CN111093128A - Loudspeaker module and electronic product - Google Patents
Loudspeaker module and electronic product Download PDFInfo
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- CN111093128A CN111093128A CN201911397818.0A CN201911397818A CN111093128A CN 111093128 A CN111093128 A CN 111093128A CN 201911397818 A CN201911397818 A CN 201911397818A CN 111093128 A CN111093128 A CN 111093128A
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- 238000001746 injection moulding Methods 0.000 claims description 7
- 239000003365 glass fiber Substances 0.000 claims description 6
- 239000011208 reinforced composite material Substances 0.000 claims description 6
- 230000035945 sensitivity Effects 0.000 abstract description 12
- 239000000178 monomer Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 230000002349 favourable effect Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005236 sound signal Effects 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)
Abstract
The invention provides a loudspeaker module and an electronic product. The speaker module includes: the loudspeaker unit is arranged in the shell and divides the shell into a front sound-emitting area and a rear sound cavity; the acoustic pipeline is provided with a sound inlet and a sound outlet, and the sound inlet is communicated to the rear sound cavity; the ratio of the length L to the sectional area S of the acoustic pipeline is more than 1.6/mm and less than 9/mm; the sound outlet of the acoustic pipeline is communicated with the closed cavity, and the sound transmitted by the sound outlet is closed in the closed cavity and isolated from the sound transmitted by the front sound-emitting area. The invention arranges the acoustic pipeline on the loudspeaker module, and sets the ratio of the length to the sectional area of the acoustic pipeline to be 1.6/mm < L/S < 9/mm, thereby reducing the resonance frequency of the loudspeaker module and improving the low-frequency sensitivity of the loudspeaker module below 500 Hz.
Description
Technical Field
The present invention relates to the field of acoustic technologies, and in particular, to a speaker module and an electronic product.
Background
The speaker module is used as an electroacoustic conversion device, and is commonly used as a sounding device in electronic products. Because the volume of electronic product is miniaturized day by day for the installation space of speaker module reduces greatly, and the size of speaker module receives bigger and bigger restriction. The size of the loudspeaker module is reduced, the size of the rear cavity of the corresponding module is reduced, and adverse effects are caused on the low-frequency performance of the loudspeaker module. Therefore, the low-frequency sound effect of the existing loudspeaker module is to be improved urgently, the bass effect of the loudspeaker module is mainly controlled by the volume of the rear sound cavity, and the bass effect is better when the volume of the rear sound cavity is larger.
Therefore, it is necessary to provide a speaker module capable of greatly improving the low-frequency sensitivity of sound without increasing the size of the rear acoustic cavity.
Disclosure of Invention
The invention aims to provide a loudspeaker module, which solves the problem of poor low-frequency sound effect of the existing loudspeaker module
The invention aims to provide an electronic product, wherein the loudspeaker module is installed in the electronic product.
A speaker module, comprising:
the loudspeaker unit is arranged in the shell and divides the shell into a front sound-emitting area and a rear sound cavity;
the acoustic pipeline is provided with a sound inlet and a sound outlet, and the sound inlet is communicated to the rear sound cavity;
the ratio of the length L to the sectional area S of the acoustic pipeline is more than 1.6/mm and less than 9/mm;
the sound outlet of the acoustic pipeline is communicated with the closed cavity, and the sound transmitted by the sound outlet is closed in the closed cavity and isolated from the sound transmitted by the front sound-emitting area. .
Optionally, the length L of the acoustic duct is 4mm < L < 15 mm.
Optionally, the cross-sectional shape of the acoustic duct is circular or polygonal.
Optionally, the cross-sectional shape of the acoustic duct is circular, and the diameter D of the acoustic duct is 1mm < D < 3 mm.
Optionally, the acoustic duct sets up in the back sound cavity, the acoustic duct edge the interior edge setting of shell, the acoustic duct with the interior edge laminating of shell.
Optionally, a portion of the structure of the enclosure forming the rear acoustic cavity forms the acoustic duct.
Optionally, the acoustic duct and the housing are integrally formed by injection molding.
Optionally, the acoustic duct has a wall thickness of 0.3-0.7 mm.
Optionally, the material of the acoustic duct is a glass fiber reinforced composite material.
An electronic product comprises the loudspeaker module;
the loudspeaker module is arranged in a shell of the electronic product, and the front sound-emitting area is opposite to the sound-emitting hole of the shell;
the shell forms the closed cavity, and a sound outlet of the acoustic pipeline is communicated with the closed cavity.
The technical scheme of the invention has the beneficial effects that: the acoustic pipeline is arranged on the loudspeaker module, and the ratio of the length to the sectional area of the acoustic pipeline is set to be 1.6/mm < L/S < 9/mm, so that the resonance frequency of the loudspeaker module can be reduced, and the low-frequency sensitivity of the loudspeaker module below 500Hz can be improved.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is an exploded view of a speaker module according to an embodiment of the present invention;
fig. 2 is a schematic diagram of an internal structure of a speaker module according to an embodiment of the invention;
fig. 3 is a schematic structural diagram of a speaker module according to an embodiment of the invention;
fig. 4 is a cross-sectional view of a speaker module according to an embodiment of the present invention;
fig. 5 is a cross-sectional view of a speaker module according to an embodiment of the present invention;
fig. 6 is a schematic view illustrating an installation of a speaker module according to an embodiment of the present invention in an electronic product;
FIG. 7 is a graph of acoustic impedance versus frequency for an acoustic duct having an L/S setting in the range of 1.6-9/mm in accordance with an embodiment of the present invention;
FIG. 8 is a graph of sound pressure level versus frequency for two speaker module configurations in accordance with an embodiment of the present invention;
the figures are labeled as follows: 10 loudspeaker units; 20 a housing; 201 an upper shell; 202 a lower shell; 30 an acoustic duct; 301 sound inlet; 302 a sound outlet; 100 housing of an electronic product.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
The invention provides a loudspeaker module, comprising: the loudspeaker unit is arranged in the shell and divides the shell into a front sound-emitting area and a rear sound cavity; the acoustic pipeline is provided with a sound inlet and a sound outlet, and the sound inlet is communicated to the rear sound cavity; the ratio of the length L to the sectional area S of the acoustic pipeline is more than 1.6/mm and less than 9/mm; the sound outlet of the acoustic pipeline is communicated with the closed cavity, and the sound transmitted by the sound outlet is closed in the closed cavity and isolated from the sound transmitted by the front sound-emitting area.
Specifically, referring to fig. 1 to 5, the speaker module of the present invention includes a housing 20. Optionally, the housing includes an upper case 201 and a lower case 202, which are fastened to each other to form a housing of the speaker module. Specifically, the upper shell and the lower shell can be hermetically connected through ultrasonic welding or bonding. Optionally, the upper housing and the lower housing are respectively provided with a positioning structure which is connected with each other in a matching way. After the upper shell 201 and the lower shell 202 are buckled, the positioning structures on the upper shell and the lower shell are connected, so that the pre-positioning is realized for the sealing connection of the upper shell and the lower shell. Optionally, the mutually-matched positioning structure is a positioning rod and a positioning sleeve, and the positioning rod is inserted into the positioning sleeve to realize a positioning function. Alternatively, a pair of positioning structures may be provided to prevent rotation of the upper housing relative to the lower housing. Optionally, the upper shell and the lower shell form a containing cavity in the shell after being buckled and connected. The speaker module further includes a speaker unit 10 as a sound generating device in the speaker module, which is disposed in the housing 20. Alternatively, the speaker unit is mounted in a receiving cavity formed by the upper case 201 and the lower case 202. As an embodiment, an installation groove may be formed on an inner wall of the housing, and the speaker unit may be installed in the installation groove. The speaker monomer will hold the chamber and separate into preceding sound zone and back sound chamber, wherein preceding sound zone be used for with speaker module outside intercommunication, pass to outside the speaker module with sound signal. The back sound cavity is used for balancing air pressure in the loudspeaker module. The loudspeaker module further comprises an acoustic duct 30. The acoustic duct has a sound inlet 301 and a sound outlet 302. Wherein sound chamber intercommunication behind sound inlet and the speaker module, the gas in the back sound chamber can get into in the acoustic pipeline through sound inlet 301. The speaker module still includes airtight chamber, and the sound that the sound outlet intercommunication airtight chamber of acoustic pipeline spreads from the sound outlet seals at airtight chamber, and it and speaker module are kept apart each other from the sound that the sound zone spread that goes out.
The acoustic duct 30 provided by the invention is used for reducing the resonance frequency of the loudspeaker module and improving the low-frequency sensitivity of the loudspeaker module. Optionally, the acoustic duct 30 has a ratio of length L to cross-sectional area S of 1.6/mm < L/S < 9/mm. Setting the L/S of the acoustic duct in the range of 1.6-9/mm can shift the resonance frequency of the speaker membrane group into a low frequency range, e.g. less than 500 Hz. Therefore, the acoustic impedance in a low-frequency range can be increased, the sensitivity of low frequency is improved, and the low-frequency acoustic performance of the loudspeaker module is optimized.
The compliance of the conventional loudspeaker module is formed by the compliance parallel connection of the loudspeaker single body and the rear sound cavity, the sound quality is provided by the sound quality of the loudspeaker single body, and f issThe formula is as follows:
wherein f iss: the resonant frequency of the loudspeaker module; cas: equivalent acoustic compliance of the speaker monomer; cab: equivalent acoustic compliance of air in the rear acoustic cavity; mas: the vibration system of the speaker unit is equivalent to the sound quality.
In the embodiment of the invention, the compliance of the loudspeaker module is still formed by the compliance parallel connection of the loudspeaker monomer and the rear sound cavity, the sound quality is provided by the sound quality of the loudspeaker monomer and the sound pipeline together, the sound quality of the loudspeaker monomer and the sound quality of the sound pipeline are equivalent to series connection at low frequency, and the fs formula is as follows:
wherein f iss: the resonant frequency of the loudspeaker module; cas: equivalent acoustic compliance of the speaker monomer; cab: equivalent acoustic compliance of air in the rear acoustic cavity; mas: equivalent acoustic mass of a vibration system of the loudspeaker monomer; mac: the acoustic duct is equivalent to an acoustic mass. The overall sound quality of the loudspeaker module is increased, so that the resonance frequency is reduced.
In fig. 7, a graph of acoustic impedance versus frequency for an L/S setting of the acoustic duct 30 in the range of 1.6-9/mm is shown, along with a graph of acoustic impedance versus frequency for a conventional speaker module without an acoustic duct, according to an embodiment of the present invention. As can be seen from the table, with the acoustic duct 30 set and the L/S of the acoustic duct set within the range of 1.6-9/mm, the peak of resonance of the speaker module is shifted to low frequencies, while to the left of the first intersection of the two curves, the acoustic impedance of the acoustic duct module structure is significantly higher than that of the conventional module structure. The acoustic impedance corresponds to the sound pressure level of the speaker module, the greater the value of the acoustic impedance, the higher the sound pressure level. Referring to fig. 8, fig. 8 is a graph of sound pressure level versus frequency for two speaker module configurations. As can be seen from fig. 8, the acoustic duct module structure in which the L/S of the acoustic duct is set in the range of 1.6-9/mm has a higher sound pressure level in a frequency range of less than 500Hz, compared to the conventional module structure. The sound pressure level directly reflects the sensitivity of the speaker module, and higher sound pressure level indicates higher sensitivity of the speaker module. Therefore, the L/S of the acoustic pipeline 30 is set within the range of 1.6-9/mm, the loudspeaker module has higher low-frequency sensitivity, and the low-frequency acoustic performance of the module is greatly improved.
According to the invention, the acoustic pipeline is arranged on the loudspeaker module, and the ratio of the length L to the sectional area S of the acoustic pipeline is set to be 1.6/mm < L/S < 9/mm, so that the resonance frequency of the loudspeaker module can be obviously reduced, the low-frequency sensitivity of the loudspeaker module below 500Hz can be improved, and the low-frequency acoustic performance of the loudspeaker module can be optimized.
Optionally, the length L of the acoustic duct is 4mm < L < 15 mm.
As an embodiment of the present invention, the length L of the acoustic duct 30 may be set in the range of 4mm to 15 mm. With the length setting of acoustic pipeline in above-mentioned within range, not only be favorable to gaseous business turn over acoustic pipeline, set up the acoustic pipeline of length in this within range on the speaker module moreover, the module has better low frequency performance.
Optionally, the cross-sectional shape of the acoustic duct 30 is circular or polygonal. As an embodiment of the invention, the cross section of the acoustic pipeline can be designed to be circular, the acoustic pipeline with the structure is convenient to process, and the circular arc surface can reduce the resistance of gas circulation. The cross-sectional shape of the acoustic duct may also be designed to be polygonal. The present invention is not limited to the cross-sectional shape of the acoustic duct, and those skilled in the art can design the cross-sectional shape into other conceivable shapes.
Optionally, the cross-sectional shape of the acoustic duct is circular, and the diameter D of the acoustic duct is 1mm < D < 3 mm.
The cross-sectional shape of the acoustic duct 30 of the present invention may be designed to be circular. When the cross section is circular, the diameter D of the acoustic pipeline can be controlled within the range of 1mm-3mm, the acoustic pipeline with the diameter within the range is arranged on the loudspeaker module, and the low-frequency sensitivity of the loudspeaker module is well improved.
Optionally, the acoustic duct is disposed in the rear acoustic cavity, the acoustic duct is disposed along an inner edge of the housing, and the acoustic duct is attached to the inner edge of the housing.
As an embodiment of the present invention, as shown in the cross-sectional view of the speaker module of fig. 4 or 5, the acoustic duct 30 may be installed in the rear acoustic cavity of the speaker module in such a manner as to be disposed along the inner edge of the housing 20. Set up the resistance that can reduce the circulation of back sound intracavity gas with the interior border of acoustic pipeline along the shell, be favorable to shortening the time that back sound intracavity gas pressure reaches the equilibrium to be favorable to improving the reaction sensitivity of speaker module. Optionally, the edge setting in the shell can be laminated to the acoustics pipeline, does not have the clearance in acoustics pipeline and the shell promptly between the edge, and this mode can reduce the resistance of the interior gaseous circulation of back sound intracavity equally, is favorable to gaseous back sound chamber through acoustics pipeline business turn over speaker module.
Optionally, a portion of the structure of the enclosure forming the rear acoustic cavity forms the acoustic duct.
As an embodiment of the present invention, referring to fig. 1 or fig. 3, a part of the structure of the housing for forming the rear acoustic cavity forms the acoustic duct 30, that is, a wall of the housing forms a duct wall of the acoustic duct. The wall of the acoustic pipeline is formed by the shell wall of the shell, so that the volume of a rear sound cavity except the acoustic pipeline in the loudspeaker module is increased, and the weight of the shell is reduced. Alternatively, the acoustic duct 30 may be integrally formed with the housing 20 of the speaker module. Alternatively, referring to fig. 1, the acoustic duct may be integrally formed with the lower case 202. The acoustic duct of the present invention is integrally formed with the housing, which not only eliminates the installation process of the acoustic duct and reduces the manufacturing cost of the speaker module, but also has higher coupling strength with the housing, and alternatively, when the acoustic duct is integrally formed with the housing, the sound outlet 302 of the acoustic duct 30 may be formed in the wall of the housing.
Optionally, the acoustic duct and the housing are integrally formed by injection molding.
As an embodiment of the present invention, the acoustic duct 30 and the speaker module housing 20 may be integrally formed by injection molding. The acoustic pipeline and the shell which are formed through injection molding have higher structural strength, and meanwhile, the injection molding process is mature, the process is simple, and the manufacturing cost of the acoustic pipeline and the shell is favorably reduced. Of course, the integral molding manner of the acoustic duct and the housing of the present invention is not limited to injection molding, and other molding manners, such as compression molding, may be selected, and the present invention is not limited thereto.
Optionally, the acoustic duct 30 has a wall thickness of 0.3-0.7 mm. The wall thickness of the acoustic pipeline is set within the range of 0.3-0.7mm, the overall mass of the acoustic pipeline is small, and the influence on the weight of the loudspeaker module is small. Meanwhile, the wall thickness of the acoustic pipeline is easy to control, and the acoustic pipeline is convenient to manufacture. In addition, the acoustic pipeline has larger inner cavity volume, which is beneficial to the gas to enter and exit the rear acoustic cavity through the acoustic pipeline.
Optionally, the material of the acoustic duct 30 is a glass fiber reinforced composite material. As an embodiment of the present invention, the acoustic duct may employ a glass fiber reinforced composite material. The acoustic pipeline made of the glass fiber reinforced composite material has the characteristics of high specific strength, light weight and the like, and meanwhile, the glass fiber reinforced composite material has good manufacturability, is convenient for forming the acoustic pipeline and is beneficial to reducing the manufacturing cost of the acoustic pipeline.
The invention also provides an electronic product. Referring to fig. 6, the electronic product includes the speaker module, and the speaker module is used as a sound generating device. Alternatively, the speaker module is installed in the housing 100 of the electronic product, and the front sound-emitting area of the speaker module is opposite to the sound-emitting hole provided on the housing of the electronic product, so that the sound signal generated by the speaker module can be transmitted to the outside of the electronic product through the sound-emitting hole and then received by the user. Optionally, the acoustic duct 30 of the present invention is disposed on the speaker module, the sound inlet 301 of the acoustic duct faces the rear sound cavity of the speaker module and is communicated with the rear sound cavity, the gas in the rear sound cavity can enter the acoustic duct through the sound inlet, the sound outlet 302 of the acoustic duct faces a cavity formed by the housing 100 of the electronic product, and the cavity is a sealed cavity formed by the housing of the electronic product. And the air enters and exits the rear sound cavity of the loudspeaker module through the acoustic pipeline. The electronic product using the loudspeaker module with the acoustic pipeline has better low-frequency sensitivity and low-frequency acoustic performance, and can bring excellent acoustic experience to users.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. A speaker module, comprising:
the loudspeaker unit is arranged in the shell and divides the shell into a front sound-emitting area and a rear sound cavity;
the acoustic pipeline is provided with a sound inlet and a sound outlet, and the sound inlet is communicated to the rear sound cavity;
the ratio of the length L to the sectional area S of the acoustic pipeline is more than 1.6/mm and less than 9/mm;
the sound outlet of the acoustic pipeline is communicated with the closed cavity, and the sound transmitted by the sound outlet is closed in the closed cavity and isolated from the sound transmitted by the front sound-emitting area.
2. A loudspeaker module according to claim 1, wherein the length L of the acoustic duct is 4mm < L < 15 mm.
3. The speaker module as claimed in claim 1, wherein the cross-sectional shape of the acoustic duct is circular or polygonal.
4. The speaker module as claimed in claim 1, wherein the cross-sectional shape of the acoustic duct is circular, and the diameter D of the acoustic duct is 1mm < D < 3 mm.
5. The speaker module of claim 1, wherein the acoustic duct is disposed within the rear acoustic cavity, the acoustic duct being disposed along an inner edge of the housing, the acoustic duct being attached to the inner edge of the housing.
6. A loudspeaker module according to claim 5, wherein a portion of the structure of the enclosure forming the rear acoustic cavity forms the acoustic duct.
7. The speaker module as recited in claim 6, wherein the acoustic duct is integrally formed with the housing by injection molding.
8. A loudspeaker module according to claim 1, wherein the acoustic duct has a wall thickness of 0.3-0.7 mm.
9. The speaker module as claimed in claim 1, wherein the acoustic duct is made of a glass fiber reinforced composite material.
10. An electronic product, comprising the speaker module of any one of claims 1-9;
the loudspeaker module is arranged in a shell of the electronic product, and the front sound-emitting area is opposite to the sound-emitting hole of the shell;
the shell forms the closed cavity, and a sound outlet of the acoustic pipeline is communicated with the closed cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911397818.0A CN111093128A (en) | 2019-12-30 | 2019-12-30 | Loudspeaker module and electronic product |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911397818.0A CN111093128A (en) | 2019-12-30 | 2019-12-30 | Loudspeaker module and electronic product |
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| CN111093128A true CN111093128A (en) | 2020-05-01 |
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| CN201911397818.0A Pending CN111093128A (en) | 2019-12-30 | 2019-12-30 | Loudspeaker module and electronic product |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023277352A1 (en) * | 2021-06-28 | 2023-01-05 | 삼성전자주식회사 | Electronic device comprising resonance structure |
| US12096178B2 (en) | 2021-06-28 | 2024-09-17 | Samsung Electronics Co., Ltd. | Electronic device with resonance structure |
-
2019
- 2019-12-30 CN CN201911397818.0A patent/CN111093128A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023277352A1 (en) * | 2021-06-28 | 2023-01-05 | 삼성전자주식회사 | Electronic device comprising resonance structure |
| US12096178B2 (en) | 2021-06-28 | 2024-09-17 | Samsung Electronics Co., Ltd. | Electronic device with resonance structure |
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