CN111101175A - Method for forming electroplated copper on surface of non-metal material - Google Patents
Method for forming electroplated copper on surface of non-metal material Download PDFInfo
- Publication number
- CN111101175A CN111101175A CN201811249064.XA CN201811249064A CN111101175A CN 111101175 A CN111101175 A CN 111101175A CN 201811249064 A CN201811249064 A CN 201811249064A CN 111101175 A CN111101175 A CN 111101175A
- Authority
- CN
- China
- Prior art keywords
- graphene
- metallic material
- electroplated copper
- ink
- recited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007769 metal material Substances 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 39
- 239000010949 copper Substances 0.000 title claims abstract description 39
- 229910052755 nonmetal Inorganic materials 0.000 title claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 86
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 86
- 238000009713 electroplating Methods 0.000 claims abstract description 53
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 238000001035 drying Methods 0.000 claims abstract description 5
- 238000005507 spraying Methods 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims description 19
- 239000011230 binding agent Substances 0.000 claims description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 11
- 239000000178 monomer Substances 0.000 claims description 8
- 239000004971 Cross linker Substances 0.000 claims description 7
- 239000003431 cross linking reagent Substances 0.000 claims description 7
- 239000002270 dispersing agent Substances 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 150000001350 alkyl halides Chemical class 0.000 claims description 6
- 239000002562 thickening agent Substances 0.000 claims description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 5
- 239000003999 initiator Substances 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- -1 amino, hydroxyl Chemical group 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 125000000524 functional group Chemical group 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000002023 wood Substances 0.000 claims description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 239000011593 sulfur Substances 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 7
- 239000003054 catalyst Substances 0.000 abstract description 5
- 230000004048 modification Effects 0.000 abstract description 4
- 238000012986 modification Methods 0.000 abstract description 4
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 229910001385 heavy metal Inorganic materials 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 13
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 4
- 229940117975 chromium trioxide Drugs 0.000 description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 3
- GAMDZJFZMJECOS-UHFFFAOYSA-N chromium(6+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Cr+6] GAMDZJFZMJECOS-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 206010070834 Sensitisation Diseases 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 230000008313 sensitization Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 206010058467 Lung neoplasm malignant Diseases 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 208000006673 asthma Diseases 0.000 description 1
- 235000013361 beverage Nutrition 0.000 description 1
- 230000000711 cancerogenic effect Effects 0.000 description 1
- 231100000357 carcinogen Toxicity 0.000 description 1
- 239000003183 carcinogenic agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- VQWFNAGFNGABOH-UHFFFAOYSA-K chromium(iii) hydroxide Chemical compound [OH-].[OH-].[OH-].[Cr+3] VQWFNAGFNGABOH-UHFFFAOYSA-K 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 230000007674 genetic toxicity Effects 0.000 description 1
- 231100000025 genetic toxicology Toxicity 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 201000005202 lung cancer Diseases 0.000 description 1
- 208000020816 lung neoplasm Diseases 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 210000002850 nasal mucosa Anatomy 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
The invention provides a method for forming electroplated copper on the surface of a non-metallic material, which comprises the steps of preparing graphene-based electroplating ink by using modified functionalized graphene, spraying the graphene-based electroplating ink on the surface of the non-metallic material, drying the graphene-based electroplating ink sprayed on the surface of the non-metallic material, and forming a layer of electroplated copper on the surface of the graphene-based electroplating ink by an electroplating process; the method uses the graphene-based electroplating ink as a conductor of the electroplated copper, enhances the bonding force between the functionalized graphene contained in the graphene-based electroplating ink and the non-metallic material by a modification means, does not need to use heavy metal as a catalyst in an electroplating process, has the advantages of environmental protection and low cost, has excellent adhesiveness and more flexibility, and can be reliably adhered to the surface of the non-metallic material and used as an adhesive between the electroplated copper and the non-metallic material.
Description
Technical Field
The invention relates to the technical field of copper electroplating, in particular to a method for forming copper electroplating on the surface of a non-metallic material.
Background
Electroplating has been widely used in industries on non-metallic materials (plastics, ceramics, glass, wood, etc.), and techniques of electroplating on non-metallic materials have been widely used in many products and industries such as automobiles, consumer goods, pipes, toys, foods and beverages, and cosmetics, because of the characteristics of corrosion resistance, toughness, wear resistance, and aesthetic appearance of the electroplated surfaces.
Conventional electroplating procedures for non-metallic materials generally involve two steps: surface pretreatment and metal plating. Surface preparation involves several chemical treatments and reaction procedures, such as cleaning (cleaning), etching (etching), sensitization (sensitization), activation (activation) and acceleration (neutralization). The surface is roughened using a strong oxidizing agent such as Chromium trioxide (Chromium trioxide) and sulfuric acid mixtures to obtain good mechanical adhesion, as well as creating microvoids to act as adhesion sites between the metal and the substrate.
The prior art pretreats the surface of non-metallic materials with a mixture of chromium trioxide, sulfuric acid and water, or a mixture of these inorganic components and phosphoric acid. However, this method has many disadvantages in that hexavalent chromium contained in the pretreatment solution is a carcinogen with genetic toxicity, and has a high risk. Workers exposed to hexavalent chromium are at risk of suffering lung cancer, asthma or damage to the nasal epithelium and skin. The use of hexavalent chromium may cause long-term environmental pollution and is widely banned in the electronics industry in the united states, europe and china. At the same time as the neutralization, large amounts of chromium hydroxide are formed, which treatment considerably hinders the removal of the compositions used. Furthermore, the pretreatment solution of the known method is very corrosive and requires a large amount of water to completely remove it from the surface of the non-metallic material. In addition, the conventional surface pretreatment process before electroplating is complicated and time-consuming. Because of the treatment of the pretreatment solution and the composition used therewith, it is necessary to reduce the hexavalent chromium compounds and to neutralize the reduction products in order to make it easier to treat the used pretreatment solution.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a method for forming electroplated copper on the surface of a non-metallic material.
The invention finds that the conductivity of the functional graphene can be applied to the electroplating process of metal copper, and based on solving the technical problems, the invention discloses a preferable scheme of a method for forming electroplated copper on the surface of a non-metal material, which comprises the following steps:
preparing graphene-based electroplating ink;
spraying the graphene-based electroplating ink on the surface of a non-metallic material;
drying the graphene-based electroplating ink sprayed on the surface of the non-metallic material for 5-30 minutes at the temperature of 50-200 ℃; and
and soaking the non-metal material with the graphene-based electroplating ink on the surface in an electroplating solution, and applying voltage or current to form electroplated copper on the graphene-based electroplating ink.
Wherein the non-metallic material comprises: any one of plastic, ceramic, wood, glass, and cloth.
Wherein the graphene-based electroplating ink is a mixture consisting of functionalized graphene, a dispersant, a thickener (thickener), and a solvent, wherein the surface of the functionalized graphene contains an oxygen functional group, and the oxygen content of the functionalized graphene containing an oxygen functional group is 5 wt% to 50 wt% of the total weight of the functionalized graphene containing an oxygen functional group.
Wherein the surface of the functionalized graphene contains: any one of amino (amino), hydroxyl (hydroxyl), carboxyl (carboxyl), double bond (double bond), triple bond (triple bond) and alkyl halide (haloalkone).
In a further preferred embodiment of the method for forming electrolytic copper plating on a surface of a non-metallic material of the present invention, the method comprises: a step of modifying the functionalized graphene by any one of binders (binders), cross-linkers (cross-linkers), monomers (monomers), oligomers (oligomers), and polymers (polymers).
The binders, crosslinkers, monomers, oligomers and polymers contain at least one functional group selected from the group consisting of amino, carboxyl, hydroxyl, double, triple, and haloalkane functional groups.
Wherein a preferred embodiment of the mixture as a graphene-based electroplating ink further comprises: a crosslinking agent and an initiator (initiators).
Wherein the functionalized graphene is further doped with any one or a combination of nitrogen (N), sulfur (S), boron (B), fluorine (F) and phosphorus (P).
Wherein the functionalized graphene contains the combination of elements in an amount of 1 wt% to 20 wt% of the total weight of the functionalized graphene.
Wherein the mixture as the graphene-based electroplating ink further comprises: an adhesive (adhesive) made of a polymer or resin or binder (binders) in an amount of 0.1 to 30 wt% of the total weight of the graphene-based electroplating ink.
The method for forming the electroplated copper on the surface of the non-metallic material has the advantages that the method can provide a substitution scheme for the heavy metal catalyst used in the existing process for electroplating copper on the surface of the non-metallic material, realizes the aim of not using hexavalent chromium and palladium as catalysts, and has the advantages of environmental protection, low cost and time saving.
Other features and embodiments of the present invention will be described in detail below with reference to the drawings.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a cross-sectional view of an electroplated copper structure formed by the method of the present invention for forming electroplated copper on the surface of a non-metallic material;
FIG. 2 is a flow chart showing the steps of the method of forming electroplated copper on the surface of a non-metallic material according to the present invention;
FIGS. 3A and 3B are schematic views of the structure according to the steps of the method of the present invention;
FIGS. 4A and 4B are functional diagrams of the present invention, respectively showing the microstructure of the electroplated copper structure formed on the surface of the non-metallic material before and after stretching;
fig. 5 is a diagram illustrating an exemplary embodiment of the present invention.
Description of the symbols
10 nonmetal material 20 graphene-based electroplating ink
30 electro-coppering 40 functionalized graphene
41 Binder and/or crosslinking agent
Detailed Description
The positional relationship described in the following embodiments includes: the top, bottom, left and right, unless otherwise indicated, are based on the orientation of the elements in the drawings.
Referring to fig. 1, a cross-sectional view of an electroplated copper structure formed by the method of forming electroplated copper on the surface of a non-metal material according to the present invention is shown.
In one embodiment as shown in fig. 1, the electroplated copper structure on the surface of the non-metallic material comprises: the non-metallic material comprises a non-metallic material 10, a graphene-based plating ink 20 adhered to the surface of the non-metallic material 10, and a copper plate 30 formed on the graphene-based plating ink 20 by a plating process.
The preferred embodiment of the method for forming electroplated copper on the surface of the non-metallic material of the present invention comprises the following steps:
a. preparing a graphene-based electroplating ink 20;
b. spraying the graphene-based electroplating ink 20 on the surface of a non-metallic material 10 (see fig. 3A);
c. drying the graphene-based electroplating ink 20 sprayed on the surface of the non-metallic material 10 for 5-30 minutes at 50-200 ℃; and
d. the non-metallic material 10 having the graphene-based plating ink 20 on the surface thereof is soaked in a plating solution, and a plated copper 30 is formed on the graphene-based plating ink 20 by applying a voltage or a current (see fig. 3B).
In a further preferred embodiment of the method for forming electrolytic copper plating on a surface of a non-metallic material of the present invention, the method comprises: a step of modifying the functionalized graphene by any one of binders (binders), cross-linkers (cross-linkers), monomers (monomers), oligomers (oligomers), and polymers (polymers). The modification step can enhance the adhesion between the functionalized graphene contained in the graphene-based electroplating ink 20 and the non-metallic material 10. The binder, the crosslinking agent, the monomer, the oligomer and the polymer contain at least one functional group selected from the group consisting of amino, carboxyl, hydroxyl, double bond, triple bond and haloalkane functional groups, so as to enhance the adhesion between the functionalized graphene contained in the graphene-based electroplating ink 20 and the non-metallic material 10.
Wherein the non-metallic material 10 may be: any one of plastic, ceramic, wood, glass, and cloth.
One preferred embodiment of the graphene-based electroplating ink 20 is a mixture of functionalized graphene (functionalized graphene), dispersants (dispersants), thickeners (thickeners), and solvents (solvents). Wherein the surface of the functionalized graphene contains an oxygen functional group, and the oxygen content of the functionalized graphene containing an oxygen functional group is 5 wt% to 50 wt% of the total weight of the functionalized graphene containing an oxygen functional group. As another preferred embodiment of the functionalized graphene, wherein the surface of the functionalized graphene contains: any one of amino (amino), hydroxyl (hydroxyl), carboxyl (carboxyl), double bond (double bond), triple bond (triple bond) and alkyl halide (haloalkone).
As a preferred embodiment of the mixture of the graphene-based electroplating ink 20, the functionalized graphene is contained in an amount of 0.5 wt% to 30 wt% of the mixture. The content of the dispersant accounts for 0.05 to 20 weight percent of the mixture, and the dispersant can be ionic or non-ionic dispersant. The solvent can be selected from organic, inorganic or aqueous systems and accounts for 30-90 wt% of the mixture. The thickener can also be used to make a high viscosity graphene-based electroplating ink 20 in an amount of 0.01 wt% to 10 wt% of the mixture.
Wherein a preferred embodiment of the mixture as the graphene-based plating ink 20 further comprises: cross-linking agents (crosslinkers) and initiators (initiators).
Wherein another preferred embodiment of the mixture as the graphene-based electroplating ink 20 further comprises: an adhesive (adhesive) made of a polymer or resin or binder (binders) in an amount of 0.1 to 30 wt% of the total weight of the graphene-based electroplating ink.
Wherein the functionalized graphene is further doped with any one or a combination of nitrogen (N), sulfur (S), boron (B), fluorine (F) and phosphorus (P). Wherein the functionalized graphene contains the combination of elements in an amount of 1 wt% to 20 wt% of the total weight of the functionalized graphene.
Please refer to fig. 4A and 4B. As can be seen from fig. 4A, the layered structure of the functionalized graphene 40 in the graphene-based plating ink 20 is not broken before and after stretching by the action of the binder and/or the crosslinking agent 41 mixed between the functionalized graphene 40, and the functionalized graphene 40 in the graphene-based plating ink 20 can be reliably adhered to the surface of the non-metallic material 10 and can be used as an adhesive between the copper plating 30 and the non-metallic material 10.
Example 1
Please refer to fig. 5, which is a diagram illustrating an exemplary implementation of the method of the present invention. As an example of the method for forming electroplated copper on the surface of the non-metal material according to the present invention, plastic is selected as the non-metal material 10, the graphene-based electroplating ink 20 is applied on the surface of the non-metal material 10, please refer to fig. 5(a), then dried in an oven at 100 ℃ for 20 minutes, after the drying is completed, the non-metal material 10 with the graphene-based electroplating ink 20 adhered on the surface is placed in an electroplating solution for 30 to 120 minutes, and an electroplated copper 30 is formed on the graphene-based electroplating ink 20 by applying a voltage or a current, please refer to fig. 5 (B).
The method for forming the electroplated copper on the surface of the non-metallic material has the advantages that the method can provide a substitution scheme for the heavy metal catalyst used in the existing process for electroplating copper on the surface of the non-metallic material, realizes the aim of not using hexavalent chromium and palladium as catalysts, and has the advantages of environmental protection, low cost and time saving. On the other hand, the modification step can enhance the adhesion between the functionalized graphene contained in the graphene-based electroplating ink 20 and the non-metallic material 10.
The above-described embodiments and/or implementations are only for illustrating the preferred embodiments and/or implementations of the present technology, and are not intended to limit the implementations of the present technology in any way, and those skilled in the art may make modifications or changes to other equivalent embodiments without departing from the scope of the technical means disclosed in the present disclosure, but should be construed as the technology or implementations substantially the same as the present technology.
Claims (11)
1. A method of forming electroplated copper on a surface of a non-metallic material, comprising:
preparing graphene-based electroplating ink;
spraying the graphene-based electroplating ink on the surface of a non-metallic material;
drying the graphene-based electroplating ink sprayed on the surface of the non-metallic material for 5-30 minutes at 50-200 ℃; and
and soaking the non-metal material with the graphene-based electroplating ink on the surface in an electroplating solution, and applying voltage or current to form electroplated copper on the graphene-based electroplating ink.
2. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 1, wherein: the non-metallic material comprises: any one of plastic, ceramic, wood, glass, and cloth.
3. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 1, wherein: the graphene-based electroplating ink is a mixture consisting of functionalized graphene, a dispersant, a thickener and a solvent.
4. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 3, wherein: the surface of the functionalized graphene contains oxygen functional groups, and the oxygen content of the functionalized graphene containing oxygen functional groups is 5 wt% to 50 wt% of the total weight of the functionalized graphene containing oxygen functional groups.
5. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 3, wherein: the surface of the functionalized graphene contains: any one functional group of amino, hydroxyl, carboxyl, double bond, triple bond and alkyl halide.
6. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 3, wherein: comprising the step of modifying the functionalized graphene with any one of a binder, a cross-linking agent, a monomer, an oligomer and a polymer.
7. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 6, wherein: the binder, the crosslinker, the monomer, the oligomer, and the polymer contain at least one functional group selected from the group consisting of amino, carboxyl, hydroxyl, double bond, triple bond, and haloalkane functional groups.
8. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 3, wherein: the mixture as the graphene-based electroplating ink further comprises: a cross-linking agent and an initiator.
9. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 3, wherein: the functionalized graphene is further doped with any one or combination of nitrogen, sulfur, boron, fluorine and phosphorus.
10. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 9, wherein: the content of the combination of elements contained in the functionalized graphene is 1 wt% to 20 wt% of the total weight of the functionalized graphene.
11. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 1, wherein: the mixture as the graphene-based electroplating ink further comprises: an adhesive made of a polymer or a resin or a binder, the content of the adhesive being 0.1 wt% to 30 wt% of the total weight of the graphene-based electroplating ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811249064.XA CN111101175A (en) | 2018-10-25 | 2018-10-25 | Method for forming electroplated copper on surface of non-metal material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811249064.XA CN111101175A (en) | 2018-10-25 | 2018-10-25 | Method for forming electroplated copper on surface of non-metal material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111101175A true CN111101175A (en) | 2020-05-05 |
Family
ID=70418765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811249064.XA Pending CN111101175A (en) | 2018-10-25 | 2018-10-25 | Method for forming electroplated copper on surface of non-metal material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111101175A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102251233A (en) * | 2010-05-18 | 2011-11-23 | 三星电子株式会社 | Resin plating method using graphene thin layer |
| CN102977742A (en) * | 2012-12-19 | 2013-03-20 | 中国科学院宁波材料技术与工程研究所 | Conducting paint |
| CN103113786A (en) * | 2013-03-07 | 2013-05-22 | 苏州牛剑新材料有限公司 | Graphene conductive ink and preparation method thereof |
| CN104693897A (en) * | 2015-02-28 | 2015-06-10 | 济宁利特纳米技术有限责任公司 | Conductive ink based on graphene composite material and preparation method thereof |
| CN108425138A (en) * | 2018-05-11 | 2018-08-21 | 华侨大学 | A kind of surface treatment method for ABS plastic plating |
-
2018
- 2018-10-25 CN CN201811249064.XA patent/CN111101175A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102251233A (en) * | 2010-05-18 | 2011-11-23 | 三星电子株式会社 | Resin plating method using graphene thin layer |
| JP2011241479A (en) * | 2010-05-18 | 2011-12-01 | Samsung Electronics Co Ltd | Plating method of resin using graphene thin film |
| CN102977742A (en) * | 2012-12-19 | 2013-03-20 | 中国科学院宁波材料技术与工程研究所 | Conducting paint |
| CN103113786A (en) * | 2013-03-07 | 2013-05-22 | 苏州牛剑新材料有限公司 | Graphene conductive ink and preparation method thereof |
| CN104693897A (en) * | 2015-02-28 | 2015-06-10 | 济宁利特纳米技术有限责任公司 | Conductive ink based on graphene composite material and preparation method thereof |
| CN108425138A (en) * | 2018-05-11 | 2018-08-21 | 华侨大学 | A kind of surface treatment method for ABS plastic plating |
Non-Patent Citations (1)
| Title |
|---|
| 付长璟, 哈尔滨工业大学出版社 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102049236B1 (en) | Conductive Polymer Dispersion, Manufacturing Method Thereof, and Manufacturing Method of Conductive Film | |
| SG190020A1 (en) | Transparent conductive glass substrate | |
| CN112375459B (en) | Graphene/water-based epoxy zinc-rich coating with high corrosion resistance and strong adhesive force and preparation method thereof | |
| JP7061817B2 (en) | Copper-based conductive paste and its manufacturing method | |
| CN107805798A (en) | Graphene prefilming agent and its preparation and application before coated metal | |
| KR20170041813A (en) | Treatment for electroplating racks to avoid rack metallization | |
| JP2010031318A (en) | Plated article | |
| US20200149178A1 (en) | Method for forming electroplated copper on surface of non-metal material by graphene-based ink | |
| CN111101175A (en) | Method for forming electroplated copper on surface of non-metal material | |
| KR102364792B1 (en) | Laminate, printed wiring board, flexible printed wiring board and molded article using the same | |
| Chen et al. | Interactions of BTESPT silane and maleic anhydride grafted polypropylene with epoxy and application to improve adhesive durability between epoxy and aluminium sheet | |
| EP3656894A1 (en) | Method for electroplating copper on non-metallic surfaces using graphene-based ink | |
| CN110982376B (en) | Anti-skid powder coating and online coating method thereof | |
| CN105131720B (en) | A kind of alcohol radical nano silver wire conductive ink | |
| KR102409631B1 (en) | Copper powder based conductive paste for improved heat resistance and its preparation method | |
| US4522850A (en) | Polymeric substrates for electroless metal deposition | |
| JP2007204689A (en) | Water-based electroconductive resin emulsion | |
| CN105237671A (en) | Terpolymer emulsion containing 1-vinyl imidazole, and preparation method thereof | |
| US20200128666A1 (en) | Flexible printed circuit and method for manufacturing the same | |
| CN111197160A (en) | Method for forming copper metal layer on surface of non-metal material | |
| TWI728617B (en) | Ion exchange resin, methods for preparing the same, and film employing the same | |
| JP7462426B2 (en) | Method for producing modified conductive composite, method for producing modified conductive composite dispersion, and method for producing conductive film | |
| CN105111350A (en) | Terpolymer emulsion containing 1-vinyl iminazole and preparation method thereof | |
| CN217099272U (en) | Corrosion-resistant epoxy paint coating structure | |
| EP3657917A1 (en) | Flexible printed circuit and method for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200505 |
|
| WD01 | Invention patent application deemed withdrawn after publication |