emitting part for transmitting an optical signal to the outside; a second integration space formed in other predetermined portions in one face of the board and used for integrating a light receiving section receiving a light signal from the outside; an upper case of the board into which the light emitting part and the light receiving part are integrated; a lower case of the board into which the light emitting part and the light receiving part are integrated; a latch for preventing the upper case from being separated from the lower case in a state where the upper case and the lower case are connected; and a socket connected to one ends of the light emitting part and the light receiving part.
Preferably, the light emitting part may include: a heat dissipation block disposed at an upper portion of the first integration space; a laser driver stacked on an upper portion of the heat dissipation block and electrically connected to an electrode line formed on the board; a laser base stacked on the upper part of the laser driver; a plurality of laser diodes stacked on an upper portion of the laser base and arranged at a predetermined interval; an optical multiplexing planar optical waveguide having one end connected to the laser diode and the other end connected to an optical transmitter combined with an optical fiber for transmission, and directly attached to one end of the board; and a cover disposed on an upper portion of the laser diode.
Preferably, the first integrated space may be formed by arranging an optical multiplexing planar optical waveguide directly attached to one end of the board and a cover directly attached to the optical multiplexing planar optical waveguide in such a manner as to form a closed space.
Preferably, the light receiving part may include: a transimpedance amplifier disposed at an upper portion of the first integration space; a photodiode base stacked on an upper portion of the transimpedance amplifier; a photodiode stacked and arranged on an upper portion of the photodiode base; a wide area multiplexing planar optical waveguide having one end connected to the photodiode and the other end connected to an optical receiver combined with a receiving optical fiber, and directly attached to one end of the board; and a cover disposed on an upper portion of the photodiode.
Preferably, the second integrated space may be formed by arranging a wide area multiplexing planar optical waveguide directly attached to one end of the board and a cover directly attached to the wide area multiplexing planar optical waveguide in such a manner as to form a closed space.
(III) advantageous effects
The present invention has the following excellent effects.
First, a three-dimensional integration space is formed on a board on which electrode lines are formed, so that a light emitting part and a light receiving part can be directly integrated without an additional package structure.
In addition, the electric signal is directly transmitted to the inner layer of the board, so that high speed can be realized and the electric interface can be reduced.
Also, the PLC may be directly integrated on a board without an additional component, and the light emitting part and the light receiving part may be simultaneously manufactured through a process, so that a process time may be significantly shortened.
Drawings
Fig. 1 is a perspective view showing the overall structure of an optical transceiver module package according to one embodiment of the present invention.
Fig. 2 is an exploded perspective view illustrating a coupling relationship of the light emitting part and the light receiving part illustrated in fig. 1.
Fig. 3 is a combined perspective view of the light emitting part and the light receiving part shown in fig. 2.
Description of the reference numerals
100: optical transceiver module package according to one embodiment of the present invention
110: board
111: first integration space
112: second integration space
120: light emitting unit
121: heat radiation block
122: laser driver
123: laser base
124: laser diode
125: light emitter
126: optical multiplexing planar optical waveguide
127: cover
130: light-receiving part
131: trans-impedance amplifier
132: photodiode base
133: photodiode
134: optical receiver
135: wide area multiplexed planar optical waveguide
136: cover
140: upper box
150: lower box
160: latch lock
170: socket with improved structure
Detailed Description
As terms used in the present invention, general terms that are widely used at present are selected as much as possible, but in a specific case, there are also terms that the applicant arbitrarily selects, and in this case, the meaning should be determined in consideration of the meaning described or used in the detailed description, rather than by the name of a simple term.
Hereinafter, the technical structure of the present invention will be described in detail with reference to preferred embodiments shown in the accompanying drawings.
In connection with this, first, fig. 1 is a perspective view showing an overall structure of an optical transceiver module package according to one embodiment of the present invention, fig. 2 is an exploded perspective view showing a combination relationship of a light emitting part and a light receiving part shown in fig. 1, and fig. 3 is a combined perspective view of the light emitting part and the light receiving part shown in fig. 2.
Referring to fig. 1 to 3, an optical transceiver module package 100 according to an embodiment of the present invention includes a board 110 formed with electrode lines, wherein various printed circuit boards (printed circuit boards) may be used as the board 110, and thus are not particularly limited.
On the other hand, the optical transceiver module package 100 according to an embodiment of the present invention includes: a first integration space 111 formed at a predetermined portion in one face of the board and for integrating a light emitting part 120 for transmitting an optical signal to the outside; and a second integration space 112 formed at other predetermined portions in one face of the board and for integrating a light receiving section 130 receiving a light signal from the outside.
In this case, a method of forming the first integrated space and the second integrated space will be described later.
On the other hand, as shown in fig. 1, an optical transceiver module package 100 according to an embodiment of the present invention includes: an upper case 140 of the board 110 into which the light emitting part 120 and the light receiving part 130 are integrated; a lower case 150 of the board 110 into which the light emitting part 120 and the light receiving part 130 are integrated; and a latch (latch)160 for preventing the upper case 140 and the lower case 150 from being separated from each other in a state where the upper case 140 and the lower case 150 are connected to each other.
At this time, the upper case 140, the lower case 150, and the latch 160 are configured to protect the board 110, the light emitting part 120, and the light receiving part 130 placed inside the cases 140 and 150, and may be formed of various materials, but, preferably, are formed of a material having durability that can sufficiently withstand external impact or pressure.
On the other hand, the optical transceiver module package 100 according to an embodiment of the present invention includes a receptacle (receptacle)170 connected to one ends of the light emitting part 120 and the light receiving part 130, the receptacle 170 performing a role of connecting optical fibers to a light emitter 125 and a light receiver 134, which will be described later.
Hereinafter, the light emitting part 120 and the light receiving part 130 according to an embodiment of the present invention will be described in detail with reference to fig. 2.
First, the light emitting part 120 includes a heat radiation block 121 disposed at an upper portion of the first integration space 111.
At this time, the heat radiation block 121 is a structure for discharging heat generated from a laser driver 122, which will be described later, to the outside to protect internal circuits and elements, and the heat radiation block 121 may be composed of various materials, and in one embodiment of the present invention, the heat radiation block 121 uses a metal or a nonmetal having excellent thermal conductivity, and particularly, may be composed of aluminum or an aluminum alloy.
On the other hand, the heat dissipation block 121 may be fixed to the first integration space 111 by using an adhesive means such as epoxy resin, and may be fixed to the first integration space 111 by using a force-insertion method without an additional adhesive means.
On the other hand, the light emitting part 120 according to one embodiment of the present invention includes: a laser driver 122 stacked on an upper portion of the heat dissipation block 121 and electrically connected to an electrode line formed on the board 110; a laser base 123 stacked on the upper part of the laser driver 122; and a plurality of laser diodes 124 stacked on an upper portion of the laser base 123 and arranged at a predetermined interval.
The laser driver 122 is a constitution for driving the laser diodes 124, and the laser diodes 124 may be arranged in an appropriate number as needed, and thus is not particularly limited.
On the other hand, the laser driver 122, the laser base 123 and the laser diode 124 may be stacked by an additional bonding method, and in the case of other embodiments, may be forcibly inserted into the first integrated space 111 to be stacked without an additional bonding method.
Also, the light emitting part 120 according to an embodiment of the present invention includes: an optical multiplexing Planar Lightwave Circuit (PLC) 126 having one end connected to the laser diode 124 and the other end connected to an optical transmitter 125 combined with an optical fiber for transmission, and directly attached to one end of the first integration space 111; and a cover 127 disposed on an upper portion of the laser diode 124.
In this case, the first integrated space 111 is formed by arranging the optical multiplexing PLC126 directly attached to one end of the board and the cover 127 directly attached to the optical multiplexing PLC126 to form a closed space.
That is, as described above, in the embodiment of the present invention, the first integrated space 111 forms a closed space using the components constituting the light emitting part and integrates the components of the light emitting part in the space, so that an additional connection part is not required, whereby it is possible to achieve the compactness of the optical transceiver module and to reduce the manufacturing cost.
Next, the light receiving section 130 according to an embodiment of the present invention will be described in detail.
Referring to fig. 2, the light receiving part 130 according to an embodiment of the present invention includes a Trans-impedance Amplifier (TIA) 131 disposed at an upper portion of the second integration space 112.
At this time, the TIA131 serves to minimize signal noise of a photodiode 133, which will be described later, and the light receiving part 130 according to another embodiment of the present invention may further include a capacitor (not shown) for suppressing noise of an electrical signal input to the TIA 131.
On the other hand, the light receiving part 130 according to one embodiment of the present invention includes: a photodiode base 132 stacked on the upper portion of the TIA 131; and a photodiode 133 stacked and arranged on an upper portion of the photodiode base 132.
At this time, the photodiode 133 is a light receiving element for receiving an optical signal input through an optical fiber.
On the other hand, the light receiving part 130 according to one embodiment of the present invention includes: a wide area multiplexing PLC135 having one end connected to the photodiode 133 and the other end connected to an optical receiver 134 combined with a receiving optical fiber, and directly attached to one end of the board 110; and a cover 136 disposed on an upper portion of the photodiode 133.
At this time, the elements constituting the light receiving part 130 may be fixed by additional bonding, respectively, but may be fixed and arranged by being forcibly inserted into the second integrated space 112 as the components of the light emitting part 120.
On the other hand, the present invention is characterized in that the second integrated space 112 is formed by arranging the wide area multiplexing PLC135 directly attached to one end of the board and the cover 136 directly attached to the wide area multiplexing PLC135 in such a manner as to form a closed space.
That is, as described above, in the embodiment of the present invention, the second integrating space 112 forms a closed space by using the components constituting the light receiving part and integrates the components of the light receiving part in the space, so that an additional connecting part is not required, whereby it is possible to realize the compactness of the optical transceiver module and reduce the manufacturing cost.
In summary, the optical transceiver module package according to the embodiment of the present invention forms a three-dimensional integration space on a board on which electrode lines are formed by the above-described technical constitution, so that a light emitting part and a light receiving part can be directly integrated without an additional package structure, and an electrical signal is directly transmitted to an inner layer of the board, so that high speed can be achieved and an electrical interface can be reduced, and a PLC can be directly integrated on the board without an additional component, and a light emitting part and a light receiving part can be simultaneously manufactured by a process, so that a process time can be significantly shortened.
As described above, the present invention has been described with reference to the preferred embodiments and the drawings, but the present invention is not limited to the embodiments, and various changes and modifications can be made by those skilled in the art to which the present invention pertains without departing from the scope of the idea of the present invention.
Claims (5)
1. An optical transceiver module package, comprising:
a plate (110) on which an electrode line is formed;
a first integration space (111) formed at a predetermined portion in one face of the board and used for integrating a light emitting part (120) for transmitting an optical signal to the outside;
a second integration space (112) formed in other predetermined portions in one face of the board and used for integrating a light receiving section (130) receiving a light signal from the outside;
an upper case (140) of the board into which the light emitting part and the light receiving part are integrated;
a lower case (150) of the board into which the light emitting part and the light receiving part are integrated;
a latch (160) which prevents the upper case from being separated from the lower case in a state where the upper case and the lower case are connected; and
and a socket (170) connected to one end of the light emitting part and the light receiving part.
2. The optical transceiver module package of claim 1,
the light emitting section includes:
a heat dissipation block (121) disposed at an upper portion of the first integration space;
a laser driver (122) laminated on an upper portion of the heat dissipation block and electrically connected to an electrode line formed on the board;
a laser base (123) laminated on the upper part of the laser driver;
a plurality of laser diodes (124) stacked on an upper portion of the laser base and arranged at a predetermined interval;
an optical multiplexing planar optical waveguide (126) having one end connected to the laser diode and the other end connected to an optical transmitter (125) coupled to a transmitting optical fiber and directly attached to one end of the board; and
and a cover (127) disposed on an upper portion of the laser diode (124).
3. The optical transceiver module package of claim 2,
the first integrated space (111) is formed by arranging an optical multiplexing planar optical waveguide (126) directly attached to one end of the board and a cover (127) directly attached to the optical multiplexing planar optical waveguide (126) in such a manner as to form a closed space.
4. The optical transceiver module package of claim 1,
the light receiving section includes:
a transimpedance amplifier (131) disposed at an upper portion of the first integration space;
a photodiode base (132) laminated on the upper part of the transimpedance amplifier;
a photodiode (133) stacked and arranged on the upper portion of the photodiode base;
a wide area multiplexing planar optical waveguide (135) having one end connected to the photodiode and the other end connected to an optical receiver (134) combined with a reception optical fiber, and directly attached to one end of the board; and
a cover (136) disposed over the photodiode.
5. The optical transceiver module package of claim 4,
the second integrated space (112) is formed by arranging a wide area multiplexing planar optical waveguide (135) directly attached to one end of the board and a cover (136) directly attached to the wide area multiplexing planar optical waveguide (135) in such a manner as to form a closed space.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180132912A KR102101425B1 (en) | 2018-11-01 | 2018-11-01 | Optical Transceiver Module Package |
| KR10-2018-0132912 | 2018-11-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111142198A true CN111142198A (en) | 2020-05-12 |
Family
ID=70467212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910432313.7A Pending CN111142198A (en) | 2018-11-01 | 2019-05-23 | Optical transceiver module package |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102101425B1 (en) |
| CN (1) | CN111142198A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115632715A (en) * | 2022-12-19 | 2023-01-20 | 西安芯湾科技有限公司 | Optical communication module and optical communication equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170242205A1 (en) * | 2014-08-07 | 2017-08-24 | Optomedia Technology Inc. | Optical transceiver |
| US9918377B1 (en) * | 2014-10-10 | 2018-03-13 | Google Llc | Heat dissipation approach in chip on board assembly by using stacked copper Microvias |
| CN107991743A (en) * | 2018-01-11 | 2018-05-04 | 绍兴柯芯光电技术有限公司 | A kind of optical transceiver module of integrated PLC planar waveguide-types device |
| CN108761666A (en) * | 2018-03-30 | 2018-11-06 | 武汉联特科技有限公司 | A kind of optical module |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002261265A (en) * | 2001-03-06 | 2002-09-13 | Sumitomo Electric Ind Ltd | Optical communication device |
| KR100605385B1 (en) * | 2004-06-18 | 2006-07-31 | 한국전자통신연구원 | Optical Transmitter/Receiver in passive optical network |
| US9923635B2 (en) * | 2016-06-08 | 2018-03-20 | Applied Optoelectronics, Inc. | Optical transmitter or transceiver including reversed planar lightwave circuit (PLC) splitter for optical multiplexing |
| KR101929465B1 (en) * | 2016-10-18 | 2019-03-14 | 주식회사 옵텔라 | Optical module |
-
2018
- 2018-11-01 KR KR1020180132912A patent/KR102101425B1/en active IP Right Grant
-
2019
- 2019-05-23 CN CN201910432313.7A patent/CN111142198A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170242205A1 (en) * | 2014-08-07 | 2017-08-24 | Optomedia Technology Inc. | Optical transceiver |
| US9918377B1 (en) * | 2014-10-10 | 2018-03-13 | Google Llc | Heat dissipation approach in chip on board assembly by using stacked copper Microvias |
| CN107991743A (en) * | 2018-01-11 | 2018-05-04 | 绍兴柯芯光电技术有限公司 | A kind of optical transceiver module of integrated PLC planar waveguide-types device |
| CN108761666A (en) * | 2018-03-30 | 2018-11-06 | 武汉联特科技有限公司 | A kind of optical module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115632715A (en) * | 2022-12-19 | 2023-01-20 | 西安芯湾科技有限公司 | Optical communication module and optical communication equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102101425B1 (en) | 2020-04-20 |
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