CN111132515B

CN111132515B - Circuit board device and electronic equipment

Info

Publication number: CN111132515B
Application number: CN201911381055.0A
Authority: CN
Inventors: 吴会兰
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2019-12-27
Filing date: 2019-12-27
Publication date: 2021-11-30
Anticipated expiration: 2039-12-27
Also published as: WO2021129837A1; CN111132515A

Abstract

The embodiment of the invention provides a circuit board device and electronic equipment. The circuit board device comprises a first circuit board, a second circuit board and a heat dissipation assembly; the first circuit board is electrically connected with the second circuit board, and an accommodating cavity is formed between the first circuit board and the second circuit board; the first circuit board and/or the second circuit board are/is provided with heat dissipation holes, and the heat dissipation holes are communicated with the accommodating cavity; the heat dissipation assembly comprises magnetic fan blades and at least one group of conductive coils, and each group of conductive coils comprises two conductive coils; the magnetic fan blades are arranged in the accommodating cavity and arranged on the second circuit board; the conductive coil is fixed on the second circuit board and is opposite to the magnetic fan blade; when the conductive coil is electrified, the magnetic fan blades rotate in an electromagnetic field generated by the conductive coil. In the embodiment of the invention, the heat generated by the electronic element in the accommodating cavity can be discharged from the heat dissipation hole through the heat dissipation assembly, so that the heat is not accumulated in the accommodating cavity any more, the performance of the electronic equipment can be improved, and the user experience is improved.

Description

Circuit board device and electronic equipment

Technical Field

The present invention relates to the field of electronic devices, and in particular, to a circuit board device and an electronic device.

Background

With the extreme pursuit of the use experience, the performance requirements of users on electronic devices such as smart phones and tablet computers are higher and higher, and more electronic elements need to be placed on the circuit boards of the electronic devices.

In the related art, in order to place more electronic components in the circuit board device, a plurality of stacked circuit boards may be disposed in the circuit board device, and two adjacent circuit boards may be electrically connected through the interposer. In particular, a receiving cavity may be formed between two adjacent circuit boards, and the receiving cavity may be used for receiving electronic components, so as to place as many electronic components as possible in the circuit board device.

However, in the process of operating the electronic device, heat generated by the electronic components on the circuit board is easily accumulated in the accommodating cavity, so that the temperature in the accommodating cavity is increased, thereby affecting the use of the electronic device and reducing the user experience.

Disclosure of Invention

In view of this, embodiments of the present invention provide a circuit board device and an electronic apparatus, so as to solve the problem that the use of the electronic apparatus is affected by the temperature increase in the accommodating cavity of the circuit board device in the electronic apparatus.

In a first aspect, an embodiment of the present invention provides a circuit board device, where the circuit board device includes a first circuit board, a second circuit board, and a heat dissipation assembly;

the first circuit board is electrically connected with the second circuit board, and an accommodating cavity is formed between the first circuit board and the second circuit board;

the first circuit board and/or the second circuit board are/is provided with heat dissipation holes, and the heat dissipation holes are communicated with the accommodating cavity;

the heat dissipation assembly comprises magnetic fan blades and at least one group of conductive coils, and each group of conductive coils comprises two conductive coils;

the magnetic fan blades are arranged in the accommodating cavity and arranged on the second circuit board;

the conductive coil is fixed on the second circuit board and is opposite to the magnetic fan blade;

when the conductive coil is electrified, the magnetic fan blades rotate in an electromagnetic field generated by the conductive coil.

In a second aspect, an embodiment of the present invention provides an electronic device, which includes the circuit board apparatus described in the first aspect.

The technical scheme provided by the embodiment of the invention at least has the following beneficial effects:

in the invention, the heat dissipation assembly comprises the magnetic fan blades and at least one group of conductive coils, and the conductive coils are fixed on the second circuit board and are opposite to the magnetic fan blades, so that the magnetic fan blades rotate in an electromagnetic field generated by the conductive coils under the condition that the conductive coils are electrified, and air in the accommodating cavity can flow after the magnetic fan blades rotate. In addition, because the heat dissipation assembly is arranged in the accommodating cavity formed between the first circuit board and the second circuit board, and the heat dissipation holes are formed in the first circuit board and/or the second circuit board, after air in the accommodating cavity flows, heat generated by the electronic element in the accommodating cavity can be discharged from the heat dissipation holes along with the flowing of the air, so that the heat is not accumulated in the accommodating cavity, the performance of the electronic equipment can be improved, and the user experience is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.

Fig. 1 is a schematic diagram of a circuit board device according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a layout of two sets of conductive coils according to an embodiment of the present invention;

FIG. 3 is a timing diagram of the energization of the two sets of conductive coils in FIG. 2;

FIG. 4 is a schematic diagram of a conductive coil provided by an embodiment of the present invention;

FIG. 5 is a schematic diagram of another circuit board arrangement provided by an embodiment of the present invention;

FIG. 6 is a schematic diagram of another circuit board arrangement provided by an embodiment of the present invention;

fig. 7 is a schematic diagram of another circuit board device according to an embodiment of the present invention.

Reference numerals:

10: a first circuit board; 20: a second circuit board; 11: heat dissipation holes; 22: a via hole; 30: a heat dissipating component; 31: magnetic fan blades; 32: a conductive coil; 33: a rotating shaft; 311: a first fan blade; 312: a second fan blade; 40: an electronic component.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Fig. 1 is a schematic diagram of a circuit board device according to an embodiment of the present invention. As shown in fig. 1, the circuit board arrangement may include a first circuit board 10, a second circuit board 20, and a heat dissipation assembly 30.

The first circuit board 10 and the second circuit board 20 are electrically connected, and a receiving cavity is formed between the first circuit board 10 and the second circuit board 20. The first circuit board 10 and/or the second circuit board 20 are/is provided with heat dissipation holes 11, and the heat dissipation holes 11 are communicated with the accommodating cavities. The heat dissipation assembly 30 includes magnetic blades 31 and at least one set of conductive coils 32, and each set of conductive coils 32 includes two conductive coils 32. The magnetic fan blades 31 are disposed in the accommodating cavity and on the second circuit board 20, and the conductive coil 32 is fixed on the second circuit board 20 and opposite to the magnetic fan blades 31. With the conductive coil 32 energized, the magnetic fan 31 rotates within the electromagnetic field generated by the conductive coil 32. .

In the embodiment of the present invention, since the heat dissipation assembly 30 includes the magnetic fan blades 31 and at least one set of conductive coils 32, and the conductive coils 32 are fixed on the second circuit board 20 and are opposite to the magnetic fan blades 31, when the conductive coils 32 are energized, the magnetic fan blades 31 rotate within the electromagnetic field generated by the conductive coils 31, and the air in the accommodating cavity flows after the magnetic fan blades 31 rotate. In addition, because the heat dissipation assembly 30 is disposed in the accommodating cavity formed between the first circuit board 10 and the second circuit board 20, and the heat dissipation holes 11 are disposed on the first circuit board 10 and/or the second circuit board 20, after the air in the accommodating cavity flows, the heat generated by the electronic component 40 in the accommodating cavity can be discharged from the heat dissipation holes 11 along with the air flowing, so that the heat is no longer accumulated in the accommodating cavity, thereby improving the performance of the electronic device and improving the user experience.

It should be noted that, in the embodiment of the present invention, both ends of the conductive coil may be connected to a power supply in the electronic device, the power supply is connected to the controller, and the controller may control the power supply to supply power to the conductive coil, so as to energize the conductive coil.

In addition, in some embodiments, in order to facilitate rotation of the magnetic fan 31 within the electromagnetic field generated by the conductive coil 32 when the conductive coil 32 is powered on, as shown in fig. 1, the magnetic fan 31 may include a first fan 311 and a second fan 312, the first fan 311 is connected to the second fan 312, and the magnetic poles of the first fan 311 are opposite to those of the second fan 312.

After each set of conductive coils 32 is energized, each set of conductive coils 32 generates two magnetic fields after being energized, and at this time, since the magnetic poles of the first fan blade 311 and the second fan blade 312 are opposite, the magnetic pole of one of the two magnetic fields may be opposite to the magnetic pole of the first fan blade 311, and the magnetic pole of the other magnetic field may be opposite to the magnetic pole of the second fan blade 312. Because there is an attraction force between the opposite magnetic forces, one magnetic field attracts the first fan blade 311, and the other magnetic field attracts the second fan blade 312, and during the process of attracting both the first fan blade 311 and the second fan blade 312, the first fan blade 311 and the second fan blade 312 rotate. Or, the magnetism of one of the two magnetic fields may be the same as that of first blade 311, and the magnetism of the other magnetic field may be the same as that of second blade 312, at this time, because there is a repulsive force between the communicated magnetism, one magnetic field repels first blade 311, and the other magnetic field repels second blade 312, and in the process of repelling both first blade 311 and second blade 312, first blade 311 and second blade 312 rotate.

Additionally, in some embodiments, the magnetic fan 31 is positioned between two conductive coils 32 of each set of conductive coils 32. The two conductive coils 32 in each set of conductive coils 32 are energized in opposite directions at the same time and are simultaneously de-energized or simultaneously energized. Wherein, the magnetic fan blade 31 can be located on the connection line of the two conductive coils 32.

Because the magnetic fan blades 31 are located between the two conductive coils 32 of each conductive coil group 32 and on the connection line of the two conductive coils 32, when the current directions of the two conductive coils 32 in each conductive coil group 32 are opposite at the same time and the two conductive coils are simultaneously electrified, the magnetic field generated by one conductive coil 32 in the two conductive coils 32 is opposite to the magnetic field generated by the other conductive coil 32, at this time, no matter the magnetism of the first fan blade 311 in the magnetic fan blades 31 is the same as or opposite to the magnetism of the magnetic field generated by one conductive coil 32, the magnetism of the second fan blade 312 is the same as or opposite to the magnetism of the magnetic field generated by the other conductive coil 32, the conductive coils 32 can drive the first fan blade 311 and the second fan blade 312 to rotate.

Additionally, where heat dissipation assembly 30 includes multiple sets of conductive coils 32, the multiple sets of conductive coils 32 may be alternately energized. The alternating energization of the plurality of sets of conductive coils 32 means that when a first pair of conductive coils 32 in the plurality of sets of conductive coils 32 is energized, the other pairs of conductive coils 32 are not energized, when a second pair of conductive coils 32 is energized, the other pairs of conductive coils 32 are not energized, and so on until each set of conductive coils 32 in the plurality of sets of conductive coils 32 is energized.

For example, fig. 2 is a schematic diagram of a layout of two sets of conductive coils according to an embodiment of the present invention. Fig. 3 is a timing diagram of the energization of the two sets of conductive coils in fig. 2. As shown in fig. 2, the first pair of conductive coils 32 of the two sets of conductive coils 32 are deployed at

positions

1 and 3, and the second pair of conductive coils 32 are deployed at

positions

2 and 4. The magnetic fan blades 31 are located on the connecting line of the two groups of conductive coils 32. The magnetic property of the first blade 311 in the magnetic blade 31 is N, and the magnetic property of the second blade 312 is S. As shown in fig. 3, the two conductive coils 32 in

positions

1 and 3 are energized simultaneously, and the current flow in the two conductive coils 32 in

positions

1 and 3 is in opposite directions. At this point, no current is applied to the two conductive coils 32 in

positions

2 and 4.

If the magnetism of the electromagnetic field generated by the conductive coil 32 in the position 1 is N, the magnetism of the electromagnetic field generated by the conductive coil 32 in the position 3 is S, and at this time, the conductive coil 32 in the position 1 and the conductive coil 32 in the position 3 can drive the first fan blade 311 and the second fan blade 312 to rotate. Then power is applied to conductive coil 32 in position 2 and conductive coil 32 in position 4, power is removed from conductive coil 32 in position 1 and conductive coil 32 in position 3, the current direction in the conductive coil 32 at the position 2 is the same as the current direction when the conductive coil 32 at the position 1 is electrified, the current direction in the conductive coil 32 at the position 4 is the same as the current direction when the conductive coil 32 at the position 3 is electrified, the magnetism of the magnetic field generated by the conductive coil 32 at the position 2 is the same as the magnetism of the magnetic field generated by the conductive coil 32 at the position 1 when the conductive coil 32 at the position 1 is electrified, the magnetism of the magnetic field generated by the conductive coil 32 at the position 4 is the same as the magnetism of the magnetic field generated by the conductive coil 32 at the position 3 when the conductive coil 32 at the position 2 is electrified, and the conductive coil 32 at the position 4 can continuously drive the first fan blade 311 and the second fan blade 312 to rotate, moreover, the rotation directions of the first blade 311 and the second blade 312 can be kept unchanged. That is, when the first blade 311 and the second blade 312 rotate clockwise under the action of the conductive coil 32 in the position 1 and the conductive coil 32 in the position 3, the first blade 311 and the second blade 312 still rotate clockwise under the action of the conductive coil 32 in the position 2 and the conductive coil 32 in the position 4.

It should be noted that, in the embodiment of the present invention, when the conductive coil 32 is powered on, the power supplied to the conductive coil 32 is an alternating current.

In addition, to facilitate fixing the conductive coil 32, in some embodiments, as shown in fig. 1, at least one pair of via holes 22 may be disposed on the second circuit board 20, and the conductive coil 32 is disposed in the via holes 22.

When at least one pair of via holes 22 is formed on the second circuit board 20, the conductive coil 32 can be disposed in the via holes 22 without additionally disposing other components in the receiving cavity to fix the conductive coil 32.

In addition, in order to enable the magnetic field generated by the conductive coil 32 after being electrified to facilitate the rotation of the magnetic fan blade 31 after the conductive coil 32 is disposed in the via hole 22, in some embodiments, the axial direction of the via hole 22 may be perpendicular to the rotation plane of the magnetic fan blade 31 during the rotation.

When the axial direction of the via hole 22 is perpendicular to the rotation plane of the magnetic fan blade 31 during rotation, it means that the conductive coil 32 is also perpendicular to the rotation plane of the magnetic fan blade 31 during rotation, and therefore, the magnetic field generated by the conductive coil 32 can better drive the magnetic fan blade 31 to rotate.

Additionally, in some embodiments, the conductive coil 32 may be disposed in the via 22 by: as shown in fig. 4, the second circuit board 20 may include a plurality of layers of circuit boards, each via hole 22 penetrates each layer of circuit board, a hole wall of each via hole 22 forms a non-closed coil on each layer of circuit board, and two adjacent non-closed coils are electrically connected to form the conductive coil 32.

In the case that the second circuit board 20 includes multiple layers of circuit boards, the non-closed coil can be directly formed on each layer of circuit board by using the hole walls of the via holes 22, and at this time, the conductive coil 32 is formed without using other materials, which can save materials.

It should be noted that the conductive coil 22 may be fixed in the via hole 22 without forming a non-closed coil on each layer of the circuit board on the wall of the via hole 22.

In addition, when the magnetic fan 31 rotates in the electromagnetic field generated by the conductive coil 32, in order to facilitate the rotation of the magnetic fan 31, in some embodiments, as shown in fig. 1, the heat dissipation assembly 30 may further include a rotating shaft 33. The rotating shaft 33 can be arranged on the second circuit board 20, the rotating shaft 33 is located between the two conductive coils 32 of each conductive coil 32 group and is located on a connecting line of the two conductive coils 32, a rotating shaft hole is formed in the magnetic fan blade 31, and the magnetic fan blade 31 is nested on the rotating shaft 33 through the rotating shaft hole.

Because set up the pivot hole on the magnetism flabellum 31, magnetism flabellum 31 alright with through the nested pivot on pivot 33 of pivot hole, later, when conductive coil 32 produced the electromagnetic field, magnetism flabellum 31 alright rotate round pivot 33 to, magnetism flabellum 31 is at the pivoted in-process, the pivot can also play the effect of fixed magnetism flabellum 31, makes magnetism flabellum 31 can not produce offset because of rotating.

It should be noted that the connection line of the two conductive coils 32 is a connection line between the axis of one conductive coil 32 and the axis of the other conductive coil 32.

In addition, in order to make the driving force of the magnetic fan blade 31 in the electromagnetic field generated by the conductive coils 32 uniform, and ensure that the magnetic fan blade 31 does not deflect and wear away from the rotating shaft during the rotation process, in some embodiments, the rotating shaft 33 may be located at the midpoint of the connecting line of the two conductive coils 32 of each set of conductive coils 32.

At this time, since the rotating shaft 33 is located at the midpoint of the connecting line of the two conductive coils 32 of each conductive coil 32, after each conductive coil 32 is powered on, in each conductive coil 32, the magnitude of the force applied to the magnetic fan blade 31 by the electromagnetic field generated by one conductive coil 32 is equal to the magnitude of the force applied to the magnetic fan blade 31 by the electromagnetic field generated by the other conductive coil 32, and the stress on the magnetic fan blade 31 is uniform, so that the magnetic fan blade 31 does not wear against the rotating shaft 33 due to uneven stress during the rotation of the magnetic fan blade 31.

In addition, after the heat is generated in the accommodating cavity, in order to facilitate the heat dissipation assembly 30 to discharge the heat out of the accommodating cavity through the heat dissipation hole 11, in some embodiments, as shown in fig. 5, the heat dissipation assembly 30 may face the heat dissipation hole 11. Because the heat dissipation assembly 30 can make the air in the accommodating cavity flow, so that the flowing air brings the heat in the accommodating cavity out of the accommodating cavity, when the heat dissipation assembly 30 faces the heat dissipation hole 11, after the heat dissipation assembly 30 makes the air in the accommodating cavity flow, the flowing air can flow out of the accommodating cavity from the heat dissipation hole 11 at the first time, so that the heat in the accommodating cavity can be transmitted to the outside of the accommodating cavity at a higher speed, and the reduction of the heat in the accommodating cavity is ensured.

In addition, in some embodiments, the implementation manner of forming the accommodating cavity between the first circuit board 10 and the second circuit board 20 may be: as shown in fig. 6, the surfaces of the first circuit board 10 adjacent to the second circuit board 20 are provided with a first groove, and the first groove and the second circuit board 20 form an accommodating cavity.

In this case, the accommodating cavity may be directly formed by the first circuit board 10 and the second circuit board 20, and compared to the related art in which an interposer is added between two adjacent circuit boards so that the accommodating cavity is formed between the two adjacent circuit boards, the manner in which the accommodating cavity is formed between the first circuit board 10 and the second circuit board 20 in the embodiment of the present invention may save materials.

In addition, in some embodiments, as shown in fig. 1, a second groove may be opened at the bottom of the first groove, and the heat dissipation assembly 30 may be disposed in the second groove. At this time, since the position of the heat dissipation assembly 30 is lower than the position of the electronic component 40 on the bottom of the first groove, at this time, the heat dissipation assembly 30 can conveniently discharge the heat dissipated by the electronic component 40 at the bottom of the first groove through the heat dissipation hole 11.

In addition, in some embodiments, as shown in fig. 7, a surface of the first circuit board 10 adjacent to the second circuit board 20 is provided with a third groove, a surface of the second circuit board 20 adjacent to the first circuit board 10 is provided with a fourth groove, and the third groove and the fourth groove form an accommodating cavity.

In addition, in some embodiments, the connection manner of the first circuit board 10 and the second circuit board 20 may be: the first circuit board 10 and the second circuit board 20 are soldered by solder paste, so that the first circuit board 10 and the second circuit board 20 are electrically connected.

In other embodiments, the connection manner of the first circuit board 10 and the second circuit board 20 may be further: one end of the elastic sheet is fixed on the first circuit board 10 through a screw, the other end of the elastic sheet is fixed on the second circuit board 20 through a screw, and the first circuit board 10 is electrically connected with the second circuit board 20 through the elastic sheet.

The following describes the use process of the circuit board device provided by the embodiment of the invention with reference to fig. 1:

in using the circuit board arrangement provided by the embodiment of the present invention, a groove may be opened on one surface of the second circuit board 20, the first circuit board 10 is kept unchanged, and then the electronic components 40 are disposed on both surfaces of the first circuit board 10, and the electronic components 40 are disposed in the groove on the second circuit board 20 and on the other surface of the second circuit board 20. The first circuit board 10 is provided with heat dissipation holes 11, a rotating shaft 33 is arranged in a groove on the second circuit board 20, the magnetic fan blades 31 are embedded on the rotating shaft 33, a plurality of groups of via holes 22 are arranged on the second circuit board 20, and each via hole 22 is provided with a conductive coil 32. Then, the first circuit board 10 and the second circuit board 20 are soldered by solder paste, and a receiving cavity is formed between the first circuit board 10 and the second circuit board 20. Alternating current is passed through the conductive coils 32 in each via 22 and ensures that the direction of current flow through the two conductive coils 32 in each set of conductive coils 32 is opposite at the same time. Additionally, multiple sets of conductive coils 32 may be alternately energized. After the conductive coil 32 is energized, the conductive coil 32 can generate an electromagnetic field, and the magnetic fan 31 can rotate in the electromagnetic field. After the magnetic fan blade 31 rotates, the magnetic fan blade 31 drives the heat generated by the electronic component 40 in the accommodating cavity to be discharged out of the accommodating cavity from the heat dissipation hole 11, so that the heat in the accommodating cavity is reduced.

To sum up, the circuit board apparatus provided by the embodiment of the present invention at least has the following beneficial effects:

An embodiment of the present invention provides an electronic device, which includes the circuit board apparatus provided in any one of the above embodiments. The electronic device includes, but is not limited to, a smart phone, a tablet computer, a notebook computer, and the like.

It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.

While preferred embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the invention.

Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or terminal equipment comprising the element.

The technical solutions provided by the present invention are described in detail above, and the principle and the implementation of the present invention are explained in this document by applying specific examples, and the descriptions of the above examples are only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims

1. A circuit board arrangement, characterized in that the circuit board arrangement comprises a first circuit board (10), a second circuit board (20) and a heat sink assembly (30);

the first circuit board (10) and the second circuit board (20) are electrically connected, and a containing cavity is formed between the first circuit board (10) and the second circuit board (20);

the first circuit board (10) and/or the second circuit board (20) are/is provided with heat dissipation holes (11), and the heat dissipation holes (11) are communicated with the accommodating cavity;

the heat dissipation assembly (30) comprises magnetic fan blades (31) and at least one group of conductive coils (32), wherein each group of conductive coils (32) comprises two conductive coils (32);

the magnetic fan blades (31) are arranged in the accommodating cavity and arranged on the second circuit board (20); the magnetic fan blade (31) comprises a first fan blade (311) and a second fan blade (312); the first fan blade (311) is connected with the second fan blade (312), and the magnetic poles of the first fan blade (311) and the second fan blade (312) are opposite;

the conductive coil (32) is fixed on the second circuit board (20) and is opposite to the magnetic fan blade (31); the magnetic fan blades (31) are positioned between the two conductive coils (32) of each group of conductive coils (32);

when the conductive coil (32) is electrified, the magnetic fan blades (31) rotate in an electromagnetic field generated by the conductive coil (32); the current directions of the two conductive coils (32) in each group of conductive coils (32) at the same time are opposite, and the two conductive coils are powered off or powered on simultaneously;

when the heat dissipation assembly (30) comprises a plurality of groups of the conductive coils (32), the plurality of groups of the conductive coils (32) are alternately electrified;

wherein at least one pair of via holes (22) is provided on the second circuit board (20), the conductive coil (32) being disposed in the via holes (22); the axial direction of the through hole (22) is vertical to the rotating surface of the magnetic fan blade (31) during rotation; the second circuit board (20) comprises a plurality of layers of circuit boards, each through hole (22) penetrates through each layer of the circuit boards, the hole wall of each through hole (22) forms a non-closed coil on each layer of the circuit boards, and two adjacent non-closed coils are electrically connected to form the conductive coil (32).

2. A circuit board arrangement according to claim 1, characterized in that the heat sink assembly (30) further comprises a shaft (33);

the rotating shaft (33) is arranged on the second circuit board (20), the rotating shaft (33) is located between two conductive coils (32) of each conductive coil (32) and located on a connecting line of the two conductive coils (32), a rotating shaft hole is formed in the magnetic fan blade (31), and the magnetic fan blade (31) is embedded in the rotating shaft (33) through the rotating shaft hole.

3. A circuit board arrangement according to claim 2, characterized in that the pivot axis (33) is located at the midpoint of the line connecting the two conductive coils (32) of each set of conductive coils (32).

4. A circuit board arrangement according to claim 1, characterized in that the heat dissipation assembly (30) is arranged towards the heat dissipation aperture (11).

5. A circuit board arrangement according to claim 1, characterized in that the surfaces of the first circuit board (10) adjacent to the second circuit board (20) are provided with a first recess, which forms the receiving cavity with the second circuit board (20).

6. An electronic device, characterized in that the electronic device comprises a circuit board arrangement according to any of claims 1-5.