CN111081590B - Scheduling method, scheduling device and scheduling system of semiconductor equipment - Google Patents
Scheduling method, scheduling device and scheduling system of semiconductor equipment Download PDFInfo
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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Abstract
The invention provides a scheduling method, a scheduling device and a scheduling system of semiconductor equipment, belongs to the technical field of semiconductor equipment, and can at least partially solve the problem that the calculation of a transmission action sequence of a wafer in the conventional semiconductor equipment fails. When the last wafer in the previous task is transmitted to the first functional module, the distribution state of the wafers in each functional module related to the previous task is acquired; judging whether the distribution state of the wafer in each functional module accords with an auxiliary detection condition parameter table, wherein the auxiliary detection condition parameter table specifies the distribution state of the wafer in each functional module related to stable transmission of a previous task; and if the distribution state of the wafers in the functional module related to the previous task is consistent with the auxiliary detection condition parameter table, starting the calculation of the transmission action sequence of the first wafer of the next task.
Description
Technical Field
The invention belongs to the technical field of semiconductor equipment, and particularly relates to a scheduling method of semiconductor equipment, a scheduling device of the semiconductor equipment and a semiconductor equipment system.
Background
Fig. 1 shows a conventional semiconductor device, which has the following operation flow:
the atmospheric robot ATR takes one wafer w out of a cassette (one of the first cassette LP1, the second cassette LP2, and the third cassette LP 3) and transfers the wafer w to a pre-evacuation chamber (also called LoadLock chamber, i.e., the first pre-evacuation chamber LA or the second pre-evacuation chamber LB in fig. 1). Thereafter, a vacuum robot VTR (having a first arm a and a second arm B) located in the vacuum transfer chamber TC takes the wafer w out of the pre-vacuuming chamber and transfers the wafer w to a plurality of process chambers (a first process chamber CH1, a second process chamber CH2, a third process chamber CH3, a fourth process chamber CH4, and a fifth process chamber CH5 in fig. 1) according to a process flow for processing. After the wafer w is processed in the process chamber, the vacuum robot VTR takes the wafer w out of the last process chamber and transfers the wafer w to a pre-vacuuming chamber. The atmospheric robot ATR then extracts the wafer w from the pre-evacuation chamber and transfers it into a cassette. At this point, the processing of the wafer w is completed.
The semiconductor equipment will typically be responsible for performing a plurality of tasks in sequence, wherein each task is for processing at least one wafer w as described above. The paths traveled by different wafers w in each task may be the same or different. The scheduling device is responsible for calculating the transmission action sequence of each wafer w (i.e. how each wafer w moves, and at what time). To improve throughput, the dispatching device typically initiates the calculation of the sequence of the transfer operations for the first wafer w of the previous job after the last wafer w of the previous job is removed from the cassette by the atmospheric robot ATR and transferred to a pre-evacuation chamber (this dispatching method is also referred to as pipe mode).
In the prior art, the calculation of the transmission action sequence of the first wafer w of the next task does not consider the state of each wafer w in the current previous task (which greatly increases the calculation amount), which results in the risk of blocking: for example, the wafer w being processed or transferred in the previous task and the first wafer w in the subsequent task occupy the same pre-vacuum chamber at the same time. This results in a failure to calculate the transfer operation sequence of the first wafer w of the subsequent task, and certainly, the first wafer w of the subsequent task cannot be transferred.
Disclosure of Invention
The invention at least partially solves the problem that the conventional scheduling device of the semiconductor equipment has a blocking risk when scheduling a plurality of tasks, and provides a scheduling method of the semiconductor equipment, a scheduling device of the semiconductor equipment and a semiconductor equipment system.
According to a first aspect of the present invention, there is provided a scheduling method for a semiconductor device, the semiconductor device including a plurality of functional modules, the scheduling method being configured to schedule a plurality of tasks, each task being configured to take out at least one wafer from a cassette, sequentially transfer the at least one wafer to the plurality of functional modules, and then transfer the at least one wafer into the cassette, the scheduling method including:
when the last wafer in the previous task is transmitted to the first functional module, the distribution state of the wafers in each functional module related to the previous task is obtained;
judging whether the distribution state of the wafer in each functional module accords with an auxiliary detection condition parameter table, wherein the auxiliary detection condition parameter table specifies the distribution state of the wafer in each functional module related to stable transmission of a previous task;
and if the distribution state of the wafers in the functional module related to the previous task is consistent with the auxiliary detection condition parameter table, starting the calculation of the transmission action sequence of the first wafer of the next task.
Optionally, after the calculation of the transmission action sequence of the first wafer of the subsequent task, the scheduling method further includes: and taking out the first wafer of the latter task from the crystal box and transmitting the first wafer to one functional module.
Optionally, the distribution status of the wafers in the functional module related to the previous task includes: whether there is a wafer in each functional module involved in the previous task.
Optionally, the scheduling method further includes: if the distribution state of the wafers in the functional module related to the previous task is inconsistent with the auxiliary detection condition parameter table, the calculation of the transmission action sequence of the first wafer of the next task is not started, and after the next transmission action is finished, the distribution state of the wafers in each functional module related to the previous task is obtained again and whether the distribution state of the wafers in the functional modules accords with the auxiliary detection condition parameter table or not is judged until the distribution state of the wafers in the functional modules related to the previous task is consistent with the auxiliary detection condition parameter table.
Optionally, before the last wafer in the previous task is transmitted to the first functional module, the scheduling method further includes a step of creating the auxiliary inspection condition parameter table, which includes:
acquiring a dynamic stable transmission action sequence of a previous task;
and determining the distribution state of the wafers in each functional module when all the transmission actions are finished before the last wafer in the previous task in the dynamic stable transmission action sequence is taken out from the crystal box, and taking the distribution state as the item content of the auxiliary detection condition parameter table.
According to a second aspect of the present invention, there is provided a scheduling apparatus for a semiconductor device, the semiconductor device including a plurality of functional modules, the scheduling apparatus being configured to schedule a plurality of tasks, each task being configured to take out at least one wafer from a cassette and transfer the wafer into the cassette after being sequentially transferred to the plurality of functional modules, the scheduling apparatus comprising:
the first acquisition module is used for acquiring first state information of the last wafer in the previous task, which is transmitted to the first functional module, and sending the first state information to the second acquisition module;
the second acquisition module is used for acquiring the distribution state of the wafers in each functional module related to the previous task when the first state information is received;
a judging module, configured to judge whether a distribution state of a wafer in each of the functional modules involved in a previous task meets an auxiliary detection condition parameter table, where the auxiliary detection condition parameter table specifies the distribution state of the wafer in each of the functional modules involved in stable transmission of the previous task, and if yes, output the start signal to the computing module;
and the calculation module is used for starting the transmission action sequence of the first wafer of the task after calculation under the condition of receiving the starting signal.
Optionally, the scheduling apparatus further includes an execution module, configured to take out a first wafer of a subsequent task from the cassette according to a calculation result of the calculation module and transmit the first wafer to one of the function modules.
Optionally, the scheduling apparatus further includes a parameter table generating module, configured to obtain a dynamic stable transmission action sequence of a previous task, determine a distribution state of the wafers in each functional module when all transmission actions before a last wafer in the previous task in the dynamic stable transmission action sequence is taken out from the cassette are completed, and use the distribution state as the item content of the auxiliary detection condition parameter table.
According to a third aspect of the present invention, there is provided a semiconductor equipment system, comprising the scheduling apparatus for a semiconductor equipment according to the second aspect of the present invention, and further comprising a semiconductor equipment, wherein the semiconductor equipment comprises a plurality of functional modules, and the scheduling apparatus is configured to schedule a plurality of tasks, wherein each task is used for taking out at least one wafer from a cassette, sequentially transferring the wafer to a plurality of the functional modules, and then transferring the wafer into the cassette.
Optionally, the functional module comprises a pre-evacuation chamber and a process chamber.
According to the scheduling method provided by the invention, when the last wafer in the previous task is transmitted to the first functional module, the calculation of the transmission action sequence of the first wafer in the next task is not started immediately, but whether the distribution state of the wafer in the functional module related to the previous task is consistent with the auxiliary detection condition parameter table or not is judged, and the calculation of the transmission action sequence of the first wafer in the next task is started only under the condition that the distribution state of the wafer in the functional module related to the previous task is consistent with the auxiliary detection condition parameter table. Thus, on the one hand, the amount of calculation required for this determination step is small, and on the other hand, the risk of clogging can be reduced.
Drawings
FIG. 1 is a schematic diagram of a conventional semiconductor device;
fig. 2 is a flowchart of a scheduling method of a semiconductor device according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of an exemplary dynamic steady state transmission sequence;
FIG. 4 is a diagram illustrating the distribution of wafers during a failure in the calculation of the transmission sequence;
fig. 5 is a block diagram of a scheduling apparatus of a semiconductor device according to an embodiment of the present invention;
wherein the reference numerals are: LP1, first cassette; LP2, second cassette; LP3, third cassette; ATR, atmospheric mechanical arm; LA, a first pre-evacuation chamber; LB, a second pre-vacuum chamber; A. a first arm; B. a second arm; CH1, a first process chamber; CH2, a second process chamber; CH3, third process chamber; CH4, fourth process chamber; CH5, fifth process chamber; TC, vacuum transmission chamber; VTR, vacuum manipulator; 1. a first acquisition module; 2. a second acquisition module; 3. a judgment module; 4. a calculation module; 5. an execution module; w, wafer.
Detailed Description
In order to make the technical solutions of the present invention better understood, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Example 1:
the present embodiment provides a scheduling method for a semiconductor device, the semiconductor device includes a plurality of functional modules, and the scheduling method is configured to schedule a plurality of tasks, where each task is used to take out at least one wafer w from a cassette, sequentially transfer the wafer w to the functional modules, and then transfer the wafer w into the cassette.
The functional module is, for example, a pre-vacuum chamber or a process chamber for performing deposition, etching, and the like on the wafer w.
The semiconductor equipment is used to perform a plurality of tasks, each task being for processing at least one wafer w. One of the tasks is to take out 1 wafer w from the second pod LP2 in sequence, transfer the wafer w into the first pre-vacuum chamber LA, transfer the wafer w into the first process chamber CH1, the third process chamber CH3, the fifth process chamber CH5 in sequence, transfer the wafer w into the second pre-vacuum chamber LA, and transfer the wafer w into the second pod LP 2. Of course, each task may be processing a plurality of wafers w, and the path taken by the wafer w in the task and the task may be different.
Referring to fig. 2, the scheduling method includes the following steps:
the first step is as follows: when the last wafer w in the previous task is transmitted to the first functional module, the distribution state of the wafers w in the functional modules involved in the previous task is obtained.
The distribution state of the wafer w in the functional module related to the previous task includes, for example: whether there is a wafer w in each functional module involved in the previous task. Of course, the distribution status may also include the processing status of each wafer w currently located in the process chamber, for example, the wafer w currently in a certain process chamber just completes the processing process in the process chamber.
The second step is that: and judging whether the distribution state of the wafer w in each functional module accords with an auxiliary detection condition parameter table, wherein the auxiliary detection condition parameter table specifies the distribution state of the wafer w in each functional module related to stable transmission of the previous task.
The auxiliary detection condition parameter table is a list generated according to the dynamic stable transmission action sequence of the previous task. Of course, the auxiliary detection condition parameter list may be generated by further referring to the dynamic stable transmission action of the latter task.
According to the dynamic stable transmission action sequence of the previous task, it can be analyzed that the first wafer w of the next task is transmitted into the first functional module after the action of the dynamic stable transmission sequence is started, so that the first functional module is not blocked with the currently-performed process. The list lists the states of the wafer w in the functional module related to the previous task, such as the presence of the wafer w in the functional module, the absence of the wafer w, or the process state of the wafer w in the functional module.
The third step: and if the distribution state of the wafer w in the functional module related to the previous task is consistent with the auxiliary detection condition parameter table, starting the calculation of the transmission action sequence of the first wafer w of the next task.
Since the distribution state of the wafers w in the functional module related to the previous task is consistent with the auxiliary detection condition parameter table, it means that if the first wafer w of the next task is currently transferred into the first functional module, the first wafer w will not be blocked by the wafer w of the previous task that has not been processed yet. The sequence of transfer actions for the first wafer w of a task after this actual computation can greatly reduce the risk of computation failure.
Optionally, after the calculation of the transmission action sequence of the first wafer w of the subsequent task is started, the scheduling method further includes: and taking out the first wafer w of the latter task from the crystal box and transmitting the wafer w to a functional module.
Since the risk of the calculation failure is greatly reduced, the first wafer w of the next task can be transmitted according to the calculation result after the calculation is completed. Specifically, the first wafer w of the latter task is taken out from the cassette and transferred to the corresponding first functional module (for example, the first pre-vacuum chamber LA or the second pre-vacuum chamber LA in fig. 1).
It should be noted that, before the second step or in real time, the scheduling method may further include determining whether the functional module involved in the previous task or both of the previous and next tasks has no wafer w. Of course, if there is no wafer w in any of these functional modules, the calculation of the transmission action sequence of the first wafer w that starts the next task at this time will not be affected by the previous task, and whether the calculation is successful or not is independent of the previous task.
Optionally, the scheduling method further includes: if the distribution state of the wafer w in the functional module related to the previous task is inconsistent with the auxiliary detection condition parameter table, the calculation of the transmission action sequence of the first wafer w of the next task is not started, and after the next transmission action is completed, the distribution state of the wafer w in each functional module related to the previous task is obtained again and whether the distribution state of the wafer w in the functional module accords with the auxiliary detection condition parameter table is judged until the distribution state of the wafer w in the functional module related to the previous task is consistent with the auxiliary detection condition parameter table.
That is, if the distribution loading pre-aided detection condition parameter table of the wafer w in the functional module related to the previous task in the second step is not consistent, the first step and the second step are repeatedly executed until the two are consistent.
Optionally, before the last wafer w in the previous task is transmitted to the first functional module, the scheduling method further includes a step of establishing an auxiliary inspection condition parameter table, which includes:
acquiring a dynamic stable transmission action sequence of a previous task;
and determining the distribution state of the wafers w in each functional module when all the transmission actions are finished before the last wafer w in the previous task in the dynamic stable transmission action sequence is taken out from the crystal box, and taking the distribution state as the item content of the auxiliary detection condition parameter table.
A semiconductor device such as that shown in fig. 1 needs to perform two tasks. The first task is to take 3 wafers w out of the first cassette LP1 in sequence, transfer the wafers w to the first pre-vacuum chamber LA, pass through the fifth process chamber CH5, the first process chamber CH1, and the second pre-vacuum chamber LA in sequence, and finally transfer the wafers w back to the first cassette LP 1. The second task then is to take 2 wafers w out of the first cassette LP1 and transport them to the first pre-evacuation chamber LA and finally back to the first cassette LP1 after passing through the fifth process chamber CH5, the first process chamber CH1, and the second pre-evacuation chamber LA in sequence.
The numbers attached to each wafer w in fig. 3 and 4 indicate the state of the wafer w in the current functional module. Wherein 0 indicates that the wafer w in the currently located functional module has not started to be processed, 1 indicates that the wafer w in the currently located functional module is being processed, and 2 indicates that the wafer w in the currently located functional module has completed processing and is waiting to be transferred away from the functional module.
Fig. 3 shows a state in the dynamic steady transfer action sequence of the first task. The transfer of the wafer w to occur is in turn:
from the first process chamber CH1 (in which the wafer w has completed processing in the first process chamber CH 1) to the second pre-evacuation chamber LA, from which it is then transferred by the atmospheric robot ATR to the first pod LP1, which is labeled with (r) in fig. 3;
from the fifth process chamber CH5 (in which the wafer w has completed processing in the fifth process chamber CH5 waiting for a subsequent process) to the first process chamber CH1, and then from the first pre-evacuation chamber LA (in which the wafer w waits for a subsequent process chamber) to the fifth process chamber CH5, this part of the action is labeled in fig. 3 with (c);
the wafer w in the first pod LP1 is transferred to the first pre-vacuum chamber LA by the atmospheric robot ATR, which is denoted by symbol (c) in fig. 3.
If the calculation of the transfer sequence of the first wafer w of the subsequent job is triggered immediately after the last wafer w of the previous job is transferred from the first pod LP1 to the first pre-vacuum chamber LA according to the prior art, there is a risk of calculation failure if the calculation is under consideration of reducing the calculation amount without considering the state of the wafer w in each functional module at present.
FIG. 4 shows the state of the wafer w in each functional block with a failed calculation. The wafer w in the first process chamber CH1 has completed all processes and is waiting to be transferred into the second pre-evacuated chamber LA. The wafer w in the first pre-vacuum chamber LA waits to be transferred away, and the wafer w in the fifth process chamber CH5 has not yet started the process therein. If the dispatching device desires the semiconductor equipment to transfer the first wafer w for the second task to the first pre-evacuation chamber LA at this time, it finds that this action cannot be performed because the first pre-evacuation chamber LA is occupied by the wafer w.
Analyzing the dynamic stable transmission action sequence of the previous task to know that: when all the transmission actions before the last wafer w in the previous task is taken out from the cassette are completed, the last wafer w in the previous task is about to be taken out from the first pre-vacuum chamber LA, and at this time, the calculation of the transmission action sequence of the first wafer w in the next task is performed, so that at least the first wafer w can be taken out firstly. Then, the distribution state of the wafers w in each functional module at this time can be used as a basis for determining whether to take the first wafer w of the subsequent task, that is, a basis for calculating the transmission action sequence of the first wafer w of the subsequent task. In the above specific example, the auxiliary detection condition parameter table can be obtained as follows:
| function module name | Distribution state of wafer w |
| First pre-evacuated chamber LA | Is free of |
| The fifth process chamber CH5 | Is provided with |
| The first process chamber CH1 | Is provided with |
In this way, in the above-mentioned interpretation step, as long as the last wafer w of the previous task is found to have been placed in the first pre-vacuum chamber LA, the real-time detection of the states of the three functional modules is started, and as long as the bodies of the three functional modules conform to the table, the calculation of the transmission sequence of the first wafer w of the next task is started. The probability of successful calculation is improved.
Of course, based on the above idea, those skilled in the art can also make more complicated determination condition settings for the case where the paths of the wafers w in the previous task and the next task are different.
Example 2:
the present embodiment provides a scheduling apparatus of a semiconductor device for performing the method provided in embodiment 1. The semiconductor equipment comprises a plurality of functional modules, and the scheduling device is used for scheduling a plurality of tasks, wherein each task is used for taking out at least one wafer from the crystal box, sequentially transmitting the wafer to the functional modules and then inputting the wafer into the crystal box. As shown in fig. 5, the scheduling apparatus includes:
the system comprises a first acquisition module 1, a second acquisition module and a third acquisition module, wherein the first acquisition module is used for acquiring first state information of a last wafer transmitted to a first functional module in a previous task and sending the first state information to the second acquisition module;
the second obtaining module 2 is configured to obtain, when the first state information is received, a distribution state of the wafer in each function module related to a previous task;
the judging module 3 is used for judging whether the distribution state of the wafers in the functional modules related to the previous task accords with an auxiliary detection condition parameter table, wherein the auxiliary detection condition parameter table specifies the distribution state of the wafers in the functional modules related to the stable transmission of the previous task, and if so, a starting signal is output to the calculating module 4;
and the calculation module 4 is configured to start the transmission action sequence of the first wafer of the subsequent task under the condition that the start signal is received.
Optionally, the dispatching device further includes an execution module 5, configured to take out the first wafer of the latter task from the pod and transmit the first wafer to one of the functional modules according to the calculation result of the calculation module 4.
Optionally, the distribution status of the wafers in the functional module involved in the previous task includes: whether there is a wafer in the functional module involved in the previous task.
Optionally, the scheduling apparatus further includes a parameter table generating module, configured to obtain a dynamic stable transmission action sequence of a previous task, determine a distribution state of the wafers in each functional module when all transmission actions before a last wafer in the previous task in the dynamic stable transmission action sequence is taken out from the cassette are completed, and use the distribution state as an item content of the auxiliary detection condition parameter table.
Example 3:
this embodiment provides a semiconductor device system, which includes the scheduling apparatus for a semiconductor device provided in embodiment 2 of the present invention, and further includes a semiconductor device, where the semiconductor device includes a plurality of function modules, and the scheduling apparatus is configured to schedule a plurality of tasks, where each task is used to take out at least one wafer from a cassette, sequentially transfer the wafer to the function modules, and then transfer the wafer into the cassette.
Optionally, the functional modules include a pre-evacuation chamber and a process chamber, and each task is used to take out at least one wafer from the cassette, sequentially transfer the wafer to a plurality of functional modules, and then transfer the wafer into the cassette, including: each task is used for taking out at least one wafer from the crystal box and sequentially transmitting the wafer to the pre-vacuumizing chamber, the at least one process chamber and the pre-vacuumizing chamber and then transmitting the wafer into the crystal box.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (7)
1. A scheduling method of a semiconductor device, the semiconductor device comprising a plurality of functional modules, the scheduling method being used for scheduling a plurality of tasks, wherein each task is used for taking out at least one wafer from a cassette, sequentially transmitting the wafer to a plurality of the functional modules and then inputting the wafer into the cassette, the scheduling method comprising:
when the last wafer in the previous task is transmitted to the first functional module, the distribution state of the wafers in each functional module related to the previous task is obtained;
judging whether the distribution state of the wafer in each functional module accords with an auxiliary detection condition parameter table, wherein the auxiliary detection condition parameter table specifies the distribution state of the wafer in each functional module related to stable transmission of a previous task;
if the distribution state of the wafers in the functional module related to the previous task is consistent with the auxiliary detection condition parameter table, starting the calculation of the transmission action sequence of the first wafer of the next task;
before the last wafer in the previous task is transmitted to the first functional module, the scheduling method further includes the step of establishing the auxiliary detection condition parameter table, which includes:
acquiring a dynamic stable transmission action sequence of a previous task;
and determining the distribution state of the wafers in each functional module when all the transmission actions are finished before the last wafer in the previous task in the dynamic stable transmission action sequence is taken out from the crystal box, and taking the distribution state as the item content of the auxiliary detection condition parameter table.
2. The method of claim 1, wherein after the calculating of the transmission sequence of the first wafer of the task after the starting, the method further comprises: and taking out the first wafer of the latter task from the crystal box and transmitting the first wafer to one functional module.
3. The scheduling method of claim 1, further comprising: if the distribution state of the wafers in the functional module related to the previous task is inconsistent with the auxiliary detection condition parameter table, the calculation of the transmission action sequence of the first wafer of the next task is not started, and after the next transmission action is finished, the distribution state of the wafers in the functional modules related to the previous task is obtained again and whether the distribution state of the wafers in the functional modules accords with the auxiliary detection condition parameter table or not is judged until the distribution state of the wafers in the functional modules related to the previous task is consistent with the auxiliary detection condition parameter table.
4. A scheduling device of a semiconductor device, the semiconductor device comprising a plurality of functional modules, the scheduling device being configured to schedule a plurality of tasks, wherein each task is configured to take out at least one wafer from a cassette, sequentially transfer the wafer to a plurality of the functional modules, and then transfer the wafer into the cassette, the scheduling device comprising:
the first acquisition module is used for acquiring first state information of the last wafer in the previous task, which is transmitted to the first functional module, and sending the first state information to the second acquisition module;
the second acquisition module is used for acquiring the distribution state of the wafers in each functional module related to the previous task when the first state information is received;
the judging module is used for judging whether the distribution state of the wafers in each functional module related to the previous task meets an auxiliary detection condition parameter table, wherein the auxiliary detection condition parameter table specifies the distribution state of the wafers in each functional module related to the stable transmission of the previous task, and if so, a starting signal is output to the calculating module;
the calculation module is used for starting a transmission action sequence of a first wafer of a task after calculation under the condition of receiving the starting signal;
the scheduling device further comprises a parameter table generating module for acquiring a dynamic stable transmission action sequence of a previous task, determining a distribution state of the wafers in each functional module when all transmission actions before a last wafer in the previous task in the dynamic stable transmission action sequence is taken out from the wafer box are completed, and taking the distribution state as the item content of the auxiliary detection condition parameter table.
5. The dispatching device as recited in claim 4, further comprising an execution module for taking out a first wafer of a subsequent task from the pod and transferring the first wafer to one of the functional modules according to the calculation result of the calculation module.
6. A semiconductor equipment system comprising the scheduling apparatus of a semiconductor equipment according to any one of claims 4 to 5, and further comprising a semiconductor equipment comprising a plurality of functional modules, wherein the scheduling apparatus is configured to schedule a plurality of tasks, wherein each task is configured to take at least one wafer out of a cassette and transfer the wafer into the cassette after transferring the wafer into the functional modules.
7. The semiconductor equipment system of claim 6, wherein the functional modules comprise a pre-evacuation chamber and a process chamber.
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