CN111085931A - Polishing head driving device and polishing equipment - Google Patents
Polishing head driving device and polishing equipment Download PDFInfo
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- CN111085931A CN111085931A CN201911410317.1A CN201911410317A CN111085931A CN 111085931 A CN111085931 A CN 111085931A CN 201911410317 A CN201911410317 A CN 201911410317A CN 111085931 A CN111085931 A CN 111085931A
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- lifting
- polishing head
- main shaft
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- 238000005498 polishing Methods 0.000 title claims abstract description 141
- 230000007246 mechanism Effects 0.000 claims abstract description 61
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 47
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 47
- 239000010703 silicon Substances 0.000 claims abstract description 47
- 238000009826 distribution Methods 0.000 claims abstract description 18
- 230000005540 biological transmission Effects 0.000 claims description 32
- 230000001681 protective effect Effects 0.000 claims description 14
- 238000013467 fragmentation Methods 0.000 abstract description 7
- 238000006062 fragmentation reaction Methods 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 description 7
- 210000004907 gland Anatomy 0.000 description 6
- 230000003028 elevating effect Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to the technical field of polishing, and discloses a polishing head driving device and polishing equipment. The polishing head driving device comprises a mounting plate, a lifting mechanism and a power mechanism. The lifting mechanism is arranged on the mounting plate and comprises a lifting motor, a screw rod, a screw nut and a lifting plate, and the lifting motor can drive the screw rod to rotate so that the screw nut drives the lifting plate to lift. The power mechanism is arranged on the lifting plate and comprises a main shaft, a rotating motor and a gas distribution block, the rotating motor is located on one side of the main shaft and can drive the main shaft to rotate, one end of the main shaft is configured to be fixedly connected with the polishing head assembly, the other end of the main shaft is fixedly connected with the gas distribution block, and the gas distribution block is communicated with the polishing head assembly through the main shaft so that the polishing head assembly can adsorb a silicon wafer and adjust the polishing pressure of the silicon wafer. The polishing head driving device not only can accurately control the lifting speed and the rotating speed, but also can effectively avoid the phenomena of silicon wafer deformation and fragmentation, and has simple and compact structure and reasonable layout.
Description
Technical Field
The invention relates to the technical field of polishing, in particular to a polishing head driving device and polishing equipment.
Background
Currently, a polishing apparatus generally includes a polishing head assembly and a polishing disk located below the polishing head assembly, wherein the polishing head assembly includes a polishing head and a ceramic disk. When the silicon wafer is polished, the silicon wafer is polished in a mode that the polishing head assembly drives the silicon wafer to rotate on the polishing disc. The polishing process principle is that diluted polishing solution is sprayed on a polishing disc, a polishing head assembly drives a silicon wafer and the polishing disc to rotate in the same direction at different speeds, so that the polishing disc and the silicon wafer are in relative friction movement, and microscopic friction cutting is performed on the surface of the silicon wafer by using fine particles embedded in polishing cloth, so that the concave and convex parts on the surface of the silicon wafer are polished to be smooth, and the purpose of surface brightness is achieved.
The movement of the polishing head assembly during polishing is typically accomplished using a polishing head drive. However, the existing polishing head driving device usually causes the phenomena of silicon wafer deformation and chipping, and has a complex structure and poor layout rationality.
Therefore, a new polishing head driving device is needed to solve the above technical problems.
Disclosure of Invention
An object of the present invention is to provide a polishing head driving apparatus, which can effectively avoid the occurrence of silicon wafer deformation and chipping, and has a simple and compact structure and a reasonable layout, compared with the prior art.
The polishing head driving device is used for effectively avoiding the phenomena of deformation and fragmentation of the silicon wafer, and has the advantages of simple and compact structure, reasonable layout, high working stability and high polishing yield.
A polishing head driving device comprising:
mounting a plate;
the lifting mechanism is arranged on the mounting plate and comprises a lifting motor, a screw rod nut and a lifting plate, the screw rod nut is sleeved on the screw rod, the lifting plate is fixedly connected with the screw rod nut, and the lifting motor can drive the screw rod to rotate so that the screw rod nut drives the lifting plate to lift;
the silicon wafer polishing device comprises a lifting plate, a power mechanism and a gas distribution block, wherein the lifting plate is provided with the lifting plate, the power mechanism comprises a main shaft, a rotating motor and the gas distribution block, the main shaft is parallel to the screw rod, the rotating motor is positioned on one side of the main shaft and can drive the main shaft to rotate, one end of the main shaft is configured to be fixedly connected with a polishing head assembly, the other end of the main shaft is fixedly connected with the gas distribution block, and the gas distribution block is communicated with the polishing head assembly through the main shaft so that the polishing head assembly can adsorb a silicon wafer and adjust polishing pressure on the.
Further, elevating system still includes spacing subassembly, spacing subassembly sets up on the mounting panel, the lifter plate and/or screw-nut can with spacing subassembly butt, in order to restrict the lift stroke of lifter plate.
Further, the limiting assembly comprises an upper limiting piece and a lower limiting piece, the top surface of the lifting plate can be abutted to the upper limiting piece, and the bottom surface of the lifting plate can be abutted to the lower limiting piece.
Further, elevating system still includes the direction subassembly, the direction subassembly includes guide post and uide bushing, the guide post sets up on the mounting panel, the uide bushing slidable ground cover is established on the guide post and with lifter plate fixed connection.
Furthermore, the power mechanism further comprises a transmission assembly, the transmission assembly comprises a first transmission wheel, a second transmission wheel and a transmission belt, the first transmission wheel is fixedly sleeved on the main shaft and located above the lifting plate, the second transmission wheel is fixedly sleeved on an output shaft of the rotating motor, and the transmission belt is sleeved on the first transmission wheel and the second transmission wheel.
Furthermore, the power mechanism further comprises a movable sleeve, the movable sleeve is fixedly connected with the lifting plate and is coaxially arranged with the main shaft, the main shaft penetrates through the movable sleeve, and the movable sleeve penetrates through the mounting plate in a liftable manner.
Furthermore, the power mechanism further comprises a fixed sleeve, the fixed sleeve is fixedly arranged on the mounting plate and is coaxial with the movable sleeve, and the movable sleeve can slidably penetrate through the fixed sleeve.
Furthermore, the power mechanism further comprises a protection cover assembly, and the protection cover assembly covers the movable sleeve and one end, close to the polishing head assembly, of the fixed sleeve.
Furthermore, one lifting mechanism and one power mechanism form a polishing unit, a plurality of polishing units are arranged on the mounting plate, and two adjacent polishing units are arranged in central symmetry.
A polishing apparatus comprising the polishing head driving device as described above.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention has the beneficial effects that:
according to the polishing head driving device provided by the invention, the power mechanism is arranged on the lifting plate of the lifting mechanism, so that the main shaft in the power mechanism can rotate and lift, and further the main shaft can drive the polishing head component to rotate and lift, and the lifting of the polishing head component is beneficial to loading and unloading of a silicon wafer and the conversion of the silicon wafer driven by the polishing head component among a plurality of polishing stations, and is beneficial to adjusting the polishing pressure of the polishing disk on the silicon wafer, and the deformation and fragmentation of the silicon wafer are prevented; meanwhile, by arranging the gas distribution block communicated with the main shaft and the polishing head assembly, the polishing head assembly can adsorb the silicon wafer and adjust the polishing pressure on the silicon wafer by controlling the direction and the flow of air flow in the gas distribution block, so that the deformation and the fragmentation of the silicon wafer can be further prevented, and the polishing quality is ensured; in addition, through will rotating the motor setting in one side of main shaft, can provide installation space for dividing the gas piece, avoid dividing the gas piece and rotating the motor and taking place to interfere, rationally distributed, simple structure.
According to the polishing equipment provided by the invention, by applying the polishing head driving device, the lifting speed and the rotating speed can be accurately controlled, the phenomena of deformation and fragmentation of a silicon wafer can be effectively avoided, the structure is simple and compact, the layout is reasonable, the working stability is high, and the polishing yield is high.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.
Fig. 1 is a side view of a polishing head driving apparatus provided by an embodiment of the present invention at a first angle;
fig. 2 is a side view of a polishing head driving apparatus according to an embodiment of the present invention at a second angle;
fig. 3 is a plan view of the polishing head driving apparatus according to the embodiment of the present invention when the gas distribution block is not mounted.
In the figure:
100-a turntable;
1-mounting a plate;
2-a lifting mechanism; 21-a lifting motor; 22-a screw rod; 23-a feed screw nut; 24-a lifter plate; 25-a spacing assembly; 251-an upper stop; 252-a lower retainer; 26-a guide assembly; 261-a guide post; 262-a guide sleeve; 27-a coupling; 28-lifting support frame; 291-first fixed seat; 292-a second fixed seat;
3, a power mechanism; 31-a main shaft; 32-a rotating motor; 321-rotating the support frame; 33-air separation block; 34-a transmission assembly; 341-transmission belt; 35-an active cannula; 36-a fixed sleeve; 37-a boot assembly; 371 — first protective shell; 372-a second protective shell; 373-a telescopic cover; 374-end cap; 381-fixed disk; 382-a connector; 391-bearings; 392-a collar; 393-a first seal; 394-bushing; 395-bushing upper gland; 396-bushing lower gland; 397 — second seal.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only or to distinguish between different structures or components and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1, the present embodiment provides a polishing head driving device that can be applied to a polishing apparatus for polishing a silicon wafer. Specifically, the polishing head driving device comprises a mounting plate 1, a lifting mechanism 2 and a power mechanism 3. The lifting mechanism 2 is arranged on the mounting plate 1, the lifting mechanism 2 comprises a lifting motor 21, a screw rod 22, a screw nut 23 and a lifting plate 24, the screw rod 22 is sleeved with the screw nut 23, the lifting plate 24 is fixedly connected with the screw nut 23, and the lifting motor 21 can drive the screw rod 22 to rotate so that the screw nut 23 drives the lifting plate 24 to lift. The power mechanism 3 is arranged on the lifting plate 24, the power mechanism 3 comprises a main shaft 31, a rotating motor 32 and a gas distribution block 33, the main shaft 31 is parallel to the screw rod 22, the rotating motor 32 is located on one side of the main shaft 31 and can drive the main shaft 31 to rotate, one end of the main shaft 31 is configured to be fixedly connected with the polishing head assembly, the other end of the main shaft 31 is fixedly connected with the gas distribution block 33, and the gas distribution block 33 is communicated with the polishing head assembly through the main shaft 31, so that the polishing head assembly can adsorb a silicon wafer and adjust the polishing pressure on the silicon wafer. Of course, in other embodiments, the silicon wafer may be other workpieces requiring polishing.
According to the polishing head driving device provided by the embodiment, the power mechanism 3 is arranged on the lifting plate 24 of the lifting mechanism 2, so that the main shaft 31 in the power mechanism 3 can rotate and lift, and further the main shaft 31 can drive the polishing head assembly to rotate and lift, and the lifting of the polishing head assembly is beneficial to loading and unloading of a silicon wafer and conversion of the silicon wafer driven by the polishing head assembly among a plurality of polishing stations, and is beneficial to adjusting the polishing pressure of a polishing disc on the silicon wafer, and preventing the silicon wafer from deforming and cracking; meanwhile, by arranging the gas distribution block 33 communicated with the main shaft 31 and the polishing head assembly, the polishing head assembly can adsorb the silicon wafer and adjust the polishing pressure on the silicon wafer by controlling the flow direction and the flow quantity in the gas distribution block 33, so that the lifting speed and the rotating speed can be accurately controlled, the deformation and the fragmentation of the silicon wafer can be prevented, and the polishing quality is ensured; in addition, through setting up rotation motor 32 in one side of main shaft 31, can provide installation space for dividing gas piece 33, avoid dividing gas piece 33 and rotation motor 32 to take place to interfere, rationally distributed, simple structure.
Alternatively, as shown in fig. 1, in the present embodiment, the mounting plate 1 is configured to be disposed on the turntable 100. The rotation of the turntable 100 drives the polishing head driving device to switch among a plurality of polishing stations.
Optionally, as shown in fig. 1, in this embodiment, the power mechanism 3 further includes a transmission assembly 34, the transmission assembly 34 includes a first transmission wheel, a second transmission wheel and a transmission belt 341, the first transmission wheel is fixedly sleeved on the main shaft 31 and located above the lifting plate 24, the second transmission wheel is fixedly sleeved on the output shaft of the rotating motor 32, and the transmission belt 341 is sleeved on the first transmission wheel and the second transmission wheel. Namely, the rotating motor 32 drives the main shaft 31 to rotate through the transmission assembly 34. The first driving wheel is arranged above the lifting plate 24, namely the main shaft 31 penetrates through the lifting plate 24 and then is fixedly connected with the first driving wheel, so that the first driving wheel can be conveniently installed.
Alternatively, as shown in fig. 1, the rotating motor 32 is fixedly disposed on the rotating support frame 321, the rotating support frame 321 is fixedly disposed on the lifting plate 24, and both the rotating motor 32 and the rotating support frame 321 are disposed on the lifting plate 24. By this arrangement, the rotating motor 32 and the rotating support 321 can be prevented from affecting the downward movement stroke of the lifting plate 24.
Specifically, in the present embodiment, the main shaft 31 extends to the other side of the mounting plate 1 through the mounting hole of the mounting plate 1.
Preferably, as shown in fig. 1, the power mechanism 3 provided in this embodiment further includes a movable sleeve 35, the movable sleeve 35 is fixedly connected to the lifting plate 24 and coaxially disposed with the main shaft 31, the main shaft 31 passes through the movable sleeve 35, and the movable sleeve 35 passes through the mounting hole of the mounting plate 1 in a liftable manner. The movable sleeve 35 can protect the main shaft 31 and prolong the service life of the power mechanism 3, and in addition, the movable sleeve 35 is fixedly connected with the lifting plate 24 and cannot rotate together with the main shaft 31, so that the movable sleeve 35 can prevent the main shaft 31 rotating at a high speed from accidentally injuring an operator.
Optionally, in this embodiment, the power mechanism 3 further includes an assembly component, as shown in fig. 1, the assembly component includes a bearing 391, and the bearing 391 is disposed on the main shaft 31 and is sandwiched between the main shaft 31 and the movable sleeve 35. Specifically, in the present embodiment, the number of the bearings 391 is two, where one of the bearings 391 is located at the upper end of the movable sleeve 35, and the other bearing 391 is located at the lower end of the movable sleeve 35.
Optionally, in this embodiment, as shown in fig. 1, the assembly further includes a collar 392, and the collar 392 is disposed between the main shaft 31 and the lifting plate 24. Further, the mounting assembly also includes a first seal 393, the first seal 393 disposed between the collar 392 and the lift plate 24 for sealing.
Optionally, in this embodiment, as shown in fig. 1, the power mechanism 3 further includes a fixed sleeve 36, the fixed sleeve 36 is fixedly disposed on the mounting plate 1 and is disposed coaxially with the movable sleeve 35, and the movable sleeve 35 slidably passes through the fixed sleeve 36. The fixed sleeve 36 can guide the movable sleeve 35, thereby being beneficial to ensuring the accuracy of the lifting path of the movable sleeve 35. Further, in the present embodiment, the fixing bushing 36 passes through the mounting hole of the mounting plate 1.
Optionally, in this embodiment, as shown in fig. 1, the assembly further includes a bushing 394, the bushing 394 is fixedly disposed within the fixing sleeve 36, and the main shaft 31 slidably passes through the bushing 394. Further, a plurality of bushings 394 are axially spaced along the retaining sleeve 36. Optionally, in this embodiment, the assembly further includes a bushing upper gland 395 and a bushing lower gland 396, the bushing 394 at the top of the fixing sleeve 36 is fixedly connected with the fixing sleeve 36 through the bushing upper gland 395, and the bushing 394 at the bottom of the fixing sleeve 36 is fixedly connected with the fixing sleeve 36 through the bushing lower gland 396.
Optionally, as shown in fig. 1, the power mechanism 3 provided in this embodiment further includes a protective cover assembly 37, and the protective cover assembly 37 covers the movable sleeve 35 and the fixed sleeve 36 at one end near the polishing head assembly. Because the distance between the end of the movable sleeve 35 and the fixed sleeve 36 close to the polishing head assembly and the polishing disk is short, the polishing liquid can easily enter the movable sleeve 35, the fixed sleeve 36 and the spindle 31, so that the protective cover assembly 37 is arranged to play a waterproof and sealing role, and prevent the polishing liquid from entering the movable sleeve 35, the fixed sleeve 36 and the spindle 31, thereby prolonging the service life of the power mechanism 3.
Alternatively, in this embodiment, as shown in fig. 1, the protective cover assembly 37 includes a first protective cover 371 and a second protective cover 372, and the first protective cover 371 is snap-fitted to the second protective cover 372 and covers an end of the fixed sleeve 36 close to the polishing head assembly. Further, the protective cover assembly 37 further includes a telescopic cover 373 and an end cap 374, the end cap 374 is disposed at one end of the movable sleeve 35 close to the polishing head assembly, one end of the telescopic cover 373 is fixedly connected to the second protective shell 372, and the other end is connected to the end cap 374. Further, a second seal 397 is provided between the end cover 374 and the main shaft 31.
Optionally, as shown in fig. 1, the power mechanism 3 provided in this embodiment further includes a fixed disk 381 and a connector 382, where the fixed disk 381 is fixedly connected to the spindle 31 through the connector 382, and the polishing head assembly is fixedly connected to the spindle 31 through the fixed disk 381.
Preferably, as shown in fig. 2, the lifting mechanism 2 further includes a limit component 25, the limit component 25 is disposed on the mounting plate 1, and the lifting plate 24 and/or the lead screw nut 23 can abut against the limit component 25 to limit the lifting stroke of the lifting plate 24. Through setting up spacing subassembly 25, be favorable to preventing that lifter plate 24 from surpassing the maximum stroke of predetermineeing at the in-process of going up and down to be favorable to guaranteeing the reliability of elevating system 2 work.
Alternatively, as shown in fig. 2, in the present embodiment, the limiting assembly 25 includes an upper limiting member 251 and a lower limiting member 252, the top surface of the lifting plate 24 can abut against the upper limiting member 251, and the bottom surface of the lifting plate 24 can abut against the lower limiting member 252. Specifically, in the present embodiment, the upper stopper 251 is mounted on the mounting plate 1 through a stopper bracket, and the lower stopper 252 is directly provided on the mounting plate 1. Preferably, the lifting mechanism 2 provided in the present embodiment further includes a sensor for detecting a position signal of the lifting plate 24.
Optionally, as shown in fig. 2 and fig. 3, the lifting mechanism 2 provided in this embodiment further includes a guide assembly 26, the guide assembly 26 includes a guide post 261 and a guide sleeve 262, the guide post 261 is disposed on the mounting plate 1, and the guide sleeve 262 slidably fits over the guide post 261 and is fixedly connected to the lifting plate 24. The cooperation of the guide column 261 and the guide sleeve 262 is beneficial to ensuring the accuracy of the lifting track of the lifting plate 24 and the stability of the lifting process. Specifically, in the present embodiment, the guide assembly 26 is a linear bearing set.
Optionally, as shown in fig. 2, the lifting mechanism 2 provided in this embodiment further includes a coupler 27, and the lifting motor 21 is connected to the lead screw 22 through the coupler 27.
Optionally, as shown in fig. 2, the lifting mechanism 2 provided in this embodiment further includes a lifting support frame 28, the lifting support frame 28 is fixedly disposed on the mounting plate 1, and the lifting motor 21 is fixedly disposed on the lifting support frame 28.
Optionally, as shown in fig. 2, the lifting mechanism 2 provided in this embodiment further includes a fixing seat assembly, the fixing seat assembly includes a first fixing seat 291 and a second fixing seat 292, the first fixing seat 291 is fixedly disposed on the lifting support frame 28, the screw rod 22 rotatably passes through the first fixing seat 291, the second fixing seat 292 is fixedly disposed on the mounting plate 1, and one end of the screw rod 22, which is far away from the lifting motor 21, is rotatably connected to the second fixing seat 292.
Preferably, as shown in fig. 3, one lifting mechanism 2 and one power mechanism 3 constitute one polishing unit, a plurality of polishing units are arranged on the mounting plate 1, and two adjacent polishing units are arranged in central symmetry. According to the arrangement, the space above the mounting plate 1 can be fully utilized, and the interference between two adjacent polishing units is avoided. Specifically, in the present embodiment, two polishing units are provided on each mounting plate 1. Further, in the same polishing unit, the output shaft of the rotating motor 32, the spindle 31, and the output shaft of the elevating motor 21 are arranged in a straight line. According to the arrangement mode, the layout of each polishing unit is more reasonable and compact, the installation space is saved, and therefore a plurality of polishing units can be conveniently arranged on the installation plate 1.
The working process of the polishing head driving device provided by the embodiment is as follows: after the lifting motor 21 obtains a signal of the previous station, the lifting motor 21 is started, so that the lifting plate 24 drives the power mechanism 3 to move downwards, the spindle 31 is controlled to ventilate through the electromagnetic valve after the lifting motor 21 is in place, the polishing head assembly adsorbs the silicon wafer, and then the lifting plate 24 drives the power mechanism 3 to ascend and return; after the turntable 100 drives the polishing head driving device to switch to the next polishing station, the lifting plate 24 drives the power mechanism 3 to move downwards, the rotating motor 32 drives the main shaft 31 to rotate in the same direction and in a differential speed with the polishing disk below to polish the silicon wafer after the polishing is completed, the rotating motor 32 stops after the polishing is completed, the lifting plate 24 drives the power mechanism 3 to ascend and return, the polishing of the silicon wafer is completed in three times in a reciprocating mode, the lifting plate 24 drives the power mechanism 3 to move downwards, the electromagnetic valve controls the main shaft 31 to stop air after the polishing is completed, the silicon wafer is unloaded, and the silicon wafer returns after the polishing is. When the next silicon wafer starts polishing, the lifting plate 24 drives the power mechanism 3 to descend, the cleaning device ascends to clean the polishing disc after the next silicon wafer is in place, and then the next silicon wafer is returned to wait for adsorption of the next silicon wafer.
The embodiment also provides polishing equipment comprising the polishing head driving device. The polishing equipment that this embodiment provided, through using above-mentioned rubbing head drive arrangement, can not only accurate control elevating speed and rotational speed, can also effectively avoid the silicon chip to warp and the emergence of fragmentation phenomenon, simple structure is compact, and is rationally distributed, and job stabilization nature is high, and the polishing yields is high.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A polishing head driving apparatus, comprising:
a mounting plate (1);
the lifting mechanism (2) is arranged on the mounting plate (1), the lifting mechanism (2) comprises a lifting motor (21), a screw rod (22), a screw rod nut (23) and a lifting plate (24), the screw rod nut (23) is sleeved on the screw rod (22), the lifting plate (24) is fixedly connected with the screw rod nut (23), and the lifting motor (21) can drive the screw rod (22) to rotate so that the screw rod nut (23) drives the lifting plate (24) to lift;
the silicon wafer polishing device comprises a power mechanism (3) arranged on the lifting plate (24), wherein the power mechanism (3) comprises a main shaft (31), a rotating motor (32) and a gas distribution block (33), the main shaft (31) is parallel to the screw rod (22), the rotating motor (32) is located on one side of the main shaft (31) and can drive the main shaft (31) to rotate, one end of the main shaft (31) is configured to be fixedly connected with a polishing head assembly, the other end of the main shaft is fixedly connected with the gas distribution block (33), and the gas distribution block (33) is communicated with the polishing head assembly through the main shaft (31) so that the polishing head assembly can adsorb a silicon wafer and adjust polishing pressure on the silicon wafer.
2. The polishing head driving device according to claim 1, wherein the lifting mechanism (2) further comprises a limit assembly (25), the limit assembly (25) is provided on the mounting plate (1), and the lifting plate (24) and/or the lead screw nut (23) can abut against the limit assembly (25) to limit a lifting stroke of the lifting plate (24).
3. The polishing head driving device according to claim 2, wherein the stopper assembly (25) comprises an upper stopper (251) and a lower stopper (252), a top surface of the lift plate (24) is capable of abutting against the upper stopper (251), and a bottom surface of the lift plate (24) is capable of abutting against the lower stopper (252).
4. The polishing head driving device according to claim 1, wherein the lifting mechanism (2) further comprises a guide assembly (26), the guide assembly (26) comprises a guide post (261) and a guide sleeve (262), the guide post (261) is disposed on the mounting plate (1), and the guide sleeve (262) is slidably fitted over the guide post (261) and fixedly connected to the lifting plate (24).
5. The polishing head driving device according to claim 1, wherein the power mechanism (3) further comprises a transmission assembly (34), the transmission assembly (34) comprises a first transmission wheel, a second transmission wheel and a transmission belt (341), the first transmission wheel is fixedly sleeved on the spindle (31) and is located above the lifting plate (24), the second transmission wheel is fixedly sleeved on the output shaft of the rotating motor (32), and the transmission belt (341) is sleeved on the first transmission wheel and the second transmission wheel.
6. Polishing head driving device according to claim 5, wherein the power mechanism (3) further comprises a movable sleeve (35), the movable sleeve (35) is fixedly connected to the lifting plate (24) and is coaxially disposed with the spindle (31), the spindle (31) passes through the movable sleeve (35), and the movable sleeve (35) passes through the mounting plate (1) in a liftable manner.
7. Polishing head drive apparatus according to claim 6, wherein said power mechanism (3) further comprises a fixed sleeve (36), said fixed sleeve (36) being fixedly disposed on said mounting plate (1) and coaxially disposed with said movable sleeve (35), said movable sleeve (35) slidably passing through said fixed sleeve (36).
8. Polishing head drive apparatus according to claim 7, wherein said power mechanism (3) further comprises a protective cover assembly (37), said protective cover assembly (37) covering an end of said movable sleeve (35) and said fixed sleeve (36) near said polishing head assembly.
9. Polishing head driving device according to any of claims 1-8, wherein one of the lifting mechanisms (2) and one of the power mechanisms (3) constitute a polishing unit, and a plurality of polishing units are arranged on the mounting plate (1), and two adjacent polishing units are arranged in a central symmetry.
10. A polishing apparatus comprising a polishing head driving device according to any one of claims 1 to 9.
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| CN201911410317.1A CN111085931A (en) | 2019-12-31 | 2019-12-31 | Polishing head driving device and polishing equipment |
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| CN201911410317.1A CN111085931A (en) | 2019-12-31 | 2019-12-31 | Polishing head driving device and polishing equipment |
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| CN201911410317.1A Pending CN111085931A (en) | 2019-12-31 | 2019-12-31 | Polishing head driving device and polishing equipment |
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