CN111112945A - Imaging component mounting frame for photoelectric imaging equipment and processing method thereof - Google Patents
Imaging component mounting frame for photoelectric imaging equipment and processing method thereof Download PDFInfo
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- CN111112945A CN111112945A CN201911169251.1A CN201911169251A CN111112945A CN 111112945 A CN111112945 A CN 111112945A CN 201911169251 A CN201911169251 A CN 201911169251A CN 111112945 A CN111112945 A CN 111112945A
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- flat plate
- mounting frame
- imaging
- main lens
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
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Abstract
The invention discloses an imaging component mounting frame for photoelectric imaging equipment, which comprises a flat plate (1-2), a right interface (2-2), a cross beam (3-2), a left interface (4-2), a main lens seat (5-2) and a reinforcing plate (6-2); the flat plate (1-2) is in a rectangular plate shape, the middle part of one side surface of the flat plate is provided with a main lens seat (5-2), two sides of the main lens seat (5-2) are provided with reinforcing plates (6-2) for connecting the main lens seat (5-2) and the flat plate (1-2), the middle part of the other side surface of the flat plate (1-2) is provided with a cross beam (3-2), and two ends of the cross beam (3-2) are respectively provided with a right interface (2-2) and a left interface (4-2) which are arranged vertical to the flat plate (1-2); the flat plate (1-2) is provided with a mounting hole A and a mounting hole B which are positioned at two sides of the beam (3-2), and the center of the main lens seat (5-2) is provided with a mounting hole C. The invention relates to a method for preparing a high-temperature-resistant ceramic material. The invention is suitable for frame parts with larger overall dimension or more complex space structure, is easy to process, saves materials and reduces cost.
Description
Technical Field
The invention belongs to the technical field of machining, and relates to an imaging assembly mounting frame for photoelectric imaging equipment and a machining method thereof.
Background
A certain type of photoelectric imaging equipment is composed of six imaging assemblies, and a frame structure is required to be designed to connect the six imaging assemblies in order. In the traditional mode, the frame structure is made of indium steel with sticky texture, the outer shape size of the frame structure is large, if the traditional machining removal mode is adopted, time and waste materials are consumed, a large amount of materials are removed, deformation is easy to generate, and the critical size is difficult to guarantee; if the mode of casting firstly and then adding precisely is adopted, the manufacturing cost of the die is high, and the period is difficult to control.
Disclosure of Invention
Objects of the invention
The purpose of the invention is: the imaging component mounting frame for the photoelectric imaging device and the processing method thereof are easy to process, low in cost and small in occupied space, and meet the requirements of mounting frame parts with large overall dimensions or complex space structures.
(II) technical scheme
In order to solve the technical problem, the invention provides an imaging component mounting frame for a photoelectric imaging device, which comprises a flat plate 1-2, a right interface 2-2, a cross beam 3-2, a left interface 4-2, a main lens seat 5-2 and a reinforcing plate 6-2; the flat plate 1-2 is rectangular plate-shaped, the middle part of one side surface of the flat plate is provided with a main lens seat 5-2, the two sides of the main lens seat 5-2 are provided with reinforcing plates 6-2 which are connected with the main lens seat 5-2 and the flat plate 1-2, the middle part of the other side surface of the flat plate 1-2 is provided with a cross beam 3-2, and the two ends of the cross beam 3-2 are respectively provided with a right interface 2-2 and a left interface 4-2 which are arranged vertically to the flat plate 1-2; the flat plate 1-2 is provided with a mounting hole A and a mounting hole B which are positioned at two sides of the beam 3-2, and the center of the main lens base 5-2 is provided with a mounting hole C.
The hole axes of the mounting holes A and B are parallel and perpendicular to the hole axis of the mounting hole C, the three hole axes are on a common plane, and the coplanarity precision is superior to 0.03 mm.
And adjacent components of the mounting frame are connected through hexagon socket countersunk head screws and are welded by using indium steel solder.
And adjacent component parts of the mounting frame are positioned and connected in a manner of embedded pins, and the connection is reinforced by using a metal-philic adhesive.
The invention also provides a method for processing the imaging component mounting frame for the photoelectric imaging equipment, which comprises the following steps: the photoelectric imaging device is mounted with each component of the imaging assembly mounting frame: the method comprises the following steps of reserving various margins for a flat plate 1-2, a right connector 2-2, a cross beam 3-2, a left connector 4-2, a main mirror base 5-2 and a reinforcing plate 6-2 to manufacture a flat plate prefabricated part 1-1, a right connector prefabricated part 2-1, a cross beam prefabricated part 3-1, a left connector prefabricated part 4-1, a main mirror base prefabricated part 5-1 and a reinforcing plate prefabricated part 6-1, annealing after machining and forming of the prefabricated parts, welding and fixing adjacent prefabricated parts, polishing and finish machining.
Screw holes and corresponding counter bores are reserved on the connecting end faces of the prefabricated parts, and adjacent prefabricated parts are connected through hexagon socket countersunk head screws.
And welding grooves are reserved at the adjacent positions of the prefabricated parts, and the adjacent prefabricated parts are welded by using indium steel welding fluxes.
The prefabricated parts are positioned and connected in an embedded pin mode, and the connection is reinforced by using a metal-philic adhesive.
(III) advantageous effects
The imaging component mounting frame for the photoelectric imaging device and the processing method thereof provided by the technical scheme are suitable for frame parts with larger overall dimensions or more complex space structures; the frame part is firstly decomposed into a plurality of components with machining allowance according to the structural form of the part, then all the components are combined together in a bolt connection mode, a welding mode and a glue connection mode, and then the components are machined to a ruler according to the part requirement, so that the frame part is easy to machine, the material is saved, and the cost is reduced.
Drawings
Fig. 1 is an external view of a frame structure, and a view a and a view B are two different view directions.
Fig. 2 is a cross-sectional view of the frame structure, wherein a is a top view of B in fig. 1, and B is a view from D to D.
Fig. 3 is an exploded view of the components of the frame structure.
Fig. 4 is a composite view of a frame structure preform, with a view a and a view B in two different directions.
Fig. 5 is an exploded view of the frame structure preforms.
Detailed Description
In order to make the objects, contents, and advantages of the present invention clearer, the following detailed description of the embodiments of the present invention will be made in conjunction with the accompanying drawings and examples.
As shown in fig. 1 and 2, the imaging component mounting frame for the photoelectric imaging device comprises a flat plate 1-2, a right interface 2-2, a cross beam 3-2, a left interface 4-2, a main lens base 5-2 and a reinforcing plate 6-2; the flat plate 1-2 is rectangular plate-shaped, the middle part of one side surface of the flat plate is provided with a main lens seat 5-2, the two sides of the main lens seat 5-2 are provided with reinforcing plates 6-2 which are connected with the main lens seat 5-2 and the flat plate 1-2, the middle part of the other side surface of the flat plate 1-2 is provided with a cross beam 3-2, and the two ends of the cross beam 3-2 are respectively provided with a right interface 2-2 and a left interface 4-2 which are arranged vertically to the flat plate 1-2; the flat plate 1-2 is provided with a mounting hole A and a mounting hole B which are positioned at two sides of the beam 3-2, and the center of the main lens base 5-2 is provided with a mounting hole C. The six imaging components are arranged on two sides of the flat plate, the strength and the rigidity of the frame structure are good, the imaging components can be effectively borne, and the imaging quality is guaranteed.
In the frame structure, the hole axes of the mounting hole A and the mounting hole B are parallel and vertical to the hole axis of the mounting hole C, the three hole axes are on a common plane, the coplanarity precision is superior to 0.03mm, and the requirement is the assembly standard of imaging equipment, and a boring machine is required to process the three hole axes to a ruler in a sequence.
All components of the frame structure are connected through hexagon socket countersunk head screws, so that the screws are completely buried below the mounting surface of the processed imaging assembly; and indium steel solder is used for completing welding between the adjacent component parts. Or, the adjacent components are positioned and connected in a manner of embedding pins, and the connection is reinforced by using a metal-philic adhesive.
According to the integral shape and the mechanical condition of the frame structure, the frame structure is split, so that the split components are simple in appearance and convenient to prefabricate. As shown in fig. 3, the frame structure is broken down into 6 simple parts, and the broken-down parts correspond to the labels in fig. 1 one-to-one.
In this embodiment, each simple part is fastened and connected by a screw, and adjacent parts are welded and formed, so that a screw hole and a corresponding counter bore are reserved on the connecting end surface of each part for bolt connection after disassembly, and a welding notch is reserved at the adjacent position of each part for welding. Machining allowance needs to be reserved on the installation surface of the imaging component for the finish machining removal after the assembly is completed.
Specifically, as shown in fig. 4 and 5, the electrophotographic apparatus is mounted with the imaging unit mounting frame components: the method comprises the following steps of reserving various allowances for a flat plate 1-2, a right connector 2-2, a cross beam 3-2, a left connector 4-2, a main mirror base 5-2 and a reinforcing plate 6-2 to manufacture a flat plate prefabricated part 1-1, a right connector prefabricated part 2-1, a cross beam prefabricated part 3-1, a left connector prefabricated part 4-1, a main mirror base prefabricated part 5-1 and a reinforcing plate prefabricated part 6-1, annealing after machining and forming of the prefabricated parts, reserving a screw hole and a corresponding counter bore in the connecting end face of each prefabricated part for connecting inner hexagonal countersunk head screws, and reserving a welding groove for welding at the adjacent position of each prefabricated part; all the prefabricated parts are connected through hexagon socket countersunk head screws, so that the screws are completely buried below the mounting surface of the processed imaging assembly; and completing welding between adjacent prefabricated parts by using indium steel welding flux, and polishing and flattening welding marks. After the assembly of the individual prefabricated parts is completed, they are annealed and tempered before finishing.
The connection mode between each prefabricated part can also be positioned and connected in a mode of embedding pins, and the connection is reinforced by using a metal-philic adhesive.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (8)
1. An imaging component mounting frame for photoelectric imaging equipment is characterized by comprising a flat plate (1-2), a right interface (2-2), a cross beam (3-2), a left interface (4-2), a main lens seat (5-2) and a reinforcing plate (6-2); the flat plate (1-2) is in a rectangular plate shape, the middle part of one side surface of the flat plate is provided with a main lens seat (5-2), two sides of the main lens seat (5-2) are provided with reinforcing plates (6-2) for connecting the main lens seat (5-2) and the flat plate (1-2), the middle part of the other side surface of the flat plate (1-2) is provided with a cross beam (3-2), and two ends of the cross beam (3-2) are respectively provided with a right interface (2-2) and a left interface (4-2) which are arranged vertical to the flat plate (1-2); the flat plate (1-2) is provided with a mounting hole A and a mounting hole B which are positioned at two sides of the beam (3-2), and the center of the main lens seat (5-2) is provided with a mounting hole C.
2. The imaging module mounting frame for an electrophotographic apparatus according to claim 1, wherein the hole axes of the mounting holes a and B are parallel to and perpendicular to the hole axis of the mounting hole C, and the three hole axes are on a common plane, and the coplanar accuracy is better than 0.03 mm.
3. The imaging assembly mounting frame for an electrophotographic apparatus according to claim 1, wherein adjacent components of the mounting frame are coupled by hexagon socket countersunk head screws and soldered using an indium steel solder.
4. The imaging assembly mounting frame for an electrophotographic apparatus according to claim 1, wherein adjacent components of the mounting frame are fixedly coupled by means of embedded pins and reinforced by means of a metal-compatible adhesive.
5. A method for processing an imaging component mounting frame for photoelectric imaging equipment is characterized by comprising the following steps: the photoelectric imaging device is mounted with each component of the imaging assembly mounting frame: the manufacturing method comprises the steps of reserving various margins for a flat plate (1-2), a right connector (2-2), a cross beam (3-2), a left connector (4-2), a main mirror base (5-2) and a reinforcing plate (6-2) to manufacture a flat plate prefabricated part (1-1), a right connector prefabricated part (2-1), a cross beam prefabricated part (3-1), a left connector prefabricated part (4-1), a main mirror base prefabricated part (5-1) and a reinforcing plate prefabricated part (6-1), annealing treatment is carried out after each prefabricated part is machined and formed, each adjacent prefabricated part is welded and fixed, and polishing and finish machining are carried out.
6. An imaging assembly mounting frame processing method for an optoelectronic imaging device as in claim 5, wherein each prefabricated member has a screw hole and a corresponding counter bore reserved on a connecting end face, and adjacent prefabricated members are connected by hexagon socket countersunk head screws.
7. An imaging assembly mounting frame processing method for an optoelectronic imaging device according to claim 6, wherein a welding groove is reserved at the adjacent position of each prefabricated member, and indium steel welding materials are used for welding between the adjacent prefabricated members.
8. An imaging assembly mounting frame processing method for photoelectric imaging equipment according to claim 5, wherein the prefabricated members are positioned and connected by means of embedded pins, and the connection is reinforced by using a metal-philic adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911169251.1A CN111112945B (en) | 2019-11-26 | 2019-11-26 | Imaging component mounting frame for photoelectric imaging equipment and processing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911169251.1A CN111112945B (en) | 2019-11-26 | 2019-11-26 | Imaging component mounting frame for photoelectric imaging equipment and processing method thereof |
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| Publication Number | Publication Date |
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| CN111112945A true CN111112945A (en) | 2020-05-08 |
| CN111112945B CN111112945B (en) | 2022-06-14 |
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| CN201911169251.1A Active CN111112945B (en) | 2019-11-26 | 2019-11-26 | Imaging component mounting frame for photoelectric imaging equipment and processing method thereof |
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| US6061190A (en) * | 1999-03-11 | 2000-05-09 | Optics For Research | Devices for holding optical components at fixed positions |
| US20080136946A1 (en) * | 2004-06-29 | 2008-06-12 | Takami Hasegawa | Imaging Apparatus Using Solid-State Image Pickup Element |
| CN201137213Y (en) * | 2007-12-20 | 2008-10-22 | 胡大宏 | Precast beam, column member frame connection structure |
| CN201926802U (en) * | 2010-12-06 | 2011-08-10 | 上海微电子装备有限公司 | Prism fixing device |
| CN102207592A (en) * | 2011-06-21 | 2011-10-05 | 成都新易盛通信技术有限公司 | Optical module and manufacturing method thereof |
| CN205404931U (en) * | 2016-02-24 | 2016-07-27 | 苏州康丽达精密电子有限公司 | High -accuracy optics support |
| CN206057662U (en) * | 2016-09-12 | 2017-03-29 | 李勇 | A kind of drawer type optical-filter switcher |
| CN107728407A (en) * | 2017-10-24 | 2018-02-23 | 辽宁中蓝电子科技有限公司 | A kind of integrated glasses base device |
| CN207106925U (en) * | 2017-06-27 | 2018-03-16 | 重庆渝之翼航空科技有限公司 | A kind of unmanned plane camera fixing support |
| CN207396819U (en) * | 2017-11-22 | 2018-05-22 | 济南快谱光电技术有限公司 | A kind of high stability optical adjusting frame |
| CN109454408A (en) * | 2018-12-10 | 2019-03-12 | 宝鸡中车时代工程机械有限公司 | The non-integral processing method of bogie frame |
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2019
- 2019-11-26 CN CN201911169251.1A patent/CN111112945B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6061190A (en) * | 1999-03-11 | 2000-05-09 | Optics For Research | Devices for holding optical components at fixed positions |
| US20080136946A1 (en) * | 2004-06-29 | 2008-06-12 | Takami Hasegawa | Imaging Apparatus Using Solid-State Image Pickup Element |
| CN201137213Y (en) * | 2007-12-20 | 2008-10-22 | 胡大宏 | Precast beam, column member frame connection structure |
| CN201926802U (en) * | 2010-12-06 | 2011-08-10 | 上海微电子装备有限公司 | Prism fixing device |
| CN102207592A (en) * | 2011-06-21 | 2011-10-05 | 成都新易盛通信技术有限公司 | Optical module and manufacturing method thereof |
| CN205404931U (en) * | 2016-02-24 | 2016-07-27 | 苏州康丽达精密电子有限公司 | High -accuracy optics support |
| CN206057662U (en) * | 2016-09-12 | 2017-03-29 | 李勇 | A kind of drawer type optical-filter switcher |
| CN207106925U (en) * | 2017-06-27 | 2018-03-16 | 重庆渝之翼航空科技有限公司 | A kind of unmanned plane camera fixing support |
| CN107728407A (en) * | 2017-10-24 | 2018-02-23 | 辽宁中蓝电子科技有限公司 | A kind of integrated glasses base device |
| CN207396819U (en) * | 2017-11-22 | 2018-05-22 | 济南快谱光电技术有限公司 | A kind of high stability optical adjusting frame |
| CN109454408A (en) * | 2018-12-10 | 2019-03-12 | 宝鸡中车时代工程机械有限公司 | The non-integral processing method of bogie frame |
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| Publication number | Publication date |
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| CN111112945B (en) | 2022-06-14 |
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