CN111085498A - Wafer edge washing system - Google Patents

Wafer edge washing system Download PDF

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Publication number
CN111085498A
CN111085498A CN201911334133.1A CN201911334133A CN111085498A CN 111085498 A CN111085498 A CN 111085498A CN 201911334133 A CN201911334133 A CN 201911334133A CN 111085498 A CN111085498 A CN 111085498A
Authority
CN
China
Prior art keywords
wafer
frame
brush
placing
box body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201911334133.1A
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Chinese (zh)
Inventor
乐美华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nan'an Boyue Industrial Design Co ltd
Original Assignee
Nan'an Boyue Industrial Design Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nan'an Boyue Industrial Design Co ltd filed Critical Nan'an Boyue Industrial Design Co ltd
Priority to CN201911334133.1A priority Critical patent/CN111085498A/en
Publication of CN111085498A publication Critical patent/CN111085498A/en
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B08B3/123—Cleaning travelling work, e.g. webs, articles on a conveyor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention discloses a wafer edge washing system which structurally comprises trundles, a box body, a control panel, a washing tank and an upper cover, wherein the trundles are arranged at four corners of the lower end of the box body and are mechanically connected; the cleaning tank comprises an edge plate, a cleaning box, an inner groove and a placing frame, wherein the edge plate is horizontally arranged at the upper end of the cleaning box and welded with the cleaning box, the inner groove is arranged at the inner side of the cleaning box and is of an integrated structure, and the placing frame is arranged at the inner side of the cleaning box and is positioned in the inner groove; the bottom hairbrush structure is arranged at the lower end of the inner cavity, so that the wafer is prevented from colliding with the inner wall, the damage to the surface of the wafer is reduced, the overall fault rate of the circuit equipment after the wafer is processed is reduced, and the yield is improved.

Description

Wafer edge washing system
Technical Field
The invention belongs to the field of wafer processing, and particularly relates to a wafer edge washing system.
Background
The wafer refers to a semiconductor silicon wafer with a circular structure, and is mainly processed into an element for circuit operation at the upper end of the wafer, the wafer needs to be subjected to photoresist coating treatment in the processing and manufacturing process, photoresist remains at the edge of the wafer after the processing, and the substances bring obstacles in the circuit operation, so the photoresist needs to be cleaned, and a wafer edge cleaning system is derived to clean the edge of the wafer, but the prior art has the following defects:
because the wafer is small and exquisite and meticulous, when putting into the aquatic and washing the limit, will receive the effect of ultrasonic wave and promote the wafer to float in the aquatic, make it touch the inner wall of equipment, and cause colliding with of wafer, lead to the wafer surface to cause the damage to lead to the fact the holistic trouble of circuit equipment after processing is accomplished, and then improved the defective percentage.
Therefore, the application provides a wafer edge cleaning system which improves the defects.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a wafer edge washing system to solve the problems that in the prior art, because a wafer is small and exquisite, when the wafer is placed into water for edge washing, the wafer is pushed to float in the water under the action of ultrasonic waves, and touches the inner wall of equipment, so that the wafer is collided, the surface of the wafer is damaged, the whole circuit equipment is broken after processing is finished, and the defective rate is increased.
In order to achieve the purpose, the invention is realized by the following technical scheme: a wafer edge washing system structurally comprises trundles, a box body, a control panel, a washing tank and an upper cover, wherein the trundles are installed at four corners of the lower end of the box body and are mechanically connected, the control panel is installed on the front side of the box body and is electrically connected through a wire, the washing tank is embedded and installed on the inner side of the box body, and the upper cover is installed at the upper end of the box body and is connected through a hinge; the cleaning tank comprises an edge plate, a cleaning box, an inner groove and a placing frame, wherein the edge plate is horizontally arranged at the upper end of the cleaning box and welded with the cleaning box, the inner groove is arranged on the inner side of the cleaning box and is of an integrated structure, and the placing frame is arranged on the inner side of the cleaning box and is located in the inner groove.
The invention is further improved, the placing frame comprises a frame, a bottom net, partition plates and a storage drawer, the bottom net is installed at the bottom of the inner side of the frame and is connected mechanically, the partition plates are horizontally installed on the inner side of the frame and are welded, and the storage drawer is arranged between the partition plates and is connected movably.
The invention is further improved, the storage drawer comprises a bottom plate, a wafer placing structure, an outer frame and a partition plate, the bottom plate is horizontally arranged at the lower end of the outer frame and is welded with the outer frame, the wafer placing structure is arranged on the inner side of the outer frame and is separated by the partition plate, and through holes are formed in the upper ends of the bottom plate and the outer frame.
The wafer placing structure is further improved, the wafer placing structure comprises a placing frame, side brushes, an inner cavity and a bottom brush structure, the side brushes are arranged on the inner side of the placing frame in a surrounding mode, the inner cavity is arranged on the inner side of the placing frame and located on the inner side of the side brushes, and the bottom brush structure is arranged at the bottom of the inner side of the placing frame and connected with the side brushes.
The invention is further improved, the bottom hairbrush structure comprises a water permeable net, a rubber block, an installation block and bristles, the rubber block is fixedly installed at the upper end of the water permeable net, the installation block is horizontally installed at the upper end of the water permeable net and is in mechanical connection, and the bristles are uniformly embedded into the outer surface of the installation block and are distributed in a sector shape.
The invention is further improved, a plurality of rubber blocks and mounting blocks are arranged and distributed at intervals, and a plurality of through holes communicated with the water permeable net are respectively arranged on the rubber blocks and the mounting blocks.
According to the technical scheme, the wafer edge washing system has the following beneficial effects:
the wafer placing structure comprises a wafer placing structure, a side brush structure and a bottom brush structure, wherein the side brush structure is arranged on the wafer placing structure, the bottom brush structure is arranged on the side of the wafer placing structure, the side brush structure is arranged on the bottom of the wafer placing structure, the side brush structure is arranged on the inner side of the wafer placing structure, the wafer placing structure is pushed by water to be washed.
The bottom hairbrush structure is arranged at the lower end of the inner cavity, a wafer shakes to be in contact with the side hairbrush to clean the side edge, the bottom of the wafer is also in contact with the bottom hairbrush structure, the bristles on the mounting block scrub the wafer, the approach of the wafer is blocked to a certain extent due to the longer bristles, and the rubber block on the inner side and the mounting block buffer the wafer when the wafer approaches and contacts to prevent collision, so that the wafer is prevented from colliding with the inner wall, the damage to the surface of the wafer is reduced, the failure rate of the whole circuit equipment is reduced after the wafer is processed, and the yield is further improved.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic diagram of a wafer edge cleaning system according to the present invention;
FIG. 2 is a schematic view of the structure of the cleaning tank of the present invention;
FIG. 3 is a schematic structural diagram of a placement frame according to the present invention;
FIG. 4 is a schematic front view of the storage drawer of the present invention;
FIG. 5 is a schematic top view of the storage drawer of the present invention;
FIG. 6 is a schematic diagram of a front view of a wafer placement structure according to the present invention;
FIG. 7 is a schematic top view of a wafer placement structure according to the present invention;
FIG. 8 is a structural diagram of the bottom brush structure of the present invention.
In the figure: the cleaning device comprises a caster-1, a box body-2, a control panel-3, a cleaning tank-4, an upper cover-5, a rim plate-41, a cleaning box-42, an inner groove-43, a placing frame-44, a frame-441, a bottom net-442, a separating plate-443, a storage drawer-444, a bottom plate-44 a, a wafer placing structure-44 b, an outer frame-44 c, a separating plate-44 d, a placing rack-b 1, a side brush-b 2, an inner cavity-b 3, a bottom brush structure-b 4, a water permeable net-b 41, a rubber block-b 42, a mounting block-b 43 and bristles-b 44.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
The first embodiment is as follows: referring to fig. 1-7, the embodiments of the present invention are as follows:
the cleaning device structurally comprises trundles 1, a box body 2, a control panel 3, a cleaning tank 4 and an upper cover 5, wherein the trundles 1 are arranged at four corners of the lower end of the box body 2 and are mechanically connected, the control panel 3 is arranged on the front side of the box body 2 and is electrically connected through a wire, the cleaning tank 4 is embedded and arranged on the inner side of the box body 2, and the upper cover 5 is arranged at the upper end of the box body 2 and is connected through a hinge; the cleaning tank 4 comprises a rim plate 41, a cleaning tank 42, an inner tank 43 and a placing frame 44, wherein the rim plate 41 is horizontally arranged at the upper end of the cleaning tank 42 and welded with the cleaning tank, the inner tank 43 is arranged at the inner side of the cleaning tank 42 and is of an integrated structure, the placing frame 44 is arranged at the inner side of the cleaning tank 42 and is positioned at the inner tank 43, and the inner side of the box body 2 is provided with an ultrasonic transducer and is arranged at the lower end of the cleaning tank 4.
Referring to fig. 3, the placement frame 44 includes a frame 441, a bottom net 442, a partition plate 443, and a storage drawer 444, wherein the bottom net 442 is installed at the bottom of the inner side of the frame 441 and mechanically connected, the partition plate 443 is horizontally installed at the inner side of the frame 441 and welded, the storage drawer 444 is installed between the partition plates 443 and movably connected to perform multi-layer separation, and the lower end of the partition plate 443 is provided with a brush to prevent the wafer from colliding with the partition plate 443 while cleaning.
Referring to fig. 4-5, the storage drawer 444 includes a bottom plate 44a, wafer placing structures 44b, an outer frame 44c, and a partition 44d, wherein the bottom plate 44a is horizontally installed at the lower end of the outer frame 44c and welded to the outer frame, the wafer placing structures 44b are installed inside the outer frame 44c and separated by the partition 44d, and through holes are formed at the upper ends of the bottom plate 44a and the outer frame 44c to form separation between the wafer placing structures 44b, so as to prevent collision between wafers.
Referring to fig. 6-7, the wafer placing structure 44b includes a placing frame b1, a side brush b2, an inner cavity b3, and a bottom brush structure b4, wherein the side brush b2 is mounted around the inside of the placing frame b1, the inner cavity b3 is disposed inside the placing frame b1 and inside the side brush b2, the bottom brush structure b4 is mounted at the bottom of the inside of the placing frame b1 and connected with the side brush b2, and in the inner cavity b3, the side brush b2 and the bottom brush structure b4 are used for brushing, and collision with the inner wall is prevented.
Based on the above embodiment, the specific working principle is as follows:
when the wafer needs to be edge-washed, the placing frame 44 is lifted, the storage drawer 444 is pulled out from the partition plate 443, the wafer can be placed inside the wafer placing structure 44b, then the storage drawer 444 is pushed back, the placing frame 44 is retracted into the inner groove 43, the wafer edge-washing operation can be started by covering the upper cover 5, the ultrasonic transducer inside the box body 2 is opened through the control panel 3, the wafer can start to act on the cleaning tank 4, ultrasonic waves are emitted to the bottom of the cleaning box 42, at the moment, water in the inner groove 43 flows to act on the wafer inside the storage drawer 444, the wafer inside the wafer placing structure 44b is pushed by the water to be cleaned and shakes inside, and is in contact with the side brush b2 and the bottom brush structure b4 for cleaning, and the wafer is prevented from approaching the placing frame b1 due to the structures of the side brush b2 and the bottom brush structure b4, after the cleaning is completed, the wafers are sequentially taken out while the placing frame 44 is lifted.
Example two: referring to fig. 6-8, the embodiment of the present invention is as follows:
the wafer placing structure 44b comprises a placing frame b1, a side brush b2, an inner cavity b3 and a bottom brush structure b4, wherein the side brush b2 is installed around the inner side of the placing frame b1, the inner cavity b3 is installed on the inner side of the placing frame b1 and located on the inner side of the side brush b2, and the bottom brush structure b4 is installed at the bottom of the inner side of the placing frame b1 and connected with the side brush b 2.
Referring to fig. 8, the bottom brush structure b4 includes a water permeable net b41, a rubber block b42, a mounting block b43, and bristles b44, the rubber block b42 is fixedly mounted at the upper end of the water permeable net b41, the mounting block b43 is horizontally mounted at the upper end of the water permeable net b41 and mechanically connected, the bristles b44 are uniformly embedded in the outer surface of the mounting block b43 and are distributed in a fan shape, and when cleaning is performed, the bristles b44 are used for blocking the wafer from approaching the inner wall.
Referring to fig. 8, the rubber blocks b42 and the mounting blocks b43 are arranged in a plurality and spaced apart from each other, the rubber blocks b42 and the mounting blocks b43 are respectively provided with a plurality of through holes to communicate with the water permeable net b41, so that water can be conveniently cleaned, and the wafer can be more easily buffered when colliding with the rubber blocks b42 and the mounting blocks b 43.
Based on the above embodiment, the specific working principle is as follows:
the wafer is cleaned by ultrasonic wave in the inner cavity b3, water is rushed in from the water permeable net b41 at the lower end of the placing frame b1 to enable the wafer to shake and contact with the side brush b2 to clean the side edge, the bottom of the wafer is also contacted with the bottom brush structure b4, the brush b44 on the mounting block b43 brushes the wafer, the approach of the wafer is blocked to a certain degree due to the fact that the brush b44 is long, and the rubber block b42 and the mounting block b43 on the inner side are buffered when the wafer is in close contact, so that collision is prevented.
The invention solves the problems that in the prior art, because the wafer is small and exquisite, when the wafer is put into water for edge washing, the wafer is pushed to float in the water by the action of the ultrasonic wave, so that the wafer touches the inner wall of the equipment to cause collision of the wafer, and the surface of the wafer is damaged, thereby causing the integral fault of the circuit equipment after the processing is finished and further improving the defective rate, the invention combines the components, the inner groove is provided with a placing frame, the wafers are respectively placed at the inner side of the wafer placing structure, the wafers at the inner side of the wafer placing structure are pushed by water to be cleaned and sway at the inner side during cleaning, the wafer is contacted with the side brush structure and the bottom brush structure for cleaning, and the self structures of the side brush structure and the bottom brush structure prevent the wafer from being close to the placing rack to be impacted, so that the collision among the wafers is reduced, and the damage to the surface of the wafer is reduced; the inner chamber lower extreme has set up end brush structure, the wafer takes place to rock and carries out the washing of side with the contact of side brush, the bottom also will contact with end brush structure, the brush hair on the installation piece will be scrubbed the wafer, and because the brush hair is longer with the being close to of stopping the wafer to a certain extent, and inboard rubber block will also cushion when the wafer is close to the contact with the installation piece, and the collision prevention, prevent wafer and inner wall from colliding, the damage that the wafer surface caused has been reduced, make its fault rate after the processing is accomplished reduce at the holistic of circuit equipment, and then the yield has been improved.
While there have been shown and described what are at present considered the fundamental principles and essential features of the invention and its advantages, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (6)

1. A wafer edge washing system structurally comprises casters (1), a box body (2), a control panel (3), a washing tank (4) and an upper cover (5), wherein the casters (1) are arranged at four corners of the lower end of the box body (2), the control panel (3) is arranged on the front surface of the box body (2), the washing tank (4) is embedded in the inner side of the box body (2), and the upper cover (5) is arranged at the upper end of the box body (2); the method is characterized in that:
the cleaning tank (4) comprises a edge plate (41), a cleaning box (42), an inner groove (43) and a placing frame (44), wherein the edge plate (41) is horizontally arranged at the upper end of the cleaning box (42), the inner groove (43) is arranged at the inner side of the cleaning box (42), and the placing frame (44) is arranged at the inner side of the cleaning box (42) and is positioned in the inner groove (43).
2. The wafer edge washing system of claim 1, wherein: the placing frame (44) comprises a frame (441), a bottom net (442), a partition plate (443) and a storage drawer (444), wherein the bottom net (442) is installed at the bottom of the inner side of the frame (441), the partition plate (443) is horizontally installed at the inner side of the frame (441), and the storage drawer (444) is arranged between the partition plates (443).
3. The wafer edge washing system of claim 2, wherein: the storage drawer (444) comprises a bottom plate (44a), a wafer placing structure (44b), an outer frame (44c) and a partition plate (44d), wherein the bottom plate (44a) is horizontally arranged at the lower end of the outer frame (44c), the wafer placing structure (44b) is arranged on the inner side of the outer frame (44c) and is separated by the partition plate (44d), and through holes are formed in the upper ends of the bottom plate (44a) and the outer frame (44 c).
4. The wafer edge washing system of claim 3, wherein: wafer placement structure (44b) includes rack (b1), side brush (b2), inner chamber (b3), end brush structure (b4), side brush (b2) encircle to be installed in rack (b1) inboard, rack (b1) inboard is located in inner chamber (b3), end brush structure (b4) is installed in rack (b1) inboard bottom.
5. The wafer edge washing system of claim 4, wherein: bottom brush structure (b4) including the net that permeates water (b41), block rubber (b42), installation piece (b43), brush hair (b44), block rubber (b42) fixed mounting is in the net that permeates water (b41) upper end, installation piece (b43) horizontal installation is in the net that permeates water (b41) upper end, brush hair (b44) evenly imbeds in installation piece (b43) surface.
6. The wafer edge washing system of claim 5, wherein: the rubber blocks (b42) and the mounting blocks (b43) are arranged in a plurality and are distributed at intervals, and the rubber blocks (b42) and the mounting blocks (b43) are respectively provided with a plurality of through holes communicated with the water permeable net (b 41).
CN201911334133.1A 2019-12-23 2019-12-23 Wafer edge washing system Withdrawn CN111085498A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911334133.1A CN111085498A (en) 2019-12-23 2019-12-23 Wafer edge washing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911334133.1A CN111085498A (en) 2019-12-23 2019-12-23 Wafer edge washing system

Publications (1)

Publication Number Publication Date
CN111085498A true CN111085498A (en) 2020-05-01

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CN201911334133.1A Withdrawn CN111085498A (en) 2019-12-23 2019-12-23 Wafer edge washing system

Country Status (1)

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CN (1) CN111085498A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203562410U (en) * 2013-11-26 2014-04-23 中芯国际集成电路制造(北京)有限公司 Wafer edge cleaning device
CN104658886A (en) * 2013-11-22 2015-05-27 台湾积体电路制造股份有限公司 Mechanisms for cleaning wafers
JP2016009729A (en) * 2014-06-23 2016-01-18 東京エレクトロン株式会社 Substrate liquid processing apparatus and substrate liquid processing
KR20180076157A (en) * 2016-12-27 2018-07-05 웅진에너지 주식회사 Apparatus for separating a wafer
CN109065472A (en) * 2018-07-06 2018-12-21 天长市百盛半导体科技有限公司 Auxiliary device is used in a kind of cleaning of solar battery crystalline silicon
CN110581094A (en) * 2019-08-26 2019-12-17 泉州洛江元康工业设计有限公司 Wafer processing equipment

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104658886A (en) * 2013-11-22 2015-05-27 台湾积体电路制造股份有限公司 Mechanisms for cleaning wafers
CN203562410U (en) * 2013-11-26 2014-04-23 中芯国际集成电路制造(北京)有限公司 Wafer edge cleaning device
JP2016009729A (en) * 2014-06-23 2016-01-18 東京エレクトロン株式会社 Substrate liquid processing apparatus and substrate liquid processing
KR20180076157A (en) * 2016-12-27 2018-07-05 웅진에너지 주식회사 Apparatus for separating a wafer
CN109065472A (en) * 2018-07-06 2018-12-21 天长市百盛半导体科技有限公司 Auxiliary device is used in a kind of cleaning of solar battery crystalline silicon
CN110581094A (en) * 2019-08-26 2019-12-17 泉州洛江元康工业设计有限公司 Wafer processing equipment

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Application publication date: 20200501

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