CN111040644A - Acrylate structural adhesive capable of being polymerized by photocatalysis - Google Patents
Acrylate structural adhesive capable of being polymerized by photocatalysis Download PDFInfo
- Publication number
- CN111040644A CN111040644A CN201811194193.3A CN201811194193A CN111040644A CN 111040644 A CN111040644 A CN 111040644A CN 201811194193 A CN201811194193 A CN 201811194193A CN 111040644 A CN111040644 A CN 111040644A
- Authority
- CN
- China
- Prior art keywords
- parts
- component
- structural adhesive
- mixture
- acrylate structural
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
Abstract
The invention relates to an acrylate structural adhesive capable of being polymerized by photocatalysis, which consists of a component A and a component B according to the volume ratio of 10: 1; the component A comprises the following components in parts by weight: 40-60 parts of acrylate monomer, 1-10 parts of methacrylic acid, 15-30 parts of toughened rubber, 15-25 parts of toughened filler, 0.5-5 parts of light latent amine, 0.05-0.2 part of stabilizer and 0.5-1 part of coupling agent; the component B comprises the following components in parts by weight: 20-50 parts of an oxidant, 20-40 parts of epoxy resin, 20-40 parts of a plasticizer, 2-10 parts of a filler and 0.05-1 part of a pigment; the acrylate structural adhesive has a photocatalytic polymerization function, can obviously accelerate the curing speed of the adhesive after being irradiated by UV light, can achieve the effect of quick curing, has the advantages of good toughness and good adhesion to aluminum alloy, magnesium alloy and various plastic alloys after being cured, and can be widely applied to the electronic assembly industry.
Description
Technical Field
The invention relates to an acrylate structural adhesive capable of being polymerized by photocatalysis and a preparation method thereof, belonging to the technical field of adhesives.
Background
The acrylate structural adhesive has the advantages of rapid curing at room temperature, good toughness, wide range of bonding materials and the like, and is widely applied to bonding structural members in industries such as electronic appliances and the like. Especially, the structure member assembly industry of the notebook set plays an irreplaceable role, and along with the increasing updating speed of the notebook industry, various novel structure member materials are also developed endlessly. The zinc alloy material is a material which is of great interest in the notebook computer assembly industry due to the advantages of low forming temperature, high processing precision, good surface quality, high production efficiency and the like.
The existing acrylate structural adhesive has the advantages of room temperature curing and high curing speed, but also has very obvious defects. In the existing high-precision and high-efficiency glue dispensing process, glue needs to be mixed by using a special glue mixing nozzle, and when glue discharging is stopped, the mixed glue in the nozzle can be polymerized and cured in a short time, so that the nozzle is scrapped; when the dispensing station is suspended, in order to maintain the available state of the glue, the glue nozzle is frequently replaced, or the glue is continuously discharged, so that waste and rapid rise of cost are easily caused. In order to overcome the defects of the existing acrylate structural adhesive, a acrylate structural adhesive capable of being polymerized by photocatalysis is developed, and the problem of waste is solved.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the acrylate structural adhesive capable of being polymerized by photocatalysis and the preparation method thereof.
The technical scheme for solving the technical problems is as follows:
an acrylate structural adhesive capable of being polymerized by photocatalysis consists of a component A and a component B according to the volume ratio of 10: 1;
wherein the component A comprises the following components in parts by weight: 40-60 parts of acrylate monomer, 1-10 parts of methacrylic acid, 15-30 parts of toughened rubber, 15-25 parts of toughened filler, 0.5-5 parts of light latent amine, 0.05-0.2 part of stabilizer and 0.5-1 part of coupling agent;
the component B comprises the following components in parts by weight: 20-50 parts of an oxidant, 20-40 parts of epoxy resin, 20-40 parts of a plasticizer, 2-10 parts of a filler and 0.05-1 part of a pigment.
The invention has the beneficial effects that: the acrylate structural adhesive has a photocatalytic polymerization function, can obviously accelerate the curing speed of the adhesive after being irradiated by UV light, can achieve the effect of quick curing, has the advantages of good toughness and good adhesion to aluminum alloy, magnesium alloy and various plastic alloys after being cured, and can be widely applied to the electronic assembly industry.
On the basis of the technical scheme, the invention can be further improved as follows.
The acrylate monomer is: one or more of ethoxylated bisphenol A dimethacrylate, tricyclodecane dimethanol diacrylate, methyl methacrylate, tetrahydrofuran methacrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate and 2-hydroxyethyl methacrylate phosphate.
The further scheme has the beneficial effect that the acrylate monomer with high molecular polarity and the acrylate monomer with low polarity are selected for compounding and use according to different molecular structures of the acrylate monomer. Because the solvent alcohol used for scrubbing the residual glue belongs to a molecular structure with stronger polarity, when the monomer is selected, the acrylate structural glue is preferably one or two of ethoxylated bisphenol A dimethacrylate and tricyclodecane dimethanol diacrylate with low molecular polarity. Considering that a monomer having a relatively high polarity is required for the bonding interface, one or a combination of hydroxyethyl methacrylate and hydroxypropyl methacrylate having a high molecular polarity is preferable.
Further, the toughened rubber is one or a mixture of more than two of chloroprene rubber, polybutadiene rubber, carboxyl-terminated acrylonitrile butadiene rubber (CTBN), vinyl-terminated acrylonitrile butadiene rubber (VTBN) and epoxy-terminated acrylonitrile butadiene rubber (ETBN).
The further scheme has the beneficial effects that the rubber with a double-bond structure is introduced, so that the toughness of the acrylate structural adhesive and the adhesive force to various polar substrates can be further improved while the rubber participates in a crosslinking and curing reaction.
Furthermore, the toughening filler is one or a mixture of more than two of ABS, MBS or SBS.
The further scheme has the beneficial effects that the toughening filler can increase the crosslinking density of a curing system and enhance the body strength of the glue layer.
Further, the light latent amine is carbamate light latent amine which can generate active amine after being irradiated by UV light, the active amine can catalyze and promote polymerization and curing of the acrylate structural adhesive, and the carbamate light latent amine comprises one or more than two of cyclohexyl- (2-nitrophenyl) carbamate (119137-03-0), cyclohexyl carbamate 1, 2-bis (4-methoxyphenyl) -2-oxyethyl ester (196599-80-1), 9-anthryl methyl-N-dicyclohexyl carbamate (1421440-13-2) and the like.
The further scheme has the beneficial effects that the light latent amine can generate active amine when irradiated by UV light, and the active amine can be used as an accelerant to effectively accelerate the reaction speed of the two components at room temperature after mixing, so that the cured material can reach the initial bonding strength within 3-5min, and the requirement of the assembly process for rapid positioning is met.
Further, the stabilizer is one or more of hydroquinone, p-tert-butyl catechol, ethylene diamine tetraacetic acid tetrasodium, p-hydroxyanisole, p-naphthoquinone or thiodiphenylamine.
The further scheme has the beneficial effect that the storage stability of the component A on temperature, metal ions and the like is prolonged on the premise of not influencing the curing speed and the curing degree.
Further, the coupling agent in the component A is one or a mixture of any more of gamma-aminopropyltriethoxysilane, gamma- (2, 3-epoxypropoxy) propyltrimethoxysilane, gamma-methacryloxypropyltrimethoxysilane, gamma-mercaptopropyltrimethylsilane, vinyltris (2-methoxyethoxy) silane and vinyltris (2-methoxyethoxy) silane.
The further scheme has the advantages that the stripping force of the adhesive layer to the bonding interface is improved, and the performances of high temperature and humidity resistance, salt mist resistance and the like are improved.
Further, the oxidant in the component B is: one or any mixture of benzoyl peroxide, lauroyl peroxide or cumene hydroperoxide. The epoxy resin is one or a mixture of E51 or E44. The plasticizer is one or a mixture of benzoate and phthalate.
In particular, the epoxy resin or plasticizer functions as an organic carrier, and is relatively stable system without reacting with an oxidizing agent. Benzoyl peroxide or lauroyl peroxide is a powdery particle, and in order to facilitate dispersion, a pretreatment method is adopted. The method comprises the following steps: weighing the oxidant and the organic carrier in a preset proportion, premixing and fully infiltrating, and then grinding for three times by three rollers.
Further, the filler in the component B is one or more of calcium powder, silicon micropowder or gas-phase silicon. The pigment is carbon black.
The further scheme has the beneficial effects that the selected inorganic filler can properly increase the glass transition temperature of a curing system while providing a certain viscosity and thixotropy for the component B, so that the temperature resistance of the glue is improved. The pigment selected by the component B is carbon black, the purpose is to distinguish the color of the component A, and the observation of the glue mixing condition of the two components in a glue mixer is facilitated.
In the technical scheme for solving the technical problems, the preparation method specifically comprises the following steps:
the preparation process of the component A comprises the step of cleaning a reaction kettle. Firstly, adding a certain proportion of acrylate monomers, methacrylic acid, toughened rubber and toughened filler, and stirring at a high speed for 1.5h until the materials are uniform and fine paste. Then adding the light latent amine, the stabilizer and the coupling agent in corresponding proportion in sequence, stirring at high speed for 1h, finally vacuumizing for 5min for defoaming, and discharging to obtain the finished product A component. In particular, the temperature of the materials in the reaction kettle is controlled to be 10-25 ℃ in the whole stirring process.
The preparation process of the component B comprises the steps of weighing a certain mass of oxidant, adding the oxidant into the epoxy resin in a corresponding proportion, and fully soaking for 24 hours. And (3) grinding the three rollers for three times, putting the materials into a clean reaction kettle, sequentially adding the plasticizer, the filler and the pigment in a corresponding proportion, vacuumizing for 5min for defoaming, and discharging to obtain a finished product B component. Particularly, the temperature of the materials is ensured to be controlled within the range of 10-25 ℃ in the whole three-roller grinding and stirring process.
Detailed Description
The principles and features of this invention are described below in conjunction with examples which are set forth to illustrate, but are not to be construed to limit the scope of the invention.
Example 1
The component A comprises the following components:
ethoxylated bisphenol a dimethacrylate: 220g
Methyl methacrylate: 280g
Hydroxyethyl methacrylate: 120g of
Methacrylic acid: 100g
2-hydroxyethyl methacrylate phosphate: 100g
Vinyl terminated nitrile rubber (VTBN): 140g
MBS ：260 g
Cyclohexyl- (2-nitrophenyl) carbamate: 30g of
Hydroquinone: 8.5g
Ethylenediaminetetraacetic acid tetrasodium salt: 12g of
Vinyltris (2-methoxyethoxy) silane: 35g of
The component B comprises the following components:
benzoyl peroxide: 60g of
Cumene hydroperoxide: 35g of
E51 ：180 g
Phthalic acid ester: 80g of
Silicon micropowder: 30g of
Carbon black: 3.5g
The preparation method comprises the following specific steps:
the preparation process of the component A comprises the step of cleaning a reaction kettle. Firstly, 220g of ethoxylated bisphenol A dimethacrylate, 280g of methyl methacrylate, 120g of hydroxyethyl methacrylate, 100g of methacrylic acid, 100g of 2-hydroxyethyl methacrylate phosphate, 140g of vinyl-terminated nitrile rubber and 260g of MBS are added, stirred at high speed for 1.5h until the materials are uniform and fine paste, then 30g of cyclohexyl- (2-nitrophenyl) carbamate, 8.5g of hydroquinone, 12g of tetrasodium ethylene diamine tetraacetate and 35g of vinyl tris (2-methoxyethoxy) silane are sequentially added, stirred at high speed for 1h, finally vacuumized for 5min for defoaming, and finally discharged to obtain the finished product A component. Particularly, in the whole stirring process, the temperature of materials in the reaction kettle is controlled to be 10-25 ℃;
the preparation process of the component B comprises the steps of weighing 60g of benzoyl peroxide and 35g of cumene hydroperoxide, adding the weighed materials into 180g E51, fully soaking for 24 hours, grinding the materials by three rollers for three times, putting the materials into a clean reaction kettle, sequentially adding 80g of phthalate, 30g of silicon micropowder and 3.5g of carbon black, finally vacuumizing for 5min for defoaming, and discharging to obtain the finished product of the component B. Particularly, the temperature of the materials is ensured to be controlled within the range of 10-25 ℃ in the whole three-roller grinding and stirring process.
Example 2
The component A comprises the following components:
tricyclodecane dimethanol diacrylate: 200g
Tetrahydrofuran methacrylate: 260g of
Hydroxyethyl methacrylate: 240g
Methacrylic acid: 80g of
2-hydroxyethyl methacrylate phosphate: 60g of
Carboxyl terminated nitrile rubber (CTBN): 150g
ABS ：300 g
Cyclohexyl carbamic acid 1, 2-bis (4-methoxyphenyl) -2-oxoethyl ester: 45g of
Triphenylphosphine: 15g of
P-tert-butylcatechol: 10g
Ethylenediaminetetraacetic acid tetrasodium salt: 12g of
Gamma-mercaptopropyltrimethylsilane: 35g of
The component B comprises the following components:
lauroyl peroxide: 100g
Cumene hydroperoxide: 30g of
E44 ：140 g
Benzoic acid ester: 120g of
Calcium powder: 40g of
Gas phase silicon: 25g of
Carbon black: 3.5g
The preparation method comprises the following specific steps:
the preparation process of the component A comprises the step of cleaning a reaction kettle. Firstly, 200g of tricyclodecane dimethanol diacrylate, 260g of tetrahydrofuran methacrylate, 240g of hydroxyethyl methacrylate, 80g of methacrylic acid, 60g of 2-hydroxyethyl methacrylate phosphate, 150g of carboxyl-terminated butadiene-acrylonitrile rubber (CTBN) and 360g of ABS are added, and the mixture is stirred at a high speed for 1.5 hours until the material is uniform and fine paste; and then adding 45g of cyclohexyl carbamic acid 1, 2-bis (4-methoxyphenyl) -2-oxyethyl ester, 15g of triphenylphosphine, 10g of p-tert-butyl catechol, 12g of tetrasodium ethylene diamine tetraacetate and 35g of gamma-mercaptopropyltrimethylsilane in sequence, stirring at a high speed for 1h, finally vacuumizing for 5min for defoaming, and discharging to obtain the finished product A component. Particularly, in the whole stirring process, the temperature of materials in the reaction kettle is controlled to be 10-25 ℃;
the preparation process of the component B comprises the steps of weighing 100g of lauroyl peroxide and 30g of cumene hydroperoxide, adding the weighed materials into 140g E44, fully soaking for 24 hours, grinding the materials by three rollers for three times, putting the materials into a clean reaction kettle, sequentially adding 120g of benzoate, 40g of silicon micropowder, 25g of gas phase silicon and 3.5g of carbon black, finally vacuumizing for 5 minutes, defoaming, and discharging to obtain the finished product of the component B. Particularly, the temperature of the materials is ensured to be controlled within the range of 10-25 ℃ in the whole three-roller grinding and stirring process.
Example 3
The component A comprises the following components:
methyl methacrylate: 360g
Tetrahydrofuran methacrylate: 200g
Hydroxypropyl methacrylate: 140g
Methacrylic acid: 120g of
Polybutadiene rubber: 180g
ABS ：140 g
SBS ：260 g
9-anthrylmethyl-N-dicyclohexylcarbamate: 36g of
Triphenylphosphine: 10g
For naphthoquinone: 10g
Ethylenediaminetetraacetic acid tetrasodium salt: 14g
Gamma-mercaptopropyl triethylsilane: 40g of
The component B comprises the following components:
benzoyl peroxide: 130g
E51 ：60 g
E44 ：80 g
Benzoic acid ester: 100g
Calcium powder: 60g of
Carbon black: 3.5g
The preparation method comprises the following specific steps:
the preparation process of the component A comprises the step of cleaning a reaction kettle. Firstly, 360g of methyl methacrylate, 200g of tetrahydrofuran methacrylate, 140g of hydroxypropyl methacrylate, 120g of methacrylic acid, 180g of polybutadiene rubber, 140g of ABS and 260g of SBS260g are added, and the mixture is stirred at a high speed for 1.5h until the mixture is uniform and fine paste; then adding 36g of 9-anthrylmethyl-N-dicyclohexyl carbamate, 10g of triphenylphosphine, 10g of para-naphthoquinone, 14g of ethylene diamine tetraacetic acid tetrasodium and 40g of gamma-mercaptopropyltriethylsilane in sequence, stirring at a high speed for 1h, finally vacuumizing for 5min for defoaming, and discharging to obtain the finished product A component. Particularly, in the whole stirring process, the temperature of materials in the reaction kettle is controlled to be 10-25 ℃;
the preparation process of the component B comprises the steps of weighing 130g of benzoyl peroxide, adding the benzoyl peroxide into a mixture of 60g E51 and 80g of E44, fully soaking for 24 hours, grinding the mixture three times by three rollers, putting the materials into a clean reaction kettle, sequentially adding 100g of benzoate, 60g of calcium powder and 3.5g of carbon black, finally vacuumizing for 5min to defoam, and discharging to obtain the finished product of the component B. Particularly, the temperature of the materials is ensured to be controlled within the range of 10-25 ℃ in the whole three-roller grinding and stirring process.
Example 4
The component A comprises the following components:
tricyclodecane dimethanol diacrylate: 160g
Hydroxyethyl methacrylate: 300g
Hydroxypropyl methacrylate: 240g
Methacrylic acid: 140g
Vinyl terminated nitrile rubber (VTBN): 180g
MBS ：180 g
SBS ：220 g
9-anthrylmethyl-N-dicyclohexylcarbamate: 48g
Ethylenediaminetetraacetic acid tetrasodium salt: 14g
Gamma-mercaptopropyl triethylsilane: 30g of
The component B comprises the following components:
benzoyl peroxide: 90g
Cumene hydroperoxide: 50g
E44 ：200 g
Phthalic acid ester: 100g
Silicon micropowder: 60g of
Carbon black: 3.5g
The preparation method comprises the following specific steps:
the preparation process of the component A comprises the step of cleaning a reaction kettle. Firstly, 160g of tricyclodecane dimethanol diacrylate, 300g of hydroxyethyl methacrylate, 240g of hydroxypropyl methacrylate, 140g of methacrylic acid, 180g of vinyl terminated butadiene-acrylonitrile rubber (VTBN), 180g of MBS and 220g of SBS are added, the mixture is stirred at a high speed for 1.5h until the material is uniform and fine paste, 48g of 9-anthryl methyl-N-dicyclohexyl carbamate, 14g of tetrasodium ethylene diamine tetraacetate and 30g of gamma-mercaptopropyl triethylsilane are sequentially added, the mixture is stirred at a high speed for 1h, finally the mixture is vacuumized for 5min and defoamed, and the finished product A component can be obtained after discharging. Particularly, in the whole stirring process, the temperature of materials in the reaction kettle is controlled to be 10-25 ℃;
the preparation process of the component B comprises the steps of weighing 90g of benzoyl peroxide and 50g of cumene hydroperoxide, adding the weighed materials into 200g E44, fully soaking for 24 hours, grinding the materials by three rollers for three times, putting the materials into a clean reaction kettle, sequentially adding 100g of phthalic acid ester, 60g of silicon micropowder and 3.5g of carbon black, finally vacuumizing for 5min for defoaming, and discharging to obtain the finished product of the component B. Particularly, the temperature of the materials is ensured to be controlled within the range of 10-25 ℃ in the whole three-roller grinding and stirring process.
Specific test verification
The performances of the acrylate structural adhesive samples of the embodiments 1 to 4 of the present invention and a common acrylate structural adhesive are verified through the following tests.
Test experiment 1: photocatalytic activity test, UV light wavelength: 365 nm; light intensity: 100mW/cm2(ii) a The irradiation time was 20 s.
Test experiment 2: the shear strength is determined according to the GB/T7128-2008 determination method
(the size of the test material galvanized aluminum plate vs. galvanized aluminum plate: 100 × 25 × 1.5 mm);
test experiment 3 the pull force test was carried out according to the method for determining GBT 6329-
(test material Zinc alloy binding sample vs acrylonitrile-butadiene-styrene copolymer/PC plastic alloy
Size: the former 50 × 25 × 2.5 mm the latter 300 × 40 × 1 mm);
remarks explanation:
1. in the above test experiments, the sample is placed in an environment of 25-30 ℃ for 2min after the glue spreading and sample preparation, and then hot pressed at 70 DEG C
The resulting mixture was allowed to stand at room temperature for 24 hours for a test of the drawing force (in which the pressure was simulated by holding the mixture between two iron clamps and the pressure was about 0.2 MPa).
2. The aging test conditions were:
high temperature and high humidity 85 ℃, 85% RH, 500 h; low-temperature storage at-40 deg.C for 500 hr
The test results are shown in table 1 below.
Table 1 comparative test results of the performance of the samples of examples 1-4 with conventional acrylate structural adhesives
As can be seen from Table 1, the acrylate structural adhesive capable of being polymerized by photocatalysis has longer gel time at room temperature when not being irradiated by light, and the gel time can be greatly shortened after being irradiated by UV light.
In addition, the acrylate structural adhesive capable of being polymerized by photocatalysis has good adhesive property to zinc alloy, and can still keep higher adhesive strength after high and low temperature aging tests. Can be widely applied to the electronic assembly industry.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention are included in the scope of the present invention.
Claims (5)
1. An acrylate structural adhesive capable of being polymerized by photocatalysis is characterized by consisting of a component A and a component B according to the volume ratio of 10: 1; the component A comprises the following components in parts by weight: 40-60 parts of acrylate monomer, 1-10 parts of methacrylic acid, 15-30 parts of toughened rubber, 15-25 parts of toughened filler, 0.5-5 parts of light latent amine, 0.05-0.2 part of stabilizer and 0.5-1 part of coupling agent; the component B comprises the following components in parts by weight: 20-50 parts of an oxidant, 20-40 parts of epoxy resin, 20-40 parts of a plasticizer, 2-10 parts of a filler and 0.05-1 part of a pigment;
the light latent amine is one or more of cyclohexyl- (2-nitrophenyl) carbamate, cyclohexyl carbamate 1, 2-bis (4-methoxyphenyl) -2-oxyethyl ester and 9-anthryl methyl-N-dicyclohexyl carbamate.
2. The acrylate structural adhesive according to claim 1, wherein the acrylate monomer is one or a mixture of two or more of ethoxylated bisphenol A dimethacrylate, tricyclodecane dimethanol diacrylate, methyl methacrylate, tetrahydrofuryl methacrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate and 2-hydroxyethyl methacrylate phosphate.
3. The acrylate structural adhesive according to claim 1, wherein the toughening rubber is one or more of chloroprene rubber, polybutadiene rubber, carboxyl-terminated nitrile rubber, vinyl-terminated nitrile rubber and epoxy-terminated nitrile rubber; the toughening filler is one or a mixture of more than two of ABS, MBS or SBS.
4. The acrylate structural adhesive according to claim 1, wherein the stabilizer is one or more of hydroquinone, p-tert-butylcatechol, tetrasodium ethylenediamine tetraacetate, p-hydroxyanisole, p-naphthoquinone or thiodiphenylamine; the coupling agent in the component A is one or a mixture of any more of gamma-aminopropyltriethoxysilane, gamma- (2, 3-epoxypropoxy) propyltrimethoxysilane, gamma-methacryloxypropyltrimethoxysilane, gamma-mercaptopropyltrimethylsilane, vinyl tris (2-methoxyethoxy) silane and vinyl tris (2-methoxyethoxy) silane.
5. The acrylate structural adhesive according to claim 1, wherein the oxidant in the component B is one or a mixture of any more of benzoyl peroxide, lauroyl peroxide or cumene hydroperoxide; the epoxy resin is one or a mixture of E51 and E44; the plasticizer is one or a mixture of benzoate and phthalate; the filler is one or more of calcium powder, silicon micropowder or gas-phase silicon; the pigment is carbon black.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811194193.3A CN111040644A (en) | 2018-10-15 | 2018-10-15 | Acrylate structural adhesive capable of being polymerized by photocatalysis |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811194193.3A CN111040644A (en) | 2018-10-15 | 2018-10-15 | Acrylate structural adhesive capable of being polymerized by photocatalysis |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111040644A true CN111040644A (en) | 2020-04-21 |
Family
ID=70230191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811194193.3A Pending CN111040644A (en) | 2018-10-15 | 2018-10-15 | Acrylate structural adhesive capable of being polymerized by photocatalysis |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111040644A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022106722A1 (en) * | 2020-11-23 | 2022-05-27 | Zephyros, Inc. | Acrylate structural adhesive free of mma |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008003250A (en) * | 2006-06-21 | 2008-01-10 | Sekisui Chem Co Ltd | Positive photosensitive resin composition, method for producing thin film pattern, and semiconductor device |
| CN101925616A (en) * | 2008-01-28 | 2010-12-22 | 巴斯夫欧洲公司 | Photolatent amidine bases for redox curing of radically curable formulations |
| CN104254581A (en) * | 2012-04-03 | 2014-12-31 | 3M创新有限公司 | Crosslinkable composition comprising photobase generators |
| JP2015007770A (en) * | 2013-05-29 | 2015-01-15 | 住友ベークライト株式会社 | Photosensitive resin composition, and electronic device |
| CN107603497A (en) * | 2017-09-18 | 2018-01-19 | 烟台德邦科技有限公司 | The acrylic ester structural adhesive that a kind of solvent resistant is cleaned |
| CN108129993A (en) * | 2017-12-14 | 2018-06-08 | 烟台德邦科技有限公司 | A kind of acrylate structural adhesive suitable for kirsite bonding |
-
2018
- 2018-10-15 CN CN201811194193.3A patent/CN111040644A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008003250A (en) * | 2006-06-21 | 2008-01-10 | Sekisui Chem Co Ltd | Positive photosensitive resin composition, method for producing thin film pattern, and semiconductor device |
| CN101925616A (en) * | 2008-01-28 | 2010-12-22 | 巴斯夫欧洲公司 | Photolatent amidine bases for redox curing of radically curable formulations |
| CN104254581A (en) * | 2012-04-03 | 2014-12-31 | 3M创新有限公司 | Crosslinkable composition comprising photobase generators |
| JP2015007770A (en) * | 2013-05-29 | 2015-01-15 | 住友ベークライト株式会社 | Photosensitive resin composition, and electronic device |
| CN107603497A (en) * | 2017-09-18 | 2018-01-19 | 烟台德邦科技有限公司 | The acrylic ester structural adhesive that a kind of solvent resistant is cleaned |
| CN108129993A (en) * | 2017-12-14 | 2018-06-08 | 烟台德邦科技有限公司 | A kind of acrylate structural adhesive suitable for kirsite bonding |
Non-Patent Citations (2)
| Title |
|---|
| KANJI SUYAMA ET AL.: "Photobase generators: Recent progress and application trend in polymer systems", 《PROGRESS IN POLYMER SCIENCE》 * |
| MASAMITSU SHIRAI ET AL.: "Photoacid and photobase generators: chemistry and applications to polymeric materials", 《PROGRESS IN POLYMER SCIENCE》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022106722A1 (en) * | 2020-11-23 | 2022-05-27 | Zephyros, Inc. | Acrylate structural adhesive free of mma |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108129993B (en) | Acrylate structural adhesive suitable for zinc alloy bonding | |
| KR101717462B1 (en) | Vinyl ester resin composition that contains polymer fine particles, process for production of same, and cured products of same | |
| CN107603497A (en) | The acrylic ester structural adhesive that a kind of solvent resistant is cleaned | |
| CN108359342A (en) | A kind of aqueous environment protection coating and its preparation method and application | |
| CN111073526A (en) | Fast-positioning two-component acrylate structural adhesive and preparation and use methods thereof | |
| CN1152085C (en) | Improved polymer composition | |
| CN1962793A (en) | Process for preparing acrylic acid emulsion adhesive for rubber | |
| CN110240868A (en) | A kind of acrylate adhesive | |
| TW202210598A (en) | Electrochemically debondable adhesive composition | |
| CN109777308A (en) | A kind of low-odor acrylate adhesive and preparation method thereof for horizontal ruler bonding | |
| CN111040644A (en) | Acrylate structural adhesive capable of being polymerized by photocatalysis | |
| JPH058638B2 (en) | ||
| CN110734718A (en) | high-strength low-odor double-component acrylate structural adhesive and preparation method thereof | |
| CN108794682B (en) | Normal-temperature ketone hydrazine self-crosslinking acrylic resin emulsion and preparation method and application thereof | |
| CN109503738A (en) | A kind of phosphoric acid modification polyisoprene rubber, polyisoprene rubber modified acrylic ester resin dispersion and preparation method and purposes | |
| CN110577804B (en) | Environment-friendly acrylate adhesive with low TVOC (total volatile organic compound) | |
| CN111040646A (en) | Acrylate adhesive of room-temperature fast-curing low-shrinkage hybrid system and preparation method thereof | |
| CN104403515B (en) | The preparation method of attapulgite load photosensitizer and ultraviolet-curing paint | |
| CN112724844B (en) | Acrylate adhesive suitable for full-flow plastic spraying process | |
| CN106632901A (en) | Preparation method of untreated fluorine-containing material adhesive | |
| CN109679509B (en) | Single-component UV-initiated fast-curing acrylate structural adhesive and preparation method thereof | |
| JP4263958B2 (en) | Method for producing copolymer latex for chipping-resistant water-borne coatings | |
| GB2163439A (en) | Adhesive bonding | |
| CN106674414A (en) | Acrylic resin and preparation method thereof | |
| CN113480953A (en) | Solvent-free environment-friendly chemical power supply sealant and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: No.3-3, Kaifeng Road, Yantai Development Zone, Shandong Province 264006 Applicant after: Yantai Debang Technology Co.,Ltd. Address before: No.3-3, Kaifeng Road, Yantai Development Zone, Shandong Province 264006 Applicant before: DARBOND TECHNOLOGY Co.,Ltd. |
|
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200421 |