CN111065200B - Heat radiation structure of integrated circuit - Google Patents
Heat radiation structure of integrated circuit Download PDFInfo
- Publication number
- CN111065200B CN111065200B CN201911328492.6A CN201911328492A CN111065200B CN 111065200 B CN111065200 B CN 111065200B CN 201911328492 A CN201911328492 A CN 201911328492A CN 111065200 B CN111065200 B CN 111065200B
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- Prior art keywords
- wall
- circuit board
- protective shell
- heat dissipation
- groove
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- 230000005855 radiation Effects 0.000 title description 3
- 230000001681 protective effect Effects 0.000 claims abstract description 51
- 230000017525 heat dissipation Effects 0.000 claims abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000000428 dust Substances 0.000 claims description 11
- 238000001035 drying Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 6
- 238000002955 isolation Methods 0.000 claims description 3
- 239000002274 desiccant Substances 0.000 claims description 2
- 239000000110 cooling liquid Substances 0.000 abstract description 10
- 238000001816 cooling Methods 0.000 abstract description 4
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- 239000002826 coolant Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20181—Filters; Louvers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Abstract
The invention discloses a heat dissipation structure of an integrated circuit, which comprises a protective shell and a circuit board, wherein a stepped groove is formed in the outer wall of the bottom of the protective shell, the circuit board is installed in the stepped groove through bolts, air holes distributed in an equidistant structure are formed in the outer wall of the bottom of the circuit board, a groove is formed in the center of the outer wall of the bottom of the circuit board, a shell is inserted into the groove, water delivery ports are formed in two sides of the inner wall of the bottom of the groove, a water delivery pipe penetrating through the protective shell is inserted into the water delivery ports, and a clamping assembly is installed on the outer wall of the top of the circuit board through screws. When the circuit board works, the cooling liquid can be injected into the cavity formed by the shell and the groove through one water pipe, and the heated cooling liquid in the shell is led out of the shell through the other water pipe, so that the circuit board can be continuously cooled by the cooling liquid, and meanwhile, the heat in the protective shell can be discharged out of the protective shell by starting the cooling fan, and the heat dissipation is further enhanced.
Description
Technical Field
The invention relates to the technical field of integrated circuits, in particular to a heat dissipation structure of an integrated circuit.
Background
The integrated circuit board is a carrier for loading the integrated circuit, and when the circuit board is used, a large amount of heat is often generated, so that professional heat dissipation equipment is needed to quickly dissipate heat of the circuit board, and the use safety of the circuit board is improved.
At present, in the use process of an integrated circuit board, a fan or a heat pipe technology is generally adopted to dissipate heat of the circuit board, the heat dissipation mode is usually open, a large amount of dust is accumulated on the circuit board due to the flowing of air, so that the circuit is abnormal, or a large amount of moisture is carried by air to corrode a circuit component, and the existing circuit board does not have the function of flexibly fixing vulnerable parts on the device, so that the vulnerable parts are easily damaged when being used, and therefore, a heat dissipation structure of the integrated circuit is urgently needed to be designed to solve the problems.
Disclosure of Invention
The invention aims to solve the defects that the existing heat dissipation structure in the prior art is poor in dustproof capability and a damaged part is easy to damage when in use, and provides the heat dissipation structure of the integrated circuit.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides an integrated circuit's heat radiation structure, includes protective housing and circuit board, the ladder groove has been seted up on the outer wall of protective housing bottom, and the circuit board passes through the bolt and installs in the ladder inslot portion, set up the gas pocket that is equidistance structure and distributes on the outer wall of circuit board bottom, circuit board bottom outer wall center department sets up flutedly, and the inside grafting of recess has the shell, the water delivery port has all been seted up to recess bottom inner wall both sides, and the inside grafting of water delivery port has the raceway that runs through the protective housing.
Furthermore, there is a clamping assembly on the outer wall of the top of the circuit board through a screw, the clamping assembly includes a substrate, the substrate is mounted on two sides of the outer wall of the top of the circuit board through a screw, two elastic columns are mounted on one side of the outer wall of the substrate, and grid plates are mounted on the outer wall of the elastic columns through bolts.
Furthermore, a through hole is formed in the center of the outer wall of the top of the protective shell, and an isolation net and a cooling fan which are distributed in an up-down structure are mounted inside the through hole through screws.
Furthermore, the both sides of the outer wall of the top of the protective shell are provided with air holes distributed in an equidistant structure, and the dust screen is installed inside the air holes through screws.
Furthermore, drying boxes are installed on the inner walls of the two sides of the protective shell through screws, and drying agents are filled in the drying boxes.
Furthermore, a protective net is installed on the outer wall of the bottom of the protective shell through screws, and mounting holes distributed in an equidistant structure are formed in the periphery of the outer wall of the bottom of the protective shell.
The invention has the beneficial effects that:
1. through the shell and the groove that set up, can be at the circuit board during operation, through the inside coolant liquid that pours into of cavity that shell and groove formed into of one of them raceway to the coolant liquid of the inside heating of shell is derived the shell through another raceway simultaneously, makes the coolant liquid can dispel the heat to the circuit board constantly, starts cooling blower simultaneously and can further strengthen the radiating effect with the inside heat discharge protective housing of protective housing.
2. Through the elastic column and the grid plate which are arranged, parts which are relatively precise and easy to crack can be flexibly clamped and used through the grid plate and the elastic column, so that the electronic components are prevented from being damaged when in use, and the use safety of the device is improved.
3. Through the protection network and the dust screen that set up, can avoid the dust to enter into the protective housing inside at circuit board during operation, influence electronic component performance on the circuit board to extension integrated circuit board's life.
4. Through the drying box who sets up, can guarantee the inside aridity of protective housing, avoid electronic component on the circuit board to wet for the short circuit appears in the operation of circuit board, is favorable to improving the life of circuit board.
Drawings
Fig. 1 is a front view of a heat dissipation structure of an integrated circuit according to the present invention;
fig. 2 is a top view of a protective casing structure of a heat dissipation structure of an integrated circuit according to the present invention;
fig. 3 is a schematic diagram of a bottom structure of a circuit board of a heat dissipation structure of an integrated circuit according to the present invention;
fig. 4 is a schematic structural diagram of a clamping assembly of a heat dissipation structure of an integrated circuit according to the present invention.
In the figure: the device comprises a protective shell 1, a protective net 2, a circuit board 3, a clamping assembly 4, a drying box 5, air vents 6, a dust screen 7, through holes 8, an isolation net 9, a heat dissipation fan 10, air vents 11, grooves 12, a water delivery port 13, a base plate 14, elastic columns 15, grid plates 16, a shell 17, a water delivery pipe 18, a stepped groove 19 and mounting holes 20.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 4, a heat dissipation structure of an integrated circuit includes a protective casing 1 and a circuit board 3, a stepped groove 19 is formed on an outer wall of a bottom of the protective casing 1 for mounting the circuit board 3, and the circuit board 3 is mounted inside the stepped groove 19 by a bolt, so that the bottom of the circuit board 3 is suspended, air holes 11 are formed on the outer wall of the bottom of the circuit board 3 and distributed in an equidistant structure for enhancing heat dissipation of the circuit board 3, a groove 12 is formed in a center of the outer wall of the bottom of the circuit board 3, the groove 12 and a housing 17 can form a cavity for storing a cooling liquid and enhancing heat dissipation of the circuit board 3, the housing 17 is inserted inside the groove 12, water inlets 13 are formed on two sides of the inner wall of the bottom of the groove 12, water pipes 18 penetrating through the protective casing 1 are inserted inside the water inlets 13, two water pipes 18 are provided, one is used for inputting the cooling liquid into the housing 17, and a cooling liquid for discharging the heat exchanged cooling liquid.
Further, there is clamping assembly 4 through the mounting screw on the outer wall of circuit board 3 top for the accurate fragile electronic components of centre gripping prevents that electronic components from damaging, clamping assembly 4 includes base plate 14, and base plate 14 passes through the mounting screw in 3 top outer wall both sides of circuit board, and there is elastic column 15 two base plate 14 relative outer wall one sides through the mounting screw, is convenient for make grid tray 16 press from both sides tight electronic components, and all installs grid tray 16 through the bolt on the relative outer wall of elastic column 15.
Furthermore, a through hole 8 is formed in the center of the outer wall of the top of the protective shell 1, a separation net 9 and a heat dissipation fan 10 which are distributed in an up-down structure are mounted inside the through hole 8 through screws, and the separation net 9 is used for preventing sundries from falling onto the heat dissipation fan 10 to damage the heat dissipation fan 10.
Further, bleeder vent 6 that is equidistance structure and distributes is all seted up to 1 top outer wall both sides of protective housing, reinforcing radiating effect, and 6 insidely have dust screen 7 through the mounting screw of bleeder vent, prevent that the dust from getting into inside protective housing 1.
Further, all install drying box 5 through the screw on the inner wall of 1 both sides of protective housing, and 5 inside packings of drying box have the drier for the inside steam of absorption protective housing 1 guarantees the aridity of 1 inside of protective housing.
Further, there is protection network 2 through the mounting screw on the outer wall of protective housing 1 bottom for prevent that the dust from getting into 1 inside circuit board 3 work that influences of protective housing, protection circuit board 3 and shell 17 can not receive the damage simultaneously, and 1 bottom outer wall of protective housing is seted up all around and is the mounting hole 20 that equidistant structure distributes, is convenient for install circuit board 3 on other equipment.
The working principle is as follows: when the protective shell is used, the clamping component 4 is firstly installed on the circuit board 3, so that the elastic column 15 and the grid plate 16 can clamp fragile or precise electronic elements, and damage to the precise and fragile electronic elements is avoided during use, then the circuit board 3 is installed at the bottom of the protective shell 1 through bolts, then the protective net 2 is installed on the outer wall of the bottom of the protective shell 1 through screws, so that the protection of the circuit board 3 is enhanced, then when the circuit board 3 works, cooling liquid is injected into a cavity formed by the shell 17 and the groove 12 on the circuit board 3 through one water conveying pipe 18 and the water conveying port 13, and meanwhile, the heated cooling liquid in the shell 17 is led out of the shell through the other water conveying pipe 18, so that the cooling liquid can continuously dissipate heat of the circuit board 3, and meanwhile, the heat dissipation fan 10 is started to discharge heat generated by the circuit board 3 in the protective shell 1 out of the protective shell 1, further strengthen circuit board 3's heat dissipation, when cooling fan 10 is inside with the leading-in protective housing 1 of air moreover, dust screen 9 prevents with protection network 2 that the dust from getting into protective housing 1 inside to through dry box 5, can adsorb the inside aqueous vapor of getting into protective housing 1, avoid circuit board 3 to wet the short circuit.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. A heat dissipation structure of integrated circuit comprises a protective shell (1) and a circuit board (3), it is characterized in that the outer wall of the bottom of the protective shell (1) is provided with a step groove (19), and the circuit board (3) is arranged in the stepped groove (19) through a bolt, so that the bottom of the circuit board (3) is suspended, the outer wall of the bottom of the circuit board (3) is provided with air holes (11) which are distributed in an equidistant structure, a groove (12) is arranged in the center of the outer wall of the bottom of the circuit board (3), and the inner part of the groove (12) is inserted with a shell (17) so that a cavity is formed between the groove (12) and the shell (17), both sides of the inner wall of the bottom of the groove (12) are provided with water conveying ports (13), a water delivery pipe (18) which penetrates through the protective shell (1) is inserted in the water delivery port (13), and a protective net (2) is arranged on the outer wall of the bottom of the protective shell (1) through screws.
2. The heat dissipation structure of an integrated circuit according to claim 1, wherein the clamping assembly (4) is mounted on the outer wall of the top of the circuit board (3) by screws, the clamping assembly (4) comprises a substrate (14), the substrate (14) is mounted on two sides of the outer wall of the top of the circuit board (3) by screws, the elastic columns (15) are mounted on one side of the outer wall of the two substrates (14) opposite to each other by screws, and the grid plates (16) are mounted on the outer wall of the elastic columns (15) opposite to each other by bolts.
3. The heat dissipation structure of an integrated circuit according to claim 1, wherein a through hole (8) is formed in the center of the outer wall of the top of the protective shell (1), and an isolation net (9) and a heat dissipation fan (10) which are distributed in an up-down structure are mounted inside the through hole (8) through screws.
4. The heat dissipation structure of an integrated circuit according to claim 1, wherein air holes (6) are formed in the two sides of the outer wall of the top of the protective shell (1) and distributed in an equidistant structure, and a dust screen (7) is installed inside each air hole (6) through a screw.
5. The heat dissipation structure of an integrated circuit according to claim 1, wherein a drying box (5) is mounted on the inner walls of both sides of the protective shell (1) through screws, and a drying agent is filled in the drying box (5).
6. The heat dissipation structure of an integrated circuit according to claim 1, wherein the periphery of the outer wall of the bottom of the protective shell (1) is provided with mounting holes (20) distributed in an equidistant structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911328492.6A CN111065200B (en) | 2019-12-20 | 2019-12-20 | Heat radiation structure of integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911328492.6A CN111065200B (en) | 2019-12-20 | 2019-12-20 | Heat radiation structure of integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111065200A CN111065200A (en) | 2020-04-24 |
| CN111065200B true CN111065200B (en) | 2021-09-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911328492.6A Active CN111065200B (en) | 2019-12-20 | 2019-12-20 | Heat radiation structure of integrated circuit |
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| CN (1) | CN111065200B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110074665A (en) * | 2019-06-06 | 2019-08-02 | 芜湖艾尔达科技有限责任公司 | A kind of nanometer film flows through formula flat mini heater |
| CN112133852B (en) * | 2020-08-10 | 2023-04-14 | 安徽鑫奇睿新能源科技有限公司 | Assembled shell for storage battery of electric motorcycle |
| CN112105239A (en) * | 2020-09-27 | 2020-12-18 | 滁州天陆泓机械有限公司 | Driver and driver alignment installation method |
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| US20160338223A1 (en) * | 2015-05-11 | 2016-11-17 | Cooler Master Co., Ltd. | Electronic device and liquid cooling heat dissipation structure thereof |
| CN208191115U (en) * | 2018-04-16 | 2018-12-04 | 刘冬阳 | One kind being convenient for heat radiating type circuit board |
| CN208369932U (en) * | 2018-05-24 | 2019-01-11 | 安徽通盈溢智能科技有限公司 | A kind of PCBA board with radiator structure |
| CN209216953U (en) * | 2019-01-18 | 2019-08-06 | 深圳市卓盟科技有限公司 | A kind of semiconductor integrated circuit board with multi-panel radiator structure |
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2019
- 2019-12-20 CN CN201911328492.6A patent/CN111065200B/en active Active
Patent Citations (6)
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| CN104735935A (en) * | 2013-12-20 | 2015-06-24 | 西安恒飞电子科技有限公司 | Power source with moisture and static electricity preventing functions |
| CN203896658U (en) * | 2014-06-24 | 2014-10-22 | 深圳市华盛源机电有限公司 | Water-cooled plate heat radiator |
| US20160338223A1 (en) * | 2015-05-11 | 2016-11-17 | Cooler Master Co., Ltd. | Electronic device and liquid cooling heat dissipation structure thereof |
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| CN111065200A (en) | 2020-04-24 |
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Effective date of registration: 20231204 Address after: No. 501, Gate 9, Laowei Village, Machang Road, Hexi District, Tianjin, 300074 Patentee after: Sun Jia Address before: 300000 Room 401, block g, Haitai green industrial base, No. 6, Haitai development road, Huayuan Industrial Zone, Binhai New Area, tianjin-04-46 Patentee before: TIANJIN ZHIAN MICROELECTRONIC TECHNOLOGY CO.,LTD. |
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Effective date of registration: 20240116 Address after: Room 413, 14th Floor, Zone B5, Ronghui Business Park, Binhai Zhongguancun Science and Technology Park, Tianjin Economic and Technological Development Zone, Binhai New Area, 300450, Tianjin Patentee after: Kunbo Technology (Tianjin) Co.,Ltd. Address before: No. 501, Gate 9, Laowei Village, Machang Road, Hexi District, Tianjin, 300074 Patentee before: Sun Jia |
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