CN111031154A - Electronic device and temperature acquisition device - Google Patents
Electronic device and temperature acquisition device Download PDFInfo
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- CN111031154A CN111031154A CN201911253887.4A CN201911253887A CN111031154A CN 111031154 A CN111031154 A CN 111031154A CN 201911253887 A CN201911253887 A CN 201911253887A CN 111031154 A CN111031154 A CN 111031154A
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- temperature information
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
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- Engineering & Computer Science (AREA)
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Abstract
The embodiment of the application provides electronic equipment and temperature acquisition equipment. The electronic device includes a housing, a connection interface, and a first temperature sensor. The shell comprises a mounting hole; the connecting interface is arranged in the mounting hole; first temperature sensor set up in the surface of casing, first temperature sensor with connect interface electric connection for with the first temperature information transmission of gathering extremely connect the interface. Through setting up the first temperature sensor at electronic equipment's surface of the casing, can directly acquire the first temperature information with the surface of the casing of user contact, first temperature sensor transmits the first temperature information of its collection for electronic equipment through the original interface of connecting of electronic equipment, can provide accurate surface of the casing's first temperature information.
Description
Technical Field
The present application relates to the field of electronic technologies, and in particular, to an electronic device and a temperature acquisition device.
Background
At present, electronic equipment such as handheld equipment like mobile phones is smaller and smaller, the integration level is higher and higher, and the functions provided by the electronic equipment are more and more powerful, so that the problem of heat generation in the electronic equipment is more and more serious, and the electronic equipment needs to control the temperature of the electronic equipment to protect the electronic equipment and prevent users from being scalded. The electronic device is in contact with the user, namely, the temperature of the electronic device shell has the greatest influence on the user. The electronic equipment obtains the temperature inside the electronic equipment, and then the temperature of the shell is calculated by combining a preset formula measured in a laboratory, the electronic equipment shares the problem that the shell is calculated by using the preset formula under different environments, and the calculated temperature of the shell is inaccurate under many environments.
Disclosure of Invention
The embodiment of the application provides electronic equipment and temperature acquisition equipment, and the temperature of an electronic equipment shell can be acquired more accurately.
An embodiment of the present application provides an electronic device, which includes:
a housing including a mounting hole;
the connecting interface is arranged in the mounting hole; and
the first temperature sensor is arranged on the outer surface of the shell and electrically connected with the connecting interface, and is used for transmitting the collected first temperature information to the connecting interface.
The embodiment of the present application further provides a temperature obtaining apparatus, which includes:
the first temperature sensor is arranged on the outer surface of the electronic equipment and used for acquiring first temperature information of the outer surface of the electronic equipment;
and the transmission chip is electrically connected with the first temperature sensor, is used for electrically connecting with a connection interface of the electronic equipment, is used for acquiring the first temperature information, and transmits the acquired first temperature information to the electronic equipment through the connection interface.
In the embodiment of the application, through setting up the first temperature sensor at electronic equipment's surface of the casing, can directly acquire the first temperature information with the surface of the casing of user contact, first temperature sensor transmits the first temperature information of its collection for electronic equipment through the original interface of connecting of electronic equipment, can provide the first temperature information of accurate surface of the casing, and electronic equipment can acquire the first temperature information of accurate surface of the casing through connecting the interface.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below.
Fig. 1 is a first structural schematic diagram of an electronic device according to an embodiment of the present application.
Fig. 2 is a second schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 3 is a third schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 4 is a fourth schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 5 is a fifth structural schematic diagram of an electronic device according to an embodiment of the present application.
Fig. 6 is a sixth schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 7 is a seventh structural schematic diagram of an electronic device according to an embodiment of the present application.
Fig. 8 is a schematic structural diagram of a first temperature obtaining apparatus according to an embodiment of the present application.
Fig. 9 is a schematic structural diagram of a second temperature obtaining apparatus according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present application.
The embodiment of the application provides electronic equipment. The electronic device may be a smart phone, a tablet computer, or other devices, and may also be a game device, an AR (Augmented Reality) device, an automobile device, a data storage device, an audio playing device, a video playing device, a notebook computer, a desktop computing device, or other devices.
In order to improve the heat generation of the electronic device, the temperature of the electronic device is controlled within a reasonable range, and various schemes can be adopted. Some of these solutions are directed to controlling the heat generation of the processor of the electronic device, and some require control depending on the temperature of the outer surface of the housing of the electronic device. Since the skin of the user directly contacts the outer surface of the housing of the electronic device during the use of the electronic device, and the sensed temperature is also the outer surface temperature of the housing of the electronic device, it is necessary to acquire the outer surface temperature of the housing of the electronic device and control the heat generating source (a functional module with serious heat generation) of the electronic device according to the outer surface temperature of the housing of the electronic device.
The electronic equipment provided by the embodiment of the application can acquire the accurate temperature of the outer surface of the shell of the electronic equipment. Taking an electronic device as a mobile phone as an example, please refer to fig. 1, and fig. 1 is a schematic view of a first structure of the electronic device according to an embodiment of the present disclosure. The electronic device 10 includes a housing 120, a connection interface 140, and a first temperature sensor 160.
The housing 120 of the electronic device 10 may include a mounting hole 122. The mounting hole 122 may extend through the housing 120, and it is also understood that the mounting hole 122 communicates between the inside and the outside of the electronic apparatus 10.
The connection interface 140 is disposed at the mounting hole 122, and the connection interface 140 may be used to connect with other external devices.
The first temperature sensor 160 may be a thermocouple temperature sensor, a thermal resistance temperature sensor, or the like. For example, the temperature sensor may be a negative temperature coefficient resistor (NTC resistor). The first temperature sensor 160 is disposed on the outer surface 124 of the housing 120, and the first temperature sensor 160 can be used to obtain first temperature information of the outer surface 124 of the housing 120 (e.g., a temperature value of the outer surface 124 of the housing 120). The first temperature sensor 160 may be electrically connected to the connection interface 140 and configured to transmit the collected first temperature information to the connection interface 140. The first temperature information collected by the first temperature sensor 160 at the outer surface 124 of the housing 120 may be transmitted to the connection interface 140 and transmitted to other functional modules within the electronic device 10 through the connection interface 140.
The electronic device 10 of this embodiment can acquire the first temperature information of the outer surface 124 of the housing 120 through the first temperature sensor 160 in different environments, the first temperature sensor 160 transmits the acquired first temperature information to the electronic device 10 through the original connection interface 140 of the electronic device 10, so that accurate first temperature information of the outer surface 124 of the housing 120 can be provided, and the electronic device 10 can acquire accurate first temperature information of the outer surface 124 of the housing 120 through the connection interface 140.
After the electronic device 10 accurately obtains the first temperature information of the outer surface 124 of the housing 120, the temperature of the electronic device 10 can be controlled according to the first temperature information. For example, after the first temperature information exceeds the temperature threshold, the power consumption of the sub-modules inside the electronic device 10 may be reduced, so as to reduce the heat generation inside the electronic device 10 and reduce the temperature of the electronic device 10.
Referring to fig. 2, fig. 2 is a second structural schematic diagram of an electronic device according to an embodiment of the present disclosure. The electronic device 10 may further include a heat generating module 126 located in the housing 120, where the heat generating module 126 generates heat to raise the ambient temperature, and the heat generating module 126 may be understood as a heat generating source in the electronic device 10. The heat generation module 126 may be a main Chip (CPU), an image processing chip (GPU), or the like. The temperature of the outer surface 124 of the housing 120 of the electronic device 10 is mainly influenced by the heat generating module 126, the orthographic projection of the heat generating module 126 on the outer surface 124 of the housing 120 at least partially coincides with the first temperature sensor 160, and the highest temperature of the outer surface 124 of the housing 120 can be obtained by obtaining the temperature of the outer surface 124 of the housing 120 through the first temperature sensor 160 at least partially arranged opposite to the heat generating module 126.
Referring to fig. 3, fig. 3 is a third structural schematic diagram of an electronic device according to an embodiment of the present disclosure. The electronic device 10 also includes a processor 180. The processor 180 is electrically connected to the connection interface 140 and configured to receive the first temperature information transmitted to the connection interface 140. The processor 180 receives the first temperature information sent by the first temperature sensor 160 through the connection interface 140, and after the processor 180 obtains the first temperature information, the processor 180 may control the temperature of the electronic device 10 according to a pre-stored temperature control strategy. For example, the processor 180 may reduce the temperature of the electronic device 10 by controlling at least one of a frequency of a main chip CPU of the electronic device 10, a frequency of an image processing chip GPU, a display backlight, a frame rate of the display, a loudness of a speaker, and the like.
The first temperature information collected by the first temperature sensor 160 may be directly transmitted to the processor 180 through the connection interface 140. The first temperature information collected by the first temperature sensor 160 may also be transmitted to the processor 180 by other means. Specifically, referring to fig. 4, fig. 4 is a schematic diagram of a fourth structure of the electronic device according to the embodiment of the present disclosure. The electronic device 10 further includes a transmission chip 170, the transmission chip 170 is disposed outside the housing 120, the transmission chip 170 is electrically connected to the first temperature sensor 160 and is configured to acquire the first temperature information acquired by the first temperature sensor 160, and the transmission chip 170 is electrically connected to the processor 180 through the connection interface 140 and is configured to transmit the acquired first temperature information to the processor 180.
Illustratively, the connection interface 140 is a headphone interface, and the transmission chip 170 is configured to convert the first temperature information into a digital audio signal and transmit the digital audio signal to the processor 180 through the headphone interface. The earphone interface can be a 3.5 mm earphone interface, and can be an earphone interface with other structures. The earphone interface may include a ground pin, a microphone pin, a left channel pin, and a right channel pin, and the processor 180 may receive a digital audio signal sent by the transmission chip 170 through the microphone pin, where the digital audio signal is obtained by converting the transmission chip 170 according to the first temperature information of the outer surface 124 of the casing 120 collected by the first temperature sensor 160.
The first temperature sensor comprises a signal pin, the connection interface comprises an input pin, and the signal pin of the first temperature sensor is electrically connected with the input pin of the connection interface. After the first temperature sensor acquires the first temperature information, the first temperature information is sent out through a signal pin of the first temperature sensor, and an input pin of a connection interface of the electronic equipment receives the first temperature information and transmits the first temperature information to a corresponding functional module in the electronic equipment.
The transmission chip and the first temperature sensor can be powered by an external power supply (such as a mobile power supply), and the transmission chip and the first temperature sensor can also be powered by electronic equipment, namely, power pins of the first temperature sensor and the transmission chip are electrically connected with power pins of the electronic equipment. For example, the power supply pin of the connection interface is electrically connected, or the power supply pin of other interfaces of the electronic device is electrically connected.
For example, please refer to fig. 5, where fig. 5 is a schematic diagram of a fifth structure of an electronic device according to an embodiment of the present application. The first temperature sensor 160 may employ a temperature acquisition chip, such as a DS18B20 chip, which employs a 1-wire connection manner, and may communicate only with 3 wires, where the temperature acquisition chip includes three pins, i.e., GND, VDD, and DQ. The three pins are connected to GND, VDD and a GPIO port on the transmission chip 170 through wires, so that the temperature acquisition chip and the transmission chip 170 can communicate. The transmission chip 170 may adopt an STM32 serial chip, an 8051 chip, etc., which may be used as an audio output device of the electronic device 10, connect to a headset interface of an electronic device, and implement communication with the processor 180 through the headset interface.
For convenience of using the transmission chip 170 and the first temperature sensor 160, the power pins VDD of the first temperature sensor 160 and the transmission chip 170 are electrically connected to the power pin VDD of the electronic device 10.
Illustratively, the temperature acquisition chip may be directly connected with the earphone interface. The electronic device 10 may control a plurality of pins of the headset interface when the temperature acquisition chip communicates with the headset interface, for example, the left channel pin L or the right channel pin R of the headset interface is connected to a power supply terminal VDD in the electronic device 10. The GND pin of the temperature acquisition chip is connected with the GND pin of the earphone interface, the signal pin DQ of the temperature acquisition chip is connected with the microphone pin Mic of the earphone interface, and the VDD pin of the temperature acquisition chip is connected with the left channel pin L or the right channel pin R of the earphone interface (equivalently, connected with a power supply pin VDD in the electronic device 10).
In some embodiments, in order to obtain the temperature of the outer surface of the casing of the electronic device, a plurality of temperature sensors (NTC sensors) may be disposed on the main board of the electronic device, and these temperature sensors are close to the heat generating source inside the electronic device, and may be approximately regarded as the temperature of the casing of the electronic device. The temperature sensors are connected to a processor of the electronic device through connecting wires, and the processor of the electronic device can read the values of the temperature sensors so as to obtain temperature values.
The temperature of the electronic equipment acquired through the temperature sensor on the mainboard can only represent the temperature of the mainboard of the electronic equipment, and when the temperature of the outer surface of the shell of the electronic equipment needs to be accurately controlled, if the temperature of the mainboard is adopted, a large difference value exists in practice, and the condition of inaccurate control can be caused.
Therefore, a scheme of fitting the temperature of the outer surface of the shell can be adopted to obtain the temperature of the outer surface of the shell of the electronic device more accurately. The core thought is that a plurality of temperature sensors are added on the electronic equipment mainboard, each temperature sensor can acquire the temperature of one position in the electronic equipment, certain correlation exists between the temperature of the outer surface of the shell and the temperature acquired by the temperature sensors on the electronic equipment mainboard, and the correlation can be linear. And (4) fitting through some conventional algorithms, namely finally obtaining the outer surface temperature of the shell of the electronic equipment through the numerical value of the temperature sensor. The expression for a common fitting algorithm is:
T＝a0+a1x1+a2x2+..+anxn
wherein T is the outer surface temperature of the shell of the electronic equipment, xnIs the temperature of the nth temperature sensor, anIs the coefficient of the nth temperature sensor. In order to obtain a relatively accurate temperature of the outer surface of the housing, the coefficients need to be sufficiently accurate in addition to ensuring sufficient accuracy of the temperature sensor. Coefficient acquisition here is generally not calculated, but by a fitting algorithm.
The fitting process is that a thermocouple is pasted at the hottest heating point on the outer surface of the shell of the electronic equipment, and the temperature of the thermocouple can be read by a computer. In addition, the temperature on the mainboard of the electronic equipment can be directly read by a program in the electronic equipment. The actual temperature of the outer surface of the shell corresponds to the temperature of the main board temperature sensor according to a time relation, and then each coefficient value can be calculated by adopting a linear fitting mode.
When the program in the electronic device wants to acquire the temperature of the outer surface of the shell, a relatively accurate value can be obtained by calculating the coefficient value and the temperature of the mainboard temperature sensor.
However, temperature fitting needs to acquire enough data to fit accurate temperature parameters, and because the existing fitting original data depends on computer acquisition and electronic equipment acquisition, the fitting original data is limited to be acquired only in a laboratory environment in most cases, and the fitting parameters calculated through the data acquired in the laboratory can be inaccurate when being applied to an actual scene.
In other embodiments of the present application, an accurate coefficient may be obtained, specifically referring to fig. 6, where fig. 6 is a schematic diagram of a sixth structure of an electronic device according to an embodiment of the present application. The electronic device 10 further includes a second temperature sensor 162 located in the housing 120, the second temperature sensor 162 is electrically connected to the processor 180, the processor 180 is configured to obtain second temperature information acquired by the second temperature sensor 162, the processor 180 is further configured to calculate a conversion coefficient according to the first temperature information and the second temperature information, and the second temperature information is calculated by the conversion coefficient to obtain the first temperature information.
The electronic device 10 may calculate a conversion coefficient between the first temperature sensor 160 and the second temperature sensor 162 during the test. When the electronic device 10 without the first temperature sensor 160 calculates the accurate first temperature information of the outer surface 124 of the housing 120 through the second temperature sensor 162 and the conversion coefficient in the housing 120. It should be noted that, in this embodiment, the obtaining of the conversion coefficient may be implemented without an additional computer or other electronic device 10, so that the electronic device 10 in this embodiment may not only obtain the conversion system through testing in a laboratory, but also obtain different conversion coefficients through testing in different scenarios, so as to obtain a plurality of conversion coefficients under multiple scenarios, multiple time periods, and multiple operating environments through testing, and store the plurality of conversion coefficients in the electronic device 10 to obtain a mapping table. For example, a conversion system corresponds to the outdoor environment, another conversion coefficient corresponds to the indoor environment, and for example, scenes such as walking, running, sitting on a subway, sitting on a bus, sitting on a train and the like all correspond to one conversion system, and a conversion coefficient can correspond to different operation environments of the electronic device 10 in different time periods in the same scene. It will be appreciated that the scenario, time period, and environment in which the electronic device 10 operates may be combined to provide a very large number of switching systems, and that in various situations (scenario, time period, and environment) the first temperature information of the outer surface 124 of the housing 120 may be accurately calculated based on the second temperature sensor 162 within the electronic device 10. It is difficult to obtain such a large number of conversion factors from laboratory testing, or the conversion factors obtained from laboratory testing are in many cases inaccurate.
The quantity of second temperature sensor is a plurality of, and a plurality of second temperature sensor intervals set up in the casing, and a plurality of second temperature sensor acquire a plurality of second temperature information, and a plurality of second temperature sensor all with treater electric connection, the treater is used for calculating according to first temperature information and a plurality of second temperature information and obtains a plurality of conversion coefficient, and wherein, each temperature sensor corresponds a conversion coefficient, and a plurality of second temperature information obtain first temperature information through a plurality of conversion coefficient calculations. The first temperature information obtained through calculation of the second temperature sensor and the conversion coefficient is prone to generate larger errors, and more accurate first temperature information can be obtained through the second temperature sensors at different positions in the electronic equipment and the conversion coefficient corresponding to each second temperature sensor. Meanwhile, the electronic equipment is prevented from being influenced by external factors, such as holding by a user, an interference heat source outside, shielding of the electronic equipment and the like, and the accuracy of the first temperature information can be prevented from being influenced by interference of single data through the plurality of second temperature sensors and the plurality of conversion coefficients.
Referring to fig. 7, fig. 7 is a schematic view illustrating a seventh structure of an electronic device according to an embodiment of the present disclosure. The electronic device 10 further includes a display screen 110, the display screen 110 is electrically connected to the processor 180, and the display screen 110 is configured to display the first temperature information acquired by the processor 180.
The electronic device 10 may also display first temperature information via the display screen 110, the first temperature information being a temperature of an outer surface 124 of the housing 120 of the electronic device 10. When the first temperature sensor 160 is disposed opposite the heat generating module 126 within the housing 120, the first temperature sensor 160 detects primarily the temperature of the heat generating module 126 within the housing 120. When the first temperature sensor 160 is not disposed opposite to the heat generating module 126 in the housing 120, the first temperature information collected by the first temperature sensor 160 may be an ambient temperature, and the display screen 110 displays the ambient temperature. If the housing 120 is made of a high thermal conductive material (e.g., a metal housing 120), the first temperature sensor 160 for collecting the ambient temperature may be disposed at some special positions of the housing 120, where the special positions are low thermal conductive areas, such as a flash lamp, an infrared sensor, and a distance sensor. In some electronic devices 10, when the housing 120 needs to be provided with a bezel antenna, it needs to be broken at the bezel portion and filled with low thermal conductive plastic, and the first temperature sensor 160 can also be used to fill the housing 120 with the low thermal conductive plastic. It should be noted that the display screen 110 may also display the second temperature information and/or the conversion coefficient, so as to facilitate the user to know the temperature condition in the electronic device 10.
It should be noted that the first temperature sensor and the transmission chip may be disposed at the outermost side of the casing, or may be disposed on the outer surface of the casing and then covered with a protective layer, such as a paint layer.
It will be appreciated that the connection interface of the electronic device may be a USB interface in other embodiments.
After the transmission chip is powered on and initialized, the transmission chip can be configured as audio output equipment of the processor, the transmission chip reads first temperature information of the first temperature sensor in real time, after the transmission chip reads the first temperature information, the first temperature information is coded into audio data and sent to the connection interface, the transmission chip is skipped to, and the first temperature information of the first temperature sensor is read in real time, and the process is repeated. In order to prevent the system from wasting due to frequent transmission of the first temperature information, a time delay may be performed after the audio data is transmitted to the connection interface because the change speed of the first temperature information is low.
The processor can open a microphone channel, monitor microphone events, read microphone input information after monitoring that the microphone has the input information, and decode to obtain original first temperature information. After the processor obtains the first temperature information, the temperature of the electronic device can be controlled according to the first temperature information. The conversion coefficient may also be calculated from the first temperature information and the second temperature information.
With continued reference to fig. 7, the electronic device 10 may further include a circuit board 82 and a battery 84. The housing 120 includes a middle frame, the middle frame includes a frame and a middle plate, the middle plate is located in the middle of the frame, and the middle plate may have a thin plate-like or sheet-like structure or a hollow frame structure. The middle frame is used for providing a supporting function for the electronic elements or functional components in the electronic device 10 so as to mount the electronic elements or functional components in the electronic device 10 together.
Wherein the middle frame and the rear cover may together form a housing of the electronic device 10 for accommodating or mounting electronic elements, functional components, etc. of the electronic device. For example, the display screen 110 may be mounted on the housing. In addition, functional components such as a camera, a receiver, a circuit board, a battery, and the like of the electronic apparatus may be mounted on the center frame for fixation. It is understood that the material of the middle frame may include metal or plastic.
The display screen 110 may be mounted on the center frame and form a display surface of the electronic device 10 for displaying images, text, and other information. The Display screen 110 may include a Liquid Crystal Display (LCD) or an Organic Light-Emitting Diode (OLED) Display screen.
It is understood that a cover plate may also be disposed on the display screen 110. The cover plate covers the display screen 110 to protect the display screen 110 and prevent the display screen 110 from being scratched or damaged by water. Wherein the cover may be a clear glass cover so that a user may view the information displayed by the display screen 110 through the cover. For example, the cover plate may be a glass cover plate of sapphire material.
The circuit board 82 may be mounted on the middle frame. The circuit board 82 may be a motherboard of the electronic device 10. One or more of the functional components such as a microphone, a speaker, a receiver, an earphone interface, a camera, an acceleration sensor, a gyroscope, a temperature sensor, and a processor may be integrated on the circuit board 82. Meanwhile, the display screen 110 may be electrically connected to the circuit board 82 to control the display of the display screen 110 by a processor on the circuit board 82.
The battery 84 may be mounted on the center frame. Meanwhile, the battery 84 is electrically connected to the circuit board 82 to enable the battery 84 to power the electronic device 10. Among them, the circuit board 82 may be provided with a power management circuit thereon. The power management circuitry is used to distribute the voltage provided by the battery 84 to the various electronic components in the electronic device 10.
The rear cover may be integrally formed. In the molding process of the rear cover, a rear camera hole and other structures can be formed on the rear cover.
Referring to fig. 8, fig. 8 is a schematic view illustrating a first structure of the temperature obtaining apparatus according to the embodiment of the present application. The temperature acquisition device includes a first temperature sensor 160 and a transmission chip 170.
Referring to fig. 1 to 7, the first temperature sensor 160 is disposed on the outer surface 124 of the electronic device 10 and is configured to collect first temperature information of the outer surface 124 of the electronic device 10.
The transmission chip 170 is electrically connected to the first temperature sensor 160, and the transmission chip 170 is configured to be electrically connected to the connection interface 140 of the electronic device 10, and is configured to acquire the first temperature information and transmit the acquired first temperature information to the electronic device 10 through the connection interface 140.
The temperature obtaining device 20 may be an external device of the electronic device 10, the temperature obtaining device 20 may be used in cooperation with the electronic device 10, the electronic device 10 does not need to be modified in hardware, and the electronic device 10 may communicate with the temperature obtaining device 20 only by running an application program matched with the temperature obtaining device 20. The application program matched with the temperature acquisition device 20 may be an application program of the electronic device 10 system, or may be a specially developed application program. The temperature obtaining device 20 may be applied to the electronic device 10 to obtain the conversion coefficient, and the obtaining manner of the conversion coefficient may refer to the foregoing embodiments, and is not described herein again. The temperature obtaining device 20 may be applied in the electronic device 10 obtaining the external temperature, and the temperature obtaining device 20 obtains the temperature of the external environment and transmits the temperature to the electronic device 10, so as to enable the user to obtain the temperature of the external environment. The manner in which the first temperature sensor 160 obtains the temperature of the external environment can refer to the above embodiments, and is not described herein again. After the electronic device 10 acquires the first temperature information, the first temperature information may be displayed on the display screen 110.
With continuing reference to fig. 9, fig. 9 is a schematic diagram illustrating a second structure of a temperature obtaining apparatus according to an embodiment of the present disclosure. The temperature obtaining device 20 further includes a coupling interface 220, the coupling interface 220 is configured to be connected to the connection interface 140 of the electronic device 10, and the transmission chip 170 transmits the first temperature information to the electronic device 10 through the coupling interface 220 and the connection interface 140. Illustratively, the coupling interface 220 is a headphone jack for interfacing with a headphone of the electronic device 10. The temperature obtaining device 20 can be electrically and physically connected to the connection interface 140 of the electronic device 10 through the universal coupling interface 220, so that the temperature obtaining device 20 can be fixedly connected to the electronic device 10.
It should be noted that the coupling interface of the temperature acquisition device may also be a USB plug, and the connection interface of the electronic device may be a USB interface.
In the description of the present application, it is to be understood that terms such as "first", "second", and the like are used merely to distinguish one similar element from another, and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated.
The electronic device and the temperature acquisition device provided by the embodiment of the application are described in detail above. The principles and implementations of the present application are described herein using specific examples, which are presented only to aid in understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (13)
1. An electronic device, comprising:
a housing including a mounting hole;
the connecting interface is arranged in the mounting hole; and
the first temperature sensor is arranged on the outer surface of the shell and electrically connected with the connecting interface, and is used for transmitting the collected first temperature information to the connecting interface.
2. The electronic device of claim 1, comprising a heat generating module located within the housing, wherein an orthographic projection of the heat generating module on the housing outer surface at least partially coincides with the first temperature sensor.
3. The electronic device of claim 1, wherein the first temperature sensor comprises a signal pin, wherein the connection interface comprises an input pin, and wherein the signal pin of the first temperature sensor is electrically connected to the input pin of the connection interface.
4. The electronic device of any of claims 1-3, further comprising a processor;
the processor is electrically connected with the connecting interface and used for receiving the first temperature information transmitted to the connecting interface.
5. The electronic device according to claim 4, further comprising a transmission chip disposed outside the housing, wherein the transmission chip is electrically connected to the first temperature sensor and configured to acquire the first temperature information acquired by the first temperature sensor, and the transmission chip is electrically connected to the processor through the connection interface and configured to transmit the acquired first temperature information to the processor.
6. The electronic device of claim 5, wherein the connection interface is a headphone interface, and the transmission chip is configured to convert the first temperature information into a digital audio signal and transmit the digital audio signal to the processor through the headphone interface.
7. The electronic device of claim 4, further comprising a second temperature sensor located in the housing, wherein the second temperature sensor is electrically connected to the processor, the processor is configured to obtain second temperature information collected by the second temperature sensor, the processor is further configured to calculate a conversion coefficient according to the first temperature information and the second temperature information, and the second temperature information is calculated by the conversion coefficient to obtain the first temperature information.
8. The electronic device according to claim 7, wherein the number of the second temperature sensors is plural, the plural second temperature sensors are disposed in the housing at intervals, the plural second temperature sensors acquire plural second temperature information, the plural second temperature sensors are all electrically connected to the processor, and the processor is configured to calculate a plurality of conversion coefficients according to the first temperature information and the plural second temperature information, wherein each of the temperature sensors corresponds to a conversion coefficient, and the plural second temperature information is calculated by the plural conversion coefficients to obtain the first temperature information.
9. The electronic device of claim 4, further comprising a display screen electrically connected to the processor, wherein the display screen is configured to display the first temperature information obtained by the processor.
10. The electronic device of claim 1, wherein the power pins of the first temperature sensor and the transmission chip are electrically connected to a power pin in the electronic device.
11. A temperature acquisition apparatus, comprising:
the first temperature sensor is arranged on the outer surface of the electronic equipment and used for acquiring first temperature information of the outer surface of the electronic equipment; and
and the transmission chip is electrically connected with the first temperature sensor, is used for electrically connecting with a connection interface of the electronic equipment, is used for acquiring the first temperature information, and transmits the acquired first temperature information to the electronic equipment through the connection interface.
12. The temperature acquisition device of claim 11, further comprising a coupling interface configured to connect to a connection interface of the electronic device, wherein the transmission chip transmits the first temperature information to the electronic device via the coupling interface and the connection interface.
13. The temperature acquisition device of claim 12, wherein the coupling interface is an earphone plug, and the connection interface is an earphone interface, the earphone plug being configured to connect with an earphone interface of the electronic device.
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