CN111040696A - High-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant and preparation method thereof - Google Patents
High-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant and preparation method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- C08K2003/0856—Iron
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
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- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
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Abstract
The invention discloses a high-thermal-conductivity magnetic-shielding high-strength waterproof pouring sealant which comprises the following raw materials in parts by weight: 25-35 parts of aluminum oxide, 5-15 parts of silicon carbide, 5-35 parts of aluminum nitride and one or more of aluminum oxide, silicon carbide and aluminum nitride; 1-8 parts of flaky nickel powder, 3-15 parts of hydroxyl iron powder, 2-40 parts of ferrum-silicon-aluminum, 10-38 parts of ferrum-nickel powder and one or more of the components; 5-40 parts of graphene, 1-9 parts of graphite powder and 3-18 parts of graphite glue powder; 2-7 parts of epoxy resin and 1-9 parts of polyurethane; the invention also provides a preparation method of the high-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant, which comprises the following steps; s1, crushing; s2, mixing; and S3, blending. The high-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant prepared by the invention is used for electronic encapsulation, and has the advantages of high strength, water resistance, good heat-conducting effect, and good insulating and magnetic-shielding effects.
Description
Technical Field
The invention belongs to the technical field of pouring sealants, and particularly relates to a high-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant and a preparation method thereof.
Background
The organic silicon heat-conducting pouring sealant has the advantages of good heat-conducting property, high and low temperature resistance, good elasticity and excellent insulativity, is applied to the fields of electric and electronic integration technology, electric appliance packaging and the like, is beneficial to improving the precision and the service life of electric and electronic devices, and is widely applied in recent years.
The current encapsulating materials mainly comprise three types of epoxy resin, organic silicon and polyurethane: the epoxy resin pouring sealant is low in price, excellent in adhesive property and good in electrical insulation, but is poor in low-temperature flexibility, poor in weather resistance and large in shrinkage; the organic silicon pouring sealant has good flame retardance and excellent high and low temperature resistance, but has high price and poor electrical insulation; the polyurethane pouring sealant integrates the advantages of epoxy resin pouring sealants and organic silicon pouring sealants, has the advantages of adjustable hardness and curing speed through a formula, excellent shock absorption, water resistance, wear resistance, low temperature resistance and the like, and is widely applied to the field of filling and sealing. At present, the technology development of polyurethane pouring sealant is fast, in Chinese invention patent (application number CN201010143048.X), a preparation method and a pouring process patent of polyurethane pouring sealant are applied by aerospace material and process research institute, and the related pouring sealant mainly has good fluidity and low viscosity, is easy to permeate into a small aperture and is beneficial to the tight filling of the inside of a poured object. In Chinese invention patent (application No. CN201010595068.0), Hongda polyurethane Limited company applies for a preparation method of two-component polyurethane pouring sealant and a product patent thereof, and the product of the two-component polyurethane pouring sealant has good adhesive force, flexibility, water resistance, flame retardance and electrical appliance performance and is suitable for pouring and sealing small and medium-sized electronic elements. Other methods such as the development of polyurethane pouring sealant with low internal consumption by Yuan Zheng of Beijing university of chemical industry (polyurethane industry, 2010 (1): 35-37), the development of flame-retardant polyurethane pouring sealant by Li Yang of Donghua university (Chinese adhesive, 2002,11 (2): 11-13) and the like report the preparation method and the pouring process of the polyurethane pouring sealant, but the magnetic shielding problem and the heat conduction problem of the pouring sealant are not concerned in the conclusions, and the patent is just explained in the aspect.
Disclosure of Invention
Aiming at the technical problems, the invention provides the high-thermal-conductivity magnetic-shielding high-strength waterproof pouring sealant and the preparation method thereof, and the high-thermal-conductivity magnetic-shielding high-strength waterproof pouring sealant has the advantages of high thermal conductivity, good waterproof performance, high tensile strength and good application prospect.
The technical scheme adopted by the invention is as follows: the high-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant comprises the following raw materials in parts by weight: 25-35 parts of alumina, 5-15 parts of silicon carbide and 5-35 parts of aluminum nitride;
1-8 parts of flaky nickel powder, 3-15 parts of hydroxyl iron powder, 2-40 parts of ferrum-silicon-aluminum and 10-38 parts of ferrum-nickel powder;
5-40 parts of graphene, 1-9 parts of graphite powder and 3-18 parts of graphite rubber powder;
2-7 parts of epoxy resin and 1-9 parts of polyurethane.
Preferably, the raw material formula of the high-thermal-conductivity magnetic-shielding high-strength waterproof pouring sealant comprises the following raw materials in parts by weight: 29-31 parts of alumina, 9-11 parts of silicon carbide and 10-30 parts of aluminum nitride;
4-6 parts of flaky nickel powder, 9-11 parts of hydroxyl iron powder, 10-30 parts of ferrum-silicon-aluminum and 10-30 parts of ferrum-nickel powder;
10-30 parts of graphene, 4-6 parts of graphite powder and 9-11 parts of graphite glue powder;
4-6 parts of epoxy resin and 4-6 parts of polyurethane.
Preferably, the raw material formula of the high-thermal-conductivity magnetic-shielding high-strength waterproof pouring sealant comprises the following raw materials in parts by weight: 30 parts of alumina, 10 parts of silicon carbide and 20 parts of aluminum nitride;
5 parts of flaky nickel powder, 10 parts of hydroxyl iron powder, 20 parts of ferrum-silicon-aluminum and 20 parts of ferrum-nickel powder;
one or more of 20 parts of graphene, 5 parts of graphite powder and 10 parts of graphite glue powder;
5 parts of epoxy resin and 5 parts of polyurethane.
The invention also provides a preparation method of the high-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant, which comprises the following steps:
s1, crushing: according to the weight percentage, 25-35 parts of alumina, 5-15 parts of silicon carbide, 5-35 parts of aluminum nitride, 1-8 parts of flaky nickel powder, 3-15 parts of hydroxyl iron powder, 2-40 parts of ferrum-silicon-aluminum, 10-38 parts of ferrum-nickel powder, 5-40 parts of graphene, 1-9 parts of graphite powder, 3-18 parts of graphite rubber powder and 2-7 parts of epoxy resin are respectively crushed by a crusher, and the crushed materials are sieved by a 50-mesh sieve for standby;
s2, mixing: selecting, by weight, crushed and sieved selected aluminum oxide, silicon carbide, aluminum nitride, flaky nickel powder, hydroxyl iron powder, iron silicon aluminum, iron nickel powder, graphene, graphite powder, graphite glue powder and epoxy resin, placing the materials in a stirrer, stirring the materials for 20 to 60 minutes, uniformly stirring the materials, slowly spraying polyurethane into the materials by using a small spray can while stirring the materials to increase the humidity of the materials to prepare a soft material A, wherein the addition amount of a wetting agent is that the materials can be kneaded into a mass by hands, the mass can be dispersed by pressing the mass with fingers, and the prepared soft material A is separated and stored;
s3, when the epoxy resin adhesive is needed, adding a proper amount of warm water at 25 ℃ into the separated and stored soft material A, mixing the soft material A and the warm water according to the weight ratio of 2-5: 1 in a container, and stirring for 3-8 minutes until the soft material A and the water are fully and uniformly mixed to obtain the epoxy resin pouring sealant.
Preferably, in the step S2, the mixture is placed in a stirrer to be stirred for 25 minutes, and stirred uniformly, and after the materials are mixed uniformly, the polyurethane is slowly sprayed into the materials by a small spray can while stirring to increase the humidity of the materials, so as to prepare the soft material a.
Preferably, in step S3, the soft material a and warm water are mixed in a weight ratio of 3.5: 1 in a container and stirred for 5 minutes.
The invention has the beneficial effects that:
1. the pouring sealant prepared by the invention has simple process, low production energy consumption and no generation of three wastes;
2. the pouring sealant prepared by the invention is used for electronic filling and sealing, and has the advantages of high strength, water resistance, good heat conduction effect, good insulation and magnetic shielding effects.
Detailed Description
The present invention will be further illustrated with reference to the following specific examples.
Example 1
High-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant; the raw material formula of the high-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant comprises the following raw materials in parts by weight: 25 parts of aluminum oxide, 50 parts of silicon carbide, 5 parts of aluminum nitride, 10 parts of flaky nickel powder, 3 parts of hydroxyl iron powder, 2 parts of iron-silicon-aluminum, 100 parts of iron-nickel powder, 5 parts of graphene, 1 part of graphite powder, 3 parts of graphite rubber powder, 2 parts of epoxy resin and 1 part of polyurethane.
The process flow comprises the following steps:
s1, crushing: selecting one or more of 25 parts of alumina, 50 parts of silicon carbide and 5 parts of aluminum nitride according to weight percentage;
one or more of 10 parts of flaky nickel powder, 3 parts of hydroxyl iron powder, 2 parts of ferrum-silicon-aluminum and 10 parts of ferrum-nickel powder;
one or more of 5 parts of graphene, 1 part of graphite powder and 3 parts of graphite adhesive powder;
2 parts of epoxy resin are respectively crushed by a crusher and sieved by a 50-mesh sieve for later use;
s2, mixing: selecting, by weight, crushed and sieved selected aluminum oxide, silicon carbide, aluminum nitride, flaky nickel powder, hydroxyl iron powder, iron silicon aluminum, iron nickel powder, graphene, graphite powder, graphite glue powder and epoxy resin, placing the materials in a stirrer, stirring the materials for 20 minutes, uniformly stirring the materials, slowly spraying polyurethane into the materials by using a small spray can while stirring the materials to increase the humidity of the materials to prepare a soft material A, wherein the adding amount of a wetting agent is that the materials can be kneaded into a mass by hands, the mass can be dispersed by pressing with fingers, and the prepared soft material A is separated and stored;
s3, when the epoxy resin adhesive is needed, adding a proper amount of warm water at 25 ℃ into the separated and stored soft material A, mixing the soft material A and the warm water according to the weight ratio of 2: 1 in a container, and stirring for 3 minutes until the soft material A and the water are fully and uniformly mixed to obtain the epoxy resin pouring adhesive.
Example 2
High-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant; the raw material formula of the high-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant comprises the following raw materials in parts by weight: 29 parts of aluminum oxide, 90 parts of silicon carbide and 100 parts of aluminum nitride;
40 parts of flaky nickel powder, 9 parts of hydroxyl iron powder, 100 parts of ferrosilicon aluminum and 100 parts of ferronickel powder;
one or more of 10 parts of graphene, 4 parts of graphite powder and 9 parts of graphite rubber powder
4 parts of epoxy resin and 4 parts of polyurethane.
The process flow comprises the following steps:
s1, crushing: according to the weight percentage, 25 parts of aluminum oxide, 50 parts of silicon carbide, 5 parts of aluminum nitride, 10 parts of flaky nickel powder, 3 parts of hydroxyl iron powder, 2 parts of ferrum-silicon-aluminum, 10 parts of ferrum-nickel powder, 5 parts of graphene, 1 part of graphite powder, 3 parts of graphite rubber powder and 2 parts of epoxy resin are respectively crushed by a crusher, and the crushed materials are sieved by a 50-mesh sieve for later use;
s2, mixing: selecting, by weight, crushed and sieved selected aluminum oxide, silicon carbide, aluminum nitride, flaky nickel powder, hydroxyl iron powder, iron silicon aluminum, iron nickel powder, graphene, graphite powder, graphite glue powder and epoxy resin, placing the materials in a stirrer, stirring the materials for 20 minutes, uniformly stirring the materials, slowly spraying polyurethane into the materials by using a small spray can while stirring the materials to increase the humidity of the materials to prepare a soft material A, wherein the adding amount of a wetting agent is that the materials can be kneaded into a mass by hands, the mass can be dispersed by pressing with fingers, and the prepared soft material A is separated and stored;
s3, when the epoxy resin adhesive is needed, adding a proper amount of warm water at 25 ℃ into the separated and stored soft material A, mixing the soft material A and the warm water according to the weight ratio of 2: 1 in a container, and stirring for 3 minutes until the soft material A and the water are fully and uniformly mixed to obtain the epoxy resin pouring adhesive.
Example 3
High-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant; the raw material formula of the high-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant comprises the following raw materials in parts by weight: 30 parts of alumina, 10 parts of silicon carbide and 20 parts of aluminum nitride;
5 parts of flaky nickel powder, 10 parts of hydroxyl iron powder, 20 parts of ferrum-silicon-aluminum and 20 parts of ferrum-nickel powder;
one or more of 20 parts of graphene, 5 parts of graphite powder and 10 parts of graphite glue powder;
5 parts of epoxy resin and 5 parts of polyurethane.
The process flow comprises the following steps:
s1, crushing: according to the weight percentage, 25 parts of aluminum oxide, 50 parts of silicon carbide, 5 parts of aluminum nitride, 10 parts of flaky nickel powder, 3 parts of hydroxyl iron powder, 2 parts of ferrum-silicon-aluminum, 10 parts of ferrum-nickel powder, 5 parts of graphene, 1 part of graphite powder, 3 parts of graphite rubber powder and 2 parts of epoxy resin are respectively crushed by a crusher, and the crushed materials are sieved by a 50-mesh sieve for later use;
s2, mixing: selecting, by weight, crushed and sieved selected aluminum oxide, silicon carbide, aluminum nitride, flaky nickel powder, hydroxyl iron powder, iron silicon aluminum, iron nickel powder, graphene, graphite powder, graphite glue powder and epoxy resin, placing the materials in a stirrer, stirring the materials for 40 minutes, uniformly stirring the materials, slowly spraying polyurethane into the materials by using a small spray can while stirring the materials to increase the humidity of the materials to prepare a soft material A, wherein the adding amount of a wetting agent is that the materials can be kneaded into a mass by hands, the mass can be dispersed by pressing with fingers, and the prepared soft material A is separated and stored;
s3, when the epoxy resin adhesive is needed, adding a proper amount of warm water at 25 ℃ into the separated and stored soft material A, mixing the soft material A and the warm water according to the weight ratio of 3.5: 1 in a container, and stirring for 3 minutes until the soft material A and the water are fully and uniformly mixed to obtain the epoxy resin pouring sealant.
Example 4
High-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant; the raw material formula of the high-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant comprises the following raw materials in parts by weight: one or more of 31 parts of aluminum oxide, 110 parts of silicon carbide and 300 parts of aluminum nitride;
60 parts of flaky nickel powder, 11 parts of hydroxyl iron powder, 30 parts of ferrosilicon aluminum and 30 parts of ferronickel powder;
30 parts of graphene, 6 parts of graphite powder and 11 parts of graphite rubber powder;
6 parts of epoxy resin and 6 parts of polyurethane.
The process flow comprises the following steps:
s1, crushing: according to the weight percentage, 25 parts of aluminum oxide, 50 parts of silicon carbide, 5 parts of aluminum nitride, 10 parts of flaky nickel powder, 3 parts of hydroxyl iron powder, 2 parts of ferrum-silicon-aluminum, 10 parts of ferrum-nickel powder, 5 parts of graphene, 1 part of graphite powder, 3 parts of graphite rubber powder and 2 parts of epoxy resin are respectively crushed by a crusher, and the crushed materials are sieved by a 50-mesh sieve for later use;
s2, mixing: selecting, by weight, crushed and sieved selected aluminum oxide, silicon carbide, aluminum nitride, flaky nickel powder, hydroxyl iron powder, iron silicon aluminum, iron nickel powder, graphene, graphite powder, graphite glue powder and epoxy resin, placing the materials in a stirrer, stirring for 55 minutes, uniformly stirring, after the materials are uniformly mixed, slowly spraying polyurethane into the materials by using a small spray can while stirring to increase the humidity of the materials to prepare a soft material A, wherein the adding amount of a wetting agent is that the materials can be kneaded into a mass by hands, the mass can be dispersed by pressing with fingers, and the prepared soft material A is separated and stored;
s3, when the epoxy resin adhesive is needed, adding a proper amount of warm water at 25 ℃ into the separated and stored soft material A, mixing the soft material A and the warm water according to the weight ratio of 4: 1 in a container, and stirring for 4 minutes until the soft material A and the water are fully and uniformly mixed to obtain the epoxy resin pouring adhesive.
Example 5
High-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant; the raw material formula of the high-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant comprises the following raw materials in parts by weight: 35 parts of alumina, 150 parts of silicon carbide and 35 parts of aluminum nitride;
80 parts of flaky nickel powder, 15 parts of hydroxyl iron powder, 40 parts of ferrosilicon aluminum and 380 parts of ferronickel powder;
40 parts of graphene, 9 parts of graphite powder and 18 parts of graphite rubber powder;
7 parts of epoxy resin and 9 parts of polyurethane.
The process flow comprises the following steps:
s1, crushing: according to the weight percentage, 25 parts of aluminum oxide, 50 parts of silicon carbide, 5 parts of aluminum nitride, 10 parts of flaky nickel powder, 3 parts of hydroxyl iron powder, 2 parts of ferrum-silicon-aluminum, 10 parts of ferrum-nickel powder, 5 parts of graphene, 1 part of graphite powder, 3 parts of graphite rubber powder and 2 parts of epoxy resin are respectively crushed by a crusher, and the crushed materials are sieved by a 50-mesh sieve for later use;
s2, mixing: selecting, by weight, crushed and sieved selected aluminum oxide, silicon carbide, aluminum nitride, flaky nickel powder, hydroxyl iron powder, iron silicon aluminum, iron nickel powder, graphene, graphite powder, graphite glue powder and epoxy resin, placing the materials in a stirrer, stirring the materials for 60 minutes, uniformly stirring the materials, slowly spraying polyurethane into the materials by using a small spray can while stirring the materials to increase the humidity of the materials to prepare a soft material A, wherein the adding amount of a wetting agent is that the materials can be kneaded into a mass by hands, the mass can be dispersed by pressing with fingers, and the prepared soft material A is separated and stored;
s3, when the epoxy resin adhesive is needed, adding a proper amount of warm water at 25 ℃ into the separated and stored soft material A, mixing the soft material A and the warm water according to the weight ratio of 5: 1 in a container, and stirring for 3 minutes until the soft material A and the water are fully and uniformly mixed to obtain the epoxy resin pouring adhesive.
The high-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant prepared by the invention is used for electronic encapsulation, and has the advantages of high strength, water resistance, good heat conduction effect, good insulation and magnetic shielding effects.
In order to test the effect of the high-thermal-conductivity magnetic-shielding high-strength waterproof pouring sealant, the high-thermal-conductivity magnetic-shielding high-strength waterproof pouring sealant produced by the invention and common waterproof pouring sealants on the market are used as experimental group materials, 300 parts of the high-thermal-conductivity magnetic-shielding high-strength waterproof pouring sealant are selected for use and are randomly and evenly divided into two groups, the first group uses the high-thermal-conductivity magnetic-shielding high-strength waterproof pouring sealant for one month, the second group uses the common high-thermal-conductivity magnetic-shielding high-strength waterproof pouring sealant, and the experimental days are.
| Pouring sealant adopting scheme | Thermal conductivity | Water resistance (Water absorption) | Tensile strength (Mpa) | Magnetic shield |
| Example 1 | 2.35 | ＜0.43 | 0.26 | Good wine |
| Example 2 | 2.18 | ＜0.21 | 0.38 | Good wine |
| Example 3 | 3.89 | ＜0.13 | 0.60 | Superior food |
| Example 4 | 3.16 | ＜0.19 | 0.55 | Good wine |
| Example 5 | 2.85 | ＜0.25 | 0.47 | Good wine |
| Common pouring sealant | 1.36 | ＜0.38 | 0.23 | Difference (D) |
The experimental data show that the traditional Chinese medicine for treating the myopic diseases by applying the scheme achieves the remarkable level of myopia treatment, and the high-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant in the embodiment 3 is high in heat conductivity coefficient, good in waterproof performance, high in tensile strength and good in application prospect.
Although the 5 embodiments of the present invention have been described in detail, the description is only for the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (6)
1. The high-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant is characterized by comprising the following raw materials in parts by weight: 25-35 parts of alumina, 5-15 parts of silicon carbide and 5-35 parts of aluminum nitride;
1-8 parts of flaky nickel powder, 3-15 parts of hydroxyl iron powder, 2-40 parts of ferrum-silicon-aluminum and 10-38 parts of ferrum-nickel powder;
5-40 parts of graphene, 1-9 parts of graphite powder and 3-18 parts of graphite rubber powder;
2-7 parts of epoxy resin and 1-9 parts of polyurethane.
2. The high-thermal-conductivity magnetic-shielding high-strength waterproof pouring sealant according to claim 1, wherein the raw material formula of the high-thermal-conductivity magnetic-shielding high-strength waterproof pouring sealant comprises the following raw materials in parts by weight: 29-31 parts of alumina, 9-11 parts of silicon carbide and 10-30 parts of aluminum nitride;
4-6 parts of flaky nickel powder, 9-11 parts of hydroxyl iron powder, 10-30 parts of ferrum-silicon-aluminum and 10-30 parts of ferrum-nickel powder;
10-30 parts of graphene, 4-6 parts of graphite powder and 9-11 parts of graphite glue powder;
4-6 parts of epoxy resin and 4-6 parts of polyurethane.
3. The high-thermal-conductivity magnetic-shielding high-strength waterproof pouring sealant according to claim 1, wherein the raw material formula of the high-thermal-conductivity magnetic-shielding high-strength waterproof pouring sealant comprises the following raw materials in parts by weight: 30 parts of alumina, 10 parts of silicon carbide and 20 parts of aluminum nitride;
5 parts of flaky nickel powder, 10 parts of hydroxyl iron powder, 20 parts of ferrum-silicon-aluminum and 20 parts of ferrum-nickel powder;
one or more of 20 parts of graphene, 5 parts of graphite powder and 10 parts of graphite glue powder;
5 parts of epoxy resin and 5 parts of polyurethane.
4. The preparation method of the high-heat-conductivity magnetic-shielding high-strength waterproof pouring sealant is characterized by comprising the following steps of:
s1, crushing: according to the weight percentage, 25-35 parts of alumina, 5-15 parts of silicon carbide, 5-35 parts of aluminum nitride, 1-8 parts of flaky nickel powder, 3-15 parts of hydroxyl iron powder, 2-40 parts of ferrum-silicon-aluminum, 10-38 parts of ferrum-nickel powder, 5-40 parts of graphene, 1-9 parts of graphite powder, 3-18 parts of graphite rubber powder and 2-7 parts of epoxy resin are respectively crushed by a crusher, and the crushed materials are sieved by a 50-mesh sieve for standby;
s2, mixing: selecting, by weight, crushed and sieved selected aluminum oxide, silicon carbide, aluminum nitride, flaky nickel powder, hydroxyl iron powder, iron silicon aluminum, iron nickel powder, graphene, graphite powder, graphite glue powder and epoxy resin, placing the materials in a stirrer, stirring the materials for 20 to 60 minutes, uniformly stirring the materials, slowly spraying polyurethane into the materials by using a small spray can while stirring the materials to increase the humidity of the materials to prepare a soft material A, wherein the addition amount of a wetting agent is that the materials can be kneaded into a mass by hands, the mass can be dispersed by pressing the mass with fingers, and the prepared soft material A is separated and stored;
s3, when the epoxy resin adhesive is needed, adding a proper amount of warm water at 25 ℃ into the separated and stored soft material A, mixing the soft material A and the warm water according to the weight ratio of 2-5: 1 in a container, and stirring for 3-8 minutes until the soft material A and the water are fully and uniformly mixed to obtain the epoxy resin pouring sealant.
5. The preparation method of the high-thermal-conductivity magnetic-shielding high-strength waterproof pouring sealant as claimed in claim 4, wherein in the step S2, the mixture is placed in a stirrer and stirred for 25 minutes, the mixture is stirred uniformly, and after the materials are mixed uniformly, polyurethane is slowly sprayed into the materials by a small spray can while stirring to increase the humidity of the materials, so that a soft material A is prepared.
6. The preparation method of the high-thermal-conductivity magnetic-shielding high-strength waterproof pouring sealant according to claim 4, wherein in the step S3, the mixture is stirred in a container for 5 minutes according to the weight ratio of the soft material A to the warm water of 3.5: 1.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114958265A (en) * | 2022-06-07 | 2022-08-30 | 株洲众为科技有限责任公司 | Method for improving electromagnetic shielding performance of pouring sealant for magnetic suspension motor and pouring sealant |
Citations (4)
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| CN101243151A (en) * | 2005-08-05 | 2008-08-13 | 3M创新有限公司 | Heat-transferring adhesive tape with improved functionality |
| CN102093806A (en) * | 2011-01-06 | 2011-06-15 | 黄柱联 | Coating or encapsulating material mixed with radiating graphite powder |
| CN103571215A (en) * | 2012-07-18 | 2014-02-12 | 天瑞企业股份有限公司 | High thermal conductivity and EMI sheltering high polymer composite material |
| CN109881038A (en) * | 2019-03-08 | 2019-06-14 | 深圳先进技术研究院 | A kind of thermally conductive electromagnetic shielding composite material and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114958265A (en) * | 2022-06-07 | 2022-08-30 | 株洲众为科技有限责任公司 | Method for improving electromagnetic shielding performance of pouring sealant for magnetic suspension motor and pouring sealant |
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