CN111029450A - Light emitting diode display device - Google Patents

Light emitting diode display device Download PDF

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Publication number
CN111029450A
CN111029450A CN201911355007.4A CN201911355007A CN111029450A CN 111029450 A CN111029450 A CN 111029450A CN 201911355007 A CN201911355007 A CN 201911355007A CN 111029450 A CN111029450 A CN 111029450A
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China
Prior art keywords
light emitting
dielectric layer
emitting diode
contact
electrically connected
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CN201911355007.4A
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Chinese (zh)
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CN111029450B (en
Inventor
林俊贤
林明昌
颜子旻
谢朝桦
刘同凯
柯瑞峰
王惠洁
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Innolux Corp
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Innolux Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The invention discloses a light emitting diode display device, which comprises a light emitting diode and a substrate. The light emitting diode comprises a central shaft, and the substrate comprises a first connecting part and a second connecting part. The central shaft of the light emitting diode passes through the first connecting part. The second connecting portion is disposed around the outer periphery of the first connecting portion and spaced from the first connecting portion by a distance greater than zero, and the first connecting portion and the second connecting portion are electrically connected to the light emitting diode, respectively.

Description

Light emitting diode display device
The application is a divisional application of a Chinese invention patent application (application number: 201710249088.4, application date: 2017, 04 and 17 months, invention name: a light emitting diode display device).
Technical Field
The present invention relates to a light emitting diode display device, and more particularly, to a light emitting diode display device formed by a fluid self-assembly method.
Background
The electronic display device is an electro-optical device that converts an electronic signal into a visible image, so that a viewer can view information carried in the electronic signal. In recent years, related products such as Liquid crystal display devices (Liquid crystal displays) and Organic electro luminescence display devices (Organic electro luminescence displays) have become popular.
In order to further reduce the size of the display device, a Micro-light-emitting-diode display (Micro-light-emitting-diode display) is an effective solution. Compared with other types of display devices, the micro light emitting diode display device has the advantages of small volume, high contrast, low power consumption, fast response time and the like.
However, since the micro-leds are very small in size, a major problem in the fabrication process is how to accurately and stably mount each micro-led on a driving backplane (driving backplane) of the display device.
In view of the above, it is a subject of research to accurately and stably assemble each micro led on a driving backplane (driving backplane).
Disclosure of Invention
In view of the above, the present invention provides a light emitting diode display device to solve the above problems.
In one embodiment, the present invention provides an led display device including an led and a substrate. The light emitting diode includes a central axis. The substrate comprises a first connecting part and a second connecting part. The central shaft of the light emitting diode penetrates through the first connecting part, the second connecting part is arranged on the outer periphery of the first connecting part and is separated from the first connecting part by a distance larger than zero, and the first connecting part and the second connecting part are respectively and electrically connected with the light emitting diode.
In some embodiments, the present invention further provides an led display device, which includes a substrate and a plurality of leds. The substrate is provided with a plurality of grooves, and each groove is internally provided with an electrical contact. The light emitting diodes are arranged to be mounted in the grooves, and each light emitting diode is provided with a body, a first contact, a second contact and a first dielectric layer. The first contact and the second contact are disposed on the body and electrically connected to the substrate through the corresponding electrical contacts.
The invention provides a light emitting diode display device applied to a display, which comprises a substrate with a plurality of grooves and a plurality of micro light emitting diodes. Each micro light-emitting diode can be provided with at least one dielectric layer, so that in the self-assembly process of the fluid, the micro light-emitting diodes can be influenced by an external electric field to be driven to the corresponding grooves on the substrate for being correctly assembled on the corresponding grooves. The body of the micro light-emitting diode can also be designed into a cuboid or a trapezoid body, and through the design, the micro light-emitting diode can be more correctly arranged in the corresponding groove on the substrate.
In addition, the connecting pad (e.g., the first connecting portion) corresponding to the anode of the micro light emitting diode in the groove can be configured to be a circular structure, and the connecting pad (e.g., the second connecting portion) corresponding to the cathode of the micro light emitting diode in the groove can be configured to be an annular structure, so that when the micro light emitting diode is installed in the groove, the anode and the cathode of the micro light emitting diode can accurately contact the corresponding connecting pad.
Drawings
FIG. 1 is a schematic view of an LED display device according to a first embodiment of the present invention;
FIG. 2 is a diagram of an LED display device according to a second embodiment of the present invention;
FIGS. 3 and 4 are schematic views of an LED display device according to a third embodiment of the present invention;
FIG. 5 is a bottom view of a light emitting diode in a flow channel according to a fourth embodiment of the present invention;
FIG. 6 is a diagram of an LED display device according to a fifth embodiment of the present invention;
FIG. 7 is a diagram of an LED display device according to a sixth embodiment of the present invention;
FIG. 8 is a diagram of an LED display device according to a seventh embodiment of the present invention;
FIG. 9 is a diagram of a first driving circuit according to an embodiment of the invention;
FIG. 10 is a diagram of a second driving circuit according to another embodiment of the present invention;
FIG. 11 is a schematic view of an LED display device according to an eighth embodiment of the present invention;
FIG. 12 is a top view of the substrate and the recess of FIG. 11;
FIG. 13 is a diagram of an LED display device according to a ninth embodiment of the present invention;
FIG. 14 is a top view of the substrate and the recess of FIG. 13;
FIG. 15 is a top view of a substrate and a recess in accordance with a tenth embodiment of the present invention;
FIG. 16 is a cross-sectional view taken along line A-A' of FIG. 15;
fig. 17 is a cross-sectional view of a substrate according to an eleventh embodiment of the present invention;
fig. 18 is a sectional view of a substrate according to a twelfth embodiment of the present invention.
Description of the symbols
100 light emitting diode display device
100A-100K light emitting diode display device
101 metal layer
102 substrate
102A-100C substrate
103 drive circuit layer
104 groove
104A groove
105 insulating layer
106 groove
107 bottom layer
108 grooves
109 side wall structure
110 first driving circuit
112 first connection part
1121 circular portion
1122 projection
114 second connecting part
116 first through hole
118 second through hole
120 second driving circuit
200 light emitting diode
200A-200I light emitting diode
202 body
2021 first side
2022 second side
204 first contact
206 second contact
208 first dielectric layer
210 second dielectric layer
212 third dielectric layer
214 fourth dielectric layer
A1 active region
A2 non-active area
AC voltage
C center shaft
D1 diameter
D2 diameter
D3 pore size
DC1 diameter
DC2 diameter
E1 electric field
E2 electric field
EC1 electrical contact
EC2 electrical contact
EM drive signal
EM1 first drive Signal
EM2 second drive signal
H concave hole
M1 first transistor
M2 second transistor
M3 third transistor
M4 fourth transistor
M5 fifth transistor
Position P1
Position P2
S slope structure
VDD first direct current voltage
VSS second DC voltage
Width of W1
Width of W2
Detailed Description
In order to make the objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. The arrangement of the components in the embodiments is for illustration and not for limiting the invention. And the reference numbers in the embodiments are partially repeated to simplify the description, and do not indicate the relevance between the different embodiments. Directional terms as referred to in the following examples, for example: up, down, left, right, front or rear, etc., are merely directions with reference to the attached drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting.
It is to be understood that the components specifically described and illustrated may exist in various forms well known to those skilled in the art. Further, when a layer is "on" another layer or a substrate, it may mean "directly on" the other layer or the substrate, or that the layer is on the other layer or the substrate, or that the other layer is interposed between the other layer and the substrate.
Furthermore, relative terms, such as "lower" or "bottom" and "upper" or "top," may be used in connection with the embodiments to describe one element's relative relationship to another element as illustrated. It will be understood that if the device is turned over with its top and bottom reversed, elements described as being on the "lower" side will be those on the "upper" side.
As used herein, the terms "about" and "approximately" generally mean within 20%, preferably within 10%, and more preferably within 5% of a given value or range. The quantities given herein are approximate quantities, meaning that the meanings of "about" and "approximately" are implied unless otherwise indicated.
[ first embodiment ]
Referring to fig. 1, fig. 1 is a schematic diagram of an led display device 100 according to a first embodiment of the invention. In this embodiment, the led display device 100 includes a substrate 102 and a plurality of leds 200 (only one led 200 is shown in the embodiment for simplicity of description), and the leds 200 may be Micro-Light-Emitting diodes (Micro-diodes). The substrate 102 may include a driving circuit layer 103, an insulating layer 105 and a bottom layer 107, the driving circuit layer 103 is disposed on the bottom layer 107, and the insulating layer 105 is disposed on the driving circuit layer 103 and has a plurality of grooves formed thereon. For convenience of illustration, only two grooves 104 and 106 are shown in this embodiment. The led 200 is configured to be mounted in the recess 104 and the recess 106, and the led 200 includes a body 202, a first contact 204, a second contact 206, and a first dielectric layer 208. In this embodiment, the body 202 is a cube or a rectangular parallelepiped, and has a first side 2021 and a second side 2022. The first contact 204, the second contact 206, and the first dielectric layer 208 are disposed on the same side of the body 202, such as the first side 2021 of the body 202.
When Fluid Self-Assembly is performed, the led 200 and the substrate 102 are immersed in a Fluid (not shown), the led 200 is located at a position P1 in fig. 1, and the first contact 204 and the second contact 206 are upward facing. When an electric field E1 is applied to the led display device 100, the first dielectric layer 208 on the led 200 is polarized by the electric field, so that the first dielectric layer 208 correspondingly generates a positive charge. Therefore, the polarized led 200 is driven by the electric field E1 to flip to the position P2 around the X axis, and the led 200 continues to move forward toward the substrate 102, so that the first contact 204 and the second contact 206 can be engaged with the groove 104 and the groove 106, respectively, to mount the led 200 on the substrate 102. At this time, the first contact 204 and the second contact 206 respectively contact electrical contacts (electrical pads) in the grooves 104 and 106, so that the first contact 204 and the second contact 206 are electrically connected to the driving circuit layer 103 in the substrate 102 through the two electrical contacts.
[ second embodiment ]
Referring to fig. 2, fig. 2 is a schematic view of a light emitting diode display device 100A according to a second embodiment of the invention. Compared to the first embodiment, the led 200A of the led display device 100A further includes a second dielectric layer 210, and the first dielectric layer 208 and the second dielectric layer 210 are located on opposite sides of the body 202, for example, the first dielectric layer 208 is located on the first side 2021 of the body 202, and the second dielectric layer 210 is located on the second side 2022 of the body 202. The first dielectric layer 208 and the second dielectric layer 210 have different dielectric coefficients. In this embodiment, the dielectric constant of the first dielectric layer 208 is greater than the dielectric constant of the second dielectric layer 210.
When Fluid Self-Assembly is to be performed, the led 200A is originally located at position P1 in fig. 2, and the first contact 204 and the second contact 206 are facing upward. When the electric field E1 is applied to the led display device 100A, the first dielectric layer 208 and the second dielectric layer 210 on the led 200 are polarized by the electric field E1, such that the first dielectric layer 208 generates a positive charge and the second dielectric layer 210 generates a negative charge. Therefore, the polarized led 200A is driven by the electric field E1 to flip to the position P2 around the X axis and move forward towards the substrate 102, so that the first contact 204 and the second contact 206 can be engaged with the groove 104 and the groove 106, respectively, to mount the led 200A on the substrate 102.
[ third embodiment ]
Referring to fig. 3 and 4, fig. 3 and 4 are schematic views of a light emitting diode display device 100B according to a third embodiment of the invention. Compared to the led 200A of the second embodiment, the led 200B of this embodiment has the first contact 204 and the second contact 206 with different diameters, and the substrate 102 has the grooves 104 and 106 corresponding to the first contact 204 and the second contact 206, respectively. In this embodiment, the diameter DC1 of the first contact 204 is greater than the diameter DC2 of the second contact 206. In addition, the light emitting diode 200B further includes a third dielectric layer 212 and a fourth dielectric layer 214. The third dielectric layer 212 is disposed between the body 202 and the first contact 204, the fourth dielectric layer 214 is disposed between the body 202 and the second contact 206, and the third dielectric layer 212 and the fourth dielectric layer 214 have different dielectric coefficients. For example, the dielectric constant of the third dielectric layer 212 is greater than the dielectric constant of the fourth dielectric layer 214.
As shown in fig. 3, the led 200B is at position P1, where the larger diameter first contact 204 is facing the smaller recess 104 and the smaller diameter second contact 206 is facing the larger recess 106. In order to mount the led 200B on the substrate 102, an electric field E2 is applied to the led display device 100B, such that the third dielectric layer 212 and the fourth dielectric layer 214 on the led 200B are polarized by the electric field E2, such that the third dielectric layer 212 generates a positive charge and the fourth dielectric layer 214 generates a negative charge. Therefore, the polarized led 200B is affected by the electric field E2 to move on the XZ plane or flip around the Y axis to the position P2 in fig. 4.
Next, in fig. 4, the electric field E2 is turned off and the electric field E1 is turned on, so that the first dielectric layer 208 and the second dielectric layer 210 on the light emitting diode 200B are polarized by the electric field E1. The first dielectric layer 208 correspondingly produces a positive charge and the second dielectric layer 210 correspondingly produces a negative charge. Therefore, the light emitting diode 200B is driven by the electric field E1 to move forward toward the substrate 102 along the Y-axis direction, so that the first contact 204 and the second contact 206 can be engaged with the grooves 104 and 106. Therefore, the light emitting diode 200B can be mounted on the substrate 102.
[ fourth embodiment ]
Referring to fig. 5, fig. 5 is a bottom view of a light emitting diode 200C in a flow channel according to a fourth embodiment of the invention. The structure of the led 200C is similar to the led 200 in fig. 1, and the difference between the two is that the body 202 of the led 200C has a trapezoid structure. When viewed from the bottom, the first side surface 2021 is a trapezoidal surface, and the first contact 204, the second contact 206 and the first dielectric layer 208 are disposed on the first side surface 2021. Similarly, the second side surface 2022 is also a trapezoidal surface when viewed from the top view.
When the light emitting diode 200C is disposed in the fluid in the flow channel and the flow direction of the fluid is along the direction of the arrow in fig. 5, the trapezoidal structure of the body 202 can make the light emitting diode 200C stably move along the flow direction of the fluid without randomly rotating or drifting. In addition, in other embodiments, the light emitting diode 200C may be configured with the first contact 204 and the second contact 206 having different diameters.
[ fifth embodiment ]
Referring to fig. 6, fig. 6 is a schematic view of a light emitting diode display device 100D according to a fifth embodiment of the invention. In this embodiment, the led 200D of the led display device 100D is disposed to be engaged with the groove 104 on the substrate 102, and the body 202 of the led 200D has a first side 2021 and a second side 2022. The first dielectric layer 208 and the first contact 204 are disposed on the first side 2021, and the second dielectric layer 210 and the second contact 206 are disposed on the second side 2022. The first dielectric layer 208 and the second dielectric layer 210 may have different dielectric coefficients, for example, the dielectric coefficient of the first dielectric layer 208 is greater than the dielectric coefficient of the second dielectric layer 210.
When the electric field E1 is applied to the led display device 100D, the first dielectric layer 208 and the second dielectric layer 210 on the led 200D are polarized by the electric field E1, such that the first dielectric layer 208 generates a positive charge and the second dielectric layer 210 generates a negative charge. Therefore, the polarized led 200D is driven by the electric field E1 to move toward the groove 104, so that the first contact 204 can be engaged with the groove 104.
[ sixth embodiment ]
Referring to fig. 7, fig. 7 is a schematic view of a light emitting diode display device 100E according to a sixth embodiment of the invention. In this embodiment, the structure of the light emitting diode 200E of the led display device 100E is similar to that of the light emitting diode 200D of the fifth embodiment, and the difference between the two embodiments is that the body 202 of the light emitting diode 200E is a trapezoid. The first side 2021 and the second side 2022 of the body 202 are rectangular surfaces and are parallel to each other. The first dielectric layer 208 and the first contact 204 are disposed on the first side 2021, and the second dielectric layer 210 and the second contact 206 are disposed on the second side 2022. The first dielectric layer 208 and the second dielectric layer 210 may have different dielectric coefficients.
For example, when the electric field E1 is used to engage the second contact 206 with the corresponding recess 104, the permittivity of the second dielectric layer 210 needs to be larger than that of the first dielectric layer 208. In addition, when the electric field E1 is used to engage the first contact 204 with the corresponding recess 106, the dielectric constant of the first dielectric layer 208 is set to be greater than that of the second dielectric layer 210.
[ seventh embodiment ]
Referring to fig. 8, fig. 8 is a schematic view of a light emitting diode display device 100F according to a seventh embodiment of the invention. In this embodiment, the led display device 100F may be a sub-pixel (subpixel) of a pixel in a display panel, and includes an led 200F, an led 200G, and an led 200H. The light emitting diodes 200F, 200G, and 200H have different contact areas with the driving circuit layer 103, and can emit light with the same wavelength, or can be light emitting diodes (e.g., red, green, and blue) emitting light sources with different wavelengths, respectively, and the structure of the light emitting diodes 200F, 200G, and 200H is similar to the light emitting diode 200D of the fifth embodiment, and the substrate 102 has grooves 104, 106, and 108 corresponding to the light emitting diodes 200F, 200G, and 200H.
When the fluid self-assembly process is to be performed, the mounting can be performed from large to small according to the sizes of the grooves 104, 106 and 108 corresponding to the light emitting diodes 200F, 200G and 200H, for example, the light emitting diode 200H corresponding to the larger groove 108 is first mounted in the groove 108, then the light emitting diode 200G is mounted in the groove 106, and finally the smallest light emitting diode 200F is mounted in the groove 104. This mounting sequence can prevent the light emitting diode from being mounted to the wrong groove during the assembly process. For example, if the led 200G is first installed, the led 200G may be engaged with the groove 108 instead of the corresponding groove 106.
It is noted that, since the sub-pixel (led display device 100F) has three leds 200F, 200G and 200H, if one of the leds is damaged, the remaining leds can continue to emit light instead of the damaged led.
Referring to fig. 9, fig. 9 is a schematic diagram of a first driving circuit 110 according to an embodiment of the invention. The driving circuit layer 103 includes a plurality of first driving circuits 110 configured to drive the light emitting diodes. Each of the first driving circuits 110 includes a first transistor M1, a second transistor M2, a third transistor M3 and a fourth transistor M4. A first end of the first transistor M1 is electrically connected to a first dc voltage VDD, a second end of the first transistor M1 is electrically connected to an electrical contact EC1, and a control end of the first transistor M1 is electrically connected to a first driving signal EM 1. A control terminal of the second transistor M2 is electrically connected to a second driving signal EM2, a first terminal of the second transistor M2 is electrically connected to the second terminal of the first transistor M1, and a second terminal of the second transistor M2 is electrically connected to a second dc voltage VSS.
A control end of the third transistor M3 is electrically connected to the second driving signal EM2, a first end of the third transistor M3 is electrically connected to the first dc voltage VDD, and a second end of the third transistor M3 is electrically connected to an electrical contact EC 2. A control terminal of the fourth transistor M4 is electrically connected to the first driving signal EM1, a first terminal of the fourth transistor M4 is electrically connected to the second terminal of the third transistor M3, and a second terminal of the fourth transistor M4 is electrically connected to the second dc voltage VSS. The first dc voltage VDD is greater than the second dc voltage VSS, and the first driving signal EM1 and the second driving signal EM2 are square wave signals and are opposite in phase to each other.
Taking the first embodiment as an example, the electrical contact EC1 may be an electrical contact disposed in the groove 104, and the electrical contact EC2 may be an electrical contact disposed in the groove 106. The first contact 204 of the led 200 may be a positive electrode configured to be electrically connected to the electrical contact EC1, and the second contact 206 may be a negative electrode configured to be electrically connected to the electrical contact EC 2. Under such a configuration, when the first driving signal EM1 is at a high voltage level (high voltage level), the first transistor M1 and the fourth transistor M4 are turned on to drive the light emitting diode 200 to emit light.
On the contrary, during the fluid self-assembly process, the anode (the first contact 204) of the led 200 may be electrically connected to the electrical contact EC2 and the cathode (the second contact 206) may be electrically connected to the electrical contact EC 1. Under such a configuration, when the second driving signal EM2 is at a high voltage level (high voltage level), the third transistor M3 and the second transistor M2 are turned on to drive the light emitting diode 200 to emit light. As can be seen from the above description, the light emitting diode 200 is driven by the first driving circuit 110 to emit light, whether the first contact 204 and the second contact 206 of the light emitting diode 200 are electrically connected to the electrical contact EC1 and the electrical contact EC2, respectively, or the first contact 204 and the second contact 206 are electrically connected to the electrical contact EC2 and the electrical contact EC1, respectively.
Referring to fig. 10, fig. 10 is a schematic diagram of a second driving circuit 120 according to another embodiment of the invention. In another embodiment, the driving circuit layer 103 may include a plurality of second driving circuits 120 configured to drive the light emitting diodes. Each of the second driving circuits 120 includes a fifth transistor M5 having a control terminal, a first terminal and a second terminal. The control terminal of the fifth transistor M5 is electrically connected to a driving signal EM, the first terminal of the fifth transistor M5 is electrically connected to a dc voltage (e.g., the second dc voltage VSS), the second terminal of the fifth transistor M5 is electrically connected to the electrical junction EC1, and the electrical junction EC2 is connected to an AC voltage AC.
Similarly, taking the first embodiment as an example, the electrical contact EC1 may be an electrical contact disposed in the groove 104, and the electrical contact EC2 may be an electrical contact disposed in the groove 106. The first contact 204 of the led 200 may be a positive electrode configured to be electrically connected to the electrical contact EC1, and the second contact 206 may be a negative electrode configured to be electrically connected to the electrical contact EC 2. Under such a configuration, when the driving signal EM is at a high voltage level and the second dc voltage VSS is greater than the voltage level of the AC voltage AC, the fifth transistor M5 is turned on to drive the light emitting diode 200 to emit light.
On the contrary, during the fluid self-assembly process, the anode (the first contact 204) of the led 200 may be electrically connected to the electrical contact EC2 and the cathode (the second contact 206) may be electrically connected to the electrical contact EC 1. Under such a configuration, when the driving signal EM is at a high voltage level and the second dc voltage VSS is less than the voltage level of the AC voltage AC, the fifth transistor M5 is turned on to drive the light emitting diode 200 to emit light. As can be seen from the above description, the light emitting diode 200 is driven by the second driving circuit 120 to emit light whether the first contact 204 and the second contact 206 of the light emitting diode 200 are electrically connected to the electrical contact EC1 and the electrical contact EC2, respectively, or the first contact 204 and the second contact 206 are electrically connected to the electrical contact EC2 and the electrical contact EC1, respectively.
[ eighth embodiment ]
Referring to fig. 11, fig. 11 is a schematic view of an led display device 100I according to an eighth embodiment of the invention. In this embodiment, the led display device 100I may include a plurality of leds 200I and a substrate 102A. For the sake of simplicity, only one led 200I and one recess 104A are shown on the substrate 102A. The led 200I includes a first contact 204 and a second contact 206, the first contact 204 is disposed at the bottom of the led 200I, and a central axis C of the led 200I passes through the first contact 204. The second contact 206 is disposed at the bottom of the led 200I and spaced apart from the central axis C. In this embodiment, the first contact 204 is the anode of the led 200I, and the width thereof may be 13 μm, but is not limited thereto. The second contacts 206 are disposed on both sides of the first contacts 204, and have a width of 9 μm and a distance of 4 μm from the first contacts 204, but not limited thereto.
Referring to fig. 11 and 12, fig. 12 is a top view of the substrate 102A and the recess 104A in fig. 11. The substrate 102A may include a metal layer 101, an insulating layer 105, a bottom layer 107 and a sidewall structure 109. The metal layer 101 is disposed on the bottom layer 107 and electrically connected to a driving circuit (not shown), and the insulating layer 105 is disposed on the metal layer 101. The sidewall structure 109 may form a groove 104A, and the groove 104A is a cylindrical groove, which is located on the insulating layer 105 to accommodate the light emitting diode 200I. A first connection portion 112 and a second connection portion 114 may be disposed in the recess 104A. As shown in fig. 12, the first connecting portion 112 is circular and located at the center of the recess 104A when viewed along the central axis C, and the second connecting portion 114 is annular and surrounds the first connecting portion 112. The first connection portion 112 is configured to be electrically connected to the first contact 204, and the second connection portion 114 is configured to be electrically connected to the second contact 206. In this embodiment, the distance between the first connection portion 112 and the second connection portion 114 may be 7.3 μm, but is not limited thereto.
Furthermore, the substrate 102A further includes a first through hole 116 and a second through hole 118. The first through hole 116 penetrates the insulating layer 105, and a conductive material (such as, but not limited to, titanium) is disposed in the first through hole 116. The first via 116 is configured to electrically connect the first connection portion 112 and the metal layer 101. The second via 118 penetrates the insulating layer 105, and a conductive material (e.g., titanium) is disposed in the second via 118, and the second via 118 is configured to electrically connect the second connection portion 114 and the metal layer 101. In this embodiment, a center of curvature of the first connecting portion 112 is located in the first through hole 116. The second through hole 118 is a ring-shaped structure (as shown in fig. 12) when viewed along the central axis C, wherein the width W2 of the second through hole 118 is smaller than the width W1 of the second connecting portion 114, and the second through hole 118 is close to the outer side of the second connecting portion 114.
When the fluid self-assembly process is performed, the light emitting diode 200I enters the recess 104A, such that the first contact 204 and the second contact 206 contact the first connection portion 112 and the second connection portion 114, respectively. Therefore, the led 200I can be electrically connected to the driving circuit (not shown), so that the driving circuit drives the led 200I to emit light.
It is noted that, since the diameter D1 (e.g., 45.7 μm) of the groove 104A is larger than the diameter D2 (e.g., 41 μm) of the LED 200I/LED display device 100I, the central axis C of the LED 200I may deviate from a central axis C1 of the groove 104A when the LED 200I enters the groove 104A. However, with the structural design in the present embodiment, the first contact 204 and the second contact 206 can still be connected to the first connection portion 112 and the second connection portion 114, respectively, and the problem that the first contact 204 contacts the second connection portion 114 or the second contact 206 contacts the first connection portion 112 does not occur.
[ ninth embodiment ]
Referring to fig. 13 and 14, fig. 13 is a schematic view of an led display device 100J according to a ninth embodiment of the invention, and fig. 14 is a top view of a substrate 102A and a groove 104A in fig. 13. The led display device 100J of the present embodiment is similar to the led display device 100I of the eighth embodiment in structure, and the difference between the two embodiments is that the first through hole 116 and the conductive material contained therein are in a ring structure when viewed along the direction of the central axis C, and are disposed to surround the first connection portion 112. Through the structure design, the contact area between the first contact 204 of the light emitting diode 200I and the first connection portion 112 is increased, and the efficiency of signal transmission between the light emitting diode 200I and the driving circuit is increased.
[ tenth embodiment ]
Referring to fig. 15 and 16, fig. 15 is a top view of a substrate 102A and a groove 104A according to a tenth embodiment of the invention, and fig. 16 is a cross-sectional view taken along line a-a' of fig. 15. Fig. 16 shows an led display device 100K similar to the led display device 100I of the eighth embodiment, and the difference between the two embodiments is that the first connection portion 112 of the embodiment has a circular portion 1121 and a protruding portion 1122 connected thereto, and the second connection portion 114 and the second through hole 118 are circular arc structures viewed along the central axis C, and the angle of the circular arc structures relative to the central axis C is greater than 180 degrees. As shown in fig. 15, the protrusion 1122 protrudes from the circular portion 1121 toward a notch of the circular arc structure, and the first through hole 116 is disposed below the protrusion 1122. Through the structure design, the contact area between the first contact 204 of the light emitting diode 200I and the first connection portion 112 is increased, and the efficiency of signal transmission between the light emitting diode 200I and the driving circuit is increased.
[ eleventh embodiment ]
Referring to fig. 17, fig. 17 is a cross-sectional view of a substrate 102B according to an eleventh embodiment of the invention. The substrate 102B disclosed in this embodiment has an active region a1 and an inactive region a 2. The active region a1 has a plurality of grooves 104A, and the substrate 102B further has a ramp structure S disposed adjacent to the boundary between the inactive region a2 and the active region a1 of the substrate 102B. During the self-assembly process, the led can smoothly move from the inactive region a2 to the active region a1 and then enter the groove 104A through the guidance of the slope structure S.
[ twelfth embodiment ]
Referring to fig. 18, fig. 18 is a cross-sectional view of a substrate 102C according to a twelfth embodiment of the invention. Similar to the eleventh embodiment, the substrate 102C has an active region a1 and an inactive region a 2. The substrate 102C further has at least one recess H disposed in the inactive area a2 of the substrate 102C, and an aperture D3 of the recess H is smaller than an aperture (diameter D1) of the groove 104A. During the fluid self-assembly process, the led will move from the inactive region a2 to the active region a1 because the diameter of the led (e.g., diameter D2) is slightly smaller than the diameter D1 and larger than the diameter D3 of the recess H, so the led will not fall into the recess H but only enter the groove 104A during the movement process.
The led display device of the foregoing embodiments of the present invention can be applied to a display (display) to serve as a light source of the display.
Compared with the prior art, the invention provides the light emitting diode display device applied to the display, which comprises the substrate with the grooves and the micro light emitting diodes. Each micro light-emitting diode can be provided with at least one dielectric layer, so that in the self-assembly process of the fluid, the micro light-emitting diodes can be influenced by an external electric field to be driven to the corresponding grooves on the substrate for being correctly assembled on the corresponding grooves. The body of the micro light-emitting diode can also be designed into a cuboid or a trapezoid body, and through the design, the micro light-emitting diode can be more correctly arranged in the corresponding groove on the substrate.
In addition, the connection pad (e.g., the first connection portion 112) in the groove corresponding to the anode of the micro light emitting diode can be configured to be a circular structure, and the connection pad (e.g., the second connection portion 114) in the groove corresponding to the cathode of the micro light emitting diode can be configured to be an annular structure, so that when the micro light emitting diode is installed in the groove, the anode and the cathode of the micro light emitting diode can accurately contact the corresponding connection pad.
Although the present invention has been disclosed in conjunction with the above embodiments, it should be understood that many modifications, substitutions and alterations may be made thereto without departing from the spirit and scope of the invention as defined by the appended claims. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification, but it is to be understood that any process, machine, manufacture, composition of matter, means, method and steps, presently existing or later to be developed, that will be obvious to one skilled in the art from this disclosure may be utilized according to the present application as many equivalents of the presently available embodiments of the present application are possible. Accordingly, the scope of the present application includes the processes, machines, manufacture, compositions of matter, means, methods, or steps described in the specification. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present invention also includes combinations of the respective claims and embodiments.

Claims (11)

1. An led display device, comprising:
the substrate is provided with a plurality of grooves, and each groove is internally provided with an electric contact;
a plurality of light emitting diodes configured to be mounted in the grooves, each of the light emitting diodes having:
a body;
the first contact and the second contact are arranged on the body and are electrically connected to the substrate through the corresponding electrical contacts respectively.
2. The light emitting diode display device of claim 1, further comprising a first dielectric layer, wherein the first contact, the second contact, and the first dielectric layer are disposed on a same side of the body.
3. The light emitting diode display device of claim 1, wherein the light emitting diode further comprises a first dielectric layer and a second dielectric layer, the first dielectric layer and the second dielectric layer being on opposite sides of the body and having different dielectric coefficients.
4. The light emitting diode display device of claim 1, wherein the first contact and the second contact have different diameters.
5. The light emitting diode display device of claim 1, wherein the light emitting diode further comprises a first dielectric layer and a second dielectric layer, the body has a first side and a second side opposite to each other, the first dielectric layer and the first contact are disposed on the first side, the second dielectric layer and the second contact are disposed on the second side, and the first dielectric layer and the second dielectric layer have different dielectric coefficients.
6. The light emitting diode display device of claim 1, wherein the light emitting diode further comprises a first dielectric layer, wherein the body has a trapezoidal structure and has a first side surface and a second side surface opposite to the first side surface, the first side surface and the second side surface are trapezoidal surfaces, and the first contact, the second contact and the first dielectric layer are disposed on the first side surface.
7. The light emitting diode display device of claim 1, wherein the body is a trapezoid and has opposite first and second sides, the light emitting diode further comprising a first dielectric layer and a second dielectric layer, the first dielectric layer and the first contact are disposed on the first side, the second dielectric layer and the second contact are disposed on the second side, and the first dielectric layer and the second dielectric layer have different dielectric coefficients.
8. The light emitting diode display device of claim 1, wherein the substrate further comprises a driver circuit layer having a plurality of driver circuits configured to drive the light emitting diodes.
9. The light emitting diode display device of claim 8, wherein each of the driving circuits comprises:
a first transistor comprising:
the control end is electrically connected with the first driving signal;
a first end electrically connected to a first DC voltage; and
a second end electrically connected to one of the anode and the cathode of the light emitting diode;
a second transistor comprising:
the control end is electrically connected with the second driving signal;
a first terminal electrically connected to the second terminal of the first transistor; and
a second terminal electrically connected to a second DC voltage;
a third transistor, comprising:
a control terminal electrically connected to the second driving signal;
a first end electrically connected to the first DC voltage; and
a second end electrically connected to the other of the anode and the cathode of the light emitting diode; and a fourth transistor including:
a control terminal electrically connected to the first driving signal;
a first terminal electrically connected to the second terminal of the third transistor; and
a second terminal electrically connected to the second DC voltage;
the first direct current voltage is greater than the second direct current voltage, and the first driving signal and the second driving signal are square wave signals and are opposite in phase.
10. The led display device of claim 8, wherein each of the driving circuits comprises a transistor comprising:
the control end is electrically connected with a driving signal;
the first end is electrically connected to a direct current voltage; and
the second end is electrically connected to one of the anode and the cathode of the light emitting diode, and the other of the anode and the cathode of the light emitting diode is electrically connected to an alternating voltage.
11. The light emitting diode display device of claim 3, wherein the light emitting diode further comprises:
a third dielectric layer disposed between the body and the first contact; and
a fourth dielectric layer disposed between the body and the second contact;
wherein the third dielectric layer and the fourth dielectric layer have different dielectric coefficients.
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