CN111074312A - Local electroplating process for bus terminal of inverter - Google Patents
Local electroplating process for bus terminal of inverter Download PDFInfo
- Publication number
- CN111074312A CN111074312A CN201911321304.7A CN201911321304A CN111074312A CN 111074312 A CN111074312 A CN 111074312A CN 201911321304 A CN201911321304 A CN 201911321304A CN 111074312 A CN111074312 A CN 111074312A
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- Prior art keywords
- bus terminal
- temperature
- washing
- plating
- solution
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
- C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
Abstract
The invention discloses a local electroplating process of an inverter bus terminal, which comprises the following steps: the preparation of the silica gel sleeve, pretreatment, copper cyanide, nickel electroplating, silver plating and post-treatment. The invention provides a local electroplating process of an inverter bus terminal, which effectively realizes local protection of the terminal, ensures the feasibility of the local electroplating process, optimizes the process flow and improves the uniformity and corrosion resistance of a plating layer.
Description
Technical Field
The invention relates to the field of silica gel, in particular to a local electroplating process of an inverter bus terminal.
Background
In the electroplating process of automobile parts, some terminals (power inverter bus bar terminals) need to be subjected to electroplating treatment, and due to the fact that the terminals are structurally provided with contact terminals, riveting operation is needed when the terminals are used, if the terminals are subjected to integral electroplating, a plating layer exists on the surfaces of the terminals, so that the terminal parts are thickened, and the plating layer is cracked during riveting, so that the whole terminals are scrapped.
At present, the most common method is to carry out complete electroplating and then carry out deplating treatment, which undoubtedly increases the electroplating process, but also is difficult to ensure the deplating thoroughness, some manufacturers can carry out local electroplating by adopting a masking tape and a spraying mode, however, for a power inverter terminal, the position needing masking is in a step mode, so that the conventional masking mode has the risk of electroplating solution leakage, the feasibility of local electroplating cannot be ensured, in addition, the existing electroplating process is incomplete, the uniformity and the glossiness of the appearance of a plating layer are low, the porosity of the plating layer is large, and spot corrosion is easy to occur, so that large-scale terminal corrosion is caused.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a local electroplating process of an inverter bus terminal, which effectively realizes local protection of the terminal, ensures the feasibility of the local electroplating process, optimizes the process flow and improves the uniformity and corrosion resistance of a plating layer.
In order to achieve the purpose, the invention provides the following technical scheme:
a local electroplating process for a bus terminal of an inverter comprises the following steps:
a. preparing a silica gel sleeve: sequentially adding methyl vinyl silicone rubber, silicon dioxide, high-hydroxyl silicone oil and metal stearate into an open mill for mixing, and then pressing the mixed silicone rubber material into a mold to form a silicone rubber sleeve;
b. pretreatment: carrying out oil removal and degreasing operation on the surface of a bus terminal to be processed;
c. copper cyanide: carrying out copper cyanide operation on the pretreated bus terminal, wherein a copper cyanide solution is adopted: potassium cyanide: 15-30g/l, cuprous cyanide: 40-60g/l, controlling the temperature at 50-60 ℃, the time at 2-4min, the current density at 1-2ASD, and then washing with normal temperature water;
d. electroplating nickel: sleeving the silica gel sleeve prepared in the step a at the riveting position of the bus terminal, and carrying out nickel plating operation on the rest parts, wherein the plating solution is Ni2 +: 50-80g/l, boric acid: 30-50g/l, nickel chloride: 10-20g/l, the pH value of the plating solution is 4.0-4.8, and the temperature is 50-65 ℃; the current density is 1-2 ASD; then washing with water at normal temperature;
e. silver plating: and (3) carrying out silver plating operation after nickel plating is finished, wherein the solution is as follows: ag +: 7-15g/l, KCN: 90-120g/l, the current density is 0.5-1ASD, the temperature is 28-32 ℃, and then the washing is carried out at normal temperature;
f. and (3) post-treatment: and (4) removing the silica gel sleeve after the silver plating is finished, and then drying to obtain a finished product.
Preferably, the percentage ratio of the methyl vinyl silicone rubber, the silicon dioxide, the high hydroxyl silicone oil and the metal stearate in the step a is as follows: 65-70% of vinyl silicone rubber, 25-33% of silicon dioxide, 1-3% of high hydroxyl silicone oil and 0.1-0.5% of metal stearate.
Preferably, the pretreatment step in the step b is specifically;
b1, cleaning and degreasing the bus terminal by adopting ultrasonic waves, wherein the ultrasonic cleaning solution uses surfactant emulsion, the temperature of the solution is 80 ℃, and the time is 5 min;
b2, first water washing: cleaning the deoiled bus terminal by using normal-temperature water, and removing ultrasonic cleaning solution on the surface;
b3, electrolytic degreasing: adding the bus terminal into an electrolytic degreasing agent for electrolytic degreasing, controlling the electrolytic degreasing temperature to be 50-60 ℃, the time to be 2-3 min and the current density to be 1-2ASD, and then washing to further remove dust and grease on the surface;
b4, second water washing: cleaning the bus terminal subjected to electrolytic degreasing by using normal-temperature water to remove electrolyte on the surface;
b5, activation: and (3) carrying out activation treatment on the bus terminal by adopting NiCl2, wherein the activation current is 35-45A, the activation time is 10-30s, and washing with water after activation.
Preferably, the drying temperature in the step f is 250-300 ℃.
Compared with the prior art, the local electroplating process for the bus terminal of the inverter disclosed by the invention has the advantages that the local protection performance is ensured by preparing the silica gel sleeve, the process flow is optimized, and the uniformity and the corrosion resistance of a plating layer are improved.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the specific contents.
The invention discloses a local electroplating process of an inverter bus terminal, which specifically comprises the following steps:
a. preparing a silica gel sleeve: sequentially adding methyl vinyl silicone rubber, silicon dioxide, high-hydroxyl silicone oil and metal stearate into an open mill according to a certain percentage, starting the open mill, adjusting the speed ratio of a roller of the open mill to be 1.2-1.3, introducing cooling water with the temperature of 30-40 ℃ into the roller after a fast roller, and mixing, wherein the roller distance is 1-2 mm at the initial stage of mixing, 2-4 mm at the middle stage of mixing, 4-5 mm at the later stage of mixing, and the mixing time is 20-40 min; then pressing the mixed silica gel material into a mould to form a silica gel sleeve;
b. pretreatment: the operation of removing oil and degreasing the surface of the bus terminal to be processed specifically comprises the following steps:
b1, cleaning and degreasing the bus terminal by adopting ultrasonic waves, wherein the ultrasonic cleaning solution uses surfactant emulsion, the temperature of the solution is 80 ℃, and the time is 5 min;
b2, first water washing: cleaning the deoiled bus terminal by using normal-temperature water, and removing ultrasonic cleaning solution on the surface;
b3, electrolytic degreasing: adding the bus terminal into an electrolytic degreasing agent for electrolytic degreasing, controlling the electrolytic degreasing temperature to be 50-60 ℃, the time to be 2-3 min and the current density to be 1-2ASD, and then washing to further remove dust and grease on the surface;
b4, second water washing: cleaning the bus terminal subjected to electrolytic degreasing by using normal-temperature water to remove electrolyte on the surface;
b5, activation: and (3) carrying out activation treatment on the bus terminal by adopting NiCl2, wherein the activation current is 35-45A, and washing with water after activation.
c. Copper cyanide: carrying out copper cyanide operation on the pretreated bus terminal, wherein a copper cyanide solution is adopted: potassium cyanide: 15-30g/l, cuprous cyanide: 40-60g/l, controlling the temperature at 50-60 ℃, the time at 2-4min, the current density at 1-2ASD, and then washing with normal temperature water;
d. electroplating nickel: sleeving the silica gel sleeve prepared in the step a at the riveting position of the bus terminal, and carrying out nickel plating operation on the rest parts, wherein the plating solution is Ni2 +: 50-80g/l, boric acid: 30-50g/l, nickel chloride: 10-20g/l, the pH value of the plating solution is 4.0-4.8, and the temperature is 50-65 ℃; the current density is 1-2 ASD; then washing with water at normal temperature;
e. silver plating: and (3) carrying out silver plating operation after nickel plating is finished, wherein the solution is as follows: ag +: 7-15g/l, KCN: 90-120g/l, the current density is 0.5-1ASD, the temperature is 28-32 ℃, and then the washing is carried out at normal temperature;
f. and (3) post-treatment: and (4) removing the silica gel sleeve after the silver plating is finished, and then performing drying operation, wherein the drying temperature is controlled to be 250-300 ℃ to obtain a finished product.
The percentage ratio of the methyl vinyl silicone rubber, the silicon dioxide, the high hydroxyl silicone oil and the metal stearate in the step a is as follows: 65-70% of vinyl silicone rubber, 25-33% of silicon dioxide, 1-3% of high hydroxyl silicone oil and 0.1-0.5% of metal stearate.
Therefore, the scope of the present invention should not be limited to the disclosure of the embodiments, but includes various alternatives and modifications without departing from the scope of the present invention, which is defined by the claims of the present patent application.
Claims (4)
1. A local electroplating process for a bus terminal of an inverter is characterized by comprising the following steps:
a. preparing a silica gel sleeve: sequentially adding methyl vinyl silicone rubber, silicon dioxide, high-hydroxyl silicone oil and metal stearate into an open mill for mixing, and then pressing the mixed silicone rubber material into a mold to form a silicone rubber sleeve;
b. pretreatment: carrying out oil removal and degreasing operation on the surface of a bus terminal to be processed;
c. copper cyanide: carrying out copper cyanide operation on the pretreated bus terminal, wherein a copper cyanide solution is adopted: potassium cyanide: 15-30g/l, cuprous cyanide: 40-60g/l, controlling the temperature at 50-60 ℃, the time at 2-4min, the current density at 1-2ASD, and then washing with normal temperature water;
d. electroplating nickel: sleeving the silica gel sleeve prepared in the step a at the riveting position of the bus terminal, and carrying out nickel plating operation on the rest parts, wherein the plating solution is Ni2 +: 50-80g/l, boric acid: 30-50g/l, nickel chloride: 10-20g/l, the pH value of the plating solution is 4.0-4.8, and the temperature is 50-65 ℃; the current density is 1-2 ASD; then washing with water at normal temperature;
e. silver plating: and (3) carrying out silver plating operation after nickel plating is finished, wherein the solution is as follows: ag +: 7-15g/l, KCN: 90-120g/l, the current density is 0.5-1ASD, the temperature is 28-32 ℃, and then the washing is carried out at normal temperature;
f. and (3) post-treatment: and (4) removing the silica gel sleeve after the silver plating is finished, and then drying to obtain a finished product.
2. The partial plating process of the inverter bus bar terminal according to claim 1, characterized in that: the percentage ratio of the methyl vinyl silicone rubber, the silicon dioxide, the high hydroxyl silicone oil and the metal stearate in the step a is as follows: 65-70% of vinyl silicone rubber, 25-33% of silicon dioxide, 1-3% of high hydroxyl silicone oil and 0.1-0.5% of metal stearate.
3. The partial plating process of the inverter bus bar terminal according to claim 1, characterized in that: the pretreatment step in the step b is specifically as follows:
b1, cleaning and degreasing the bus terminal by adopting ultrasonic waves, wherein the ultrasonic cleaning solution uses surfactant emulsion, the temperature of the solution is 80 ℃, and the time is 5 min;
b2, first water washing: cleaning the deoiled bus terminal by using normal-temperature water, and removing ultrasonic cleaning solution on the surface;
b3, electrolytic degreasing: adding the bus terminal into an electrolytic degreasing agent for electrolytic degreasing, controlling the electrolytic degreasing temperature to be 50-60 ℃, the time to be 2-3 min and the current density to be 1-2ASD, and then washing to further remove dust and grease on the surface;
b4, second water washing: cleaning the bus terminal subjected to electrolytic degreasing by using normal-temperature water to remove electrolyte on the surface;
b5, activation: and (3) carrying out activation treatment on the bus terminal by adopting NiCl2, wherein the activation current is 35-45A, the activation time is 10-30s, and washing with water after activation.
4. The partial plating process of the inverter bus bar terminal according to claim 1, characterized in that: the drying temperature in the step f is 100-140 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911321304.7A CN111074312A (en) | 2019-12-20 | 2019-12-20 | Local electroplating process for bus terminal of inverter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911321304.7A CN111074312A (en) | 2019-12-20 | 2019-12-20 | Local electroplating process for bus terminal of inverter |
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| Publication Number | Publication Date |
|---|---|
| CN111074312A true CN111074312A (en) | 2020-04-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911321304.7A Pending CN111074312A (en) | 2019-12-20 | 2019-12-20 | Local electroplating process for bus terminal of inverter |
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| Country | Link |
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| CN (1) | CN111074312A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111676495A (en) * | 2020-05-19 | 2020-09-18 | 安费诺精密连接器(深圳)有限公司 | Local electroplating method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103013128A (en) * | 2012-10-09 | 2013-04-03 | 一致有限公司 | Material of high temperature resistant silica gel product and manufacturing method |
| CN104137345A (en) * | 2013-02-22 | 2014-11-05 | 古河电气工业株式会社 | Terminal, wiring connection structure, and method for manufacturing terminal |
| CN104788963A (en) * | 2014-05-30 | 2015-07-22 | 安徽天彩电缆集团有限公司 | Preparation process for silicone rubber cable sheath used for urban rails |
| CN105505292A (en) * | 2016-01-07 | 2016-04-20 | 东莞市日源盛橡胶绝缘制品有限公司 | Vulcanized silicone rubber formula and preparing technology thereof |
| CN106366666A (en) * | 2016-06-29 | 2017-02-01 | 泰州市天晟制冷科技有限公司 | Preparation method of mixed gel |
-
2019
- 2019-12-20 CN CN201911321304.7A patent/CN111074312A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103013128A (en) * | 2012-10-09 | 2013-04-03 | 一致有限公司 | Material of high temperature resistant silica gel product and manufacturing method |
| CN104137345A (en) * | 2013-02-22 | 2014-11-05 | 古河电气工业株式会社 | Terminal, wiring connection structure, and method for manufacturing terminal |
| CN104788963A (en) * | 2014-05-30 | 2015-07-22 | 安徽天彩电缆集团有限公司 | Preparation process for silicone rubber cable sheath used for urban rails |
| CN105505292A (en) * | 2016-01-07 | 2016-04-20 | 东莞市日源盛橡胶绝缘制品有限公司 | Vulcanized silicone rubber formula and preparing technology thereof |
| CN106366666A (en) * | 2016-06-29 | 2017-02-01 | 泰州市天晟制冷科技有限公司 | Preparation method of mixed gel |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111676495A (en) * | 2020-05-19 | 2020-09-18 | 安费诺精密连接器(深圳)有限公司 | Local electroplating method |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Xu Aiming Inventor after: Wu Jianpeng Inventor before: Xu Aimin Inventor before: Wu Jianpeng |
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| CB03 | Change of inventor or designer information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200428 |
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| RJ01 | Rejection of invention patent application after publication |