CN111129958A - Anion generator and air filtering device provided with same - Google Patents
Anion generator and air filtering device provided with same Download PDFInfo
- Publication number
- CN111129958A CN111129958A CN201811292143.9A CN201811292143A CN111129958A CN 111129958 A CN111129958 A CN 111129958A CN 201811292143 A CN201811292143 A CN 201811292143A CN 111129958 A CN111129958 A CN 111129958A
- Authority
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- China
- Prior art keywords
- semiconductor
- filter screen
- negative ion
- anion
- refrigeration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 150000001450 anions Chemical class 0.000 title claims abstract description 57
- 238000001914 filtration Methods 0.000 title claims description 9
- 239000004065 semiconductor Substances 0.000 claims abstract description 56
- 238000005057 refrigeration Methods 0.000 claims abstract description 55
- 150000002500 ions Chemical class 0.000 claims abstract description 42
- 239000000523 sample Substances 0.000 claims abstract description 42
- 230000005611 electricity Effects 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 108091006515 Anion channels Proteins 0.000 claims description 4
- 102000037829 Anion channels Human genes 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000000919 ceramic Substances 0.000 description 5
- 238000009833 condensation Methods 0.000 description 5
- 230000005494 condensation Effects 0.000 description 5
- 239000011859 microparticle Substances 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 2
- 238000004887 air purification Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- -1 oxygen ions Chemical class 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
- H01T23/00—Apparatus for generating ions to be introduced into non-enclosed gases, e.g. into the atmosphere
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F8/00—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying
- F24F8/10—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying by separation, e.g. by filtering
- F24F8/192—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying by separation, e.g. by filtering by electrical means, e.g. by applying electrostatic fields or high voltages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F8/00—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying
- F24F8/30—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying by ionisation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
- H01T19/00—Devices providing for corona discharge
- H01T19/04—Devices providing for corona discharge having pointed electrodes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Plasma & Fusion (AREA)
- Electrostatic Separation (AREA)
Abstract
The utility model provides an anion generator, includes the frame install high-voltage package, discharge electrode and telluric electricity field on the frame, high-voltage package with discharge electrode looks electricity intercommunication, its characterized in that: the semiconductor refrigeration module is installed on the frame and comprises an outer frame, a conducting strip and a refrigeration semiconductor, the outer frame is fixed on the frame, the conducting strip and the refrigeration semiconductor are arranged inside the outer frame, the conducting strip is electrically connected with the discharge electrode, the negative ion probe is installed on the conducting strip, the head of the negative ion probe extends forwards out of the outer frame, and the hot end of the refrigeration semiconductor is close to the conducting strip. The invention has the advantages that: this anion generator is through installing semiconductor refrigeration module at the frame, and anion probe installs on semiconductor refrigeration module's conducting strip, and refrigeration semiconductor's hot junction is close to the conducting strip for the heat that the hot junction produced can transfer to anion probe position, and then strengthens anion probe and produce the effect of anion, improves the production concentration of anion.
Description
Technical Field
The invention relates to the technical field of air purification, in particular to an anion generator and an air filtering device provided with the anion generator.
Background
Because the negative ions in the air have the functions of purifying the air, eliminating pollution, improving the living environment and treating and protecting the health of human bodies, the negative ion generator is more and more popular with people. The negative ion generator is a device for generating air negative ions, wherein a release tip made of metal or carbon elements is electrified with high-voltage negative electricity, high-point cloud is generated by utilizing tip direct-current high voltage, a large amount of electrons are released at high speed and are captured by oxygen molecules in the air, and then the electrons are combined with microparticles in the air, so that the capability of a filter screen for adsorbing the microparticles in the air is improved, and the negative ion generator is usually applied to the field of air purification. The working principle of the refrigeration semiconductor is that by utilizing the Peltier effect of semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, the purpose of refrigeration can be realized, and the reliability is high. The existing air conditioning system design does not consider various components and contents thereof in airflow, such as the contents of oxygen and negative oxygen ions, and the air conditioning filter screen on the market only plays a role in filtering, cannot change the component content of the filtered air, and cannot effectively improve the air quality.
Disclosure of Invention
The first technical problem to be solved by the present invention is to provide an anion generator with high anion generating concentration in view of the above-mentioned prior art.
The second technical problem to be solved by the present invention is to provide an air filtering device with a better adsorption effect on micro-particles in air, aiming at the current state of the prior art.
The technical scheme adopted by the invention for solving the first technical problem is as follows: this anion generator, including the frame install high-voltage package, discharge electrode and telluric electricity field on the frame, the high-voltage package with discharge electrode looks electricity intercommunication, its characterized in that: the semiconductor refrigeration module is arranged on the frame and comprises an outer frame, a conducting plate and a refrigeration semiconductor, the outer frame is fixed on the frame, the conducting plate and the refrigeration semiconductor are arranged inside the outer frame, the conducting plate is electrically connected with the discharge electrode, a negative ion probe is arranged on the conducting plate or the discharge electrode, the head of the negative ion probe extends forwards out of the outer frame, and the hot end of the refrigeration semiconductor is close to the conducting plate.
In order to improve the concentration of generated negative ions, a heat conductor is fixed on the rear side of the conducting strip, the refrigeration semiconductor is arranged on the rear side of the heat conductor, the hot end of the refrigeration semiconductor is in contact with the heat conductor, a cold storage block is arranged at the cold end of the refrigeration semiconductor, and a flow guide structure for guiding condensed water formed on the cold storage block to the periphery of the head of the negative ion probe is arranged on the outer frame.
In order to make the head surrounding area of the negative ion probe smoothly flow to the condensation water on the cold accumulation block, the outer frame comprises a cylindrical main body and a conical head arranged at the front end of the cylindrical main body, the cylindrical main body is provided with an inner wall and an outer wall, a condensation water channel is formed between the inner wall and the outer wall, a water inlet of the condensation water channel is enclosed around the cold accumulation block, a water outlet of the condensation water channel is connected with the inner surface of the conical head, a through hole for the head of the negative ion probe to pass through is formed in the center of the conical head, and the inner surfaces of the condensation water channel and the conical head form the flow guide structure.
Further preferably, the discharge electrode passes through the cylindrical body, and the conductive sheet, the heat conductor, and the refrigeration semiconductor are sequentially disposed inside the cylindrical body from front to back.
Further preferably, the root of the negative ion probe is welded to the center of the conductive sheet.
In order to generate uniform negative ions in a discharge area, the frame is provided with a longitudinal beam and a transverse beam, the longitudinal beam and the transverse beam are both in a U-shaped groove structure, the discharge electrodes are conductive strips arranged in the U-shaped grooves of the transverse beam, the semiconductor refrigeration modules are arranged on the transverse beam, and at least two semiconductor refrigeration modules are distributed on one conductive strip at intervals.
In order to avoid interference between the generated negative ions and the grounding electrode, the grounding electrode is a grounding metal sheet arranged on the front side of the conductive bar, and the grounding metal sheet and the negative ion probe are staggered with each other.
In order to enable the outer frame of the semiconductor refrigeration module to have the functions of isolation and insulation, the outer frame of the semiconductor refrigeration module is an insulator.
The technical scheme adopted by the invention for solving the second technical problem is as follows: this install air filter of above-mentioned anion generator, including the shell, anion generator installs in the shell, its characterized in that: the utility model discloses a negative ion probe, including shell, anion generator, filter screen subassembly, anion probe, the both sides opening around the shell the inside filter screen subassembly that still installs of shell, the filter screen subassembly is located anion generator's front side and with anion generator between form the anion passageway, the head of anion probe stretches into in this anion passageway.
The filter screen subassembly can have multiple structure, preferably, the filter screen subassembly includes that filter screen, filter screen bordure, filter screen protecgulum and filter screen back lid, the filter screen is bordured the parcel and is in the periphery of filter screen, the filter screen protecgulum assembles with the filter screen back lid mutually, and the filter screen protecgulum after the assembly is fixed with the filter screen back lid the periphery that the filter screen was bordured.
Compared with the prior art, the invention has the advantages that: this anion generator is through installing semiconductor refrigeration module at the frame, and anion probe installs on semiconductor refrigeration module's conducting strip, and refrigeration semiconductor's hot junction is close to the conducting strip for the heat that the hot junction produced can transfer to anion probe position, and then strengthens anion probe and produce the effect of anion, improves the production concentration of anion. In addition, the semiconductor refrigeration module is specially designed for the negative ion probe, the volume is small, the installation is convenient, the amount of generated condensed water is small, the adverse effect on the filter screen is small, the negative ion generator is an integrated module, and the semiconductor refrigeration module can be used only by reserving proper size and power supply electric shock in the whole machine.
Drawings
FIG. 1 is a schematic view showing a structure of an anion generator according to an embodiment of the present invention;
FIG. 2 is a schematic view of the negative ion generator shown in FIG. 1;
FIG. 3 is a schematic perspective exploded view of an anion generator according to an embodiment of the present invention;
FIG. 4 is a schematic perspective exploded view of an anion generator according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a semiconductor refrigeration module according to an embodiment of the present invention;
FIG. 6 is an exploded perspective view of the present conductor refrigeration module of FIG. 5;
fig. 7 is a structural sectional view of the outer frame of the present conductor refrigeration module shown in fig. 5;
FIG. 8 is a schematic structural view of an air filtration unit according to an embodiment of the present invention;
FIG. 9 is a schematic view of the air filter assembly of FIG. 8 at another angle;
FIG. 10 is a schematic view of the air filtration device of FIG. 8 with the housing removed;
fig. 11 is an exploded view of a screen assembly according to an embodiment of the present invention.
Detailed Description
The invention is described in further detail below with reference to the accompanying examples.
As shown in fig. 1 to 7, the anion generator in this embodiment includes a frame 1, a high voltage pack 2, a discharge electrode 3, and a ground electrode 4 are mounted on the frame 1, the high voltage pack 2 is electrically connected to the discharge electrode 3, the high voltage pack 2 is covered by a cover plate 13, an anion probe 6 is electrically connected to the discharge electrode 3, the anion probe 6 is a discharge needle, and corona discharge is caused between the discharge electrode 3 and the ground electrode 4 to generate anions.
The frame 1 is provided with a longitudinal beam 11 and a cross beam 12, the longitudinal beam 11 and the cross beam 12 are both U-shaped groove structures, the discharge electrode 3 is a conductive strip arranged in the U-shaped groove of the cross beam 12, the conductive strip is a copper sheet, the semiconductor refrigeration module 5 is arranged on the cross beam 12, at least two semiconductor refrigeration modules 5 are distributed on one conductive strip at intervals, and the semiconductor refrigeration module 5 is connected with a lead wire and is connected with a direct current power supply. The grounding electrode 4 is a grounding metal sheet arranged on the front side of the conductive strip, and the grounding metal sheet and the negative ion probe 6 are staggered with each other. In this embodiment, there are 4 conducting strips, are equipped with 3 semiconductor refrigeration modules 5 on every conducting strip, install 12 semiconductor refrigeration modules 5 promptly on frame 1, and every semiconductor refrigeration module 5 corresponds to there is an anion probe 6 for the anion produces more evenly.
The semiconductor cooling module 5 of the present embodiment includes an outer frame 51, a conductive sheet 52, a cooling semiconductor 53, a heat conductor 54, and a cold storage block 55, with the direction indicated by the arrow a in fig. 6 being the forward direction. The outer frame 51 is an insulator and fixed on the frame 1, and the outer frame 51 can play a role in isolation and insulation by adopting the insulator. The outer frame 51 includes a cylindrical main body 511 and a tapered head 512 provided at the front end of the cylindrical main body, the discharge electrode 3 transversely penetrates through the cylindrical main body 511, the conductive sheet 52, the heat conductor 54 and the refrigeration semiconductor 53 are sequentially provided inside the cylindrical main body 511 from front to back, and the conductive sheet 52 is a copper sheet and is in direct electrical contact with the discharge electrode 3, i.e., a conductive strip. The center of the conical head 512 is provided with a through hole 516, the root of the negative ion probe 6 is welded on the conducting strip 52, and the head of the negative ion probe 6 passes through the through hole 516 and extends forwards out of the outer frame 51.
In this embodiment, the heat conductor 54 is made of heat conducting ceramic, the hot end 531 of the refrigeration semiconductor 53 is in surface contact with the heat conducting ceramic, and heat generated by the hot end 531 of the refrigeration semiconductor 53 is transferred to the negative ion probe 6 through the heat conducting ceramic and the conducting strip 52, so that the negative ion effect generated by the negative ion probe 6 is enhanced. In addition, the refrigeration semiconductor 53 and the negative ion probe 6 are not affected by each other due to the non-conductivity of the heat conductive ceramic.
The cold storage block 55 is installed at the rear portion of the outer frame 51, the cold storage block 55 has a triangular prism shape, and the cold end 532 of the refrigeration semiconductor 53 is in surface contact with the cylindrical surface of the cold storage block 55. The outer frame 51 is provided with a guide structure for guiding the condensed water formed on the cold storage block 55 to the periphery of the head of the negative ion probe 6. In this embodiment, the cylindrical main body 511 has an inner wall 513 and an outer wall 514, a condensed water channel 515 is formed between the inner wall 513 and the outer wall 514, a water inlet of the condensed water channel 515 is surrounded around the cold accumulation block 55, a water outlet of the condensed water channel 515 is connected with the inner surface of the conical head 512, and a flow guide structure is formed between the condensed water channel 515 and the inner surface of the conical head 512.
As shown in fig. 8 to 10, the air filtering device of the present embodiment includes a housing 7, the housing 7 is installed on an anion generator and a filter screen assembly 8, the filter screen assembly 8 is located 20-30 cm in front of the anion generator, the filter screen assembly 8 is located at the front side of the anion generator and forms an anion channel 9 with the anion generator, and the head of the anion probe 6 extends into the anion channel 9.
As shown in fig. 11, the strainer assembly 8 of the present embodiment includes a strainer 81, a strainer rim 82, a strainer front cover 83, and a strainer rear cover 84, the strainer rim 82 is wrapped around the strainer 81, the strainer front cover 83 and the strainer rear cover 84 can be assembled by snap-fit connection, and the assembled strainer front cover 83 and the strainer rear cover 84 are fixed around the strainer rim 82.
Install fan (not shown in the figure) in air filter's rear side, in operation, anion probe 6 communicates with each other with high-pressure package 2 negative pole through conducting strip 52, emit the anion, the hot junction 531 of refrigeration semiconductor 53 produces heat and passes through heat conduction ceramic and transmit to anion probe 6, and simultaneously, the air links to each other with cold-storage piece 55 of low temperature, the cold junction 532 of refrigeration semiconductor 53 produces the comdenstion water and passes through near the diversion structure flow anion probe 6 pointed end on the frame 51 under the drive of fan, both interact and combine each other, make anion probe release anion concentration strengthened, the anion of release fully combines with the microparticle in the air, make the microparticle by taking the burden electricity, and then by filter screen subassembly 8 fully absorption, in order to improve the filter effect of filter screen.
Claims (10)
1. An anion generator, including frame (1), install high-voltage package (2), discharge electrode (3) and telluric electricity field (4) on frame (1), high-voltage package (2) with discharge electrode (3) looks electricity communicates, its characterized in that: the semiconductor refrigeration device is characterized in that a semiconductor refrigeration module (5) is installed on the frame (1), the semiconductor refrigeration module (5) comprises an outer frame (51), a conducting strip (52) and a refrigeration semiconductor (53), the outer frame (51) is fixed on the frame (1), the conducting strip (52) and the refrigeration semiconductor (53) are arranged inside the outer frame (51), the conducting strip (52) is electrically connected with the discharge electrode (3), a negative ion probe (6) is installed on the conducting strip (52) or the discharge electrode (3), the head of the negative ion probe (6) extends out of the outer frame (51), and a hot end (531) of the refrigeration semiconductor (53) is close to the conducting strip (52).
2. The negative ion generator according to claim 1, wherein: a heat conductor (54) is fixed on the rear side of the conducting strip (52), the refrigeration semiconductor (53) is arranged on the rear side of the heat conductor (54), the hot end (531) of the refrigeration semiconductor (53) is in contact with the heat conductor (54), a cold storage block (55) is arranged on the cold end (532) of the refrigeration semiconductor (53), and a flow guide structure for guiding condensed water formed on the cold storage block (55) to the periphery of the head of the negative ion probe is arranged on the outer frame (51).
3. The negative ion generator according to claim 2, wherein: the outer frame (51) includes tube-shape main part (511) and locates the toper head (512) of tube-shape main part front end, tube-shape main part (511) have inner wall (513) and outer wall (514), form comdenstion water passageway (515) between inner wall (513) and outer wall (514), the water inlet of comdenstion water passageway (515) encloses and establishes around cold-storage piece (55), the delivery port of comdenstion water passageway (515) with the internal surface of toper head (512) links up mutually, open the through-hole (516) that supply anion probe (6) head to pass in the center of toper head (512), the internal surface of comdenstion water passageway (515) and toper head (512) forms the water conservancy diversion structure.
4. The negative ion generator according to claim 3, wherein: the discharge electrode (3) penetrates through the cylindrical main body (511), and the conductive sheet (52), the heat conductor (54) and the refrigeration semiconductor (53) are sequentially arranged inside the cylindrical main body (511) from front to back.
5. The negative ion generator according to claim 3, wherein: the root of the negative ion probe (6) is welded at the center of the conducting strip (52).
6. The negative ion generator according to claim 1, wherein: the frame (1) is provided with a longitudinal beam (11) and a transverse beam (12), the longitudinal beam (11) and the transverse beam (12) are both in a U-shaped groove structure, the discharge electrodes (3) are conductive strips arranged in the U-shaped grooves of the transverse beam, the semiconductor refrigeration modules (5) are arranged on the transverse beam (12), and at least two semiconductor refrigeration modules (5) are distributed on one conductive strip at intervals.
7. The negative ion generator according to claim 6, wherein: the grounding electrode (4) is a grounding metal sheet arranged on the front side of the conductive strip, and the grounding metal sheet and the negative ion probe (6) are staggered with each other.
8. The negative ion generator according to claim 1, wherein: the outer frame (51) of the semiconductor refrigeration module (5) is an insulator.
9. An air filter device with the anion generator of any of claims 1 to 8 installed, comprising a housing (7), the anion generator being installed in the housing (7), characterized in that: the utility model discloses a negative ion probe, including shell (7), both sides opening around shell (7) inside filter screen subassembly (8) still install, filter screen subassembly (8) are located anion generator's front side and with anion generator between form anion channel (9), the head of anion probe (6) stretches into in this anion channel (9).
10. An air filtration device according to claim 9 wherein: filter screen subassembly (8) are including behind filter screen (81), the filter screen bordure (82), filter screen protecgulum (83) and the filter screen lid (84), the filter screen is bordured (82) the parcel and is in the periphery of filter screen (81), lid (84) assemble behind filter screen protecgulum (83) and the filter screen, and filter screen protecgulum (83) after the assembly and filter screen lid (84) are fixed the periphery of filter screen bordure (82).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811292143.9A CN111129958A (en) | 2018-11-01 | 2018-11-01 | Anion generator and air filtering device provided with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811292143.9A CN111129958A (en) | 2018-11-01 | 2018-11-01 | Anion generator and air filtering device provided with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111129958A true CN111129958A (en) | 2020-05-08 |
Family
ID=70494133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811292143.9A Withdrawn CN111129958A (en) | 2018-11-01 | 2018-11-01 | Anion generator and air filtering device provided with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111129958A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113540982A (en) * | 2021-02-23 | 2021-10-22 | 北京众清科技有限公司 | Water ion emission device |
| CN113719906A (en) * | 2021-09-26 | 2021-11-30 | 青岛海信日立空调系统有限公司 | Air conditioner |
-
2018
- 2018-11-01 CN CN201811292143.9A patent/CN111129958A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113540982A (en) * | 2021-02-23 | 2021-10-22 | 北京众清科技有限公司 | Water ion emission device |
| CN113719906A (en) * | 2021-09-26 | 2021-11-30 | 青岛海信日立空调系统有限公司 | Air conditioner |
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Application publication date: 20200508 |