CN111113252B - MLCC grinding process - Google Patents

MLCC grinding process Download PDF

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CN111113252B
CN111113252B CN201911269687.8A CN201911269687A CN111113252B CN 111113252 B CN111113252 B CN 111113252B CN 201911269687 A CN201911269687 A CN 201911269687A CN 111113252 B CN111113252 B CN 111113252B
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grinding
mlcc
product
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ground
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CN111113252A (en
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黄作权
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Xiamen Sinofaith Electronic Technology Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B31/00Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
    • B24B31/02Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving rotary barrels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed

Abstract

The invention provides an MLCC grinding process, which changes the traditional MLCC grinding concept, comprises two stages of grinding, combines a new grinding medium, formulates a new proportioning process, searches the grinding rotating speed and grinding time process of a new grinding process, and achieves the effect of fully leading out the inner electrode of an MLCC product, so that the outer electrode of the MLCC product can be fully contacted with the inner electrode layer, and the electrical performance of the product is ensured; meanwhile, the generation of internal force microcracks of the product is reduced, the performance and the reliability of the product are improved, and the product quality is improved.

Description

MLCC grinding process
Technical Field
The invention relates to the field of capacitor grinding, in particular to an MLCC grinding process.
Background
MLCC (Multi-layer Ceramic Capacitors), also called monolithic Capacitors, is formed by overlapping Ceramic dielectric films with printed electrodes (inner electrodes) in a staggered manner, forming a Ceramic chip through one-time high-temperature sintering, and sealing metal layers (outer electrodes) at two ends of the chip to form a monolithic structure, so that the MLCC is also called a monolithic capacitor.
After sintering, the MLCC product needs to be ground, wherein grinding means that a grinding medium is added into the sintered MLCC chip to be matched with the chip, and the edge corners of the product are ground smoothly by grinding at a high speed through a grinding machine, so that the inner electrode layer is fully led out, the outer electrode of the product is in full contact with the inner electrode layer, and the electrical performance of the product is ensured.
The lead-out degree of the electrodes in the MLCC directly influences the electrical performance of the MLCC and influences the quality of the MLCC. The electrode of the MLCC product ground by the traditional grinding process of the MLCC is not sufficiently led out. Therefore, in order to ensure the electrode extraction and performance of the product, the existing solution is to increase the highest grinding rotation speed and prolong the grinding time, so that the surface of the MLCC product achieves a smooth effect, the impact force on the product in the grinding process is large, and quality defects such as internal cracks of the product are easily caused, and the performance of the product is influenced.
Disclosure of Invention
In order to solve the problems that the impact force on a product is large in the grinding process caused by the conventional grinding process, the quality defects such as internal cracks of the product are easily caused, and the performance of the product is influenced, the invention provides an MLCC grinding process, which comprises the following steps:
s10, taking 800-1200ml of MLCC product to be ground, 500-700ml of silicon carbide powder, 500-700ml of alumina ball and 500-700ml of zirconia ball for later use;
s20, pouring 800-1200ml of MLCC product to be ground, 500-700ml of silicon carbide powder and 500-700ml of alumina balls into a grinding tank for grinding in the first stage;
s30, opening a tank cover of the grinding tank, cleaning the MLCC product and powder ground in the step S20, drying the MLCC product and powder by blowing, and respectively sorting the MLCC product ground in the first stage;
s40, continuously adding 500-700ml zirconia balls, and grinding for 15-25min at the rotating speed of 25-35 rpm; then grinding for 55-65min at the rotating speed of 125-135 rpm; finishing the grinding of the second stage;
and S50, taking out the MLCC product ground in the second grinding stage from the grinding tank, and cleaning the MLCC product to finish grinding the MLCC product.
Further, the process steps are as follows:
s10, taking 1000ml of MLCC product to be ground, 600ml of silicon carbide powder, 600ml of alumina balls and 600ml of zirconia balls for later use;
s20, pouring 1000ml of MLCC product to be ground, 600ml of silicon carbide powder and 600ml of alumina balls into a grinding tank for grinding in the first stage;
s30, opening a tank cover of the grinding tank, cleaning the MLCC product and powder ground in the step S20, drying the MLCC product and powder by blowing, and respectively sorting the MLCC product ground in the first stage;
s40, continuously adding 600ml of zirconia balls, and grinding for 20min at the rotating speed of 30 rpm; then grinding for 60min at the rotating speed of 130 rpm; finishing the grinding of the second stage;
and S50, taking out the MLCC product ground in the second grinding stage from the grinding tank, and cleaning the MLCC product to finish grinding the MLCC product.
Further, the grinding rotation speed and time in the first stage in step S20 are as follows: :
grinding at 25-35rpm for 15-25min;
grinding at 55-65rpm for 15-25min;
grinding at 75-85rpm for 15-25min;
the rotation speed is 115-125rpm for 115-125 min;
the rotation speed 155-.
Further, the grinding rotation speed and time in the first stage in step S20 are as follows: :
grinding at the rotating speed of 30rpm for 20min;
grinding at the rotation speed of 60rpm for 20min;
grinding at a rotation speed of 80rpm for 20min;
grinding at a rotation speed of 120rpm for 120 min;
grinding at 160rpm for 380 min.
Further, the diameter of the silicon carbide powder is 10-20 μm.
Further, the diameter of the alumina ball is 2.0-4.0 mm.
Further, the diameter of the zirconia ball is 2.0-4.0 mm.
The invention provides an MLCC grinding process, which changes the traditional MLCC grinding concept, comprises two stages of grinding, combines a new grinding medium, formulates a new proportioning process, searches the grinding rotating speed and grinding time process of a new grinding process, and achieves the effect of fully leading out the inner electrode of an MLCC product, so that the outer electrode of the MLCC product can be fully contacted with the inner electrode layer, and the electrical performance of the product is ensured; meanwhile, the generation of internal force microcracks of the product is reduced, the performance and the reliability of the product are improved, and the product quality is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a drawing of the electrode lead-out effect of example 1 according to the present invention;
FIG. 2 is a drawing of the electrode lead-out effect of example 2 according to the present invention;
FIG. 3 is a graph showing the electrode lead-out effect of comparative example 1 according to the present invention;
FIG. 4 is a graph showing the electrode lead-out effect of comparative example 3 according to the present invention;
FIG. 5 shows the edge angle effect of the products of the examples and comparative examples after a first stage of grinding;
FIG. 6 shows the edge angle effect of the products of the examples and comparative examples after the second stage grinding.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides an MLCC grinding process, which comprises the following steps:
s10, taking 800-1200ml of MLCC product to be ground, 500-700ml of silicon carbide powder, 500-700ml of alumina ball and 500-700ml of zirconia ball for later use;
s20, pouring 800-1200ml of MLCC product to be ground, 500-700ml of silicon carbide powder and 500-700ml of alumina balls into a grinding tank for grinding in the first stage;
s30, opening a tank cover of the grinding tank, cleaning the MLCC product and powder ground in the step S20, drying the MLCC product and powder by blowing, and respectively sorting the MLCC product ground in the first stage;
s40, continuously adding 500-700ml zirconia balls, and grinding for 15-25min at the rotating speed of 25-35 rpm; then grinding for 55-65min at the rotating speed of 125-135 rpm; finishing the grinding of the second stage;
and S50, taking out the MLCC product ground in the second grinding stage from the grinding tank, and cleaning the MLCC product to finish grinding the MLCC product.
Preferably, the process steps are as follows:
s10, taking 1000ml of MLCC product to be ground, 600ml of silicon carbide powder, 600ml of alumina balls and 600ml of zirconia balls for later use;
s20, pouring 1000ml of MLCC product to be ground, 600ml of silicon carbide powder and 600ml of alumina balls into a grinding tank for grinding in the first stage;
s30, opening a tank cover of the grinding tank, cleaning the MLCC product and powder ground in the step S20, drying the MLCC product and powder by blowing, and respectively sorting the MLCC product ground in the first stage;
s40, continuously adding 600ml of zirconia balls, and grinding for 20min at the rotating speed of 30 rpm; then grinding for 60min at the rotating speed of 130 rpm; finishing the grinding of the second stage;
and S50, taking out the MLCC product ground in the second grinding stage from the grinding tank, and cleaning the MLCC product to finish grinding the MLCC product.
Preferably, the grinding speed and time of the first stage in step S20 are as follows: :
grinding at 25-35rpm for 15-25min;
grinding at 55-65rpm for 15-25min;
grinding at 75-85rpm for 15-25min;
the rotation speed is 115-125rpm for 115-125 min;
the rotation speed 155-.
Preferably, the grinding speed and time of the first stage in step S20 are as follows: :
grinding at the rotating speed of 30rpm for 20min;
grinding at the rotation speed of 60rpm for 20min;
grinding at a rotation speed of 80rpm for 20min;
grinding at a rotation speed of 120rpm for 120 min;
grinding at 160rpm for 380 min.
Preferably, the diameter of the silicon carbide powder is 10-20 μm.
Preferably, the diameter of the alumina ball is 2.0-4.0 mm.
Preferably, the zirconia balls have a diameter of 2.0-4.0 mm.
To examine the practical application of the present invention, a capacitor product model 1206X7R224 was now provided as a capacitor to be ground, with examples and comparative examples as shown in table 1:
TABLE 1
Figure BDA0002313819370000061
Figure BDA0002313819370000071
And after the product ground in the first stage is operated, opening the tank cover, cleaning the product and the powder, and respectively separating the product after the product and the powder are dried. After the product was separated, the products of examples 1 to 3 and comparative examples 1 to 3 were subjected to second-stage grinding according to the processes shown in table 2, respectively:
TABLE 2
Figure BDA0002313819370000072
Figure BDA0002313819370000081
A bill of materials for each of the above examples and comparative examples is shown in table 3:
TABLE 3
Serial number Name of Material Specification of material type
1 Zirconia ball Diameter: 2.0-4.0mm
2 Silicon carbide powder D50:10-20um
3 Alumina ball Diameter: 2.0-4.0mm
4 Alumina powder D50:10-20um
5 Quartz sand 20-40 mesh
According to the above experiment, the comparative example 1 is a conventional process, which uses alumina powder and quartz sand as grinding media, and the grinding time is about 860 min. In the embodiments 1, 2 and 3 of the grinding process provided by the invention, the grinding is performed in the first stage and the second stage, and the total grinding time of the first stage and the second stage is less than that of the conventional process, so that the grinding time is greatly shortened. Meanwhile, the maximum grinding speed of the comparative example 1 is 190rpm, and the maximum grinding speeds of the examples 1, 2 and 3 are 160rpm, and the grinding speed can be reduced by adopting the MLCC grinding process for grinding, so that the generation of internal force microcracks of the product is reduced, the performance and the reliability of the product are improved, and the quality of the product is improved.
As can be seen from the electrode extraction rates of example 1, example 2 and example 3, the electrode extraction rates of example 1, example 2 and example 3 were 90%, 80% and 75%, respectively, which were much higher than 50% in comparative example 1. Therefore, the electrode extraction rate can be greatly improved by adopting the grinding process provided by the invention for grinding. As can be seen from comparative examples 2 and 3, although alumina powder is adopted for the second-stage grinding in comparative example 2, the electrode extraction rate is only improved by 5%, and although two grinding stages are also adopted in comparative example 3, and 900ml of zirconia balls are adopted in the second grinding stage, the extraction effect of the second stage of comparative document 3 is only improved by 5% compared with that of the first stage, so that the MLCC grinding process provided by the invention has a significant promotion effect on the extraction electrode through mutual synergistic effect among the steps and the specific grinding media adopted.
Compared with the traditional grinding process, the grinding process provided by the invention has the following 2 advantages:
1. the traditional grinding concept is changed, grinding is carried out in two stages, the highest grinding rotating speed is reduced, the grinding time is shortened, and the production efficiency is improved;
2. the comprehensive quality of the product is improved: the impact force is reduced in the product grinding process, internal microcracks are reduced, the loss angle tangent value is reduced, the performance and reliability of the product are improved, and the product quality is improved.
The MLCC grinding process provided by the invention changes the traditional grinding concept, comprises two stages of grinding, combines a new grinding medium, makes a new proportioning process, searches a new grinding process grinding rotating speed and grinding time process, and achieves the effect of fully leading out the inner electrode of the MLCC product, so that the outer electrode of the MLCC product can be fully contacted with the inner electrode layer, and the electrical performance of the product is ensured; meanwhile, the generation of internal force microcracks of the product is reduced, the performance and the reliability of the product are improved, and the product quality is improved.
Although terms such as MLCC, silicon carbide powder, alumina balls, zirconia balls, quartz sand, etc. are used more often herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (6)

1. An MLCC grinding process is characterized in that: the process comprises the following steps:
s10, taking 800-1200ml of MLCC product to be ground, 500-700ml of silicon carbide powder, 500-700ml of alumina ball and 500-700ml of zirconia ball for later use;
s20, pouring 800-1200ml of MLCC product to be ground, 500-700ml of silicon carbide powder and 500-700ml of alumina balls into a grinding tank for grinding in the first stage, wherein the grinding rotation speed and the grinding time in the first stage are as follows in sequence:
grinding at 25-35rpm for 15-25min;
grinding at 55-65rpm for 15-25min;
grinding at 75-85rpm for 15-25min;
the rotation speed is 115-125rpm for 115-125 min;
the rotation speed of 155-;
s30, opening a tank cover of the grinding tank, cleaning the MLCC product ground in the step S20, drying the MLCC product by blowing, and sorting the MLCC product ground in the first stage;
s40, continuously adding 500-700ml zirconia balls, grinding for 15-25min at the rotating speed of 25-35rpm, then grinding for 55-65min at the rotating speed of 125-135rpm, and finishing the grinding at the second stage;
and S50, taking the MLCC product ground in the second stage out of the grinding tank, and cleaning the MLCC product to finish grinding the MLCC product.
2. The MLCC grinding process of claim 1, wherein: the process comprises the following steps:
s10, taking 1000ml of MLCC product to be ground, 600ml of silicon carbide powder, 600ml of alumina balls and 600ml of zirconia balls for later use;
s20, pouring 1000ml of MLCC product to be ground, 600ml of silicon carbide powder and 600ml of alumina balls into a grinding tank for grinding in the first stage, wherein the grinding rotation speed and the grinding time in the first stage are as follows in sequence:
grinding at 25-35rpm for 15-25min;
grinding at 55-65rpm for 15-25min;
grinding at 75-85rpm for 15-25min;
the rotation speed is 115-125rpm for 115-125 min;
the rotation speed of 155-;
s30, opening a tank cover of the grinding tank, cleaning the MLCC product ground in the step S20, drying the MLCC product by blowing, and sorting the MLCC product ground in the first stage;
s40, continuously adding 600ml of zirconia balls, grinding for 20min at the rotating speed of 30rpm, then grinding for 60min at the rotating speed of 130rpm, and finishing the grinding of the second stage;
and S50, taking out the MLCC product grinding tank ground in the second stage, and cleaning to finish grinding the MLCC product.
3. The MLCC grinding process according to claim 1 or 2, wherein: the grinding rotation speed and time of the first stage in the step S20 are as follows:
grinding at the rotating speed of 30rpm for 20min;
grinding at the rotation speed of 60rpm for 20min;
grinding at a rotation speed of 80rpm for 20min;
grinding at a rotation speed of 120rpm for 120 min;
grinding at 160rpm for 380 min.
4. The MLCC grinding process of claim 1, wherein: the diameter of the silicon carbide powder is 10-20 μm.
5. The MLCC grinding process according to claim 4, wherein: the diameter of the alumina ball is 2.0-4.0 mm.
6. The MLCC grinding process according to claim 5, wherein: the diameter of the zirconia ball is 2.0-4.0 mm.
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CN115256204A (en) * 2022-07-28 2022-11-01 江苏芯声微电子科技有限公司 MLCC tumbling grinding process

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102642170A (en) * 2012-05-07 2012-08-22 广东风华高新科技股份有限公司 Multilayer ceramic capacitor grinding process and application of multilayer ceramic capacitor grinding process
CN103328598A (en) * 2010-12-28 2013-09-25 圣戈本陶瓷及塑料股份有限公司 Polishing slurry including zirconia particles and a method of using the polishing slurry
CN105451939A (en) * 2013-08-09 2016-03-30 新东工业株式会社 Polishing tool and processing method for member
CN109262438A (en) * 2018-09-07 2019-01-25 东莞信柏结构陶瓷股份有限公司 Zirconia ceramics polishing method and zirconia ceramic product
CN110253343A (en) * 2019-05-16 2019-09-20 厦门华信安电子科技有限公司 A kind of multilayer ceramic capacitor dry type beforehand research grinding process and preparation method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103328598A (en) * 2010-12-28 2013-09-25 圣戈本陶瓷及塑料股份有限公司 Polishing slurry including zirconia particles and a method of using the polishing slurry
CN102642170A (en) * 2012-05-07 2012-08-22 广东风华高新科技股份有限公司 Multilayer ceramic capacitor grinding process and application of multilayer ceramic capacitor grinding process
CN105451939A (en) * 2013-08-09 2016-03-30 新东工业株式会社 Polishing tool and processing method for member
CN109262438A (en) * 2018-09-07 2019-01-25 东莞信柏结构陶瓷股份有限公司 Zirconia ceramics polishing method and zirconia ceramic product
CN110253343A (en) * 2019-05-16 2019-09-20 厦门华信安电子科技有限公司 A kind of multilayer ceramic capacitor dry type beforehand research grinding process and preparation method thereof

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