CN111040443A - Polyamide powder material for selective laser sintering and preparation method thereof - Google Patents

Polyamide powder material for selective laser sintering and preparation method thereof Download PDF

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CN111040443A
CN111040443A CN201911376721.1A CN201911376721A CN111040443A CN 111040443 A CN111040443 A CN 111040443A CN 201911376721 A CN201911376721 A CN 201911376721A CN 111040443 A CN111040443 A CN 111040443A
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polyamide
laser sintering
selective laser
powder material
temperature
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谭锐
罗秋帆
李俭
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Hunan Farsoon High Tech Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/09Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098Metal salts of carboxylic acids
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00Materials specially adapted for additive manufacturing
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/003Additives being defined by their diameter
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives

Abstract

The invention provides a polyamide powder material for selective laser sintering, which comprises the following components in percentage by mass: 95 to 99.6 percent of polyamide, 0.1 to 3.0 percent of stearate, 0.2 to 1 percent of hydrophobic nano silicon dioxide and 0.1 to 1 percent of phosphite powder antioxidant. The polyamide powder material prepared by the method has good melt fluidity and reduced material crystallization temperature, can solve the problems of part warping and low material recycling rate of the material in a selective laser sintering process, and has good surface quality, high dimensional precision and excellent mechanical property.

Description

Polyamide powder material for selective laser sintering and preparation method thereof
Technical Field
The invention belongs to the technical field of additive manufacturing, and particularly relates to a polyamide powder material for selective laser sintering and a preparation method thereof.
Background
The selective laser sintering technology can prepare products with any complex structure within the size range, and is very effective for sample design and test in the research process and even small-batch manufacturing in the production process, but compared with the traditional process, the manufacturing method has some influences on precision and mechanical properties, and in many fields, particularly when manufacturing selective laser display samples, users pay great attention to the surface quality and the size precision of the selective laser sintering products.
Polyamide materials are one of the main raw materials for manufacturing three-dimensional objects by a selective laser sintering technology, however, in actual production, a selective laser sintering product of polyamide powder has the problems of poor surface quality, poor mechanical properties, low dimensional precision, low material recycling rate and the like, and the attractiveness, the use effect and the manufacturing cost are influenced. The reason for this problem is that besides the relation with the process parameters in the laser sintering process, the influence of the material properties on the quality of the sintered part is also very big, which is reflected in:
melt flowability of the polyamide powder material. In the selective laser sintering process, powder is melted after absorbing laser energy, a material is changed into a melt from solid powder, the single-layer sintering time is generally 10-60s, so the melt needs to be leveled in a sintering processing area in the period, otherwise, internal and surface defects of a workpiece are easily caused, and the surface quality and performance are influenced;
molecular weight of the polyamide powder material. The molecular weight of the material is a key factor influencing the mechanical property of the material, and the material has high molecular weight, more excellent mechanical property, especially more excellent toughness;
crystalline properties of polyamide powder materials. In the selective laser sintering process, the molten material may undergo a long cooling time, and due to non-uniformity of cooling, the material may cool at different rates at different locations, thereby causing non-uniform shrinkage. The crystallization temperature of the material is high, the temperature for starting the crystallization of the part is higher, and the larger the crystallinity of the material is, the larger the generated volume shrinkage is.
In selective laser sintering molding, the melt flow index of polyamide powder is one of key parameters influencing the surface quality, the size and the precision of a workpiece, the melt flow index is too low, the workpiece is easy to have the phenomena of orange peel, size shrinkage and the like, and meanwhile, the melt flow index of the powder (residual powder) which is not molded by selective laser sintering is reduced quickly, so that the recycling of the residual powder is influenced, and the reutilization property of the material is reduced; the crystallization temperature and the crystallinity of the material are key parameters influencing the dimensional accuracy of the workpiece, the material has high crystallization temperature and high crystallinity, the temperature of the sintered workpiece during the crystallization process is higher, the volume shrinkage generated by the crystallization is larger, the uneven shrinkage of the workpiece is larger, and the dimensional accuracy of the workpiece is reduced.
In the prior art, some methods can be adopted to improve the melt fluidity of the material, such as adding a plasticizer or reducing the molecular weight of polyamide powder, although the method improves the melt fluidity of the material and improves the processing performance of the material, the common plasticizer is generally a low molecular substance, so that the problems of low melting point and poor compatibility with powder materials exist, a new problem often appears in practical application, and the problem of reduction of the mechanical property of the material is caused by the improvement of the melt fluidity of the material due to the simple reduction of the molecular weight of the material; with regard to the crystallization properties, it is also possible to use methods by adding some additives, but these methods also tend to cause a great loss in the mechanical properties of the material, in particular in the toughness.
Disclosure of Invention
In order to solve the technical problems, the invention provides a polyamide powder material for selective laser sintering and a preparation method thereof.
The invention provides a polyamide powder material for selective laser sintering, which comprises the following components in percentage by mass: 95 to 99.6 percent of polyamide, 0.1 to 3.0 percent of stearate, 0.2 to 1 percent of hydrophobic nano silicon dioxide and 0.1 to 1 percent of phosphite powder antioxidant.
More preferably, the mass ratio of the polyamide to the stearate is 40-200: 1
Further preferably, the polyamide is one or more of PA12, PA1212, PA1012, PA1010, PA612, PA610, PA6, PA46, PA66, PA56, PA513 and PA 514.
Further preferably, the stearate comprises one or more of zinc stearate, calcium stearate, barium stearate, magnesium stearate and aluminum stearate.
Further preferably, the particle size of the hydrophobic nano-silica is in the range of 8-100nm
The invention also provides a preparation method of the polyamide powder material for selective laser sintering, which comprises the following steps:
(1) adding polyamide, a solvent and stearate into a high-pressure closed reaction kettle, continuously stirring and heating to 140-180 ℃ under the protection of inert gas, preserving heat for 30-60min, then cooling to room temperature at an average speed of 0.5-1.5 ℃/min, and obtaining polyamide powder with the particle size of 30-120 mu m after suction filtration, drying and screening;
(2) and mixing the polyamide powder, the hydrophobic nano-silica and the phosphite powder antioxidant at the rotating speed of 1000-1500rpm for 3-10min to prepare the polyamide powder material for selective laser sintering.
Further preferably, the solvent is one or more of methanol, ethanol, propanol, butanol, water and butanone.
Further preferably, the mass ratio of the polyamide to the solvent is 1: 4-10.
Further preferably, the temperature reduction process in step 1 is a two-stage temperature reduction: cooling with cooling water, in the first stage, reducing the temperature in the kettle to 60-90 deg.C at a cooling rate of 0.5-1.0 deg.C/min, and in the second stage, increasing the flow rate of cooling water, and reducing the temperature in the kettle to room temperature at 1.0-1.5 deg.C/min.
The invention also provides a preparation method of the polyamide powder material for selective laser sintering, which comprises the following steps:
(1) mixing polyamide and stearate at the speed of 200-800rpm for 10-60min, drying at the temperature of 70-90 ℃ for 60-240min, adding the mixture into a hopper of an extruder, wherein the extrusion temperature is 20-60 ℃ higher than the melting point of the polyamide, the screw rotation speed is 300-600rpm, granulating the extruded material, grinding the powder by a low-temperature freezing and crushing process at the crushing temperature of-80-130 ℃, drying and screening to obtain polyamide powder with the particle size of 30-120 mu m;
(2) and mixing the polyamide powder, the hydrophobic nano-silica and the phosphite powder antioxidant at the rotating speed of 1000-1500rpm for 3-10min to prepare the polyamide powder material for selective laser sintering.
The polyamide powder material for laser sintering provided by the invention has the following beneficial effects:
(1) the stearate is a low molecular substance with higher melting point and thermal stability, has the function of an intermolecular lubricant after being melted, can enhance the mutual movement among polyamide molecular chains and improve the melt fluidity of polyamide. Stearate is added in the preparation process of the polyamide powder, the stearate is embedded between high molecular chains in a dissolved or melted polyamide material, and the low molecular stearate can be used as a lubricant to reduce the friction force between the molecular chains, improve the motion capability of the molecular chains, improve the fluidity of the material at the molecular level, improve the melt fluidity of the powder material and improve the crystallization property of the material, so that the material can be crystallized at lower temperature and reduce the crystallinity of the material;
(2) because the stearate is embedded between polymer chains and forms a whole with the polyamide, the risk of two-phase separation does not exist in the using process, and the flowability of the powder is not influenced; the stearate has good chemical stability, cannot be decomposed due to high laser energy in the sintering process, is a permanent lubricant for the polyamide powder, can slow down the over-quick reduction of the melt flow index of the polyamide powder, improves the surface quality of a polyamide sintered product, and improves the reutilization property of a polyamide material so as to reduce the use cost of the material;
(3) according to the invention, the hydrophobic nano silicon dioxide is uniformly mixed with the polyamide powder, so that a layer of hydrophobic substance is attached to the outer surface of the polyamide powder, and the water absorption performance of the polyamide material is reduced; meanwhile, the hydrophobic nano silicon dioxide has a better effect on static electricity removal, so that the influence of static electricity on the powder in the storage and use process is reduced, and the fluidity of the powder is favorably maintained.
The invention also provides two preparation methods of the polyamide powder material for laser sintering, the preparation methods are simple and feasible, the cost is lower, the polyamide powder material prepared by the preparation method has good melt fluidity, the crystallization temperature of the material is reduced, the problems of part warping and low material recycling rate of the material in the selective laser sintering process can be solved, and sintered parts with good surface quality, high dimensional precision and excellent mechanical properties can be obtained.
Drawings
FIG. 1 is a DCS chart of examples 1-3 and comparative example 1 of the polyamide powder material for selective laser sintering according to the invention.
Detailed Description
The present invention is described in further detail below by way of specific examples.
Example 1
Adding 10kg of PA1212 material, 80kg of ethanol and 50g of calcium stearate into a 100L reaction kettle, introducing high-purity nitrogen until the pressure is 0.3MPa, starting stirring, heating to raise the temperature in the kettle to 150 ℃, and preserving the heat for 30min at the temperature; cooling with cooling water to 80 deg.C at a rate of 0.8 deg.C/min, increasing flow rate of cooling water to reduce temperature to room temperature, vacuum filtering, drying, and sieving to obtain 30-120 μmPA1212 powder;
6kg of PA1212 powder, 18g of hydrophobic silica with an average particle size of 20nm and 30g of antioxidant were put into a mixing device and mixed at 1200rpm for 5min to prepare a PA1212 powder material for selective laser sintering.
The prepared PA1212 powder material was sintered on a ST252, a hua-dao-ke apparatus using a standard material sinter pack.
Example 2
Adding 10kg of PA1212 material, 80kg of ethanol and 100g of calcium stearate into a 100L reaction kettle, introducing high-purity nitrogen until the pressure is 0.3MPa, starting stirring, heating to raise the temperature in the kettle to 150 ℃, and preserving the heat for 30min at the temperature; and then cooling with cooling water to reduce the temperature in the kettle to 80 ℃ at a cooling rate of 0.8 ℃/min, increasing the flow of the cooling water to reduce the temperature in the kettle to room temperature, and performing suction filtration, drying and screening to obtain 30-120 mu mPA1212 powder.
6kg of PA1212 powder, 18g of hydrophobic silica with an average particle size of 20nm and 30g of antioxidant were put into a mixing device and mixed at 1200rpm for 5min to prepare a PA1212 powder material for selective laser sintering.
The prepared PA1212 powder material was sintered on a ST252, a hua-dao-ke apparatus using a standard material sinter pack.
Example 3
Adding 10kg of PA1212 material, 80kg of ethanol and 150g of calcium stearate into a 100L reaction kettle, introducing high-purity nitrogen until the pressure is 0.3MPa, starting stirring, heating to raise the temperature in the kettle to 150 ℃, and preserving the heat for 30min at the temperature; and then cooling with cooling water to reduce the temperature in the kettle to 80 ℃ at a cooling rate of 0.8 ℃/min, increasing the flow of the cooling water to reduce the temperature in the kettle to room temperature, and performing suction filtration, drying and screening to obtain 30-120 mu mPA1212 powder.
6kg of PA1212 powder, 18g of hydrophobic silica with an average particle size of 20nm and 30g of antioxidant were put into a mixing device and mixed at 1200rpm for 5min to prepare a PA1212 powder material for selective laser sintering.
The prepared PA1212 powder material was sintered on a ST252, a hua-dao-ke apparatus using a standard material sinter pack.
Comparative example 1
Adding 10kg of PA1212 material and 80kg of ethanol into a 100L reaction kettle, introducing high-purity nitrogen until the pressure is 0.3MPa, starting stirring, heating to raise the temperature in the kettle to 150 ℃, and preserving the heat for 120min at the temperature; and then cooling by using cooling water, so that the temperature in the kettle is reduced to 80 ℃ at a cooling rate of 0.8 ℃/min, increasing the flow of the cooling water so that the temperature in the kettle is reduced to room temperature, and carrying out suction filtration, drying and screening to obtain the PA1212 powder material with the average particle size of 30-120 mu m.
6kg of PA1212 powder, 18g of hydrophobic silica with an average particle size of 20nm and 30g of antioxidant were put into a mixing device and mixed at 1200rpm for 5min to prepare a PA1212 powder material for selective laser sintering.
The prepared PA1212 powder material was sintered on a ST252, a hua-dao-ke apparatus using a standard material sinter pack.
Example 4
Adding 10kg of PA1212 material, 80kg of ethanol and 100g of barium stearate into a 100L reaction kettle, introducing high-purity nitrogen until the pressure is 0.3MPa, starting stirring, heating to raise the temperature in the kettle to 150 ℃, and preserving the heat for 30min at the temperature; and then cooling with cooling water to reduce the temperature in the kettle to 80 ℃ at a cooling rate of 0.8 ℃/min, increasing the flow of the cooling water to reduce the temperature in the kettle to room temperature, and performing suction filtration, drying and screening to obtain 30-120 mu mPA1212 powder.
6kg of PA1212 powder, 18g of hydrophobic silica with an average particle size of 20nm and 30g of antioxidant were put into a mixing device and mixed at 1200rpm for 5min to prepare a PA1212 powder material for selective laser sintering.
The prepared PA1212 powder material was sintered on a ST252, a hua-dao-ke apparatus using a standard material sinter pack.
Example 5
Adding 10kg of PA1212 material, 80kg of ethanol and 100g of zinc stearate into a 100L reaction kettle, introducing high-purity nitrogen until the pressure is 0.3MPa, starting stirring, heating to raise the temperature in the kettle to 150 ℃, and preserving the heat for 30min at the temperature; and then cooling with cooling water to reduce the temperature in the kettle to 80 ℃ at a cooling rate of 0.8 ℃/min, increasing the flow of the cooling water to reduce the temperature in the kettle to room temperature, and performing suction filtration, drying and screening to obtain 30-120 mu mPA1212 powder.
6kg of PA1212 powder, 18g of hydrophobic silica with an average particle size of 20nm and 30g of antioxidant were put into a mixing device and mixed at 1200rpm for 5min to prepare a PA1212 powder material for selective laser sintering.
The prepared PA1212 powder material was sintered on a ST252, a hua-dao-ke apparatus using a standard material sinter pack.
Example 6
Adding 10kg of PA6 material, 40kg of methanol, 40kg of deionized water and 100g of calcium stearate into a 100L reaction kettle, introducing high-purity nitrogen until the pressure is 0.3MPa, starting stirring, heating to raise the temperature in the kettle to 155 ℃, and preserving the heat for 30min at the temperature; cooling with cooling water to 70 deg.C at a rate of 0.5 deg.C/min, increasing the flow rate of cooling water to reduce the temperature to room temperature, vacuum filtering, drying, and sieving to obtain PA6 powder with average particle diameter of 30-120 μm.
6kg of PA6 powder, 18g of hydrophobic silicon dioxide with the average particle size of 20nm and 30g of antioxidant are put into a mixing device and mixed for 5min at the rotating speed of 1200rpm, and the PA6 powder material for selective laser sintering is prepared.
The prepared PA6 powder material was sintered on a ST252 equipment of the hua-dao family using a standard material sinter package.
Comparative example 2
Adding 10kg of PA6 material, 40kg of methanol and 40kg of deionized water into a 100L reaction kettle, introducing high-purity nitrogen until the pressure is 0.3MPa, starting stirring, heating to raise the temperature in the kettle to 155 ℃, and preserving the heat for 30min at the temperature; and then cooling by using cooling water, so that the temperature in the kettle is reduced to 70 ℃ at a cooling rate of 0.5 ℃/min, increasing the flow of the cooling water so that the temperature in the kettle is reduced to room temperature, and carrying out suction filtration, drying and screening to obtain the PA6 powder material with the average particle size of 30-120 mu m.
6kg of PA6 powder, 18g of hydrophobic silicon dioxide with the average particle size of 20nm and 30g of antioxidant are put into a mixing device and mixed for 5min at the rotating speed of 1200rpm, and the PA6 powder material for selective laser sintering is prepared.
The prepared PA6 powder material was sintered on a ST252 equipment of the hua-dao family using a standard material sinter package.
Example 7
Adding 10kg of PA66 material, 48kg of methanol, 32kg of deionized water, 100g of calcium stearate and 10g of 800-mesh titanium dioxide into a 100L reaction kettle, introducing high-purity nitrogen until the pressure is 0.3MPa, starting stirring, heating to raise the temperature in the kettle to 160 ℃, and preserving the heat for 30min at the temperature; cooling with cooling water to 70 deg.C at a rate of 0.5 deg.C/min, increasing flow rate of cooling water to reduce temperature to room temperature, vacuum filtering, drying, and sieving to obtain powder with particle size of 30-120 μmPA 66.
6kg of PA66 powder, 18g of hydrophobic silicon dioxide with the average particle size of 20nm and 30g of antioxidant are put into a mixing device and mixed for 5min at the rotating speed of 1200rpm, and the PA66 powder material for selective laser sintering is prepared.
The prepared PA66 powder material was sintered on a ST252 equipment of the hua-dao family using a standard material sinter package.
Comparative example 3
Adding 10kg of PA66 material, 48kg of methanol, 32kg of deionized water and 10g of 800-mesh titanium dioxide into a 100L reaction kettle, introducing high-purity nitrogen until the pressure is 0.3MPa, starting stirring, heating to raise the temperature in the kettle to 160 ℃, and preserving the heat for 30min at the temperature; and then cooling by using cooling water, so that the temperature in the kettle is reduced to 70 ℃ at a cooling rate of 0.5 ℃/min, increasing the flow of the cooling water so that the temperature in the kettle is reduced to room temperature, and carrying out suction filtration, drying and screening to obtain the PA66 powder material with the average particle size of 30-120 mu m.
6kg of PA66 powder, 18g of hydrophobic silicon dioxide with the average particle size of 20nm and 30g of antioxidant are put into a mixing device and mixed for 5min at the rotating speed of 1200rpm, and the PA66 powder material for selective laser sintering is prepared.
The prepared PA66 powder material was sintered on a ST252 equipment of the hua-dao family using a standard material sinter package.
Example 8
Mixing 10kg of PA1212 material and 100g of calcium stearate at the speed of 300rpm for 30min, drying at 80 ℃ for 120min, adding the mixture into a hopper of an extruder, setting the extrusion temperature at 220 ℃, rotating the screw at 450rpm, granulating the extruded material, grinding the material by a low-temperature freezing and crushing process at the crushing temperature of-100 ℃, and drying and screening the obtained powder to obtain PA1212 powder with the average particle size of 30-120 mu m.
6kg of PA1212 powder, 18g of hydrophobic silica with an average particle size of 20nm and 30g of antioxidant were put into a mixing device and mixed at 1200rpm for 5min to prepare a PA1212 powder material for selective laser sintering.
The prepared PA1212 powder material was sintered on a ST252, a hua-dao-ke apparatus using a standard material sinter pack.
Comparative example 4
Drying 10kg of PA1212 material at 80 ℃ for 120min, adding the dried material into a hopper of an extruder, setting the extrusion temperature at 220 ℃, setting the rotation speed of a screw at 450rpm, cutting the extruded material into particles, grinding the particles by a low-temperature freezing and crushing process at-100 ℃, and drying and screening the obtained powder to obtain the PA1212 powder material with the average particle size of 30-120 mu m.
6kg of PA1212 powder, 18g of hydrophobic silica with an average particle size of 20nm and 30g of antioxidant were put into a mixing device and mixed at 1200rpm for 5min to prepare a PA1212 powder material for selective laser sintering.
The prepared PA1212 powder material was sintered on a ST252, a hua-dao-ke apparatus using a standard material sinter pack.
Example 9
10kg of PA6 material and 100g of calcium stearate are mixed for 30min at the speed of 300rpm, dried for 120min at the temperature of 80 ℃, then added into a hopper of an extruder, the extrusion temperature is set to be 260 ℃, the screw rotation speed is 450rpm, the extruded material is granulated, ground by a low-temperature freezing and crushing process, the crushing temperature is-110 ℃, and then the obtained powder is dried and sieved to obtain PA6 powder with the average particle size of 30-120 mu m.
6kg of PA6 powder, 18g of hydrophobic silicon dioxide with the average particle size of 20nm and 30g of antioxidant are put into a mixing device and mixed for 5min at the rotating speed of 1200rpm, and the PA6 powder material for selective laser sintering is prepared.
The prepared PA6 powder material was sintered on a ST252 equipment of the hua-dao family using a standard material sinter package.
Comparative example 5
Drying 10kg of PA6 material at 80 ℃ for 120min, adding the material into a hopper of an extruder, setting the extrusion temperature at 260 ℃, setting the rotation speed of a screw at 450rpm, granulating the extruded material, grinding the material by a low-temperature freezing and crushing process at-110 ℃, and drying and screening the obtained powder to obtain the PA6 powder material with the average particle size of 30-120 mu m.
6kg of PA6 powder, 18g of hydrophobic silicon dioxide with the average particle size of 20nm and 30g of antioxidant are put into a mixing device and mixed for 5min at the rotating speed of 1200rpm, and the PA6 powder material for selective laser sintering is prepared.
The prepared PA6 powder material was sintered on a ST252 equipment of the hua-dao family using a standard material sinter package.
Example 10
10kg of PA66 material and 100g of calcium stearate are mixed for 30min at the speed of 300rpm, dried for 120min at the temperature of 80 ℃, then added into a hopper of an extruder, the extrusion temperature is set to 3000 ℃, the screw rotation speed is 450rpm, the extruded material is granulated, ground by a low-temperature freezing and crushing process, the crushing temperature is-110 ℃, and then the obtained powder is dried and sieved to obtain PA66 powder with the average particle size of 30-120 mu m.
6kg of PA66 powder, 18g of hydrophobic silicon dioxide with the average particle size of 20nm and 30g of antioxidant are put into a mixing device and mixed for 5min at the rotating speed of 1200rpm, and the PA66 powder material for selective laser sintering is prepared.
The prepared PA66 powder material was sintered on a ST252 equipment of the hua-dao family using a standard material sinter package.
Comparative example 6
Drying 10kg of PA66 material at 80 ℃ for 120min, adding the material into a hopper of an extruder, setting the extrusion temperature at 300 ℃, setting the rotation speed of a screw at 450rpm, granulating the extruded material, grinding the material by a low-temperature freezing and crushing process at-110 ℃, and drying and screening the obtained powder to obtain the PA66 powder material with the average particle size of 30-120 mu m.
6kg of PA66 powder, 18g of hydrophobic silicon dioxide with the average particle size of 20nm and 30g of antioxidant are put into a mixing device and mixed for 5min at the rotating speed of 1200rpm, and the PA66 powder material for selective laser sintering is prepared.
The prepared PA66 powder material was sintered on a ST252 equipment of the hua-dao family using a standard material sinter package.
DCS tests were carried out on examples 1 to 3 and comparative example 1, respectively, and as shown in FIG. 1, melt flow index tests were carried out on the polyamide powder materials for selective laser sintering prepared in examples 1 to 10 and comparative examples 1 to 6, respectively; testing the mechanical property and the surface roughness of the workpiece of the national standard sample strips sintered in the examples 1-10 and the comparative examples 1-6 respectively; the sintered powders of examples 1 to 10 and comparative examples 1 to 6 were subjected to the melt flow index test as shown in Table 1.
TABLE 1 Property test data of Polyamide powder Material for Selective laser sintering and sintered workpiece thereof
Figure BDA0002341160380000081
It can be seen from table 1 that, in the same milling process, after stearate is added, the melt index of the new powder is increased, which is helpful for the mechanical properties and surface quality of the fabricated part, the crystallization temperature of the material is decreased, the warpage and dimensional accuracy of the fabricated part are improved, and the melt index of the remaining powder is also increased, which is beneficial for the recycling of the material and the maintenance of the mechanical properties of the material.

Claims (10)

1. The polyamide powder material for selective laser sintering comprises the following components in percentage by mass: 95 to 99.6 percent of polyamide, 0.1 to 3.0 percent of stearate, 0.2 to 1 percent of hydrophobic nano silicon dioxide and 0.1 to 1 percent of phosphite powder antioxidant.
2. The polyamide powder material for selective laser sintering according to claim 1, wherein the mass ratio of the polyamide to the stearate is 40-200: 1
3. The polyamide powder material for selective laser sintering according to claim 2, wherein the polyamide is one or more of PA12, PA1212, PA1012, PA1010, PA612, PA610, PA6, PA46, PA66, PA56, PA513 and PA 514.
4. The polyamide powder material for selective laser sintering according to claim 3, wherein the stearate comprises one or more of zinc stearate, calcium stearate, barium stearate, magnesium stearate, and aluminum stearate.
5. The polyamide powder material for selective laser sintering according to claim 4, wherein the particle size of the hydrophobic nano silica is in the range of 8-100 nm.
6. A preparation method of a polyamide powder material for selective laser sintering is characterized by comprising the following steps:
(1) adding polyamide, a solvent and stearate into a high-pressure closed reaction kettle, continuously stirring and heating to 140-180 ℃ under the protection of inert gas, preserving heat for 30-60min, then cooling to room temperature at an average speed of 0.5-1.5 ℃/min, and obtaining polyamide powder with an average particle size of 30-120 mu m after suction filtration, drying and screening;
(2) and mixing the polyamide powder, the hydrophobic nano-silica and the phosphite powder antioxidant at the rotating speed of 1000-1500rpm for 3-10min to prepare the polyamide powder material for selective laser sintering.
7. The method for preparing polyamide powder material for selective laser sintering according to claim 6, wherein the solvent is one or more of methanol, ethanol, propanol, butanol, water and butanone.
8. The method for preparing a polyamide powder material for selective laser sintering according to claim 7, wherein the mass ratio of the polyamide to the solvent is 1: 4-10.
9. The method for preparing polyamide powder material for selective laser sintering according to claim 8, wherein the cooling process in step 1 is a two-stage cooling process: cooling with cooling water, wherein the temperature in the kettle is reduced to 60-90 deg.C at a cooling rate of 0.5-1.0 deg.C/min in the first stage, and the flow rate of cooling water is increased in the second stage to rapidly reduce the temperature in the kettle to room temperature.
10. A preparation method of a polyamide powder material for selective laser sintering is characterized by comprising the following steps:
(1) mixing polyamide and stearate at the speed of 200-800rpm for 10-60min, drying at the temperature of 70-90 ℃ for 60-240min, adding the mixture into a hopper of an extruder, wherein the extrusion temperature is 20-60 ℃ higher than the melting point of the polyamide, the screw rotation speed is 300-600rpm, granulating the extruded material, grinding the powder by a low-temperature freezing and crushing process at the crushing temperature of-80-130 ℃, drying and screening to obtain polyamide powder with the average particle size of 30-120 mu m;
(2) and mixing the polyamide powder, the hydrophobic nano-silica and the phosphite powder antioxidant at the rotating speed of 1000-1500rpm for 3-10min to prepare the polyamide powder material for selective laser sintering.
CN201911376721.1A 2019-12-27 2019-12-27 Polyamide powder material for selective laser sintering and preparation method thereof Pending CN111040443A (en)

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