CN111101010A - High-strength high-conductivity copper-niobium alloy material and preparation method thereof - Google Patents
High-strength high-conductivity copper-niobium alloy material and preparation method thereof Download PDFInfo
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- CN111101010A CN111101010A CN201911370716.XA CN201911370716A CN111101010A CN 111101010 A CN111101010 A CN 111101010A CN 201911370716 A CN201911370716 A CN 201911370716A CN 111101010 A CN111101010 A CN 111101010A
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C1/00—Making non-ferrous alloys
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C9/00—Alloys based on copper
Abstract
The invention relates to the technical field of metal materials, in particular to a high-strength high-conductivity copper-niobium alloy material and a preparation method thereof. The invention aims to provide a high-strength high-conductivity copper-niobium alloy material and a preparation method thereof, wherein the preparation method of the high-strength high-conductivity copper-niobium alloy material comprises the following steps: step S1: copper powder and niobium powder are ball-milled into nano powder in a ball milling tank, wherein the content of the niobium powder is more than 0 and less than or equal to 1 wt%, and the balance is copper powder; step S2: pressing and molding the nano powder to obtain a blank; step S3: and sintering the blank at the temperature of 420-500 ℃ to obtain the material. The preparation process of the high-strength high-conductivity copper-niobium alloy is simple in process, does not have a smelting process, achieves the effects of energy conservation and environmental protection, and the obtained copper-niobium alloy material has high strength and high conductivity.
Description
Technical Field
The invention relates to the technical field of metal materials, in particular to a high-strength high-conductivity copper-niobium alloy material and a preparation method thereof.
Background
Because copper and copper alloy have excellent physical properties such as high electrical conductivity, high thermal conductivity and good processability and formability, copper and copper alloy are widely applied to the fields of marine ships, electronic appliances, aerospace and aviation, machine manufacturing, metallurgy, national defense war industry and the like, and play a significant role in national defense construction and scientific and technological development. The mechanical property of the material can be obviously improved by adding a proper amount of niobium into the copper alloy. The copper-niobium alloy can be used for manufacturing springs working at high temperature, still keeps good elasticity and toughness in a red hot state, and can be repeatedly compressed for hundreds of millions of times. Copper niobium can be used to make electrical connectors, switch contacts, critical components such as membrane disks, diaphragms, bellows, spring washers, microelectromechanical brushes and commutators, electrical connectors, watch parts, audio components, and the like. The copper and the niobium are easy to weld and braze, have excellent corrosion resistance in atmosphere, fresh water and seawater, and are suitable for manufacturing deep sea detectors and submarine cables. Copper niobium has a particular advantage: the spark is not generated when the impact is applied, which is very important for manufacturing tools special for military industry, petroleum and mines. For copper alloy, the conductivity is the main application property, and the mechanical property of the material is enhanced by adding alloy elements, but the conductivity is rapidly reduced. Therefore, the preparation of the copper-niobium alloy with excellent mechanical properties and electrical properties is a problem to be solved.
To date, various preparation and processing technologies for copper-niobium composite materials have been developed, such as Lee et al (ActaMaterialia, 60, 1747-; misra et al (Philophilal Magazine, 84, 1021-. Dunlian et al (Journal of Alloys and Compounds, 602, 331-338; Ph's university of Chongqing, 2014) indicated that by conventional in situ drawing, the niobium phase inside the material is transformed into a nano-scale fiber shape, which greatly increases the copper-niobium heterogeneous interface area per unit volume, thereby producing a high-strength copper-niobium composite wire. In addition, the bundle drawing technology is also an important means for preparing the copper-niobium composite wire, and the copper-niobium composite wire which takes copper as a matrix and niobium core wire as a reinforcement is prepared by multiple times of bundle drawing and heat treatment by the Jingming et al (CN 201110080239.0). Wangpeng et al (CN201611060545.7) indicated that the strength limit of the copper-niobium composite wire prepared by bundling and drawing is between 800MPa and 900MPa, and the strength of the material is difficult to further improve. Zhang Yongleather et al (CN201710493162) use a pure niobium round bar as a bar core, put the bar core into an oxygen-free copper round tube, and draw and heat-treat the assembled copper-niobium composite bar to prepare a high-strength copper-niobium composite wire rod with a niobium core alternately coated by copper and niobium, wherein the tensile strength of the material can reach 987MPa, and the corresponding conductivity is 74.6% IACS. Yangtze river et al (CN201711387284.4) prefer primary and secondary addition elements in the alloying process, thereby greatly reducing the usage amount of alloy elements, effectively preventing the copper-niobium alloy from burning and evaporating in a smelting state, and obtaining the copper-niobium alloy with excellent die-casting performance.
The main problem of the smelting method for preparing the copper-niobium alloy is that niobium is easy to oxidize and burn to generate a loose oxide film and a loose nitride film, and the diffusion of oxygen and nitrogen to the surface of a melt cannot be prevented, so that the copper-niobium alloy is continuously oxidized and consumed. At present, when the copper-niobium alloy is prepared by a smelting method, argon protection is generally adopted. Because the smelting temperature is about 1200 ℃, the niobium has overlarge vapor pressure to cause the niobium to continuously volatilize in the smelting process, and the yield of the residual niobium in the alloy is only about 10 to 30 wt%; in addition, the method has complex equipment and high production cost, the casting product is easy to be mixed with flux, and the performance can not meet the requirement. In addition, as can be seen from a Cu-Nb phase diagram, niobium and copper are hardly mutually soluble in an equilibrium state, and the conventional smelting method is a pseudo alloy. Therefore, the dispersion uniformity of niobium in the prepared product is not easy to control, and the niobium is easy to segregate, so that the performance is not uniform.
And the copper-niobium alloy with higher performance is prepared by deformation compounding methods such as accumulative pack rolling, in-situ drawing, bundling drawing and the like. However, due to the technical limitations, the method is only suitable for preparing wires, the preparation process is complex and time-consuming, the energy consumption is high, the repeatability is not high, and the high-temperature resistance stability of the prepared material is low.
In the copper-niobium alloy, niobium is dispersed into a copper matrix as a second phase to play a strengthening role. Generally, the smaller the second phase particles are, the better the strengthening effect on metal or alloy is, but the process of adding nano-scale particles into molten metal by the traditional method is complex, the control requirement on the production process is high, and the uniform distribution of the nano-particles is difficult to realize. And only the second phase particles are refined to be nano-structure, and the performance improvement of the material is limited. The preparation of the material with the three-dimensional nano structure is a difficult problem in the field of material research. On one hand, the nano powder is difficult to prepare, expensive, extremely easy to oxidize and not beneficial to transportation and storage. On the other hand, the crystal grains of the nano powder can grow rapidly in the sintering process, the size of the crystal grains is extremely difficult to control, and the conventional method can not prepare compact copper-niobium alloy blocks with three-dimensional nano structures.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a high-strength high-conductivity copper-niobium alloy material and a preparation method thereof.
The purpose of the invention is realized by adopting the following technical scheme:
the invention provides a preparation method of a high-strength high-conductivity copper-niobium alloy material, which comprises the following steps: step S1: copper powder and niobium powder are ball-milled into nano powder in a ball milling tank, wherein the content of the niobium powder is more than 0 and less than or equal to 1 wt%, and the balance is copper powder; step S2: pressing and molding the nano powder to obtain a blank; step S3: and sintering the blank at the temperature of 420-500 ℃ to obtain the copper-niobium alloy material.
In one embodiment, in the step S3, the sintering temperature is 460-500 ℃.
In one embodiment, in the step S3, the sintering time is 0-10 min.
In one embodiment, in the step S3, the sintering time is 1-3 min.
In one embodiment, in the step S3, the average grain size inside the copper-niobium alloy material is 20 to 100 nm.
In one embodiment, in the step S1, the ball milling time is 60 to 180 hours.
In one embodiment, in the step S1, the ball milling time is 130 h.
In one embodiment, in the step S1, the particle size of the nano-powder is 10 to 20 nm.
In one embodiment, in the step S3, the preheating time is 0-10 min.
The invention also provides a high-strength high-conductivity copper-niobium alloy material prepared by the preparation method of the high-strength high-conductivity copper-niobium alloy material.
Compared with the prior art, the invention has the beneficial effects that:
the preparation process of the copper-niobium alloy is simple in process and free of smelting process, the effects of energy conservation and environmental protection are achieved, and the copper-niobium alloy with the three-dimensional nano structure is obtained. In addition, the growth of crystal grains in the sintering process is controlled through lower sintering temperature in the preparation process of the copper-niobium alloy, so that the copper-niobium alloy material keeps higher strength, namely the performance of the copper-niobium alloy material is improved through the combined action of the nano-structure reinforcement and the nano-scale micro-alloying of the copper-niobium matrix.
Detailed Description
The present invention will be described in more detail below, and it should be noted that the description of the present invention is only illustrative and not restrictive. The various embodiments may be combined with each other to form other embodiments not shown in the following description.
The invention provides a preparation method of a high-strength high-conductivity copper-niobium alloy material, which comprises the following steps: step S1: and weighing the copper powder and the niobium powder in proportion, then loading the weighed copper powder and niobium powder into a ball milling tank, and carrying out high-energy ball milling to obtain nano powder. The content of the niobium powder is more than 0 and less than or equal to 1 wt%, the balance is copper powder, the content of the niobium powder is preferably 0.1-1 wt%, and more preferably 0.1-0.8 wt%. The niobium powder is less in addition amount, and the conductivity of the material is less in reduction. The niobium powder is added into the copper powder to enhance the mechanical property of the copper powder, but the conductivity of the copper powder is reduced due to the excessive addition of the niobium powder; the addition amount is too small, the material strength is low, and the requirement cannot be met.
The material of the inner lining of the ball milling tank body and the ball milling medium has great influence on impurities introduced in the ball milling process of the copper powder and the niobium powder, so that the final performance of the material is influenced; meanwhile, the hardness of the material can influence the ball milling efficiency, and is high relative to the ball milling efficiency, so that in order to reduce impurities such as iron and the like introduced into ball milling powder due to continuous collision and abrasion of the inner lining of the stainless steel ball milling tank body and a ball milling medium in the ball milling process, the invention can design to use red copper as the inner lining of the ball milling tank and red copper balls as the ball milling medium. Because red copper is relatively soft, hardening treatment needs to be carried out for about 200 hours of continuous ball milling before ball milling, and the lining of the ball milling tank and a ball milling medium have enough hardness. It should be noted that before the step of ball milling the copper powder and the niobium powder, a layer of micromolecules is grafted on the surfaces of the copper powder and the niobium powder, and then parameters such as re-agglomeration ball milling time of the nano powder, the using amount of a process control agent and the like are controlled in the ball milling process, so that the surface area of the agglomerated nano powder is greatly reduced, the protection of the nano powder is realized, and the oxidation phenomenon of the nano powder after ball milling after being placed in the air for a long time is reduced or avoided.
Step S2: and applying pressure to the nano powder to press and form the nano powder to obtain a blank. It should be understood that, in the process of pressure forming the nano powder, the higher the compactness of the nano powder, the more beneficial the subsequent sintering process. In the process of pressure forming of the nano powder, the pressure is preferably 300 MPa.
Step S3: and sintering the blank at the temperature of 420-500 ℃ to obtain the copper-niobium alloy material. The growth rate of the crystal grains is accelerated along with the increase of the temperature and the increase of the sintering temperature, and particularly, the growth rate of the crystal grains is faster as the sintering temperature is higher. The invention adopts a pressure-assisted low-temperature rapid activation solid-phase sintering technology, and the technology is suitable for sintering high-activity nano copper and copper alloy powder. The specific principle is that the energy of the high-activity powder is released in a concentrated manner at a certain temperature, so that the instantaneous sintering of the nano powder at a lower temperature is realized, the growth process of crystal grains is inhibited, and the compact copper alloy block with the three-dimensional nano structure is obtained. The specific preparation process is that the molded blank is wrapped by carbon paper and then placed in the middle of a hot-pressing die and preheated in a resistance furnace; and (3) immediately pressurizing to more than 100Mpa for sintering after the sample is heated to the sintering temperature, wherein the sintering time is preferably 1-3 min, and the overlong sintering time does not influence the material densification process, but can cause the material strength to be reduced. It should be understood that the greater the pressure at which the green body is pressurized, the better the die can withstand, and 200Mpa is preferred in the present invention.
In one embodiment, in the step S3, the sintering temperature is preferably 460 to 500 ℃. The present invention controls the grain size in the alloy by sintering below the melting point of copper.
In one embodiment, in the step S3, the sintering time is 0-10 min. Preferably, in the step S3, the sintering time is 1-3 min. The present invention also achieves control of grain size in the alloy material by sintering temperatures below the melting point of copper and sintering times that are as short as possible.
In a specific embodiment, the average grain size inside the formed copper-niobium alloy material is 20-100 nm, namely, the copper-niobium alloy with the three-dimensional nano structure is prepared by a mechanical alloying and low-temperature transient activation solid-phase sintering method.
In one embodiment, the preheating time is 0-10 min, preferably 3-5 min, and the purpose of preheating is to uniformly heat the green body to the sintering temperature.
In one embodiment, the ball-to-feed ratio during ball milling is (3-20): 1, preferably (4-10): 1, more preferably the earth-to-feed ratio is 4: 1. specifically, when the ball-to-material ratio is 4:1, the ball milling efficiency is optimal, and when the ball-to-material ratio is greater than or less than 4:1, the ball milling efficiency is reduced although the nano powder can be obtained.
In one embodiment, in the step S1, the process control agent may be stearic acid, ethyl acetate, ethane, heptane, acetone, methanol, ethanol, ethylene glycol or benzene, etc., and in one embodiment, the corresponding process control agent may be selected according to specific ball milling parameters, which is not limited herein. In one embodiment of the invention, the content of the process control agent is 0.1-10 ml per kg of the total amount of the copper powder and the niobium powder, preferably 2-6 ml per kg of the total amount of the copper powder and the niobium powder, the higher the content of the process control agent is, the higher the ball milling efficiency is, the less the required ball milling time is, but the more the process control agent is, the lower the ball milling efficiency is, and the more the required ball milling time is increased.
In addition, the ball-to-feed ratio is increased, the ball milling efficiency is improved, and the required process control agent is increased. Acetone is preferred as the process control agent in the present invention, and the amount of process control agent is one milliliter per kilogram of the total amount of copper and niobium powder.
In one embodiment, in the step S1, the ball milling time is 60 to 180 hours, and preferably 130 hours. It should be noted that, as the size of the initial particle of the copper powder and the niobium powder and the change of the ball milling medium, the ball milling time changes, for example, the larger the initial particle size of the copper powder and the niobium powder is, the more the required ball milling time increases; the ball milling medium is replaced by red copper from stainless steel, and the ball milling time is increased.
In a specific embodiment, in the step S1, the particle size of the nano powder is 10 to 20nm, and the copper powder and the niobium powder are ball-milled to a nano size to achieve micro-alloying of the nano powder.
The method for preparing the copper-niobium alloy material by mechanical alloying and low-temperature instantaneous activation solid-phase sintering has the advantages of simple process, no smelting process, almost no loss of raw materials, energy conservation, environmental protection and excellent performance. The performance of the material is improved by the combined action of the nano-structure reinforcement and the nano-scale micro-alloying of the copper-niobium matrix, wherein the ball-milled powder reaches the nano level in the high-energy ball milling process, and the nano-scale micro-alloying is realized; and (3) sintering the ball-milled nano powder, and controlling the sintering temperature and the sintering time in the sintering process to control the growth of grains, so that the formed copper-niobium alloy material nano structure is strengthened. Namely, the addition amount of the niobium powder is reduced, so that the copper-niobium alloy material keeps higher conductivity, and the lower sintering temperature is that the copper-niobium alloy keeps higher strength, namely, the copper-niobium alloy material with higher strength is obtained under the combined action of nano-structure strengthening and micro-alloying.
The invention also provides a high-strength high-conductivity copper-niobium alloy material prepared by the preparation method of the high-strength high-conductivity copper-niobium alloy material. By adding a small amount of niobium into the copper material and combining the reinforcing effect of the nano structure and the auxiliary effect of microalloying, the formed copper-niobium alloy material has higher strength and electrical conductivity.
If the copper-niobium alloy material prepared by the preparation method is subjected to ball milling in a ball milling tank by taking red copper as a ball milling medium, no iron impurity is introduced, the conductivity and the strength are improved, and the non-magnetism of the copper material is realized.
Example 1
Copper powder and niobium powder are weighed, mixed and loaded into a ball milling tank, wherein the content of niobium is 0.1 wt%, the balance is copper, the total weight is 300kg, and the ball material ratio is 4:1, 600ml of process control agent and 150h of ball milling time. And placing the blank formed by pressing the ball-milled nano powder into a high-temperature furnace, wherein the sintering temperature is 460 ℃, preheating for 3 minutes, and then pressurizing. The pressure is 200MPa, and the sintering and heat preservation are carried out for 1 minute. Then taking out for aging treatment at 210 ℃ for 5 hours. The sample was polished to a relative density of 98.5%. Tensile strength 667MPa, elastic modulus 124GPa, and electrical conductivity 80.0% IACS.
Example 2
Copper powder and niobium powder are weighed, mixed and loaded into a ball milling tank, wherein the content of niobium is 0.2 wt.%, the balance is copper, the total weight is 300kg, and the ball material ratio is 4:1, 500ml of process control agent and 140 hours of ball milling time. And (3) placing the blank formed by pressing the ball-milled nano powder in a high-temperature furnace, wherein the sintering temperature is 460 ℃, preheating for 3 minutes, and then pressurizing. The pressure is 200MPa, and the sintering and heat preservation are carried out for 1 minute. Then taking out for aging treatment at 210 ℃ for 5 hours. The sample was polished to a relative density of 98.3%. Tensile strength 733MPa, elastic modulus 125GPa, and electrical conductivity 79.2% IACS.
Example 3
Copper powder and niobium powder are weighed, mixed and loaded into a ball milling tank, wherein the content of niobium is 0.3 wt.%, the balance is copper, the total weight is 300kg, and the ball material ratio is 4:1, 350ml of process control agent and 140h of ball milling time. And (3) placing the blank formed by pressing the ball-milled nano powder in a high-temperature furnace, wherein the sintering temperature is 460 ℃, preheating for 3 minutes, and then pressurizing. The pressure is 200MPa, and the sintering and heat preservation are carried out for 1 minute. Then taking out for aging treatment at 210 ℃ for 5 hours. The sample was polished to a relative density of 98.4%. Tensile strength 809MPa, elastic modulus 131GPa and electric conductivity 78.1% IACS.
Example 4
Copper powder and niobium powder are weighed, mixed and loaded into a ball milling tank, wherein the content of niobium is 0.5 wt%, the balance is copper, the total weight is 300kg, and the ball material ratio is 4:1, 300ml of process control agent and 140h of ball milling time. And (3) placing the blank formed by pressing the ball-milled nano powder in a high-temperature furnace, preheating for 3 minutes at the junction temperature of 460 ℃, and then pressurizing. The pressure is 200MPa, and the sintering and heat preservation are carried out for 1 minute. Then taking out for aging treatment at 210 ℃ for 5 hours. The sample was polished to a relative density of 98.3%. Tensile strength 943MPa, elastic modulus 132GPa, and electric conductivity 75.5% IACS.
Example 5
Copper powder and niobium powder are weighed, mixed and loaded into a ball milling tank, wherein the content of niobium is 0.8 wt%, the balance is copper, the total weight is 300kg, and the ball material ratio is 4:1, 200ml of process control agent and 120h of ball milling time. And (3) placing the blank formed by pressing the ball-milled nano powder in a high-temperature furnace, wherein the sintering temperature is 460 ℃, preheating for 3 minutes, and then pressurizing. The pressure is 200MPa, and the sintering and heat preservation are carried out for 1 minute. Then taking out for aging treatment at 210 ℃ for 5 hours. The sample was polished to a relative density of 98.2%. Tensile strength 975MPa, elastic modulus 133GPa, and electrical conductivity 74.3% IACS.
Example 6
Copper powder and niobium powder are weighed, mixed and loaded into a ball milling tank, wherein the niobium content is 1.0 wt.%, the balance is copper, the total weight is 300kg, and the ball material ratio is 4:1, 200ml of process control agent and 110h of ball milling time. And (3) placing the blank formed by pressing the ball-milled nano powder in a high-temperature furnace, wherein the sintering temperature is 460 ℃, preheating for 3 minutes, and then pressurizing. The pressure is 200MPa, and the sintering and heat preservation are carried out for 1 minute. Then taking out for aging treatment at 210 ℃ for 5 hours. The sample was polished to a relative density of 98.3%. Tensile strength 974MPa, elastic modulus 132GPa, and electric conductivity 70.2% IACS.
Example 7
Copper powder and niobium powder are weighed, mixed and loaded into a ball milling tank, wherein the content of niobium is 0.3 wt.%, the balance is copper, the total weight is 300kg, and the ball material ratio is 4:1, 350ml of process control agent and 140h of ball milling time. And (3) placing the blank formed by pressing the ball-milled nano powder in a high-temperature furnace, wherein the sintering temperature is 460 ℃, preheating for 3 minutes, and then pressurizing. The pressure is 200MPa, and the sintering and heat preservation are carried out for 2 minutes. Then taking out for aging treatment at 210 ℃ for 5 hours. The sample was polished to a relative density of 98.4%. Tensile strength 799MPa, elastic modulus 131GPa, and electrical conductivity 78.2% IACS.
Example 8
Copper powder and niobium powder are weighed, mixed and loaded into a ball milling tank, wherein the content of niobium is 0.3 wt.%, the balance is copper, the total weight is 300kg, and the ball material ratio is 4:1, 350ml of process control agent and 140h of ball milling time. And (3) placing the blank formed by pressing the ball-milled nano powder in a high-temperature furnace, wherein the sintering temperature is 460 ℃, preheating for 3 minutes, and then pressurizing. The pressure is 200MPa, and the sintering and heat preservation are carried out for 3 minutes. Then taking out for aging treatment at 210 ℃ for 5 hours. The sample was polished to a relative density of 98.5%. The tensile strength is 787MPa, the elastic modulus is 131GPa, and the electric conductivity is 78.4 percent IACS.
Example 9
Copper powder and niobium powder are weighed, mixed and loaded into a ball milling tank, wherein the content of niobium is 0.3 wt.%, the balance is copper, the total weight is 300kg, and the ball material ratio is 4:1, 350ml of process control agent and 140h of ball milling time. And (3) placing the blank formed by pressing the ball-milled nano powder in a high-temperature furnace, wherein the sintering temperature is 420 ℃, preheating for 3 minutes, and then pressurizing. The pressure is 200MPa, and the sintering and heat preservation are carried out for 1 minute. Then taking out for aging treatment at 210 ℃ for 5 hours. The sample was polished to a relative density of 98.1%. The tensile strength is 437MPa, the elastic modulus is 95GPa, and the electric conductivity is 77.8 percent IACS.
Example 10
Copper powder and niobium powder are weighed, mixed and loaded into a ball milling tank, wherein the content of niobium is 0.3 wt.%, the balance is copper, the total weight is 300kg, and the ball material ratio is 4:1, 350ml of process control agent and 140h of ball milling time. And (3) placing the blank formed by pressing the ball-milled nano powder in a high-temperature furnace, wherein the sintering temperature is 500 ℃, preheating for 3 minutes, and then pressurizing. The pressure is 200MPa, and the sintering and heat preservation are carried out for 1 minute. Then taking out for aging treatment at 210 ℃ for 5 hours. The sample was polished to a relative density of 98.4%. Tensile strength 746MPa, elastic modulus 129GPa, electrical conductivity 78.0% IACS.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.
Claims (10)
1. A preparation method of a high-strength high-conductivity copper-niobium alloy material is characterized by comprising the following steps:
step S1: copper powder and niobium powder are ball-milled into nano powder in a ball milling tank, wherein the content of the niobium powder is more than 0 and less than or equal to 1 wt%, and the balance is copper powder;
step S2: pressing and molding the nano powder to obtain a blank;
step S3: and sintering the blank at the temperature of 420-500 ℃ to obtain the copper-niobium alloy material.
2. The method for preparing the high-strength high-conductivity copper-niobium alloy material according to claim 1, wherein in the step S3, the sintering temperature is 460-500 ℃.
3. The method for preparing the high-strength high-conductivity copper-niobium alloy material according to claim 1, wherein in the step S3, the sintering time is 0-10 min.
4. The method for preparing the high-strength high-conductivity copper-niobium alloy material according to claim 3, wherein in the step S3, the sintering time is 1-3 min.
5. The method for preparing a high-strength high-conductivity copper-niobium alloy material as claimed in any one of claims 1 to 4, wherein in the step S3, the average grain size inside the copper-niobium alloy material is 20 to 100 nm.
6. The method for preparing the high-strength high-conductivity copper-niobium alloy material according to claim 1, wherein in the step S1, the ball milling time is 60-180 h.
7. The method for preparing the high-strength high-conductivity copper-niobium alloy material according to claim 6, wherein in the step S1, the ball milling time is 130 h.
8. The method for preparing the high-strength high-conductivity copper-niobium alloy material according to claim 1, wherein in the step S1, the particle size of the nano powder is 10 to 20 nm.
9. The method for preparing the high-strength high-conductivity copper-niobium alloy material according to claim 1, wherein in the step S3, the preheating time is 0-10 min.
10. A high-strength high-conductivity copper-niobium alloy material prepared by the preparation method of the high-strength high-conductivity copper-niobium alloy material as claimed in any one of claims 1 to 9.
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| CN101818273A (en) * | 2010-04-14 | 2010-09-01 | 中南大学 | Method for preparing Cu-Nb alloy with high strength, high conductivity and high-temperature softening resistance |
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| CN108145153A (en) * | 2018-02-06 | 2018-06-12 | 中国科学院长春应用化学研究所 | A kind of copper product and preparation method thereof |
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