CN111044182B - Force/moment adjustable sensor and manufacturing method - Google Patents
Force/moment adjustable sensor and manufacturing method Download PDFInfo
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- CN111044182B CN111044182B CN201911420977.8A CN201911420977A CN111044182B CN 111044182 B CN111044182 B CN 111044182B CN 201911420977 A CN201911420977 A CN 201911420977A CN 111044182 B CN111044182 B CN 111044182B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L3/00—Measuring torque, work, mechanical power, or mechanical efficiency, in general
- G01L3/02—Rotary-transmission dynamometers
- G01L3/04—Rotary-transmission dynamometers wherein the torque-transmitting element comprises a torsionally-flexible shaft
- G01L3/10—Rotary-transmission dynamometers wherein the torque-transmitting element comprises a torsionally-flexible shaft involving electric or magnetic means for indicating
Abstract
The invention provides a force/moment adjustable sensor and a manufacturing method thereof, wherein the force/moment adjustable sensor comprises the following steps: the system comprises a mobile platform, a sensor bottom plate (1), a cross-shaped double-cantilever beam unit, a sensor active regulation beam (2), a sensor passive regulation beam (3), a sensor front plate (4), a sensor input plate (5) and a sensor output plate (6); the sensor bottom plate (1) fixes the sensor on the mobile platform, and simultaneously the sensor bottom plate (1) is grounded; the cross-shaped double cantilever beam unit comprises: the sensor active regulation and control beam (2) and the sensor passive regulation and control beam (3); the sensor active regulation and control beam (2) and the sensor passive regulation and control beam (3) are arranged in a crossed manner; the capacitance change of the output plate can generate capacitance change information; the capacitance change information is matched to force/torque value measurement result information. The invention has the function of system fine adjustment and can compensate position errors and long-term measurement loss caused by sensor processing.
Description
Technical Field
The invention relates to the field of force and torque sensors, in particular to a force/torque adjustable sensor and a manufacturing method thereof, and particularly relates to a system adjustable micro-force-torque sensor.
Background
The research on milligram-level micro-robots at home and abroad has achieved a plurality of breakthrough achievements, particularly flapping wing micro-aircrafts. The milligram-level flapping wing micro aircraft can realize the control effect of generating micro moment by overcoming the gravity takeoff. The aircrafts have the characteristics of small self-weight, high system working frequency, high motion nonlinearity degree and the like besides small lift force and moment, the fact that the lift force and control moment data of the aircrafts cannot be accurately collected in real time is one of bottlenecks limiting the micro bionic flapping wing aircraft to further develop system optimization and accurate control, and therefore high-precision micro force and micro moment sensors are urgently needed to analyze and obtain force and moment feedback conditions under different control signals, and therefore a control strategy is optimized.
Patent document CN110207864A discloses a micro-force sensor with integrated sensitive film and force transmission guide rod, which comprises a sensitive film and a force transmission guide rod fixedly connected, wherein the sensitive film comprises a substrate, a central plate arranged at the central position of a substrate, a cantilever beam connected between the substrate and the central plate, and a piezoresistor arranged on the cantilever beam, the substrate is provided with a contact hole matched with the piezoresistor in position, and a metal lead and the piezoresistor form ohmic contact in the contact hole to form a wheatstone bridge; the central plate is integrally connected with a force transmission guide rod. The invention can meet the measurement of micro force, but can not meet the measurement requirement of micro moment, and for the micro robot, the invention can simultaneously measure force and moment and has very important function, and the data obtained by the measurement function is an important guide parameter for carrying out system optimization and precise control.
Based on this, a micro-force-moment sensor is urgently needed to realize the simultaneous measurement of the force and the moment of the micro-robot.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a force/torque adjustable sensor and a manufacturing method thereof.
According to the invention, the sensor capable of adjusting force/moment is characterized by comprising the following components: the system comprises a mobile platform, a sensor bottom plate 1, a cross-shaped double-cantilever beam unit, a sensor active regulation beam 2, a sensor passive regulation beam 3, a sensor front plate 4, a sensor input plate 5, a sensor output plate 6, a quartz wafer 7, piezoelectric ceramics 8, carbon fibers 9 and a thin film circuit 10; the sensor bottom plate 1 fixes the sensor on a five-degree-of-freedom mobile platform, so that the stable installation of the sensor is ensured, meanwhile, the sensor bottom plate 1 is grounded, and the whole sensor is in an equipotential state through a built-in circuit. The cross-shaped double cantilever beam unit comprises: the sensor active regulation and control beam 2 and the sensor passive regulation and control beam 3; the sensor active regulation and control beam 2 and the sensor passive regulation and control beam 3 are arranged in a crossed manner; one end of the sensor active control beam 2 is connected with the sensor bottom plate 1; the other end of the sensor active control beam 2 is connected with a sensor front plate 4; one end of the sensor passive regulation and control beam 3 is connected with the sensor bottom plate 1; the other end of the sensor passive control beam 3 is connected with a sensor front plate 4. The sensor front plate 4 is connected with a sensor input plate 5 and a sensor output plate 6; the sensor output plate 6 includes: output plate capacitance, capacitance displacement probe; the displacement change of the sensor output plate 6 causes the capacitance of the output plate to change; the capacitance change of the output plate can generate capacitance change information; the capacitance change information is matched to force/torque value measurement result information.
Preferably, the method further comprises the following steps: a flatness adjustment member 7; the flatness adjustment member 7 includes: a first flatness adjustment member and a second flatness adjustment member; the first flatness adjustment member is provided on the surface of the sensor base plate 1; the second flatness adjustment member is provided on the surface of the sensor front plate 4.
Preferably, the method further comprises the following steps: a piezoelectric member 8; the piezoelectric member 8 is in contact with the flatness adjustment member 7; the piezoelectric member 8 can adjust the position accuracy of the cross-shaped double-cantilever unit.
Preferably, the method further comprises the following steps: a carbon fiber layer 9; the carbon fiber layer 9 is in contact with the piezoelectric member 8; the number of the carbon fiber layers 9 is two.
Preferably, the method further comprises the following steps: a thin film circuit layer 10; the thin film circuit layer 10 is arranged between the two carbon fiber layers 9.
Preferably, one end of the sensor active control beam 2 is connected with the sensor bottom plate 1 through a right-angle flexible hinge; the other end of the active regulation and control beam 2 of the sensor is connected with a front sensor plate 4 through a right-angle flexible hinge.
Preferably, one end of the sensor passive regulation and control beam 3 is connected with the sensor bottom plate 1 through a right-angle flexible hinge; the other end of the sensor passive regulation and control beam 3 is connected with a sensor front plate 4 through a right-angle flexible hinge.
The invention provides a method for manufacturing a sensor capable of adjusting force/moment, which comprises the following steps: step M1: processing a film circuit layer 10 to bond a polyimide film with a copper sheet through PSA glue, then transferring a carbon powder circuit on glossy paper onto the copper sheet film through a stamping machine, etching the copper sheet film by using an etching liquid which is prepared by an environment-friendly copper etching agent and has the concentration greater than a set threshold value, and etching the copper sheet part which is not covered by the carbon powder so as to obtain a film circuit; step M2: the method comprises the steps that laser cutting with the precision larger than a set threshold value is adopted to pattern multiple layers of materials, the adopted sheet materials need to perform corresponding patterned cutting on each layer according to different structural parameters of a sensor, an upper quartz wafer is only used as a front plate covering film of the sensor to ensure a rigid structure of the front plate, an upper carbon fiber layer, a lower carbon fiber layer and a polyimide film with a circuit cover the whole sensor structure, the folding position of the carbon fiber is required to be cut according to the design of a flexible hinge when the carbon fiber is cut, an upper piezoelectric ceramic wafer only covers a transverse right cantilever beam, a lower piezoelectric ceramic wafer only covers a transverse left cantilever beam, and a lower quartz wafer only covers the bottom plate part of the sensor; step M3: carrying out vacuum lamination processing, wherein the vacuum lamination sequence is from top to bottom: laminating a plurality of layers of materials including quartz wafers, piezoelectric ceramics, carbon fibers, thin film circuits, carbon fibers, piezoelectric ceramics and quartz wafers in sequence, placing the laminated materials in an electric heating blowing dry box, and exhausting air through a vacuum pump to realize a vacuum laminating process; step M4: performing a first round of laser cutting; step M5: carrying out mirror image pattern superposition; step M6: performing second contour cutting; step M7: and (4) carrying out mirror image stretching assembly forming, wherein the mirror image stretching assembly is based on a 90-degree flexible hinge limiting design, and when the mirror image stretching assembly is stretched and folded to a right-angle position, the assembly is completed.
Compared with the prior art, the invention has the following beneficial effects:
1. in the invention, the micro-force-moment sensing can meet the function of simultaneously measuring force and moment of the milligram-scale micro robot;
2. the invention has the function of system fine adjustment, and can compensate position error and long-term measurement loss caused by sensor processing;
3. the plane integration process method and the mirror image assembly process provided by the invention have the characteristics of high processing precision and high yield, and the modularized design can be applied to the manufacturing process of the similar sensors.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic view of the overall structure of the present invention.
FIG. 2 is a schematic diagram of a thin film circuit process of the present invention;
FIG. 3 is a schematic view of a multi-layer laminate of the present invention;
FIG. 4 is a schematic view of a first round cutting process according to the present invention;
FIG. 5 is a schematic view of a second round cutting process according to the present invention;
FIG. 6 is a mirror assembly view of the present invention;
FIG. 7 is a schematic view of a flexible hinge of the present invention.
In the figure:
sensor base plate 1 sensor output plate 6
Flatness adjusting component 7 for actively regulating and controlling beam 2 by sensor
Sensor passive regulation beam 3 piezoelectric component 8
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.
As shown in fig. 1 to 7, the present invention provides an adjustable force/torque sensor, comprising: the system comprises a mobile platform, a sensor bottom plate 1, a cross-shaped double-cantilever beam unit, a sensor active regulation beam 2, a sensor passive regulation beam 3, a sensor front plate 4, a sensor input plate 5, a sensor output plate 6, a quartz wafer 7, piezoelectric ceramics 8, carbon fibers 9 and a thin film circuit 10; the sensor bottom plate 1 fixes the sensor on a five-degree-of-freedom mobile platform, so that the stable installation of the sensor is ensured, meanwhile, the sensor bottom plate 1 is grounded, and the whole sensor is in an equipotential state through a built-in circuit. The cross-shaped double cantilever beam unit comprises: the sensor active regulation and control beam 2 and the sensor passive regulation and control beam 3; the sensor active regulation and control beam 2 and the sensor passive regulation and control beam 3 are arranged in a crossed manner; one end of the sensor active control beam 2 is connected with the sensor bottom plate 1; the other end of the sensor active control beam 2 is connected with a sensor front plate 4; one end of the sensor passive regulation and control beam 3 is connected with the sensor bottom plate 1; the other end of the sensor passive control beam 3 is connected with a sensor front plate 4. The sensor front plate 4 is connected with a sensor input plate 5 and a sensor output plate 6; the sensor output plate 6 includes: output plate capacitance, capacitance displacement probe; the displacement change of the sensor output plate 6 causes the capacitance of the output plate to change; the capacitance change of the output plate can generate capacitance change information; the capacitance change information is matched to force/torque value measurement result information.
Preferably, the method further comprises the following steps: a flatness adjustment member 7; the flatness adjustment member 7 includes: a first flatness adjustment member and a second flatness adjustment member; the first flatness adjustment member is provided on the surface of the sensor base plate 1; the second flatness adjustment member is provided on the surface of the sensor front plate 4.
Preferably, the method further comprises the following steps: a piezoelectric member 8; the piezoelectric member 8 is in contact with the flatness adjustment member 7; the piezoelectric member 8 can adjust the position accuracy of the cross-shaped double-cantilever unit.
Preferably, the method further comprises the following steps: a carbon fiber layer 9; the carbon fiber layer 9 is in contact with the piezoelectric member 8; the number of the carbon fiber layers 9 is two.
Preferably, the method further comprises the following steps: a thin film circuit layer 10; the thin film circuit layer 10 is arranged between the two carbon fiber layers 9.
Preferably, one end of the sensor active control beam 2 is connected with the sensor bottom plate 1 through a right-angle flexible hinge; the other end of the active regulation and control beam 2 of the sensor is connected with a front sensor plate 4 through a right-angle flexible hinge.
Preferably, one end of the sensor passive regulation and control beam 3 is connected with the sensor bottom plate 1 through a right-angle flexible hinge; the other end of the sensor passive regulation and control beam 3 is connected with a sensor front plate 4 through a right-angle flexible hinge.
Specifically, in one embodiment, a system-adjustable micro-force-torque sensor includes: the sensor comprises a fixed bottom plate, a cross-shaped double cantilever beam structure, a sensor front plate, a force-moment input plate and two sensor output plates. The cantilever beam structure in cross distribution is the measurement sensitive unit, and the double cantilever beams have the output characteristic of the similar translation of the lower end under the action of stress and are suitable for being used as the elastic sensitive measurement structure of the sensor. Two double cantilever beam crosses the distribution, and two semicircle boards at the sensor end are sensor output board, and two output boards cooperate two high accuracy capacitance displacement probes respectively, change the displacement of output board and read out for the signal of telecommunication. During force testing, a tested object is fixed on a sensor input plate, four cantilever beams of the sensor are stressed respectively to generate the same deformation to drive an output plate to generate displacement change, so that distance change is generated between the four cantilever beams and a fixed high-precision capacitance displacement probe, and the average value of the distance change detected by the two probes is the deformation displacement generated under the action of a lifting force. During the moment test, four cantilever beam boards on the sensor receive the cross moment of torsion effect, drive two output boards and produce torsional displacement, and the difference that two capacitance probe detected is the displacement variation volume that produces under the moment of torsion effect. When force and moment are measured simultaneously, the displacement superposition of the two probes is realized on the micro deformation of the cantilever beam, similarly, the average value of the distance change detected by the two probes is the deformation displacement generated under the action of the lifting force, and the difference value detected by the two capacitance probes is the displacement variable quantity generated under the action of the torque, so that the effects of measuring force and moment simultaneously are realized. Meanwhile, piezoelectric ceramic pieces are introduced into the transverse double cantilever beams, and the positions of the cantilever beams can be finely adjusted by loading different direct-current voltages on the active control cantilever beams, so that the fine adjustment of the positions and the precision of the force-torque sensor is realized.
Specifically, in one embodiment, as shown in fig. 1-7, wherein fig. 1 is a structural diagram and fig. 2-7 are process diagrams, a system-adjustable micro-force-moment sensor and a manufacturing process thereof, includes: the sensor comprises a sensor bottom plate 1, a sensor active control beam 2, a sensor passive control beam 3, a sensor front plate 4, a sensor input plate 5, a sensor output plate 6, a quartz wafer 7, piezoelectric ceramics 8, carbon fibers 9 and a thin film circuit 10;
referring to fig. 1, which is an overall structural diagram of a micro-force-torque sensor, a system-adjustable micro-force-torque sensor includes: the sensor comprises a sensor bottom plate 1, a sensor active control beam 2, a sensor passive control beam 3, a sensor front plate 4, a sensor input plate 5 and a sensor output plate 6. The sensor active control beam and the sensor passive control beam are arranged in a cross shape, two ends of the sensor active control beam and the sensor passive control beam are respectively connected with the sensor bottom plate and the sensor front plate through a right-angle flexible hinge, the sensor input plate is connected to the middle position of the sensor front plate, and the left side and the right side of the sensor front plate are respectively connected with the sensor input plate.
Fig. 2-7 are process diagrams of the micro-force-torque sensor. The plane processing adopts a multilayer superposition plane integrated process, and comprises two layers of quartz wafers 7, two layers of piezoelectric ceramics 8, two layers of carbon fibers 9 and a layer of thin film circuit 10. FIG. 2 is a thin film circuit process diagram. Fig. 3 is a schematic view of a multi-layer laminate. Fig. 4 and 5 are first and second round laser cutting patterns, respectively. The assembly process adopts a mirror image stretching assembly process, two sensors of two mirror images are mutually overlapped, and then mirror image stretching is carried out on the sensors. Fig. 6 is a mirror image assembly schematic. Due to the right-angle limiting design of the flexible hinge, when the sensor is folded to a 90-degree position in a mirror image mode, the assembly is completed, the sensor is structurally fixed through gluing, and then the sensor in the mirror image mode is separated into two micro-force-torque sensors. Fig. 7 is a schematic view of a flexible hinge.
The invention provides a method for manufacturing a sensor capable of adjusting force/moment, which comprises the following steps: step M1: processing a film circuit layer 10 to bond a polyimide film with a copper sheet through PSA glue, then transferring a carbon powder circuit on glossy paper onto the copper sheet film through a stamping machine, etching the copper sheet film by using an etching liquid which is prepared by an environment-friendly copper etching agent and has the concentration greater than a set threshold value, and etching the copper sheet part which is not covered by the carbon powder so as to obtain a film circuit; step M2: the method comprises the steps that laser cutting with the precision larger than a set threshold value is adopted to pattern multiple layers of materials, the adopted sheet materials need to perform corresponding patterned cutting on each layer according to different structural parameters of a sensor, an upper quartz wafer is only used as a front plate covering film of the sensor to ensure a rigid structure of the front plate, an upper carbon fiber layer, a lower carbon fiber layer and a polyimide film with a circuit cover the whole sensor structure, the folding position of the carbon fiber is required to be cut according to the design of a flexible hinge when the carbon fiber is cut, an upper piezoelectric ceramic wafer only covers a transverse right cantilever beam, a lower piezoelectric ceramic wafer only covers a transverse left cantilever beam, and a lower quartz wafer only covers the bottom plate part of the sensor; step M3: carrying out vacuum lamination processing, wherein the vacuum lamination sequence is from top to bottom: laminating a plurality of layers of materials including quartz wafers, piezoelectric ceramics, carbon fibers, thin film circuits, carbon fibers, piezoelectric ceramics and quartz wafers in sequence, placing the laminated materials in an electric heating blowing dry box, and exhausting air through a vacuum pump to realize a vacuum laminating process; step M4: performing a first round of laser cutting; step M5: carrying out mirror image pattern superposition; step M6: performing second contour cutting; step M7: and (4) carrying out mirror image stretching assembly forming, wherein the mirror image stretching assembly is based on a 90-degree flexible hinge limiting design, and when the mirror image stretching assembly is stretched and folded to a right-angle position, the assembly is completed.
Specifically, in one embodiment, a process from planar integration to three-dimensional assembly mirror molding. The built-in circuit of the sensor is realized by a thin film circuit process, namely, a thin copper foil is adhered on a polyimide film, a circuit diagram is transferred to the copper foil through carbon powder, and the effect of a copper sheet circuit is realized by etching the uncovered copper foil. And then, forming a sheet material by performing laser cutting on seven layers of materials such as quartz wafers, piezoelectric ceramics, carbon fibers, polyimide films and the like corresponding to respective drawings, for example, adopting a sheet shape of 65 multiplied by 65mm, and positioning the patterned materials through positioning holes and stacking the materials in sequence. The material is put into an electric heating blowing dry box for air exhaust, and a certain temperature is set for vacuum lamination. And then carrying out first round of laser cutting on the overlapped material, overlapping the two mirror image sensor materials, and carrying out a second round of laser cutting process to obtain the planar sensor structure. And finally, carrying out mirror image stretching on the sensor, finishing assembly when the sensor is folded to a 90-degree position in a mirror image due to the right-angle limiting design of the flexible hinge, fixing the sensor structure by adopting adhesion, and separating the sensor in the mirror image into two micro-force-torque sensors.
The micro-force-moment sensing can meet the function of simultaneously measuring force and moment of a milligram-level micro robot; the system has a system fine adjustment function, and can compensate position errors and long-term measurement loss caused by sensor processing; the plane integration process method and the mirror image assembly process have the characteristics of high machining precision and high yield, and the modularized design can be applied to the manufacturing process of the similar sensors.
Those skilled in the art will appreciate that, in addition to implementing the system and its various devices, modules, units provided by the present invention as pure computer readable program code, the system and its various devices, modules, units provided by the present invention can be fully implemented by logically programming method steps in the form of logic gates, switches, application specific integrated circuits, programmable logic controllers, embedded microcontrollers and the like. Therefore, the system and various devices, modules and units thereof provided by the invention can be regarded as a hardware component, and the devices, modules and units included in the system for realizing various functions can also be regarded as structures in the hardware component; means, modules, units for performing the various functions may also be regarded as structures within both software modules and hardware components for performing the method.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.
Claims (6)
1. An adjustable force/torque sensor, comprising: the system comprises a mobile platform, a sensor bottom plate (1), a cross-shaped double-cantilever beam unit, a sensor active regulation beam (2), a sensor passive regulation beam (3), a sensor front plate (4), a sensor input plate (5) and a sensor output plate (6);
the sensor bottom plate (1) fixes the sensor on the mobile platform, and simultaneously the sensor bottom plate (1) is grounded;
the cross-shaped double cantilever beam unit comprises: the sensor active regulation and control beam (2) and the sensor passive regulation and control beam (3);
the sensor active regulation and control beam (2) and the sensor passive regulation and control beam (3) are arranged in a crossed manner;
one end of the sensor active regulation and control beam (2) is connected with the sensor bottom plate (1);
the other end of the sensor active control beam (2) is connected with a sensor front plate (4);
one end of the sensor passive regulation and control beam (3) is connected with the sensor bottom plate (1);
the other end of the sensor passive regulation and control beam (3) is connected with a sensor front plate (4);
the sensor front plate (4) is connected with the sensor input plate (5) and the sensor output plate (6);
the sensor output plate (6) includes: output plate capacitance, capacitance displacement probe;
the displacement change of the sensor output plate (6) enables the capacitance of the output plate to change;
the capacitance change of the output plate can generate capacitance change information;
the capacitance change information is matched with force/torque value measurement result information;
further comprising: a flatness adjustment member (7);
the flatness adjustment member (7) includes: a first flatness adjustment member and a second flatness adjustment member;
the first flatness adjustment member is arranged on the surface of the sensor base plate (1);
the second flatness adjustment member is arranged on the surface of the sensor front plate (4);
further comprising: a piezoelectric member (8);
the piezoelectric component (8) is in contact with the flatness adjusting component (7);
the piezoelectric component (8) can adjust the position precision of the cross-shaped double-cantilever unit.
2. The adjustable force/torque sensor of claim 1, further comprising: a carbon fiber layer (9);
the carbon fiber layer (9) is in contact with the piezoelectric member (8);
the number of the carbon fiber layers (9) is two.
3. The adjustable force/torque sensor of claim 2, further comprising: a thin film circuit layer (10);
the thin film circuit layer (10) is arranged between the two carbon fiber layers (9).
4. The adjustable force/moment sensor according to claim 1, characterized in that one end of the active control beam (2) of the sensor is connected with the sensor base plate (1) by a right-angle flexible hinge;
the other end of the sensor active control beam (2) is connected with a sensor front plate (4) through a right-angle flexible hinge.
5. The adjustable force/moment sensor according to claim 1, characterized in that one end of the sensor passive control beam (3) is connected with the sensor base plate (1) through a right-angle flexible hinge;
the other end of the sensor passive regulation and control beam (3) is connected with a sensor front plate (4) through a right-angle flexible hinge.
6. A method for manufacturing a force/torque adjustable sensor, which is characterized in that the force/torque adjustable sensor of any one of claims 1-5 is adopted, and the method comprises the following steps:
step M1: processing a thin film circuit layer (10), bonding a polyimide film with a copper sheet through PSA glue, then transferring a carbon powder circuit on glossy paper onto the copper sheet thin film through a stamping machine, etching the copper sheet thin film by using an etching liquid which is prepared by an environment-friendly copper etching agent and has the concentration greater than a set threshold value, and etching the copper sheet part which is not covered by the carbon powder so as to obtain a thin film circuit;
step M2: the method comprises the steps that laser cutting with the precision larger than a set threshold value is adopted to pattern multiple layers of materials, the adopted sheet materials need to perform corresponding patterned cutting on each layer according to different structural parameters of a sensor, an upper quartz wafer is only used as a front plate covering film of the sensor to ensure a rigid structure of the front plate, an upper carbon fiber layer, a lower carbon fiber layer and a polyimide film with a circuit cover the whole sensor structure, the folding position of the carbon fiber is required to be cut according to the design of a flexible hinge when the carbon fiber is cut, an upper piezoelectric ceramic wafer only covers a transverse right cantilever beam, a lower piezoelectric ceramic wafer only covers a transverse left cantilever beam, and a lower quartz wafer only covers the bottom plate part of the sensor;
step M3: carrying out vacuum lamination processing, wherein the vacuum lamination sequence is from top to bottom: laminating a plurality of layers of materials including quartz wafers, piezoelectric ceramics, carbon fibers, thin film circuits, carbon fibers, piezoelectric ceramics and quartz wafers in sequence, placing the laminated materials in an electric heating blowing dry box, and exhausting air through a vacuum pump to realize a vacuum laminating process;
step M4: carrying out first round of laser cutting;
step M5: carrying out mirror image pattern superposition;
step M6: performing second contour cutting;
step M7: and (4) carrying out mirror image stretching assembly forming, wherein the mirror image stretching assembly is based on a 90-degree flexible hinge limiting design, and when the mirror image stretching assembly is stretched and folded to a right-angle position, the assembly is completed.
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| JP2005300490A (en) * | 2004-04-16 | 2005-10-27 | Nippon Telegr & Teleph Corp <Ntt> | Mechanical detection element and detector |
| CN102175361B (en) * | 2011-01-27 | 2014-07-23 | 西安交通大学 | Three-dimensional micro-force sensor capable of measuring sub micro Newton force and packaging method of three-dimensional micro-force sensor |
| DE102017203384B3 (en) * | 2017-03-02 | 2018-01-18 | Robert Bosch Gmbh | Micromechanical pressure sensor |
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