CN111029069A - Tm2O3Rare earth element modified high-temperature-resistant high-reliability NTC semiconductor ceramic thermosensitive chip material - Google Patents
Tm2O3Rare earth element modified high-temperature-resistant high-reliability NTC semiconductor ceramic thermosensitive chip material Download PDFInfo
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- CN111029069A CN111029069A CN201911364168.XA CN201911364168A CN111029069A CN 111029069 A CN111029069 A CN 111029069A CN 201911364168 A CN201911364168 A CN 201911364168A CN 111029069 A CN111029069 A CN 111029069A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/042—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient mainly consisting of inorganic non-metallic substances
- H01C7/043—Oxides or oxidic compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/30—Apparatus or processes specially adapted for manufacturing resistors adapted for baking
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Abstract
The present invention relates to Tm2O3Rare earth element modified high-temperature-resistant high-reliability NTC semiconductor ceramic thermosensitive chip material. The material provided by the invention comprises an NTC thermistor material and thulium trioxide, wherein the mass ratio of the thulium trioxide to the NTC thermistor material is 1-5: 100. According to the invention, thulium trioxide is added into the NTC thermistor material for modification so as to improve the high temperature resistance and reliability of the thermistor chip. The invention also relates to a thermistor chip prepared by adopting the material and a preparation method thereof.
Description
Technical Field
The invention relates to the technical field of resistance materials, in particular to a Tm2O3Modified NTC heat-sensitive chip material.
Background
The thermistor chip has the characteristic that the resistance value changes along with the temperature change, and the temperature of the position where the thermistor chip is located can be determined through the resistance value of the thermistor chip, so that the temperature detection function is realized. The conventional thermistor chip is manufactured by forming a ceramic structure by using metal oxide sintered at high temperature, and then performing processes such as electrode printing, dicing and the like.
The NTC thermistor chip made of the existing semiconductor ceramic material is packaged and sintered by glass, the normal use temperature range is approximately between-40 ℃ and 250 ℃, and the stability of the chip can only be maintained to 250 ℃ at most. However, the instant high temperature of the current heating type electronic products, such as electronic cigarettes, capsule coffee machines, high temperature ovens, etc., can reach 330 ℃ to 350 ℃, the current thermistor chip is difficult to maintain stable and normal operation at the high temperature, and the resistance value of the thermistor chip can seriously drift along with the use time and usually exceeds more than 10%, which causes a large error of the measured temperature and leads to misjudgment in serious cases, so that the heater can continue to heat after the actual temperature reaches the preset temperature, or stop heating before the actual temperature does not reach the preset temperature. Therefore, there is a need for an improved thermistor material to improve the stability of the thermistor chip in a high temperature environment.
Disclosure of Invention
Based on this, the present invention provides a Tm2O3Rare earth element modified high-temperature-resistant high-reliability NTC semiconductor ceramic thermosensitive chip material.
The technical scheme adopted by the invention is as follows:
tm (Tm)2O3The modified NTC thermal sensitive chip material is composed of an NTC thermal sensitive resistance material and thulium trioxide, and the mass ratio of the thulium trioxide to the NTC thermal sensitive resistance material is 1-5: 100.
Compared with the prior art, the NTC thermistor material is added with the thulium trioxide (Tm)2O3) Modified to obtain novel NTC thermosensitive chip material, so as to improve the high temperature resistance and reliability of the thermosensitive resistor chip, to make the resistance and B value of the thermosensitive resistor chip more stable, to maintain the qualified range in the long-term working at 350 deg.C, and to ensure the annual drift of the resistanceThe ratio is less than 0.3%.
According to the invention, the adding amount range of the thulium trioxide is controlled to be 1-5% of the mass of the NTC thermistor material, so that the thermosensitive ceramic structure can be effectively enhanced, otherwise, the modifying effect cannot be achieved due to too small adding amount of the thulium trioxide, and the structural strength of the thermosensitive ceramic structure can be reduced due to too much adding amount of the thulium trioxide, which may cause the thermosensitive ceramic structure to become loose.
Further, the mass ratio of the thulium trioxide to the NTC thermistor material is 1: 20. Tests show that under the condition, the resistance value and the B value of the thermistor chip prepared from the material are more stable, the high-temperature resistance performance is good, and the reliability is high.
Specifically, the NTC thermistor material comprises the following components in percentage by mass: manganese dioxide (MnO)2) 25% of ferric oxide (Fe)2O3) 30% of cobaltosic oxide (Co)3O4) 35% of silicon dioxide (SiO)2) 5% and zinc (Zn) 5%.
Specifically, the NTC thermistor material comprises the following components in percentage by mass: manganese dioxide 60%, cobaltosic oxide 35%, nickel sesquioxide (Ni)2O3) 3% of aluminum oxide (Al)2O3)2％。
Specifically, the NTC thermistor material comprises the following components in percentage by mass: 65% of manganese dioxide, 10% of cobaltosic oxide and 25% of nickel sesquioxide.
Specifically, the NTC thermistor material comprises the following components in percentage by mass: 20% of manganese dioxide, 45% of ferric oxide, 30% of cobaltosic oxide and 5% of nickel sesquioxide.
According to the invention, the thulium trioxide is added into different transition metal oxide formula systems, so that thermistor chips with different models and specifications can be obtained, and the temperature resistance and reliability can be improved through the modification effect of the thulium trioxide.
The invention also provides an NTC thermistor chip which comprises a thermosensitive ceramic substrate and two electrodes respectively arranged on two surfaces of the thermosensitive ceramic substrate, wherein the thermosensitive ceramic substrate is made of the material.
The invention also provides a preparation method of the NTC thermistor chip, which comprises the steps of preparing the thermal sensitive ceramic substrate, preparing the electrode layer and cutting; wherein the step of preparing a heat-sensitive ceramic substrate comprises: mixing thulium trioxide and an NTC thermistor material according to the mass ratio of 1-5: 100, and performing ball milling, compression molding, high-temperature sintering and cutting to obtain a flaky thermosensitive ceramic substrate.
Further, in the step of preparing the thermal sensitive ceramic substrate, thulium trioxide and the NTC thermistor material are mixed in a mass ratio of 1: 20.
For a better understanding and practice, the invention is described in detail below with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic structural view of an NTC thermistor chip according to the present invention;
fig. 2 is a schematic structural view of an NTC thermistor chip of the present invention after being encapsulated by glass;
fig. 3 is a schematic flow chart of a method for manufacturing an NTC thermistor chip according to the present invention.
Detailed Description
Example 1
Tm of the present example2O3The modified NTC heat-sensitive chip material comprises the following components in parts by weight:
25 parts of manganese dioxide, 30 parts of ferric oxide, 35 parts of cobaltosic oxide, 5 parts of silicon dioxide, 5 parts of zinc and 5 parts of thulium trioxide.
The NTC thermistor chip is prepared by using the material, as shown in fig. 1, the thermistor chip 10 includes a thermal sensitive ceramic substrate 11 and two electrodes 12 respectively disposed on two surfaces of the thermal sensitive ceramic substrate 11, the thermal sensitive ceramic substrate 11 is made of the material, and the electrodes 12 are made of metal, such as silver.
As shown in fig. 3, the method for preparing the NTC thermistor chip using the material includes the steps of:
(1) and mixing the raw materials according to the formula, and then performing ball milling, drying, sieving, grinding, drying and sieving in sequence to obtain the prepared powder of the NTC heat-sensitive chip material for later use.
(2) Placing the prepared powder into a rubber mold, loosely packing and compacting, then placing the rubber mold into an isostatic press for pressing, taking out the ceramic ingot formed into a cuboid structure from the rubber mold after pressure relief, then sintering the ceramic ingot at high temperature to obtain a ceramic ingot with a compact structure, and then slicing the ceramic ingot according to the designed thickness by using an inside diameter slicer to obtain the flaky thermosensitive ceramic substrate.
(3) Silver paste is printed on two surfaces of the thermal sensitive ceramic substrate, and the silver paste is dried and sintered to obtain the silver layer printed on the thermal sensitive ceramic substrate.
(4) And calculating the size of a single thermistor chip according to the designed resistance value, and then cutting the thermal sensitive ceramic substrate to obtain the single thermistor chip.
The preparation method is basically the same as that of the conventional NTC thermistor chip, except that the raw material in the step (1) is added with the thulium trioxide.
Example 2
Tm of the present example2O3The modified NTC heat-sensitive chip material comprises the following components in parts by weight:
60 parts of manganese dioxide, 35 parts of cobaltosic oxide, 3 parts of nickel trioxide, 2 parts of aluminum oxide and 5 parts of thulium trioxide.
The structure and the preparation method of the NTC thermistor chip made of the material in this embodiment are the same as those in embodiment 1.
Example 3
Tm of the present example2O3The modified NTC heat-sensitive chip material comprises the following components in parts by weight:
65 parts of manganese dioxide, 10 parts of cobaltosic oxide and 25 parts of nickel sesquioxide.
The structure and the preparation method of the NTC thermistor chip made of the material in this embodiment are the same as those in embodiment 1.
Example 4
Tm of the present example2O3The modified NTC heat-sensitive chip material comprises the following components in parts by weight:
65 parts of manganese dioxide, 30 parts of ferric oxide, 10 parts of cobaltosic oxide and 25 parts of nickelous trioxide.
The structure and the preparation method of the NTC thermistor chip made of the material in this embodiment are the same as those in embodiment 1.
Comparative example 1
The comparison example provides an NTC thermistor material, which comprises the following components in parts by weight:
25 parts of manganese dioxide, 30 parts of ferric oxide, 35 parts of cobaltosic oxide, 5 parts of silicon dioxide and 5 parts of zinc.
The structure and the preparation method of the NTC thermistor chip manufactured by using the material in the present comparative example are the same as those in example 1.
Comparative example 2
The comparison example provides an NTC thermistor material, which comprises the following components in parts by weight:
60 parts of manganese dioxide, 35 parts of cobaltosic oxide, 3 parts of nickelous oxide and 2 parts of aluminum oxide.
The structure and the preparation method of the NTC thermistor chip manufactured by using the material in the present comparative example are the same as those in example 1.
Comparative example 3
The comparison example provides an NTC thermistor material, which comprises the following components in parts by weight:
65 parts of manganese dioxide, 10 parts of cobaltosic oxide and 25 parts of nickel sesquioxide.
The structure and the preparation method of the NTC thermistor chip manufactured by using the material in the present comparative example are the same as those in example 1.
Comparative example 4
The comparison example provides an NTC thermistor material, which comprises the following components in parts by weight:
65 parts of manganese dioxide, 30 parts of ferric oxide, 10 parts of cobaltosic oxide and 25 parts of nickelous trioxide.
The structure and the preparation method of the NTC thermistor chip manufactured by using the material in the present comparative example are the same as those in example 1.
As shown in fig. 2, the glass case 2 was sealed outside the thermistor chips 10 of examples 1 to 4 and comparative examples 1 to 4 by glass sealing and firing, and the two electrodes 12 of the thermistor chip 10 were led out of the glass case 2 by two lead wires 3, respectively, to obtain a glass-sealed thermistor.
The glass-sealed thermistors obtained from the thermistor chips of examples 1 to 4 and comparative examples 1 to 4 were subjected to a high temperature resistance test, the thermistors were stored at a high temperature of 350 ℃ for 1000 hours, and the resistance change and the B value change of the thermistor chips before and after the test were measured.
Comparative examples 1 to 4 were each performed by taking 10 thermistor chips as samples, and the test results are shown in table 1 below, where table 1 shows the resistance values of the thermistor chips at normal temperature and 25 ℃, the B values measured from the resistance values at 25 ℃ and 50 ℃, the resistance change rate after storage at 350 ℃ for 1000 hours, and the B value change rate after storage at 350 ℃ for 1000 hours.
TABLE 1
Examples 1 to 4 were each performed by taking 10 thermistor chips as samples, and the test results are shown in table 2 below, where table 2 shows the resistance values of the thermistor chips at normal temperature and 25 ℃, the B values measured from the resistance values at 25 ℃ and 50 ℃, the resistance value change rate after storage at 350 ℃ for 1000 hours, and the B value change rate after storage at 350 ℃ for 1000 hours.
TABLE 2
As can be seen by comparing the data in tables 1 and 2, the thermistor chips of examples 1 to 4 are significantly better in high temperature resistance and higher in reliability than the thermistor chips of comparative examples 1 to 4 to which thulium trioxide is not added. The thermistor chips of examples 1 to 4 had resistance change rates within 0.3% and B value change rates within 0.3%; whereas the thermistor chips of comparative examples 1 to 4 had a resistance change rate of more than 1% and a B value change rate of more than 0.3%.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.
Claims (9)
1. Tm (Tm)2O3The modified NTC heat-sensitive chip material is characterized in that: the material is composed of an NTC thermistor material and thulium trioxide, and the mass ratio of the thulium trioxide to the NTC thermistor material is 1-5: 100.
2. The material of claim 1, wherein: the mass ratio of the thulium trioxide to the NTC thermistor material is 1: 20.
3. The material according to claim 1 or 2, characterized in that: the NTC thermistor material comprises the following components in percentage by mass: 25% of manganese dioxide, 30% of ferric oxide, 35% of cobaltosic oxide, 5% of silicon dioxide and 5% of zinc.
4. The material according to claim 1 or 2, characterized in that: the NTC thermistor material comprises the following components in percentage by mass: 60% of manganese dioxide, 35% of cobaltosic oxide, 3% of nickel sesquioxide and 2% of aluminum oxide.
5. The material according to claim 1 or 2, characterized in that: the NTC thermistor material comprises the following components in percentage by mass: 65% of manganese dioxide, 10% of cobaltosic oxide and 25% of nickel sesquioxide.
6. The material according to claim 1 or 2, characterized in that: the NTC thermistor material comprises the following components in percentage by mass: 20% of manganese dioxide, 45% of ferric oxide, 30% of cobaltosic oxide and 5% of nickel sesquioxide.
7. An NTC thermistor chip, characterized in that: the electrode comprises a thermosensitive ceramic substrate and two electrodes respectively arranged on two surfaces of the thermosensitive ceramic substrate, wherein the thermosensitive ceramic substrate is made of the material as claimed in any one of claims 1 to 6.
8. A preparation method of an NTC thermistor chip is characterized by comprising the following steps: the method comprises the steps of preparing a thermal sensitive ceramic substrate, preparing an electrode layer and cutting; wherein the step of preparing a heat-sensitive ceramic substrate comprises: mixing thulium trioxide and an NTC thermistor material according to the mass ratio of 1-5: 100, and performing ball milling, compression molding, high-temperature sintering and cutting to obtain a flaky thermosensitive ceramic substrate.
9. The method of claim 8, wherein: in the step of preparing the thermal sensitive ceramic substrate, thulium trioxide and the NTC thermistor material are mixed according to the mass ratio of 1: 20.
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| CN201911364168.XA CN111029069A (en) | 2019-12-26 | 2019-12-26 | Tm2O3Rare earth element modified high-temperature-resistant high-reliability NTC semiconductor ceramic thermosensitive chip material |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0345559A (en) * | 1989-07-11 | 1991-02-27 | Tdk Corp | Ceramic composition having resistive element non-linear to electric voltage |
| EP1137016A1 (en) * | 1999-08-30 | 2001-09-26 | Denso Corporation | Thermistor device |
| JP2005236274A (en) * | 2004-01-20 | 2005-09-02 | Tdk Corp | Resistive paste, resistor and electronic components |
| CN105753454A (en) * | 2016-02-17 | 2016-07-13 | 刘操 | Thermal sensitive ceramic material with low electrical resistivity and negative temperature coefficient and preparation method thereof |
| CN108147790A (en) * | 2017-12-26 | 2018-06-12 | 珠海爱晟医疗科技有限公司 | Medical NTC heat sensitive chips of the high precision high stability containing gold and preparation method thereof |
-
2019
- 2019-12-26 CN CN201911364168.XA patent/CN111029069A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0345559A (en) * | 1989-07-11 | 1991-02-27 | Tdk Corp | Ceramic composition having resistive element non-linear to electric voltage |
| EP1137016A1 (en) * | 1999-08-30 | 2001-09-26 | Denso Corporation | Thermistor device |
| JP2005236274A (en) * | 2004-01-20 | 2005-09-02 | Tdk Corp | Resistive paste, resistor and electronic components |
| CN105753454A (en) * | 2016-02-17 | 2016-07-13 | 刘操 | Thermal sensitive ceramic material with low electrical resistivity and negative temperature coefficient and preparation method thereof |
| CN108147790A (en) * | 2017-12-26 | 2018-06-12 | 珠海爱晟医疗科技有限公司 | Medical NTC heat sensitive chips of the high precision high stability containing gold and preparation method thereof |
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