CN111097988B - Microwave assembly reflow soldering clamping positioning device - Google Patents
Microwave assembly reflow soldering clamping positioning device Download PDFInfo
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- CN111097988B CN111097988B CN202010042870.0A CN202010042870A CN111097988B CN 111097988 B CN111097988 B CN 111097988B CN 202010042870 A CN202010042870 A CN 202010042870A CN 111097988 B CN111097988 B CN 111097988B
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- screw rod
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- 238000005476 soldering Methods 0.000 title claims abstract description 27
- 238000003825 pressing Methods 0.000 claims abstract description 93
- 230000000712 assembly Effects 0.000 claims abstract description 14
- 238000000429 assembly Methods 0.000 claims abstract description 14
- 210000000078 claw Anatomy 0.000 claims description 16
- 125000006850 spacer group Chemical group 0.000 claims description 11
- 229910001369 Brass Inorganic materials 0.000 claims description 8
- 239000010951 brass Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims 3
- 239000000306 component Substances 0.000 description 41
- 238000003466 welding Methods 0.000 description 28
- 238000000034 method Methods 0.000 description 9
- 238000009825 accumulation Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000014509 gene expression Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 235000014676 Phragmites communis Nutrition 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000005291 magnetic effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 230000005298 paramagnetic effect Effects 0.000 description 1
- 239000002907 paramagnetic material Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The invention discloses a reflow soldering clamping and positioning device for a microwave assembly, which comprises a shell and a circuit board. Each positioning piece is arranged on the base and used for positioning the relative position of the shell on the base; each shell pressing assembly is connected with the base, and the shell pressing assemblies are used for pressing the shell on the base; the circuit board pressing block assembly is connected with the base and used for pressing the circuit board on the shell. The reflow soldering clamping and positioning device for the microwave assembly can conveniently, rapidly and accurately clamp and position the microwave assembly, and solves the technical problem that the reflow soldering clamping and positioning device for the microwave assembly comprising a printed board or a micro band plate, a shell and an electronic component is not applicable in the prior art.
Description
Technical Field
The invention belongs to the technical field of clamping and positioning devices in the welding and assembling process of aerospace electronic components, and particularly relates to a microwave component reflow soldering clamping and positioning device.
Background
The microwave component in the aerospace electronic product is the basis of an active phased array antenna and is a core component of the active phased array radar, and the welding quality consistency of the microwave component directly influences the overall index of the radar. Active phased array radar needs to be made up of hundreds or thousands of microwave components. The microwave component comprises a circuit board, an electronic component and a shell, wherein the circuit board can be a printed board or a microstrip board. The aerospace electronic products are suitable for the requirements of a carrier and a load, and have very high requirements on the assembling process. Even mass-produced products are also characterized by high reliability, high efficiency, and low reject rate.
The existing reflow soldering clamping and positioning device is suitable for soldering electronic components on a printed board or a micro-band board, and can simply act on the board, such as turning the board over.
However, the welding of the microwave assembly related to the scheme needs to weld a printed board or a micro-strip board attached with various electronic components on the shell, and the prior art does not have a suitable reflow soldering clamping and positioning device.
Disclosure of Invention
The invention aims to provide a reflow soldering clamping and positioning device for a microwave assembly, which solves the technical problem that the reflow soldering clamping and positioning device for the microwave assembly is not applicable to the prior art.
The technical scheme of the invention is as follows:
The microwave assembly reflow soldering clamping and positioning device comprises a shell and a circuit board, wherein the positioning and clamping device comprises a base, a plurality of positioning pieces, at least two shell compacting assemblies and a circuit board compacting block assembly;
Each positioning piece is arranged on the base and used for positioning the relative position of the shell on the base;
Each shell pressing assembly is connected with the base, and is used for pressing the shell on the base;
the circuit board pressing block assembly is connected with the base and used for pressing the circuit board on the shell.
Preferably, the shell is provided with a plurality of pressing grooves, each pressing groove forms a mounting foot, and each mounting foot is provided with a first positioning hole; the base is provided with a plurality of second positioning holes corresponding to the first positioning holes; the locating piece is a locating pin corresponding to the second locating hole and is used for being inserted into the corresponding first locating hole and second locating hole.
Preferably, the shell compacting assembly comprises a sliding block, a spring piece and a screw;
The base is provided with at least two sliding grooves, the number of the sliding grooves is the same as that of the shell pressing assemblies, the sliding grooves are matched with the sliding blocks, and the bottom surface of each sliding groove is provided with a screw hole;
The sliding block is provided with a first through hole corresponding to the screw hole; the sliding block is convexly provided with shell pressing claws, the shell pressing claws correspond to the mounting feet one by one, and the shell pressing claws are arranged on the mounting feet;
the upper surface of the sliding block is provided with a spring piece groove which is matched with the spring piece, and the spring piece is arranged in the spring piece groove; the spring piece is provided with a second through hole corresponding to the screw rod, and the shape and the size of the second through hole are the same as those of the first through hole;
The first end of the screw rod sequentially penetrates through the second through hole in the spring piece and the first through hole in the sliding block and stretches into the screw hole, and the first end of the screw rod is in threaded connection with the screw hole; the screw is provided with a boss which is used for being matched with the spring piece to compress the sliding block.
Preferably, the first through hole and the second through hole are kidney-shaped holes; the stroke length of the kidney-shaped hole on the sliding block and the spring piece relative to the screw rod is more than or equal to the protruding extension length of the shell pressing claw protruding out of the sliding block;
in the adjustment state, the sliding block and the spring piece slide relative to the screw rod through the second through hole and the first through hole respectively.
Preferably, the number of the screws is two, the circuit board pressing block assembly comprises a pressing plate, a circuit board pressing block and two screw rod assemblies, and the two screw rod assemblies are respectively arranged on the two screws;
through holes corresponding to the two screw rods are respectively arranged at two ends of the pressing plate, and the pressing plate is sleeved on the two screw rods through the through holes;
Each screw rod sleeve comprises an elastic piece and a limiting piece; the elastic piece is provided with a third through hole, the elastic piece is sleeved on the corresponding screw rod through the third through hole, the first end of the elastic piece is contacted with the upper surface of the pressing plate, and the second end of the elastic piece is contacted with the limiting piece; the limiting piece is connected with the second end of the corresponding screw rod;
the circuit board pressing block is arranged on the lower surface of the pressing plate and is used for being matched with the elastic piece and the pressing plate to press the circuit board.
Preferably, the limiting piece is a nut, and the nut is in threaded connection with the second end of the screw rod; the lower surface of the nut is in contact with the second end of the elastic member.
Preferably, the screw set further comprises an annular spacer; the annular spacer bush is sleeved on the corresponding screw rod, and the annular spacer bush is positioned between the boss and the pressing plate.
Preferably, the base is a brass base.
Preferably, each screw comprises a first thread section, a first smooth section, a boss, a second smooth section and a second thread section from the first end to the second end in sequence; the first thread section corresponds to the screw hole, and the second thread section corresponds to the nut; the diameter of the first thread segment is smaller than the diameter of the first smooth segment.
By adopting the technical scheme, the invention has the following advantages and positive effects compared with the prior art:
(1) When the invention is used, the shell is placed on the base, and the specific position of the shell on the base is determined by the positioning piece; the shell is pressed on the base by the shell pressing component; the circuit board is placed on the appointed position of the shell, namely the circuit board needs to be welded on the appointed position of the shell, and the circuit board is pressed on the shell by the circuit board pressing block assembly. Therefore, the clamping and positioning device can conveniently, rapidly and accurately clamp and position the microwave assembly, and solves the technical problem that the reflow soldering clamping and positioning device which is not suitable for the microwave assembly comprising a printed board or a micro band plate, a shell and an electronic component in the prior art.
(2) The locating piece, the shell pressing component and the circuit board pressing block component can ensure that the welded shell and the microwave device cannot shift and loosen in the whole welding operation process, and the way of locating and fixing the components is reliable and accurate, so that the reliability of welding quality meets the specified requirements.
(3) The circuit board pressing block can be replaced and adjusted according to the requirements of different products so as to adapt to the requirements of the different products.
(4) The invention adopts the brass base, the brass has good heat conductivity, the brass base can rapidly store heat in the welding process, and can rapidly dissipate heat after being discharged from a welding furnace, so that the applicability and the universality are strong. The heat can be quickly transferred to the microwave assembly by quick heat accumulation, and the welded microwave assembly can be ensured to reach the specified welding temperature so as to realize welding and assembly at the specified position.
(5) The spring reed can be used for pressing the sliding block and then pressing the shell, and the elasticity of the spring reed can be used for adapting to the influence of the thickness tolerance of the mounting foot on clamping. Meanwhile, due to the arrangement of the spring piece pressing grooves on the sliding block, the spring pieces can move simultaneously when the sliding block slides, and interference is not generated.
Drawings
The invention is described in further detail below with reference to the attached drawing figures, wherein:
FIG. 1 is a schematic structural view of a microwave assembly reflow soldering clamping and positioning device of the invention;
FIG. 2 is a schematic illustration of the microwave assembly of the present invention;
FIG. 3 is a schematic view of the present invention with the microwave assembly in place;
FIG. 4 is a schematic view of a housing press jaw of the present invention pressing against a microwave assembly;
FIG. 5 is a schematic view of a circuit board press of the present invention pressing against a microwave assembly and positioning;
FIG. 6 is an exploded view of a microwave assembly reflow soldering clip positioning apparatus of the present invention;
Fig. 7 is an exploded schematic view of a microwave assembly with a microwave assembly reflow soldering clamping and positioning device of the present invention.
Reference numerals illustrate:
1: a base; 2: a slide block; 201: a housing pressing claw; 3: a spring piece; 4: an annular spacer; 5: a pressing plate; 6: a screw; 7: a spring; 8: a nut; 9: a positioning pin; 10: a circuit board pressing block; 11: a housing; 12: a circuit board; 13: an electronic component.
Detailed Description
The invention provides a microwave assembly reflow soldering clamping and positioning device which is further described in detail below with reference to the accompanying drawings and specific embodiments. Advantages and features of the invention will become more apparent from the following description and from the claims. It is noted that the drawings are in a very simplified form and utilize non-precise ratios, and are intended to facilitate a convenient, clear, description of the embodiments of the invention.
Meanwhile, the expressions "first", "second", etc. are used only for the purpose of distinguishing a plurality of configurations, and do not limit the order between configurations or other features.
In addition, the expression "comprising" an element is an "open" expression which merely means that the corresponding component is present and should not be interpreted as excluding the additional component.
Referring to fig. 1 to 7, the microwave assembly of fig. 2 to 5 omits electronic components, printed boards or micro-tape boards, and only the housing is shown. The embodiment provides a microwave assembly reflow soldering clamping and positioning device, which is used for carrying out rapid, convenient and reliable clamping and positioning operation on a welded assembly when spacecraft electronic products, particularly microwave assemblies, are assembled in a combined welding way, so as to ensure that a welding effect meeting the requirements is obtained. The microwave assembly comprises a shell 11 and a circuit board 12, wherein the circuit board 12 is welded on the shell 11, and the clamping and positioning device comprises a base 1, a plurality of positioning pieces, at least two shell pressing assemblies and a circuit board pressing block assembly. Each positioning member is disposed on the base 1, and the positioning members are used for positioning the relative position of the housing 11 on the base 1. Each housing compression assembly is connected to the base 1, the housing compression assemblies being used to compress the housing 11 against the base 1. The circuit board pressing block assembly is connected with the base 1 for pressing the circuit board 12 against the housing 11.
In using the present embodiment, the housing 11 is placed on the base 1, and the specific position of the housing 11 on the base 1 is determined by means of the positioning member; the shell 11 is pressed on the base 1 by a shell pressing component; the circuit board 12 is placed at a designated location of the housing 11, i.e., the circuit board 12 needs to be soldered at a specific location of the housing 11, and the circuit board 12 is pressed against the housing 11 with a circuit board press block assembly. Therefore, the clamping and positioning device can conveniently, rapidly and accurately clamp and position the microwave assembly, and solves the technical problem that the reflow soldering clamping and positioning device which is not suitable for the microwave assembly comprising the printed board or the micro-strip board, the shell 11 and the electronic component 13 in the prior art.
The microwave assembly comprises a circuit board 12, an electronic component 13 and a housing 11, wherein the circuit board 12 can be a printed board or a microstrip board. In the application of the embodiment, the printed board or the microstrip board, the electronic component 13 and the shell 11 are assembled according to the specified technological requirements, the part to be welded is coated with the specified welding flux, the electronic component 13 is accurately placed on the specified position of the printed board or the microstrip board, then the combination is put into the quick clamping and positioning device for reflow soldering of the microwave assembly, and then the quick clamping and positioning device is put into reflow soldering equipment for soldering operation.
The structure of the present embodiment will now be described. Referring specifically to fig. 7, the housing 11 of the microwave assembly is generally a rectangular box without a cover, i.e., a rectangular parallelepiped with a recess, i.e., an inner cavity, on its upper surface. The four corners of the shell 11 are provided with notches to form pressing grooves, and the lower parts of the pressing grooves form mounting feet. Each mounting foot is vertically provided with a first positioning hole. The printed board or the micro band plate is connected with the electronic components 13 and is placed in the inner cavity of the shell 11 together; the front and back sides of the printed board or the micro-strip board are provided with electronic components 13, and the bottom surface of the inner cavity of the shell 11 is provided with a rectangular through hole for avoiding the electronic components 13 on the lower surface of the printed board or the micro-strip board.
Referring to fig. 1 to 7 again, four second positioning holes corresponding to the first positioning holes are also provided on the base 1, and the positioning members adopt positioning pins 9 corresponding to the second positioning holes. The positioning pin 9 is firstly installed in the second positioning hole when being installed and combined in the embodiment, the positioning pin protrudes out of the upper surface of the base by a proper length, and the first positioning hole on the shell is sleeved in the protruding pin for positioning. The diameter of the locating pins 9 and the distance between the locating pins are matched according to the relevant size of the microwave components to be welded, so that the microwave components to be welded can be ensured to be quickly placed on the base 1, and the installation positions of the microwave components are the same each time. In other implementations, the positioning member may also be a screw or the like; however, a gap is easy to exist between the screw and the screw mounting hole, and compared with the positioning pin adopted in the embodiment, the accuracy is higher. Meanwhile, two square holes for avoiding the electronic components 13 on the lower surface of the printed board or the microstrip board are also formed in the base 1.
The present embodiment includes two sets of housing compression assemblies. Each group of shell compacting assemblies comprises a sliding block 2, a screw rod 6 and a spring piece 3. The upper surface of base 1 is rectangle, is equipped with two spouts at the upper surface of base 1, and two spouts are established on the short edge of long direction upper surface relatively, and the spout is used for installing corresponding slider 2. The whole slider 2 is cuboid, and two casing pressure claws 201 are protruding respectively on the side that every slider 2 is close to base 1 center, and casing pressure claw 201 can be the briquetting that suits with the indent shape on the casing 11, and casing pressure claw 201 is located corresponding installation footing. The four housing press jaws 201 on the two slide blocks 2 correspond exactly to the four mounting feet on the housing 11, respectively.
The upper surface of slider 2 is equipped with the spring leaf recess, and spring leaf 3 is placed in the spring leaf recess, and spring leaf 3 has along screw rod 6 length direction's radian. Screw holes are arranged below the sliding grooves on the base, and threads are arranged in the screw holes. The sliding block 2 is provided with a first through hole corresponding to the screw hole, and the spring piece 3 is provided with a second through hole corresponding to the screw hole. The first end of the screw rod 6 is also provided with threads, and the first end of the screw rod 6 sequentially penetrates through the second through hole and the first through hole to extend into the screw hole and is connected with the base through threads. The spring piece is arranged to adapt to the thickness tolerance change of the mounting feet, if the spring piece is fixed by a screw, the slider can be directly pressed, and the spring piece cannot adapt to the thickness tolerance change of the mounting feet. Therefore, a spring leaf structure is adopted here. The spring piece can ensure that the sliding block slides and the sliding block compresses the shell.
The first through hole and the second through hole are kidney-shaped holes, and the movable distance of the kidney-shaped holes relative to the screw rod 6 is larger than or equal to the protruding extension length of the shell pressing claw 201 protruding out of the sliding block 2. Therefore, when the microwave assembly to be welded is replaced, only the slider 2 needs to be moved, the housing pressing claw 201 moves out of the mounting feet on the microwave assembly housing 11, and the slider 2 slides back after a new microwave assembly is replaced, so that the housing pressing claw 201 continuously presses the housing 11 on the base 1, and the screw 6 does not need to be unscrewed from the base 1, thereby improving the efficiency.
The screw 6 of this embodiment is also provided with a boss. The boss is used for pressing the spring plate 3, so that the spring plate can press the sliding block 2 with proper pressure and be conducted to the mounting feet of the microwave assembly shell 11, the shell 11 can be pressed on the upper surface of the base 1, namely the mounting surface, and the subsequent operations such as moving and welding are ensured not to be displaced.
The circuit board briquetting assembly of this embodiment includes clamp plate 5, circuit board briquetting 10, two screw rod suites. Two ends of the pressing plate 5 are respectively provided with through holes corresponding to the two screw rods 6, and the pressing plate 5 is sleeved on the two screw rods 6 through the through holes. The two screw rod 6 external member sets up respectively on two screw rods 6, and the screw rod external member includes elastic component, locating part and annular spacer 4. The elastic piece is provided with a third through hole, and the elastic piece is sleeved on the corresponding screw rod 6 through the third through hole. The two ends of the elastic piece along the length direction of the screw rod 6 are respectively connected with the pressing plate 5 and the limiting piece. The limiting piece is connected with the second end of the corresponding screw rod 6. In particular, the elastic element may be a spring 7 and the limiting element may be a nut 8. The springs 7 are sleeved on the corresponding screw rods 6, and the nuts 8 are connected with the second ends of the corresponding screw rods 6 through threads. The two ends of the spring 7 are respectively connected with the pressing plate 5 and the nut 8. The circuit board pressing block 10 is arranged on the lower surface of the pressing plate 5 and is used for being matched with the elastic piece and the pressing plate 5 to press the printed board or the micro-strip board; the circuit board pressing block 10 is also provided with a avoidance hole for avoiding the electronic component 13 on the upper surface of the printed board or the micro band plate. The circuit board pressing block 10 is made of stainless steel materials, and the stainless steel materials are high in density, free of rust and non-magnetic. In other embodiments, other non-magnetic materials may be used for the circuit board compact 10. In practical situations, the circuit board pressing block 10 can be replaced and adjusted according to the requirements of different products so as to adapt to the requirements of different products. Due to the arrangement of the elastic piece, the embodiment can be suitable for microwave components with different heights.
The annular spacer bush 4 is sleeved on the screw rod 6 and is positioned between the boss and the pressing plate 5. The annular spacer bush 4 can limit the pressing plate 5, so that the clamping and positioning device does not need to hold up the pressing plate 5 by hands when in use, and the welded microwave assembly and the base can be operated, positioned and placed by two hands without being influenced by the two hands. The use of the annular spacer 4 can make the installation of the microwave assembly and the circuit board pressing block 10 more convenient and quick, thereby improving the operation efficiency.
In this embodiment, each screw 6 comprises, in order from the first end to the second end, a first flight section, a first smooth section, a boss, a second smooth section and a second flight section. The first thread segment corresponds to the screw hole and the second thread segment corresponds to the nut 8. The diameter of the first thread segment is smaller than the diameter of the first smooth segment. Thus, the junction of the first smooth section and the first threaded section has a step which ensures that the screw 6 is screwed into the seat 1 to a depth.
The base 1 of this embodiment adopts the brass base, and brass has good heat conductivity, can heat accumulation fast in the welding process, can dispel the heat fast again after leaving the welding stove, and suitability and commonality are stronger. The heat can be quickly transferred to the microwave assembly by quick heat accumulation, and the welded microwave assembly can be ensured to reach the specified welding temperature so as to realize welding and assembly at the specified position.
The parts of the embodiment are made of non-paramagnetic materials such as brass and stainless steel, so that the non-paramagnetic parts of the embodiment can not generate an induced magnetic field or residual magnetism on the welded microwave assembly, and meet the assembly requirements of aerospace electronic products.
When the embodiment is used, firstly, the spatial depth and the height of a welding area of the welding equipment of the embodiment are determined, whether the welding operation can be carried out by the device is determined, then, whether the used circuit board pressing block 10 meets the requirements is determined, the adaptation adjustment is carried out, and then, the corresponding subsequent welding operation can be carried out. The specific process is as follows:
Step 1: determining that the weight of the circuit board compact 10 meets the requirement in the embodiment;
step 2: determining that the total height of the welding device meets the space size requirement of the welding device;
Step 3: referring to fig. 1, the slider 2 of the present embodiment is pulled to both sides, ensuring that the welded microwave assembly housing 11 can be placed therebetween;
Step 4: referring to fig. 2 and3, a soldered electronic component group including an electronic component 13 and a printed board or microstrip board coated with flux and a housing 11, i.e., an entire microwave assembly, are mounted on a base 1 and positioned with positioning pins; only the housing is shown in fig. 2 and3, and the electronic component 13 and the printed board or microstrip board are not shown;
Step 5: referring to fig. 4, the slider 2 is pushed to the middle, so that the housing pressing claw 201 on the slider 2 presses the mounting feet on the housing 11 of the welded microwave assembly; only the housing is shown in fig. 4, and the electronic component 13 and the printed board or microstrip board are not shown;
Step 6: referring to fig. 5, the pressing plate 5 is lifted up properly, the circuit board pressing block 10 is put into a prescribed position of the microwave assembly, and then the pressing plate 5 is put down to press on the circuit board pressing block 10;
step 7: after the operation is finished, the assembled embodiment and the welded microwave assembly can be moved into welding equipment together, and welding operation is carried out according to a specified program;
Step 8: after the welding operation is completed, the circuit board compact 10 and the welded microwave assembly are taken out in the reverse order described above.
The embodiment is used for welding the components and the shell 11, the microstrip board and the printed board in the space electronic product, and when the device is used for the occasion of mass production, the device can conveniently clamp the components to be welded so as to improve the production efficiency and ensure the reliability of the process quality.
The embodiment is convenient to use, and can be suitable for reflow soldering operation of microwave component products with different specifications by replacing the base 1, and the embodiment is firm and reliable in clamping and fixing of the microwave component, and can ensure that the products meet the process requirements and the welding quality requirements in the reflow soldering process.
The embodiments of the present invention have been described in detail with reference to the drawings, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, it is within the scope of the appended claims and their equivalents to fall within the scope of the invention.
Claims (7)
1. The reflow soldering clamping and positioning device for the microwave assembly comprises a shell and a circuit board and is characterized by comprising a base, a plurality of positioning pieces, at least two shell pressing assemblies and a circuit board pressing block assembly;
Each positioning piece is arranged on the base and used for positioning the relative position of the shell on the base;
Each shell pressing assembly is connected with the base, and is used for pressing the shell on the base;
the circuit board pressing block assembly is connected with the base and used for pressing the circuit board on the shell;
the shell is provided with a plurality of pressing grooves, and each pressing groove forms a mounting foot;
The shell compacting assembly comprises a sliding block, a spring piece and a screw rod; the base is provided with at least two sliding grooves, the number of the sliding grooves is the same as that of the shell pressing assemblies, the sliding grooves are matched with the sliding blocks, and the bottom surface of each sliding groove is provided with a screw hole; the sliding block is provided with a first through hole corresponding to the screw hole; the sliding block is convexly provided with shell pressing claws, the shell pressing claws correspond to the mounting feet one by one, and the shell pressing claws are arranged on the mounting feet; the upper surface of the sliding block is provided with a spring piece groove which is matched with the spring piece, and the spring piece is arranged in the spring piece groove; the spring piece is provided with a second through hole corresponding to the screw rod, and the shape and the size of the second through hole are the same as those of the first through hole; the first end of the screw rod sequentially penetrates through the second through hole in the spring piece and the first through hole in the sliding block and stretches into the screw hole, and the first end of the screw rod is in threaded connection with the screw hole; a boss is arranged on the screw rod and used for being matched with the spring piece to compress the sliding block;
The number of the screws is two, the circuit board pressing block assembly comprises a pressing plate, a circuit board pressing block and two screw rod assemblies, and the two screw rod assemblies are respectively arranged on the two screws; through holes corresponding to the two screw rods are respectively arranged at two ends of the pressing plate, and the pressing plate is sleeved on the two screw rods through the through holes; each screw rod sleeve comprises an elastic piece and a limiting piece; the elastic piece is provided with a third through hole, the elastic piece is sleeved on the corresponding screw rod through the third through hole, the first end of the elastic piece is contacted with the upper surface of the pressing plate, and the second end of the elastic piece is contacted with the limiting piece; the limiting piece is connected with the second end of the corresponding screw rod; the circuit board pressing block is arranged on the lower surface of the pressing plate and is used for being matched with the elastic piece and the pressing plate to press the circuit board.
2. The microwave assembly reflow soldering clamping and positioning device of claim 1, wherein each mounting foot is provided with a first positioning hole; the base is provided with a plurality of second positioning holes corresponding to the first positioning holes; the locating piece is a locating pin corresponding to the second locating hole and is used for being inserted into the corresponding first locating hole and second locating hole.
3. The apparatus of claim 1, wherein the first through hole and the second through hole are kidney-shaped holes; the stroke length of the kidney-shaped hole on the sliding block and the spring piece relative to the screw rod is more than or equal to the protruding extension length of the shell pressing claw protruding out of the sliding block;
in the adjustment state, the sliding block and the spring piece slide relative to the screw rod through the second through hole and the first through hole respectively.
4. The microwave assembly reflow soldering clamping and positioning device of claim 1, wherein the limiting piece is a nut, and the nut is in threaded connection with the second end of the screw; the lower surface of the nut is in contact with the second end of the elastic member.
5. The microwave assembly reflow solder clip positioning apparatus of claim 1, wherein the screw assembly further includes an annular spacer; the annular spacer bush is sleeved on the corresponding screw rod, and the annular spacer bush is positioned between the boss and the pressing plate.
6. The microwave assembly reflow solder clip positioning apparatus of claim 1, wherein the base is a brass base.
7. The microwave assembly reflow solder clip positioning apparatus of claim 4, wherein each screw includes a first threaded section, a first smooth section, a boss, a second smooth section and a second threaded section in sequence from the first end to the second end; the first thread section corresponds to the screw hole, and the second thread section corresponds to the nut; the diameter of the first thread segment is smaller than the diameter of the first smooth segment.
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