CN111141738A - Ultrafast laser drilling and arranging hole and in-situ detection method for composite material plate - Google Patents
Ultrafast laser drilling and arranging hole and in-situ detection method for composite material plate Download PDFInfo
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
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- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
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Abstract
The invention relates to a method for ultrafast laser drilling and in-situ detection of a composite material plate, which comprises the steps of obtaining a conductive material and an insulating material of the composite material plate so as to optimize technological parameters of ultrafast laser drilling; installing a material plate; starting and adjusting the light path; and obtaining an optical signal in the processed hole. The invention has small heat influence on the periphery of a processing area; the punching efficiency and the punching precision of the composite material row holes are improved; internal processing in a depth direction can be controlled by using a focused light beam; the depth and the strength of the processed composite material row and the peripheral cracks can be detected in situ; the number of the row holes can be controlled in real time by the multi-beam parallel laser beam.
Description
Technical Field
The invention relates to the technical field of ultrafast laser processing, in particular to a method for ultrafast laser drilling and in-situ detection of a composite material plate.
Background
The composite material has the characteristics of high strength and light weight, and is widely applied to the aerospace industry. However, due to the high hardness, good wear resistance and non-uniform texture of the composite material, the cutting force increases during cutting, and the tool is easily worn. When the worn cutter is used for cutting, the workpiece is easy to delaminate, the surface of the workpiece is scratched, a large amount of burrs are generated at the inlet and the outlet, and the like, so that the reasonable cutting amount can not be determined according to the processing material, and great difficulty is brought to cutting processing. Composite drilling is currently one of the most challenging issues facing the industrial field, especially the aerospace industry. In the past, problems of cracking, delamination, burning, poor surface quality and poor coaxiality occurred when drilling composite materials. These problems are particularly acute when drilling laminates or multi-layer materials, such as the upper layer of cochinchia alloy, the bottom layer of aluminum alloy and the middle layer of carbon fiber reinforced plastic. The sand-containing and hydraulic punching can generate small cutting force, but the machining precision is low, and in addition, the water-containing and water-soluble solution can cause the part to swell, and the defects of layering, pollution to an operation field and the like can occur in the punching process, so the method is generally not recommended to be adopted. The laser processing has the characteristics of no tool abrasion, no contact with a workpiece, high processing precision and the like, so the defects can be overcome. The laser head with the light-gathering diameter of 00.020-0.25 mm can drill holes and punch holes on thin-wall parts made of composite materials, and the laser head can also punch holes on thin-wall parts with the thickness of 0.025mm if the processing parameters are reasonably selected. The traditional laser is adopted to drill (erode) holes, because the laser pulse width is wide, the duration time of the laser pulse impact is long, and the laser pulse width is mostly nano (10)-9) On the order of seconds, much longer than the time required for thermal diffusion or conduction, which results in thermal diffusion and conduction to the surrounding area, it is necessary to form a "heat-affected zone" with a thickness of several tens of microns to several hundreds of microns, where thermal damage or damage (such as melting, deformation, wrinkling, roughness, etc.) can form at the interface between this "heat-affected zone" thickness and its surrounding areaCracks or delamination, etc.) to eliminate these defects and problems, subsequent processing (e.g., grinding, microetching, cleaning, etc.) is often employed, which can result in product quality, lifetime issues, and other defects and quality (reliability) issues resulting from thermal damage to the machined hole. However, when a strong laser pulse is applied for as short as several hundred ultrafast or shorter laser pulses, or more than 100 million laser pulses per second, the impact (impact) time is extremely short and the material to be impacted is removed very quickly, so that it is almost impossible or impossible to cause thermal diffusion and conduction, or thermal diffusion or conduction of a substance takes a certain time (generally, within picoseconds), and the problem of thermal destruction of a "heat affected zone" is certainly avoided only when the impact time of the laser pulse is shorter than the thermal diffusion or conduction time required for the material to be processed. The ultrafast laser pulse has short action time and very high instantaneous power, can change substances in different forms into plasma instantly, can generate very peculiar phenomenon when acting on the substances, and has the advantages of small heat effect and high processing precision. In order to improve the processing efficiency of the ultrafast laser in the high-specific-strength composite material row-drilling processing process, a multi-beam parallel row-drilling processing method is adopted, so that the processing efficiency can be greatly improved.
Disclosure of Invention
In order to avoid the problems of defects and quality (reliability) caused by thermal damage of a high-strength composite material in the process of perforating and simultaneously monitor the material strength of the high-strength composite material in real time and the coupling between microcracks and depth occurring in the perforating process, the invention provides an ultrafast laser perforating and in-situ detection method for a composite material plate, which comprises the following steps:
acquiring a conductive material and an insulating material of a composite material plate to optimize ultrafast laser drilling process parameters, thereby obtaining process parameters with high drilling efficiency and good hole section quality, and storing the optimized process parameters in an industrial personal computer;
step two, clamping and centering the composite material plate, and aligning the position to be punched by using an ultrafast laser probe;
turning on the ultrafast laser, reflecting the emitted laser by a laser reflector, passing through a half wave plate, a polarization beam splitter and two reflectors, and then irradiating the laser into the spatial light modulator, wherein the laser capacity can be adjusted by rotating the angle of the half wave plate;
loading a hologram on the spatial light modulator, modulating the phase of light to generate multiple beams, enabling the multiple beams to pass through a 4F optical information processing system to eliminate the influence of zero-order light on processing, further enabling the 4F optical information processing system to present the image of the spatial light modulator on a processing plane, and enabling the multiple beams to perform multiple-beam parallel processing on the composite material plate;
processing the obtained optical signal in the hole at the processing position through a turnover mirror and a lens through a spectrometer, transmitting the optical signal to an industrial personal computer, and changing relevant processing parameters in real time through the industrial personal computer;
step five, properly clamping the composite material plate needing to be punched with the holes on a processing table, and enabling multiple beams subjected to phase modulation to pass through a reflector and then emit multiple beam laser beams to act on the composite material plate through a laser probe;
placing a pulse generator near the hole area of the composite material plate to be detected and punched, installing a holographic camera near the hole area of the composite material plate to be detected and punched, and shooting optical information of the hole of the composite material plate by the holographic camera;
processing an optical signal shot by a holographic camera through a spectrometer, and transmitting the optical signal to an industrial personal computer to obtain a stripe pattern of a hole of the composite plate, so that the stripe pattern is detected and analyzed in real time to find out defects, if the hole of the composite plate has cracks, a clear dynamic hologram of the hole cracks of the composite plate can be obtained, and the purpose of in-situ detection of ultrafast laser drilling holes of the composite plate is achieved;
step seven, setting relevant process parameters of ultrafast laser drilling aiming at the thick composite material plate through an industrial personal computer aiming at the relevant parameter reference in the step one, sending an instruction, starting an ultrafast laser, and irradiating laser emitted by the ultrafast laser to the surface of the composite material plate after a series of shaping to drill holes;
placing a pulse generator near a hole area of the composite material to be detected and punched in the punching process, installing a holographic camera near the hole area of the composite material thick plate to be detected and punched, and shooting optical information of the hole of the composite material thick plate;
meanwhile, a stress wave sent by the pulse generator enters a detection part, a fluctuation signal after a series of changes of refraction and diffuse scattering are generated in a discontinuous change area around the hole of the composite material and is received by a stress wave sensor attached to the CCD camera, the fluctuation signal is transmitted to an industrial control station and is processed by a detector, and the layering condition around the hole of the composite material can be detected in real time;
processing an optical signal shot by a holographic camera through a spectrometer, and transmitting the optical signal to an industrial personal computer to obtain a stripe pattern of the holes of the thick plate made of the composite material, so that the stripe pattern and the microcrack condition at different depths of the holes of the thick plate made of the composite material are detected and analyzed in real time;
ninth, in the process of processing the row holes, laser emitted by the ultrafast device is irradiated to the surface of the composite material plate after being shaped by a series of shapes, the laser is transmitted to an industrial personal computer by utilizing corresponding process parameters of the layer, in the process of punching at one side, optical signals shot by the CCD camera are processed by a spectrometer and are transmitted to the industrial personal computer to obtain stripe patterns of the holes of the composite material thick plate, so that the stripe patterns at different depths of the holes of the composite material thick plate are detected and analyzed in real time, clear dynamic holograms of the cracks of the holes of the composite material are obtained, meanwhile, a stress wave sensor is used for transmitting fluctuation signals of stress waves to defect areas around the holes to an industrial control console for analysis and processing, and when the industrial personal computer receives the fluctuation signals processed by the geophone, the optical signals and the holograms processed by the spectrometer, the accuracy requirements of the holes processed by the composite material thick plate and the mechanical properties of the composite material thick plate as the lower layer are judged to The control console transmits the processing technological parameters of the ultrafast laser to the control console, whether the ultrafast laser stops processing or not is determined by utilizing the technological parameters optimized by the industrial control console, and the composite material plate is continuously processed and arranged with holes by using the optimized subsequent technological parameters, so that the hole arrangement mode is realized by ultrafast laser until the holes are punched until the composite material plate obtains the hole arrangement holes with ideal depth and excellent mechanical property.
Further, the laser emitted by the ultrafast laser can adjust the laser energy by turning to the angle of the half wave plate.
Furthermore, the 4F optical information processing system comprises a first lens, a second laser reflector, a spatial filter, a third laser reflector and a second lens, laser is reflected to the spatial filter through the first lens and the second laser reflector, and is reflected through the second lens and then enters the rear component after passing through the laser filter and the third laser reflector.
The invention has the beneficial effects that:
the invention relates to a precise laser processing technology which can realize a non-heat-affected zone and carry out in-situ detection on composite material hole punching.
The method has the advantages that ① has little thermal influence on the periphery of a processing area, ② improves the punching efficiency and punching precision of the composite material row holes, ③ can utilize a focused light beam to carry out internal processing in a depth direction, ④ can carry out in-situ detection on the depth and intensity of the processed composite material row and peripheral cracks, ⑤ can control the number of row holes in real time through a multi-beam parallel laser beam
Drawings
FIG. 1 is a schematic view of the overall structure of the apparatus required for punching and detecting in the present invention;
FIG. 2 is a schematic flow chart of the present invention;
in the figure: 1-industrial personal computer, 2-ultrafast laser, 3-laser reflector I, 4-half wave plate, 5-polarization spectroscope, 6-spatial light modulator, 7-lens I, 8-laser reflector II, 9-spatial filter, 10-laser reflector III, 11-lens II, 12-electric turnover mirror, 13-lens III, 14-spectrometer, 15-laser reflector IV, 16-laser probe, 17-holographic camera, 18-pulse generator, 19-composite material plate and 20-processing table
Detailed Description
The invention is further described with reference to the following drawings and specific embodiments.
Fig. 1 shows a processing and detecting apparatus according to the present invention, which includes an industrial personal computer for receiving, processing and feeding back various processing information, an ultrafast laser for generating and emitting ultrafast laser, a first laser mirror, a wave plate, a polarization beam splitter, a spatial light modulator, a first lens, a second laser mirror, a spatial filter, a third laser mirror, a second lens, an electric flip mirror, a third lens, a spectrometer, a fourth laser mirror, a laser probe, a holographic camera, a pulse generator, a composite material plate, and a processing table. The first lens, the second lens and the third lens are plano-concave lenses of F500, F500 and F300 respectively.
The pulse generator emits a stress wave to enter the processed hole, the ultrafast laser generates and emits ultrafast laser, the holographic camera is installed at the upper right of the processed and evacuated position and is used for shooting optical information of the processed hole, the spectrograph receives and processes optical signals and transmits the optical signals to the industrial personal computer, and the composite material plate is placed on the processing table.
Referring to fig. 1 and 2, the method comprises the following specific steps:
acquiring a conductive material and an insulating material of a composite material plate to optimize ultrafast laser drilling process parameters, thereby obtaining process parameters with high drilling efficiency and good hole section quality, and storing the optimized process parameters in an industrial personal computer;
step two, clamping and centering the composite material plate, and aligning the position to be punched by using an ultrafast laser probe;
and step three, turning on the ultrafast laser, reflecting the emitted laser by the laser reflector, passing through the half-wave plate, the polarization beam splitter and the two reflectors, and then irradiating the laser into the spatial light modulator, wherein the two reflectors are not shown in the figure. Wherein the laser power can be adjusted by rotating the angle of the half wave plate;
loading a hologram on the spatial light modulator, modulating the phase of light to generate multiple beams, wherein the multiple beams pass through a 4F optical information processing system to eliminate the influence of zero-order light on processing, the 4F optical information processing system comprises a first lens, a second laser reflector, a spatial filter, a third laser reflector and a second lens, laser is reflected to the spatial filter through the first lens and the second laser reflector, the laser passes through the laser filter and then the third laser reflector and then enters a rear part, the spatial filter is arranged at the focus of the first lens to block the zero-order light, then the 4F optical information processing system presents the image of the spatial light modulator (subjected to Fourier transform thickness) on a processing plane, and multiple beams are used for processing a composite material plate in parallel;
processing the obtained optical signal in the hole at the processing position through a turnover mirror and a lens, transmitting the optical signal to an industrial personal computer, and changing relevant processing parameters in real time through the industrial personal computer;
step five, properly clamping the composite material plate needing to be punched with the holes on a processing table, and enabling multiple beams subjected to phase modulation to pass through a reflector and then emit multiple beam laser beams to act on the composite material plate through a laser probe;
placing a pulse generator near the hole area of the composite material plate to be detected and punched, installing a holographic camera near the hole area of the composite material plate to be detected and punched, and shooting optical information of the hole of the composite material plate by the holographic camera; during detection, the pulse generator sends a stress wave to enter a detection part, the stress wave generates a series of changes such as refraction, diffuse scattering and the like in discontinuous change areas such as layering and microcrack defects and the like around the holes of the composite material, and fluctuation signals generated by the high sensitivity of the stress wave to the defect areas are analyzed so as to detect the layering and microcrack defects around the holes of the composite material; processing an optical signal shot by a holographic camera through a spectrometer, and transmitting the optical signal to an industrial personal computer to obtain a stripe pattern of a hole of the composite plate, so that the stripe pattern is detected and analyzed in real time to find out defects, if the hole of the composite plate has cracks, a clear dynamic hologram of the hole cracks of the composite plate can be obtained, and the purpose of in-situ detection of ultrafast laser drilling holes of the composite plate is achieved;
step seven, setting relevant process parameters of ultrafast laser drilling aiming at the thick composite material plate through an industrial personal computer aiming at the relevant parameter reference in the step one, sending an instruction, starting an ultrafast laser, and irradiating laser emitted by the ultrafast laser to the surface of the composite material plate after a series of shaping to drill holes;
placing a pulse generator near a hole area of the composite material to be detected and punched in the punching process, installing a holographic camera near the hole area of the composite material thick plate to be detected and punched, and shooting optical information of the hole of the composite material thick plate by the holographic camera; meanwhile, a stress wave sent by the pulse generator enters a detection part, a fluctuation signal after a series of changes such as refraction, diffuse scattering and the like are generated in discontinuous change areas such as layering and microcrack defects around the holes of the composite material is received by a stress wave sensor attached to the CCD camera, the fluctuation signal is transmitted to an industrial control console, and the fluctuation signal is processed by a detector so as to detect the layering situation around the holes of the composite material in real time; processing an optical signal shot by a holographic camera through a spectrometer, and transmitting the optical signal to an industrial personal computer to obtain a stripe pattern of the holes of the thick plate made of the composite material, so that the stripe pattern and the microcrack condition at different depths of the holes of the thick plate made of the composite material are detected and analyzed in real time;
ninth, in the process of processing the row holes, laser emitted by the ultrafast device is irradiated to the surface of the composite material plate after being shaped by a series of shapes, the laser is transmitted to an industrial personal computer by utilizing corresponding process parameters of the layer, in the process of punching at one side, optical signals shot by the CCD camera are processed by a spectrometer and are transmitted to the industrial personal computer to obtain stripe patterns of the holes of the composite material thick plate, so that the stripe patterns at different depths of the holes of the composite material thick plate are detected and analyzed in real time, clear dynamic holograms of the cracks of the holes of the composite material are obtained, meanwhile, a stress wave sensor is used for transmitting fluctuation signals of stress waves to defect areas around the holes to an industrial control console for analysis and processing, and when the industrial personal computer receives the fluctuation signals processed by the geophone, the optical signals and the holograms processed by the spectrometer, the accuracy requirements of the holes processed by the composite material thick plate and the mechanical properties of the composite material thick plate as the lower layer are judged to The control console transmits the processing technological parameters of the ultrafast laser to the control console, whether the ultrafast laser stops processing or not is determined by utilizing the technological parameters optimized by the industrial control console, and the composite material plate is continuously processed and arranged with holes by using the optimized subsequent technological parameters, so that the hole arrangement mode is realized by ultrafast laser until the holes are punched until the composite material plate obtains the hole arrangement holes with ideal depth and excellent mechanical property.
It should be understood that parts of the specification not set forth in detail are well within the prior art.
It should be understood that the above description of the preferred embodiments is given for clarity and not for any purpose of limitation, and that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (3)
1. A method for ultrafast laser drilling and in-situ detection of composite material plates is characterized by comprising the following steps: the method comprises the following steps:
acquiring a conductive material and an insulating material of a composite material plate to optimize ultrafast laser drilling process parameters, thereby obtaining process parameters with high drilling efficiency and good hole section quality, and storing the optimized process parameters in an industrial personal computer;
step two, clamping and centering the composite material plate, and aligning the position to be punched by using an ultrafast laser probe;
turning on the ultrafast laser, reflecting the emitted laser by a laser reflector, passing through a half wave plate, a polarization beam splitter and two reflectors, and then irradiating the laser into the spatial light modulator, wherein the laser capacity can be adjusted by rotating the angle of the half wave plate;
loading a hologram on the spatial light modulator, modulating the phase of light to generate multiple beams, enabling the multiple beams to pass through a 4F optical information processing system to eliminate the influence of zero-order light on processing, further enabling the 4F optical information processing system to present the image of the spatial light modulator on a processing plane, and enabling the multiple beams to perform multiple-beam parallel processing on the composite material plate;
processing the obtained optical signal in the hole at the processing position through a turnover mirror and a lens through a spectrometer, transmitting the optical signal to an industrial personal computer, and changing relevant processing parameters in real time through the industrial personal computer;
step five, properly clamping the composite material plate needing to be punched with the holes on a processing table, and enabling multiple beams subjected to phase modulation to pass through a reflector and then emit multiple beam laser beams to act on the composite material plate through a laser probe;
placing a pulse generator near the hole area of the composite material plate to be detected and punched, installing a holographic camera near the hole area of the composite material plate to be detected and punched, and shooting optical information of the hole of the composite material plate by the holographic camera;
processing an optical signal shot by a holographic camera through a spectrometer, and transmitting the optical signal to an industrial personal computer to obtain a stripe pattern of a hole of the composite plate, so that the stripe pattern is detected and analyzed in real time to find out defects, if the hole of the composite plate has cracks, a clear dynamic hologram of the hole cracks of the composite plate can be obtained, and the purpose of in-situ detection of ultrafast laser drilling holes of the composite plate is achieved;
step seven, setting relevant process parameters of ultrafast laser drilling aiming at the thick composite material plate through an industrial personal computer aiming at the relevant parameter reference in the step one, sending an instruction, starting an ultrafast laser, and irradiating laser emitted by the ultrafast laser to the surface of the composite material plate after a series of shaping to drill holes;
placing a pulse generator near a hole area of the composite material to be detected and punched in the punching process, installing a holographic camera near the hole area of the composite material thick plate to be detected and punched, and shooting optical information of the hole of the composite material thick plate;
meanwhile, a stress wave sent by the pulse generator enters a detection part, a fluctuation signal after a series of changes of refraction and diffuse scattering are generated in a discontinuous change area around the hole of the composite material and is received by a stress wave sensor attached to the CCD camera, the fluctuation signal is transmitted to an industrial control station and is processed by a detector, and the layering condition around the hole of the composite material can be detected in real time;
processing an optical signal shot by a holographic camera through a spectrometer, and transmitting the optical signal to an industrial personal computer to obtain a stripe pattern of the holes of the thick plate made of the composite material, so that the stripe pattern and the microcrack condition at different depths of the holes of the thick plate made of the composite material are detected and analyzed in real time;
ninth, in the process of processing the row holes, laser emitted by the ultrafast device is irradiated to the surface of the composite material plate after being shaped by a series of shapes, the laser is transmitted to an industrial personal computer by utilizing corresponding process parameters of the layer, in the process of punching at one side, optical signals shot by the CCD camera are processed by a spectrometer and are transmitted to the industrial personal computer to obtain stripe patterns of the holes of the composite material thick plate, so that the stripe patterns at different depths of the holes of the composite material thick plate are detected and analyzed in real time, clear dynamic holograms of the cracks of the holes of the composite material are obtained, meanwhile, a stress wave sensor is used for transmitting fluctuation signals of stress waves to defect areas around the holes to an industrial control console for analysis and processing, and when the industrial personal computer receives the fluctuation signals processed by the geophone, the optical signals and the holograms processed by the spectrometer, the accuracy requirements of the holes processed by the composite material thick plate and the mechanical properties of the composite material thick plate as the lower layer are judged to The control console transmits the processing technological parameters of the ultrafast laser to the control console, whether the ultrafast laser stops processing or not is determined by utilizing the technological parameters optimized by the industrial control console, and the composite material plate is continuously processed and arranged with holes by using the optimized subsequent technological parameters, so that the hole arrangement mode is realized by ultrafast laser until the holes are punched until the composite material plate obtains the hole arrangement holes with ideal depth and excellent mechanical property.
2. The method for ultrafast laser drilling and in-situ detection of composite material plate according to claim 1, wherein: the laser emitted by the ultrafast laser can adjust the laser energy by rotating to the angle of the half wave plate.
3. The method for ultrafast laser drilling and in-situ detection of composite material plate according to claim 1, wherein: the 4F optical information processing system comprises a first lens, a second laser reflector, a spatial filter, a third laser reflector and a second lens, wherein laser is reflected to the spatial filter through the first lens and the second laser reflector, and is reflected through the second lens and then enters a rear part after passing through the laser filter and the third laser reflector.
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