CN111097987A - Vacuum brazing structure of liquid cooling plate with micro-channel - Google Patents
Vacuum brazing structure of liquid cooling plate with micro-channel Download PDFInfo
- Publication number
- CN111097987A CN111097987A CN202010032872.1A CN202010032872A CN111097987A CN 111097987 A CN111097987 A CN 111097987A CN 202010032872 A CN202010032872 A CN 202010032872A CN 111097987 A CN111097987 A CN 111097987A
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- Prior art keywords
- micro
- welding
- channel
- plate
- ribs
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- 238000005219 brazing Methods 0.000 title claims abstract description 30
- 239000007788 liquid Substances 0.000 title abstract description 11
- 238000001816 cooling Methods 0.000 title abstract description 10
- 238000003466 welding Methods 0.000 claims abstract description 57
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 45
- 229910052802 copper Inorganic materials 0.000 claims abstract description 37
- 239000010949 copper Substances 0.000 claims abstract description 37
- 229910000679 solder Inorganic materials 0.000 abstract description 19
- 238000000034 method Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 230000007704 transition Effects 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention discloses a vacuum brazing structure of a liquid cooling plate with a micro-channel, which comprises: the micro-channel plate comprises a micro-channel plate and a bottom plate, wherein the micro-channel plate and the bottom plate are arranged from top to bottom, a plurality of ribs are arranged at the bottom of the micro-channel plate side by side, and a micro-channel is formed between every two adjacent ribs. The welding device comprises a plurality of ribs, a bottom plate and a welding piece, wherein a copper net and the welding piece are arranged between the plurality of ribs and the bottom plate, the copper net is pressed at the bottoms of the plurality of ribs, and the welding piece is pressed between the bottom plate and the copper net. The invention has the beneficial effects that: the welding cost is low, and a special welding process is not needed; by arranging the copper mesh transition layer, redundant solder can be absorbed in time during welding, and the condition that the micro-channel is blocked by the solder is greatly reduced; the mesh number of the copper net can be adjusted according to the width of the micro-channel, and the application range is wide; the process is simple and controllable, the requirement on the quality of the surface to be welded is low during welding, and the welding quality is stable.
Description
Technical Field
The invention relates to the technical field of welding of liquid cooling plates with micro channels, in particular to a vacuum brazing structure of a liquid cooling plate with a micro channel.
Background
The traditional welding method adopts contact reaction brazing, direct brazing or vacuum diffusion welding when a liquid cooling plate with a micro-channel is welded.
As shown in fig. 1, the conventional contact reaction brazing structure is to perform silver plating on the surface of the bottom plate in contact with the bottom ribs of the microchannel plate, and then directly press the microchannel plate against the silver-plated surface of the cover plate for brazing. However, the brazing structure has high manufacturing cost, is only suitable for producing smaller parts, is very expensive for the whole silver plating of large workpieces, has strict requirements on the thickness of a plating layer, has the thickness of at least more than 15 micrometers, and has a relatively complex manufacturing process.
As shown in fig. 2, the conventional direct brazing structure is to place a welding piece between the bottom plate and the micro flow channel plate, and to perform brazing welding after pressing the three together. The welding principle is as follows: after the temperature of the workpiece is raised, the workpiece is not melted, the prefabricated solder is melted, and the liquid solder is utilized to connect the metals together through reactions such as metallurgy, diffusion and the like at the gap of the welding seam of the flow channel under the capillary action. The flow ability of the brazing filler metal on the surface of the work piece depends on the welding gap of the work piece to be welded, i.e. the wet spreading ability of the brazing filler metal on the surface of the work piece. After the wetting and spreading capability of the solder on the surface of the workpiece is ensured, the welding quality depends on the welding gap, and the width of the micro-channel is just in the range of the capillary gap of the solder, which easily causes the situation that the bottom of the micro-channel is blocked by the solder as shown in fig. 3.
The traditional structure of vacuum diffusion welding is that two workpieces to be welded are pressed together tightly and are placed in a vacuum or protective atmosphere furnace for heating, so that microscopic plastic deformation is generated on the micro unevenness of the two welding surfaces to achieve close contact, and atoms are diffused mutually in the subsequent heating and heat preservation, thereby being connected together. However, the brazing structure has the disadvantages of high quality requirement of the surface to be welded, long welding time, unstable joint quality and high cost.
Disclosure of Invention
Aiming at the problems in the prior art, the invention mainly aims to provide a vacuum brazing structure of a liquid cooling plate with a micro-channel, and aims to solve the problems that the conventional liquid cooling plate with the micro-channel is high in welding cost, easy to cause hole blockage and unstable in welding quality during brazing.
In order to achieve the above object, the present invention provides a vacuum brazing structure of a liquid-cooled plate having micro flow channels, comprising: the micro-channel plate comprises a micro-channel plate and a bottom plate, wherein the micro-channel plate and the bottom plate are arranged from top to bottom, a plurality of ribs are arranged at the bottom of the micro-channel plate side by side, and a micro-channel is formed between every two adjacent ribs. The welding device comprises a plurality of ribs, a bottom plate and a welding piece, wherein a copper net and the welding piece are arranged between the plurality of ribs and the bottom plate, the copper net is pressed at the bottoms of the plurality of ribs, and the welding piece is pressed between the bottom plate and the copper net.
Preferably, the copper mesh comprises two rows of copper wires which are vertically twisted together.
Preferably, the copper wire is wavy.
Preferably, the positions of the copper wires, the bottom surfaces of the ribs and the top surfaces of the welding sheets in contact are provided with welding planes.
Compared with the prior art, the invention has the beneficial effects that: the welding cost is low, and a special welding process is not needed; by arranging the copper mesh transition layer, redundant solder can be absorbed in time during welding, and the condition that the micro-channel is blocked by the solder is greatly reduced; the mesh number of the copper net can be adjusted according to the width of the micro-channel, and the application range is wide; the process is simple and controllable, the requirement on the quality of the surface to be welded is low during welding, and the welding quality is stable.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of a conventional contact reaction brazing structure;
FIG. 2 is a schematic diagram of a conventional structure using direct brazing;
FIG. 3 is a schematic front structural view of a flow channel blocked by conventional direct brazing;
FIG. 4 is a schematic cross-sectional view of an embodiment of the present invention;
FIG. 5 is a perspective view of a copper mesh according to an embodiment of the present invention;
FIG. 6 is an enlarged view of a portion of FIG. 5 at A;
FIG. 7 is a schematic top view of a copper mesh according to an embodiment of the present invention;
the objects, features and advantages of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The invention provides a vacuum brazing structure of a liquid cooling plate with a micro-channel.
Referring to fig. 4-7, fig. 4 is a schematic front sectional view illustrating an embodiment of the present invention, fig. 5 is a perspective view illustrating a copper mesh according to an embodiment of the present invention, fig. 6 is a partially enlarged view of a portion a in fig. 5, and fig. 7 is a partially schematic top view illustrating the copper mesh according to an embodiment of the present invention.
As shown in fig. 4, in the embodiment of the present invention, the vacuum brazing structure of a liquid cooling plate having micro flow channels includes: the micro-channel plate 100 and the bottom plate 200 are arranged up and down, the bottom of the micro-channel plate 100 is provided with a plurality of ribs 110 side by side, and a micro-channel 120 is formed between two adjacent ribs 110. A copper net 300 and a welding sheet 400 are arranged between the plurality of ribs 110 and the bottom plate 200, the copper net 300 is pressed against the bottoms of the plurality of ribs 110, and the welding sheet 400 is pressed between the bottom plate 200 and the copper net 300.
Specifically, in the present embodiment, to ensure that the copper mesh 300 has a certain structural strength, as shown in fig. 5-6, the copper mesh 300 includes two rows of copper wires 310 that are vertically twisted together.
In the embodiment, in order to ensure that the copper wire 310 has sufficient capacity to absorb the excessive solder and further provide the strength of the structure of the copper mesh 300, the copper wire 310 is wavy.
As shown in fig. 6-7, the copper mesh 300 formed by weaving wavy copper wires 310 can not only form holes 320 in the horizontal plane, but also form gaps 330 in the vertical plane. The holes 320 allow the solder melted by the direct heat brazing to pass through, and the solder spreads between the ribs 110 and the copper wires 310 by capillary action, so that the copper wires 310 are connected with the ribs 110. Meanwhile, the hole 320 has a certain height to absorb a portion of the excessive solder. The gap 330 absorbs another portion of the excess solder so that the excess solder does not continue to spread upward into the fluidic channel 120, greatly improving the ability of the copper mesh 300 to absorb the excess solder, and thus greatly reducing the occurrence of solder blocking the fluidic channel 120. In addition, the wavy copper wire 310 has a large elasticity, so that when the micro flow channel plate 100 and the base plate 200 are clamped tightly for direct heating brazing, the top of the copper wire 310 can tightly abut against the ribs 110 at the bottom of the micro flow channel plate 100, the bottom of the copper wire 310 can tightly abut against the welding sheet 400 at the top of the base plate 200, and the welding sheet 400 is tightly connected with the base plate 200 through the welding material after being melted, so that the stability of brazing quality is greatly improved.
Specifically, in this embodiment, in order to ensure the stability of the structure during the brazing process, prevent the sliding of the welding spot, increase the welding area at the welding spot, and improve the strength and stability of the welded structure, thereby improving the welding quality, the position where the copper wire 310 contacts the bottom surface of the rib 110 and the top surface of the welding piece 400 is provided with the welding plane 311.
Compared with the prior art, the invention has the beneficial effects that: the welding cost is low, and a special welding process is not needed. By arranging the copper mesh 300 transition layer, redundant solder can be absorbed in time during welding, and the situation that the solder blocks the micro-channel 120 is greatly reduced. The mesh number of the copper net 300 can be adjusted according to the width of the micro-channel 120, and the application range is wide. The process is simple and controllable, the requirement on the quality of the surface to be welded is low during welding, and the welding quality is stable.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (4)
1. A vacuum brazing structure for a liquid-cooled plate having micro flow channels, comprising: the micro-channel plate comprises a micro-channel plate and a bottom plate which are arranged up and down, wherein the bottom of the micro-channel plate is provided with a plurality of ribs side by side, and a micro-channel is formed between every two adjacent ribs; the welding device comprises a plurality of ribs, a bottom plate and a welding piece, wherein a copper net and the welding piece are arranged between the plurality of ribs and the bottom plate, the copper net is pressed at the bottoms of the plurality of ribs, and the welding piece is pressed between the bottom plate and the copper net.
2. The vacuum brazing structure for liquid-cooled panels with microchannels of claim 1, wherein the copper mesh includes two rows of copper wires which are twisted together perpendicularly to each other.
3. The vacuum brazing structure for a liquid-cooled plate having micro flow channels according to claim 2, wherein the copper wire is in a wave shape.
4. The structure for vacuum brazing a liquid-cooled plate having micro flow channels according to any one of claims 2 to 3, wherein a welding plane is provided at a position where the copper wires are in contact with the bottom surfaces of the ribs and the top surfaces of the welding pieces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010032872.1A CN111097987A (en) | 2020-01-13 | 2020-01-13 | Vacuum brazing structure of liquid cooling plate with micro-channel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010032872.1A CN111097987A (en) | 2020-01-13 | 2020-01-13 | Vacuum brazing structure of liquid cooling plate with micro-channel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111097987A true CN111097987A (en) | 2020-05-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010032872.1A Pending CN111097987A (en) | 2020-01-13 | 2020-01-13 | Vacuum brazing structure of liquid cooling plate with micro-channel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111097987A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012199286A (en) * | 2011-03-18 | 2012-10-18 | Mitsubishi Electric Corp | Preliminary soldering method of electronic component |
| CN206717222U (en) * | 2017-05-22 | 2017-12-08 | 深圳市晟达真空钎焊技术有限公司 | The vacuum brazing welding structure of fluid channel annular seal space heat exchanger |
| CN108133916A (en) * | 2017-12-25 | 2018-06-08 | 中国电子科技集团公司第五十四研究所 | A kind of microchannel heat sink welding structure and technique |
| CN209078071U (en) * | 2018-07-25 | 2019-07-09 | 陕西图灵电子科技有限公司 | A kind of limit weld tabs |
| CN212286198U (en) * | 2020-01-13 | 2021-01-05 | 深圳市晟达真空钎焊技术有限公司 | Vacuum brazing structure of liquid cooling plate with micro-channel |
-
2020
- 2020-01-13 CN CN202010032872.1A patent/CN111097987A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012199286A (en) * | 2011-03-18 | 2012-10-18 | Mitsubishi Electric Corp | Preliminary soldering method of electronic component |
| CN206717222U (en) * | 2017-05-22 | 2017-12-08 | 深圳市晟达真空钎焊技术有限公司 | The vacuum brazing welding structure of fluid channel annular seal space heat exchanger |
| CN108133916A (en) * | 2017-12-25 | 2018-06-08 | 中国电子科技集团公司第五十四研究所 | A kind of microchannel heat sink welding structure and technique |
| CN209078071U (en) * | 2018-07-25 | 2019-07-09 | 陕西图灵电子科技有限公司 | A kind of limit weld tabs |
| CN212286198U (en) * | 2020-01-13 | 2021-01-05 | 深圳市晟达真空钎焊技术有限公司 | Vacuum brazing structure of liquid cooling plate with micro-channel |
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