CN111036533A

CN111036533A - Solder filtering device

Info

Publication number: CN111036533A
Application number: CN201811188599.0A
Authority: CN
Inventors: 姚力军; 潘杰; 王学泽; 丁向前
Original assignee: Hefei Jiangfeng Electronic Material Co ltd
Current assignee: Hefei Jiangfeng Electronic Material Co ltd
Priority date: 2018-10-12
Filing date: 2018-10-12
Publication date: 2020-04-21

Abstract

A solder filtering device comprising: the filter comprises a filter part and a filter part, wherein the filter part comprises at least one filter unit, the filter unit comprises a fixing piece and a mesh screen, the surface of the fixing piece is provided with a cavity penetrating through the thickness of the fixing piece, and the mesh screen is arranged in the cavity; a collecting part located at a bottom of the filtering part, a top surface of the collecting part having a receiving groove. Utilize solder filter equipment can convenient and fast realize the purification of solder, and purifying effect is good.

Description

Solder filtering device

Technical Field

The invention relates to the technical field of semiconductor manufacturing, in particular to a solder filtering device.

Background

The sputtering coating belongs to one of the processes for preparing thin films by a physical vapor deposition method, and particularly relates to a method for forming a thin film by bombarding the surface of a target by using high-energy particles so that target atoms or molecules obtain enough energy to escape and deposit on the surface of a base material or a workpiece.

The back plate has good electric conduction and heat conduction performance and can also play a role in fixing and supporting, so the target material needs to be welded with the back plate before film coating and then assembled to the sputtering base station together.

In the process of welding the target and the back plate, the surface of the target and the surface of the back plate need to be coated with solder, the surface of the target and the surface of the back plate need to be subjected to infiltration treatment by using ultrasonic waves, then the target is placed on the back plate, and the welding of the target and the back plate can be completed after the solder is cooled.

In the process of the welding process, when the target is subjected to the infiltration treatment and placed on the back plate, the excessive solder often overflows from the surface of the target and the surface of the back plate and drips onto a workbench for the welding process. To save costs, the solder on the work table needs to be recycled for use in the next soldering process.

However, the solder dropped on the table contains impurities, and the soldering effect is affected by recovering the solder as it is and putting it into use.

Disclosure of Invention

The invention aims to provide a solder filtering device which can conveniently and quickly realize the purification of solder and has good purification effect.

To solve the above problems, the present invention provides a solder filtering apparatus, comprising: the filter comprises a filter part and a filter part, wherein the filter part comprises at least one filter unit, the filter unit comprises a fixing piece and a mesh screen, the surface of the fixing piece is provided with a cavity penetrating through the thickness of the fixing piece, and the mesh screen is arranged in the cavity; a collecting part located at a bottom of the filtering part, a top surface of the collecting part having a receiving groove.

Optionally, the solder filtering apparatus further includes: a cooling part located at a bottom of the collecting part, a top surface of the cooling part having a groove.

Optionally, the surface of the side wall of the groove is provided with two through holes penetrating through the side wall of the groove, and the two through holes are respectively located at two sides of the groove.

Optionally, the number of the filter units is multiple, and the multiple filter units are stacked.

Optionally, the mesh screens of a plurality of the filter units have different pore sizes.

Optionally, the pore size of the mesh screen of the filter unit gradually decreases from the top to the bottom of the filter portion.

Optionally, the number of the filter units is three, and the first filter unit, the second filter unit and the third filter unit are sequentially arranged from the top to the bottom of the filter part.

Optionally, the pore size of the first filtering unit is 1.5mm, the pore size of the second filtering unit is 1mm, and the pore size of the third filtering unit is 0.5 mm.

Optionally, the mesh screen is located at the bottom of the fixture.

Optionally, the solder filtering device is an indium solder filtering device.

Compared with the prior art, the technical scheme of the invention has the following advantages:

in the technical scheme of the solder filtering device provided by the invention, the solder filtering device comprises a filtering part and a collecting part, wherein the filtering part comprises at least one filtering unit, the filtering unit comprises a fixing part and a mesh screen, the surface of the fixing part is provided with a cavity penetrating through the thickness of the fixing part, and the mesh screen is arranged in the cavity. And solder is poured into the cavity of the fixing piece, and impurities in the solder can be filtered by utilizing the mesh screen. The collecting part is located at the bottom of the filtering part and is used for collecting the solder filtered by the mesh screen, and the filtered solder flows into the accommodating groove located on the top surface of the collecting part. Utilize solder filter equipment can convenient and fast realize the purification of solder, and purifying effect is good.

In an alternative aspect, the solder filter apparatus further includes: a cooling part located at a bottom of the collecting part, a top surface of the cooling part having a groove. The cooling part is suitable for cooling the solder in the accommodating tank, the groove is used for storing cold water, and the solder is subjected to heat exchange with the cold water through the bottom wall of the accommodating tank, so that the solder is rapidly cooled.

In an alternative scheme, the mesh screens of the plurality of filtering units are different in pore size and are respectively used for filtering out impurities with different particle sizes in the solder, so that different kinds of impurities in the solder are removed, and the purification of the solder is realized.

In an alternative scheme, the pore size of the mesh screen of the filtering unit is gradually reduced from the top to the bottom of the filtering part, so that the filtering unit gradually refines the welding flux to remove impurities with different particle sizes in the welding flux, and the purifying effect of the filtering part is ensured. In addition, large-particle impurities in the solder are firstly filtered, and then small-particle impurities in the solder are filtered, so that the purification efficiency is improved, and the situation that the large-particle impurities and the small-particle impurities are blocked and left on the same mesh screen to cause mesh blockage of the mesh screen and influence on the speed of the solder passing through the mesh screen is avoided.

Drawings

FIG. 1 is a schematic diagram of a solder filter apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic view of a first filter unit of the solder filter apparatus shown in FIG. 1;

FIG. 3 is a schematic view of a second filter unit of the solder filter apparatus shown in FIG. 1;

FIG. 4 is a schematic view of a third filter unit of the solder filter apparatus shown in FIG. 1;

FIG. 5 is a schematic view of the construction of the collection portion of the solder filter apparatus shown in FIG. 1;

FIG. 6 is a schematic view of the cooling portion of the solder filter apparatus shown in FIG. 1;

fig. 7 is a schematic structural view of a solder collecting apparatus.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

Referring to fig. 1, a solder filtering apparatus 100 includes a filtering portion 200 and a collecting portion 300. The filtering portion 200 includes at least one filtering unit, the filtering unit includes a fixing member and a mesh screen, the surface of the fixing member has a cavity penetrating through the thickness of the fixing member, and the mesh screen is disposed in the cavity. The collecting part 300 is located at the bottom of the filtering part 200.

The solder filtering device 100 is suitable for purifying the solder recovered from the workbench for welding the target material and the back plate, so as to improve the welding effect of the solder, facilitate reuse and contribute to reducing the cost.

In this embodiment, the solder filter device 100 is an indium solder filter device. The solder is an indium solder, and the target is an aluminum target. In the process of welding the target and the back plate, the surface of the target coated with the solder and the surface of the back plate are subjected to wetting treatment by using ultrasonic waves, so that part of the solder is oxidized, and the recovered solder contains indium oxide. In addition, in the soaking treatment process, part of the aluminum material on the surface of the aluminum target is affected by the ultrasonic waves and is doped into the solder, so that a small amount of aluminum powder is also contained in the solder, and part of the aluminum powder is oxidized to form aluminum oxide in the soaking treatment process, so that the solder also contains aluminum oxide impurities.

In this embodiment, the number of the filter units is plural, and the plural filter units are stacked.

The plurality of filtering units can realize layer-by-layer filtering of impurities in the solder, and the purifying effect is improved.

In this embodiment, the mesh screens of the plurality of filtering units have different pore sizes to be respectively used for filtering out impurities with different particle sizes in the solder, so as to remove different types of impurities in the solder and realize purification of the solder.

In this embodiment, from the top to the bottom of the filter portion, the pore size of the mesh screen of the filter unit is gradually reduced, so that the filter unit gradually refines the filter of the solder, thereby removing impurities with different particle sizes in the solder and ensuring the purification effect of the filter portion. In addition, large-particle impurities in the solder are firstly filtered, and then small-particle impurities in the solder are filtered, so that the purification efficiency is improved, and the situation that the large-particle impurities and the small-particle impurities are blocked and left on the same mesh screen to cause mesh blockage of the mesh screen and influence on the speed of the solder passing through the mesh screen is avoided.

In this embodiment, the number of the filter units is three. In other embodiments, the number of the filter units may also be one, two or more than three.

In this embodiment, the three filter units are a first filter unit 210, a second filter unit 220 and a third filter unit 230 in sequence from the top to the bottom of the filter part 200.

Referring to fig. 2, the first filtering unit 210 includes a first fixing member 211 and a first mesh 212, a surface of the first fixing member 211 has a first cavity 213 penetrating through a thickness of the first fixing member 211, and the first mesh 212 is disposed in the first cavity 213.

The first filtering unit 210 is adapted to filter indium oxide impurity particles in the solder.

In this embodiment, the first fixing member 211 is cylindrical, and the inner wall of the first cavity 213 is cylindrical. In other embodiments, the first fixing member may also have a prism shape.

In this embodiment, the surface of the first mesh 212 is perpendicular to the central axis of the first cavity 213. The edge of the first mesh 212 is connected to the inner wall of the first chamber 213.

In this embodiment, the grid shape of the first mesh 212 is a square, and the side length of the square grid is 1.5 mm. If the side length of the square mesh is too large, the indium oxide particles easily pass through the first mesh screen 212, so that the first filter unit 210 loses the filtering effect on the indium oxide impurities in the solder. If the side length of the square mesh is too small, various impurities in the solder are accumulated on the first mesh screen 212, so that the speed of the solder passing through the first mesh screen 212 is slow, and the purification efficiency is affected.

In other embodiments, the mesh shape of the first mesh screen may also be circular, and the aperture size of the circular mesh is 1.5 mm. In addition, the mesh shape of the first mesh screen may also be rectangular.

In this embodiment, the first mesh 212 is located at the bottom of the first fixing member 211.

The first mesh screen 212 is located at the bottom of the first fixing member 211, so that a first accommodating chamber is defined by the inner wall of the first cavity 213 and the first mesh screen 212, the solder is poured into the first cavity 213, and the first accommodating chamber provides a space for the solder to be filtered by the first mesh screen 212, so that the solder can be prevented from overflowing due to insufficient accommodating space, the filtering efficiency can be improved, and the waste of the solder caused by the overflow of the solder can be prevented.

Referring to fig. 3, the second filtering unit 220 includes a second fixing member 221 and a second mesh 222, the surface of the second fixing member 221 has a second cavity 223 penetrating the thickness of the second fixing member 221, and the second mesh 222 is disposed in the second cavity 223.

The second filtering unit 220 is adapted to filter alumina foreign particles in the recovered solder.

In this embodiment, the second fixing member 221 is cylindrical, and the inner wall of the second cavity 223 is formed to be cylindrical. In other embodiments, the second fixing member may also have a prism shape.

In this embodiment, the size of the second fixing member 221 is the same as that of the first fixing member 211 (refer to fig. 2), and the radius of the second cavity 223 is equal to that of the first cavity 213 (refer to fig. 2), so that the solder flowing out of the first filter unit 210 flows into the second filter unit 220.

In this embodiment, the surface of the second mesh screen 222 is perpendicular to the central axis of the second cavity 223. The edge of the second mesh screen 222 is connected to the inner wall of the second chamber 223.

In this embodiment, the mesh shape of the second mesh 222 is circular, and the diameter of the circular mesh is 1 mm. If the diameter of the circular grids is too large, alumina particles easily pass through the circular grids, and the filtering effect of the second mesh screen 222 on alumina impurities in the solder is affected. If the diameter of the circular mesh is too small, the rate of the solder passing through the second mesh 222 is slow, affecting the efficiency of the operation.

In other embodiments, the mesh shape of the second mesh screen may also be square or rectangular.

In this embodiment, the second mesh 222 is located at the bottom of the second fixing member 221, and the inner wall of the second cavity 223 and the second mesh 222 form a second accommodating cavity, so as to provide a space for the solder to be filtered by the second mesh 222, and prevent the solder from overflowing.

Referring to fig. 4, the third filtering unit 230 includes a third fixing member 231 and a third mesh 232, the surface of the third fixing member 231 has a third cavity 233 penetrating the thickness of the third fixing member 231, and the third mesh 232 is disposed in the third cavity 233.

The third filtering unit 230 is adapted to filter aluminum foreign particles in the recovered solder.

In this embodiment, the size of the third fixing member 231 is the same as that of the second fixing member 221 (refer to fig. 3), and the radius of the third cavity 233 is equal to that of the second cavity 223 (refer to fig. 3), so that the solder flowing out of the second filter unit 220 completely flows into the third filter unit 230.

In this embodiment, the surface of the third mesh 232 is perpendicular to the central axis of the third cavity 233. The edge of the third mesh 232 is connected to the inner wall of the third chamber 233.

In this embodiment, the mesh shape of the third mesh 232 is circular, and the diameter of the circular mesh is 0.5 mm. If the diameter of the circular meshes is too large, aluminum particles easily pass through the circular meshes, and the filtering effect of the third mesh screen 232 on aluminum impurities in the solder is affected. If the diameter of the circular mesh is too small, the rate of the solder passing through the third mesh 232 is slow, which affects the work efficiency.

In other embodiments, the mesh shape of the third mesh screen may also be square or rectangular.

In this embodiment, the third mesh 232 is located at the bottom of the third fixing element 231, and the inner wall of the third cavity 233 and the third mesh 232 enclose a third accommodating cavity, so as to provide a space for the solder to be filtered by the third mesh 232, and prevent the solder from overflowing.

In this embodiment, the first filtering unit 210, the second filtering unit 220 and the third filtering unit 230 are stacked. In other embodiments, the combination mode of the filtering units can be flexibly selected according to the impurity condition contained in the solder to be recovered. For example, the filter unit includes only the first filter unit and the second filter unit. Therefore, the assembly mode of the filter part has elasticity, and various options can be provided.

Referring to fig. 5, the collecting part 300 has a receiving groove 310 on a top surface thereof, and the collecting part 300 is adapted to collect the solder purified by the filter part 200.

In this embodiment, the collecting part 300 has a cylindrical shape, and the size of the collecting part 300 is the same as that of the first filter unit 210. The inner wall of the receiving groove 310 is formed in a cylindrical shape, and the bottom wall surface of the receiving groove 310 is lower than the top surface of the collecting part 300.

The collecting part 300 is located at the bottom of the filter part 200, and the solder purified by the first filter unit 210 (refer to fig. 1), the second filter unit 220 (refer to fig. 1) and the third filter unit 230 (refer to fig. 1) finally flows into the receiving groove 310.

Referring to fig. 1 and 6, the solder filtering apparatus 100 further includes: a cooling part 400, the cooling part 400 being located at the bottom of the collecting part 300, the cooling part 400 having a groove 401 on the top surface thereof.

The cooling part 400 is adapted to cool the solder in the receiving groove 310 so as to store the solder.

In this embodiment, the cooling part 400 has a cylindrical shape, and the size of the cooling part 400 is the same as that of the collecting part 300. In other embodiments, the outer wall diameter of the cooling portion may also be greater than the outer wall diameter of the collecting portion.

The grooves 401 are used to store cold water with which the solder is heat-exchanged through the bottom wall of the receiving groove 310 (refer to fig. 5), so that the solder is rapidly cooled.

In this embodiment, the surface of the sidewall of the groove 401 has two through holes 410 penetrating through the sidewall of the groove 401, and the two through holes 410 are respectively located at two sides of the groove 401.

In this embodiment, the solder filter apparatus 100 further includes: a water pipe (not shown) is disposed in the groove 401 in a winding manner, and the through hole 410 is suitable for two ends of the water pipe to pass through.

Cold water circulates in the water pipe, and the cold water can continuously absorb heat of the solder in the accommodating groove 310 (refer to fig. 5), so that the cooling speed of the solder can be increased.

In summary, the solder filtering device 100 can conveniently and rapidly purify the solder, and has a good purifying effect.

Fig. 7 is a schematic structural view of a solder collecting apparatus 500.

The solder collecting device 500 comprises a collecting box body 510, a baffle 530 and a handle 540, wherein the collecting box body 510 is provided with a collecting cavity 520 on the top surface, and an opening 521 is formed on the side wall of the collecting cavity 520. The blocking piece 530 is disposed on the sidewall of the collecting chamber 520, and the blocking piece 530 can move up and down relative to the collecting box 510 to open or close the opening 521. The handle 540 is disposed on the top surface of the collection box 510, and the sidewall of the collection box 510 at the bottom of the handle 540 is opposite to the sidewall of the opening 521.

The solder collecting device 500 is used for collecting the solder on the workbench of the welding target and the back plate. In the process of welding the target and the back plate, the welding flux is generally heated by the worktable to melt the welding flux, so that the welding flux on the worktable is in a liquid state and can be collected by the welding flux collecting device 500 without reheating.

The solder on the work table is uniformly received in the collection chamber 520, and the opening 521 is closed by the stopper 530 to prevent the solder from flowing out.

After the solder collecting device 500 collects all the solder on the workbench, the solder collecting device 500 is moved to the upper part of the solder filtering device 100 (refer to fig. 1), the baffle 530 is moved to open the opening 521, the solder in the collecting cavity 520 flows out from the opening 521 and is received by the solder filtering device 100, and the solder filtering device 100 purifies the solder.

Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A solder filtering device, comprising:

the filter comprises a filter part and a filter part, wherein the filter part comprises at least one filter unit, the filter unit comprises a fixing piece and a mesh screen, the surface of the fixing piece is provided with a cavity penetrating through the thickness of the fixing piece, and the mesh screen is arranged in the cavity;

a collecting part located at a bottom of the filtering part, a top surface of the collecting part having a receiving groove.

2. The solder filter apparatus of claim 1, further comprising: a cooling part located at a bottom of the collecting part, a top surface of the cooling part having a groove.

3. The solder filtering device according to claim 2, wherein the recess side wall surface has through holes penetrating the recess side wall, and the number of the through holes is two, respectively located on both sides of the recess.

4. The solder filtering device according to claim 1, wherein the number of the filtering units is plural, and plural filtering units are stacked.

5. The solder filtering device according to claim 4, wherein the mesh screens of a plurality of the filter units have different pore sizes.

6. The solder filtering device according to claim 5, wherein the mesh screen of the filter unit is gradually reduced in pore size from the top to the bottom of the filter portion.

7. The solder filtering device according to claim 6, wherein the number of the filtering units is three, and the first filtering unit, the second filtering unit and the third filtering unit are arranged in sequence from the top to the bottom of the filtering portion.

8. The solder filtering device according to claim 7, wherein the first filter unit has a pore size of 1.5mm, the second filter unit has a pore size of 1mm, and the third filter unit has a pore size of 0.5 mm.

9. The solder filtering device of claim 1, wherein the mesh screen is located at a bottom of the fixture.

10. The solder filter apparatus of claim 1, wherein the solder filter apparatus is an indium solder filter apparatus.