CN111031415A - Loudspeaker module and electronic device - Google Patents
Loudspeaker module and electronic device Download PDFInfo
- Publication number
- CN111031415A CN111031415A CN201911157620.5A CN201911157620A CN111031415A CN 111031415 A CN111031415 A CN 111031415A CN 201911157620 A CN201911157620 A CN 201911157620A CN 111031415 A CN111031415 A CN 111031415A
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- China
- Prior art keywords
- layer
- module
- alloy layer
- module housing
- shell
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
Abstract
The invention provides a loudspeaker module and an electronic device, wherein the loudspeaker module comprises a module shell with a cavity and a loudspeaker single body accommodated in the cavity, an embedded part is combined on the module shell corresponding to the loudspeaker single body, and the embedded part comprises a first alloy layer, a damping layer and a second alloy layer which are sequentially arranged. The module shell has the characteristics of high temperature resistance, high hardness, adjustable damping and the like.
Description
Technical Field
The present invention relates to the field of acoustic technologies, and in particular, to a speaker module and an electronic device having the speaker module.
Background
At present, the expansion of consumer electronics market makes a large number of mobile phones and notebook computers widely used, and the acoustic device has a wide demand as an important acoustic component in consumer electronics products. With the demands of consumer electronic products for light and thin appearance and more excellent performance, the sound generating device as an important component unit of such products also puts forward higher and higher demands on performance, size, safety, etc.
The structure of the steel sheet of moulding plastics is usually adopted to current speaker module shell, and the steel sheet adopts single stainless steel material usually, and its main defect that exists includes: the physical properties of the steel sheet and the injection molding piece are obviously different, resonance frequency points are also different, so that the bonding strength of the steel sheet and the injection molding piece cannot be guaranteed, the strength of the module shell is low, resonance is easy to generate, the resonance problem of the front sound cavity is caused, and the product is poor in high-frequency sound effect and short in service life.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a speaker module and an electronic device, so as to solve the problems of poor high-frequency sound effect and short service life of the conventional speaker module housing due to low strength and easy generation of resonance.
The invention provides a loudspeaker module, which comprises a module shell with a cavity and a loudspeaker monomer accommodated in the cavity, wherein an embedded part is combined on the module shell corresponding to the loudspeaker monomer; the embedding part comprises a first alloy layer, a damping layer and a second alloy layer which are sequentially arranged.
Preferably, the first alloy layer and/or the second alloy layer is at least one of a copper alloy layer, an aluminum alloy layer, a titanium alloy layer, a nickel alloy layer, and an aluminum magnesium alloy layer.
In addition, the first alloy layer and/or the second alloy layer preferably includes at least one element selected from the group consisting of aluminum, magnesium, copper, titanium, and nickel.
In addition, it is preferable that the first alloy layer and the second alloy layer are made of the same material or different materials.
In addition, the preferred structure is that the damping layer is at least one layer of silica gel layer, silicone rubber layer, polyurethane layer, polyvinyl chloride layer, epoxy resin layer, rubber layer, foam layer, paint layer and foam plastic layer.
In addition, the silica gel layer preferably includes at least one material selected from butyl, acrylate, polysulfide, and nitrile.
In addition, the preferred structure is that the module shell comprises an upper module shell and a lower module shell which are connected in an adaptive manner; the corresponding embedding parts are arranged at the positions of the module upper shell and the module lower shell corresponding to the loudspeaker monomers.
Further, it is preferable that a trapezoidal concave structure is provided in the middle of the embedded portion.
In addition, the embedded part is preferably provided with a combination part embedded in the injection part; a limit groove is arranged on the combining part; wherein, the limiting groove is a continuous positioning groove surrounding the combining part; or the limiting groove is at least two positioning grooves which are arranged on the combining part at intervals.
According to another aspect of the present invention, there is provided an electronic device including the speaker module as described in any one of the above.
Utilize above-mentioned speaker module and electron device, set up the embedding part of module shell into three layer construction, first alloy-layer, damping layer and second alloy-layer promptly, this three layer construction not only can improve the bulk strength and the heat dispersion of module shell, can also effectively reduce the preceding sound chamber resonance of speaker, reduces high-frequency distortion, product simple structure, long service life, stable performance.
To the accomplishment of the foregoing and related ends, one or more aspects of the invention comprise the features hereinafter fully described. The following description and the annexed drawings set forth in detail certain illustrative aspects of the invention. These aspects are indicative, however, of but a few of the various ways in which the principles of the invention may be employed. Further, the present invention is intended to include all such aspects and their equivalents.
Drawings
Other objects and results of the present invention will become more apparent and more readily appreciated as the same becomes better understood by reference to the following description taken in conjunction with the accompanying drawings. In the drawings:
fig. 1 is a schematic view of a module housing structure of a module housing according to an embodiment of the present invention;
fig. 2 is a partial structural view of an insertion portion of a module housing according to an embodiment of the invention.
Wherein the reference numerals include: the structure comprises an injection part 1, an embedded part 2, a first alloy layer 21, a damping layer 22, a second alloy layer 23 and a concave structure 3.
The same reference numbers in all figures indicate similar or corresponding features or functions.
Detailed Description
In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.
To describe the module housing structure of the present invention in detail, embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
Fig. 1 shows a schematic structure of a module case according to an embodiment of the present invention; fig. 2 shows a partial schematic structure of an insertion portion of a module case according to an embodiment of the present invention.
As shown in fig. 1 and fig. 2, the speaker module according to the embodiment of the present invention includes a module housing having a cavity, and a speaker unit accommodated in the cavity; an embedded part 2 is combined on the module shell corresponding to the position of the loudspeaker monomer; the embedded part 2 includes a first alloy layer, a damping layer, and a second alloy layer, which are sequentially disposed.
Specifically, the module housing may include an upper module housing and a lower module housing (not shown) adapted to be connected to the upper module housing; the insertion part may be provided on the module upper case and/or the module lower case, and the case where the insertion part is provided on the module upper case will be explained as an example below.
The module upper shell further comprises an injection molding part 1 fixed with the module lower shell and an embedded part 2 embedded in the injection molding part 1, and the embedded part 2 corresponds to the arrangement position of the loudspeaker monomer; the embedded part 2 comprises a first alloy layer 21, a damping layer 22 and a second alloy layer 23 which are sequentially arranged, and the module shell can have the characteristics of high hardness, low density, difficult oxidation, good heat dissipation, good electromagnetic shielding effect and the like through the matching of the alloy layers (the first alloy layer 21 and the second alloy layer 23, the same below) and the damping layer 22.
Specifically, the first alloy layer 21 and/or the second alloy layer 23 may be at least one or a combination of a copper alloy layer, an aluminum alloy layer, a titanium alloy layer, a nickel alloy layer, and an aluminum magnesium alloy layer; for example, the first alloy layer 21 may be a copper alloy layer, or a bonding layer in which a copper alloy layer is bonded to a titanium alloy layer or other layers, and the second alloy layer 23 has a structure similar to that of the first alloy layer 21.
In one embodiment of the present invention, the material of the first alloy layer 21 and/or the second alloy layer 23 includes at least one element or a combination of a plurality of elements selected from aluminum, magnesium, copper, titanium, and nickel, in other words, the first alloy layer 21 and/or the second alloy layer 23 has a single-layer structure, but one or more metal materials are added to the first alloy layer 21 and/or the second alloy layer 23. For example, aluminum is used as the main element of the first alloy layer 21 and/or the second alloy layer 23, and then a certain amount of magnesium or other metal material is added to increase the hardness of the upper shell of the module.
It is understood that the first alloy layer 21 and the second alloy layer 23 may be made of the same material/metal layer (copper alloy layer, aluminum alloy layer, titanium alloy layer, nickel alloy layer, aluminum magnesium alloy layer, or the like, hereinafter the same), or the first alloy layer 21 and the second alloy layer 23 may be made of different materials/metal layers, and the provision of the alloy layers greatly improves the pressure resistance and the electromagnetic shielding performance of the module upper case.
In another embodiment of the present invention, the damping layer 22 located between the two alloy layers can be selected from at least one or a combination of a silicone layer, a silicone rubber layer, a polyurethane layer, a polyvinyl chloride layer, an epoxy resin layer, a rubber layer, a foam layer, a paint layer, and a foam layer; further, the silica gel layer comprises at least one material or a plurality of materials of butyl, acrylate, polysulfide and butyronitrile. The damping layer 22 can adjust the damping characteristic of the upper shell of the module, so that the high-frequency sound effect of the loudspeaker module is improved, and the high-frequency distortion is reduced.
In the specific implementation, since the embedded part 2 needs to secure sufficient mechanical strength, it is preferable that the thicknesses of the first alloy layer 21 and the second alloy layer 23 occupy 2/3 or more of the entire thickness of the embedded part 2, and if the ratio is less than this, insufficient strength is likely to be caused. The thickness of the damping layer 22 located in the middle can be flexibly adjusted according to actual conditions.
It should be noted that, in order to reduce the influence of the module housing on the acoustic cavity of the speaker module, a trapezoidal recessed structure 3 may be further disposed on the embedding portion 2, and when the module upper housing is assembled with the module lower housing, the recessed structure 3 is recessed toward a side close to the module lower housing.
Further, the insertion part 2 in the module case of the present invention is configured as a non-planar structure of other structures, for example, the cross section of the module upper case is configured as a wave structure or a zigzag structure, and the assembly stress during the assembly of the module upper case and the module lower case is offset by the module upper case having a special shape, thereby improving the strength of the module upper case.
In another embodiment of the present invention, a combination part (not shown in the figures) embedded in the injection part 1 is disposed on the embedding part 2, and in order to improve the connection firmness between the combination part and the injection part 1, a limit groove or a limit bend may be disposed on the combination part; wherein, the limiting groove is arranged as a continuous positioning groove surrounding the combining part; or the limiting groove is at least two positioning grooves which are arranged on the combining part at intervals.
Corresponding to the module shell, the invention also provides an electronic device which comprises the loudspeaker module; the loudspeaker module comprises the module shell and a loudspeaker single body contained in the module shell.
Therefore, the loudspeaker module provided by the invention has the advantages that the module shell has high hardness, low density, high temperature resistance, difficulty in oxidation and good heat dissipation performance, the damping characteristic of a product can be adjusted through the module shell, the electromagnetic shielding effect of the module shell is good, and the front sound cavity resonance of the product can be reduced, so that the high-frequency sound effect of the product is improved, and the high-frequency distortion is reduced.
The speaker module and the electronic device according to the present invention are described above by way of example with reference to fig. 1 and 2. However, it should be understood by those skilled in the art that various modifications can be made to the speaker module and the electronic device of the present invention without departing from the scope of the invention. Therefore, the scope of the present invention should be determined by the contents of the appended claims.
Claims (10)
1. A loudspeaker module comprises a module shell with a cavity and a loudspeaker single body accommodated in the cavity; it is characterized in that the preparation method is characterized in that,
an embedded part is combined on the module shell corresponding to the position of the loudspeaker single body;
the embedding part comprises a first alloy layer, a damping layer and a second alloy layer which are sequentially arranged.
2. The module housing of claim 1,
the first alloy layer and/or the second alloy layer is at least one of a copper alloy layer, an aluminum alloy layer, a titanium alloy layer, a nickel alloy layer and an aluminum magnesium alloy layer.
3. The module housing of claim 1,
the material of the first alloy layer and/or the second alloy layer comprises at least one element of aluminum, magnesium, copper, titanium and nickel.
4. The module housing according to claim 2 or 3,
the first alloy layer and the second alloy layer are made of the same or different materials.
5. The module housing of claim 1,
the damping layer is at least one of a silica gel layer, a silicone rubber layer, a polyurethane layer, a polyvinyl chloride layer, an epoxy resin layer, a rubber layer, a foam layer, a coating layer and a foam plastic layer.
6. The module housing of claim 5,
the silica gel layer comprises at least one material of butyl, acrylate, polysulfide and butyronitrile.
7. The module housing of claim 1,
the module shell comprises an upper module shell and a lower module shell which are connected in an adaptive manner;
the module epitheca with the module inferior valve corresponds the free position of speaker all sets up corresponding embedding portion.
8. The module housing of claim 1,
and a trapezoidal concave structure is arranged in the middle of the embedded part.
9. The module housing according to claim 1, wherein a coupling portion embedded in the injection molded portion is provided on the embedding portion; wherein the content of the first and second substances,
a limiting groove is arranged on the combining part;
the limiting groove is a continuous positioning groove surrounding the combining part; alternatively, the first and second electrodes may be,
the limiting groove is at least two positioning grooves which are arranged on the combining part at intervals.
10. An electronic device comprising a speaker module according to any one of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911157620.5A CN111031415A (en) | 2019-11-22 | 2019-11-22 | Loudspeaker module and electronic device |
| PCT/CN2020/126906 WO2021098529A1 (en) | 2019-11-22 | 2020-11-06 | Loudspeaker module and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911157620.5A CN111031415A (en) | 2019-11-22 | 2019-11-22 | Loudspeaker module and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111031415A true CN111031415A (en) | 2020-04-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911157620.5A Pending CN111031415A (en) | 2019-11-22 | 2019-11-22 | Loudspeaker module and electronic device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111031415A (en) |
| WO (1) | WO2021098529A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021098529A1 (en) * | 2019-11-22 | 2021-05-27 | 歌尔股份有限公司 | Loudspeaker module and electronic device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0065882A2 (en) * | 1981-05-26 | 1982-12-01 | Celestion International Limited | Radiating domes for loudspeakers |
| CN103428590A (en) * | 2012-05-18 | 2013-12-04 | 周巍 | Shielding casing for moving-iron type loudspeaker or receiver |
| CN205195972U (en) * | 2015-10-21 | 2016-04-27 | 歌尔声学股份有限公司 | Loudspeaker module group |
| CN206237563U (en) * | 2016-10-27 | 2017-06-09 | 东莞泉声电子有限公司 | Novel vibrating sound pick-up |
| CN107708032A (en) * | 2017-10-17 | 2018-02-16 | 李傲 | One kind electromagnetic shielding high tone quality sound equipment |
| CN108156573A (en) * | 2016-12-02 | 2018-06-12 | 阿米纳音响（深圳）有限公司 | A kind of assembly method for stealthy sound equipment frame |
| CN208386928U (en) * | 2018-06-28 | 2019-01-15 | 歌尔科技有限公司 | Loudspeaker mould group and electroacoustic transducer |
| CN109940960A (en) * | 2019-01-28 | 2019-06-28 | 江苏澳盛复合材料科技有限公司 | A kind of one-pass molding composite panel and the notebook computer casing as made from the plate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111031415A (en) * | 2019-11-22 | 2020-04-17 | 歌尔股份有限公司 | Loudspeaker module and electronic device |
-
2019
- 2019-11-22 CN CN201911157620.5A patent/CN111031415A/en active Pending
-
2020
- 2020-11-06 WO PCT/CN2020/126906 patent/WO2021098529A1/en active Application Filing
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0065882A2 (en) * | 1981-05-26 | 1982-12-01 | Celestion International Limited | Radiating domes for loudspeakers |
| CN103428590A (en) * | 2012-05-18 | 2013-12-04 | 周巍 | Shielding casing for moving-iron type loudspeaker or receiver |
| CN205195972U (en) * | 2015-10-21 | 2016-04-27 | 歌尔声学股份有限公司 | Loudspeaker module group |
| CN206237563U (en) * | 2016-10-27 | 2017-06-09 | 东莞泉声电子有限公司 | Novel vibrating sound pick-up |
| CN108156573A (en) * | 2016-12-02 | 2018-06-12 | 阿米纳音响（深圳）有限公司 | A kind of assembly method for stealthy sound equipment frame |
| CN107708032A (en) * | 2017-10-17 | 2018-02-16 | 李傲 | One kind electromagnetic shielding high tone quality sound equipment |
| CN208386928U (en) * | 2018-06-28 | 2019-01-15 | 歌尔科技有限公司 | Loudspeaker mould group and electroacoustic transducer |
| CN109940960A (en) * | 2019-01-28 | 2019-06-28 | 江苏澳盛复合材料科技有限公司 | A kind of one-pass molding composite panel and the notebook computer casing as made from the plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021098529A1 (en) * | 2019-11-22 | 2021-05-27 | 歌尔股份有限公司 | Loudspeaker module and electronic device |
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| Publication number | Publication date |
|---|---|
| WO2021098529A1 (en) | 2021-05-27 |
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Application publication date: 20200417 |