CN111016323A - Para-aramid film modified high-toughness resin-based composite material and preparation method thereof - Google Patents
Para-aramid film modified high-toughness resin-based composite material and preparation method thereof Download PDFInfo
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- CN111016323A CN111016323A CN201911248189.5A CN201911248189A CN111016323A CN 111016323 A CN111016323 A CN 111016323A CN 201911248189 A CN201911248189 A CN 201911248189A CN 111016323 A CN111016323 A CN 111016323A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/106—Carbon fibres, e.g. graphite fibres
Abstract
The invention discloses a para-aramid film modified high-toughness resin-based composite material, which is prepared by co-curing a para-aramid film and a resin-based prepreg; the para-aramid film is a pure poly-p-phenylene terephthamide film or a mixture film containing poly-p-phenylene terephthamide; the content (mass%) of the poly-p-phenylene terephthamide in the para-aramid film is 50-100%, and the thickness of the film is 0.01-0.5 mm. The invention also discloses a preparation method of the para-aramid film modified high-toughness resin-based composite material, which comprises the following steps: paving and pasting the para-aramid film and a resin-based prepreg on a die to obtain a preformed blank, and then flattening and compacting; and curing and molding, and demolding to obtain the para-aramid film modified high-toughness resin-based composite material. The resin-based composite material provided by the invention has the advantages that the impact resistance and the surface damage resistance of the resin-based composite material are obviously improved.
Description
Technical Field
The invention relates to the technical field of resin-based composite materials, in particular to a para-aramid film modified high-toughness resin-based composite material and a preparation method thereof.
Background
Resin-based composite materials are fiber-reinforced materials using an organic polymer as a matrix, and usually glass fibers, carbon fibers, aramid fibers, woven fabrics thereof, and the like are used as reinforcements. The resin-based composite material has the advantages of light weight, high specific strength, high specific modulus, excellent performances of corrosion resistance, heat insulation, sound insulation, impact resistance and the like, and is widely applied to the industries of aerospace, medicine, machinery, building and the like. With the technological progress and the technical development, the resin matrix composite material has higher requirements on impact resistance, and the para-aramid film is one of the key materials capable of further improving the toughness of the resin matrix composite material. The para-aramid film is a film mainly containing poly (p-phenylene terephthalamide) as a main component or all components, and in recent years, due to the maturity of a large-scale preparation technology of para-aramid nanofibers, high-quality and ultrathin para-aramid film products are gradually mature, and the para-aramid film has excellent performances such as high heat resistance, low dielectric property, impact resistance, tear resistance, puncture resistance and the like.
Disclosure of Invention
Technical problem to be solved
The invention aims to solve the technical problem of how to integrally improve the toughness of the resin-based composite material on the premise of not reducing other properties of the resin-based composite material.
(II) technical scheme
In order to solve the technical problem, the invention provides a para-aramid film modified high-toughness resin-based composite material, which comprises the following components in percentage by weight: para-aramid film, resin-based prepreg.
Preferably, the resin-based composite material is prepared by laminating and co-curing the para-aramid film and the resin-based prepreg.
Preferably, the para-aramid film is a pure poly (p-phenylene terephthalamide) film or a film of a mixture containing poly (p-phenylene terephthalamide).
Preferably, the content (specifically, mass%) of the poly-p-phenylene terephthamide in the para-aramid film is 50-100%, and the thickness of the film is 0.01-0.5 mm.
Preferably, the para-aramid film modified high tenacity resin based composite material according to claim 2, wherein said film of a blend comprising poly (p-phenylene terephthalamide) is a film of a blend of poly (p-phenylene terephthalamide) with polyethylene or polypropylene or polyester.
Preferably, the resin in the resin-based prepreg comprises: the epoxy resin contains bismaleimide monomer and homologues, bismaleimide resin containing diallyl bisphenol A monomer and homologues, bisphenol A epoxy resin or bisphenol S epoxy resin or bisphenol F epoxy resin or novolac epoxy resin, and amine curing agent, imidazole curing agent or anhydride curing agent.
Preferably, the resin-based prepreg contains a reinforcing material: carbon fibers and fabrics thereof, glass fibers and fabrics thereof, quartz fibers and fabrics thereof, or aramid fibers and fabrics thereof.
The invention also provides a preparation method of the para-aramid film modified high-toughness resin-based composite material, which comprises the following steps:
(1) cutting the para-aramid film and the resin-based prepreg according to the size of the die;
(2) laying and pasting the cut para-aramid film and the resin-based prepreg on a die in an interval or non-interval sequence to obtain a preformed blank, allowing the film and the prepreg to be flattened by an electric iron, and allowing the film and the prepreg to be vacuumized and pre-compacted according to the process requirements;
(3) and curing and molding the para-aramid film modified resin-based composite material, and demolding to obtain the para-aramid film modified high-toughness resin-based composite material.
(III) advantageous effects
The invention provides a para-aramid film modified resin-based composite material and a preparation method thereof for the first time aiming at the requirements of the fields of aerospace, rail transit and the like on the impact resistance of resin-based composite materials. The para-aramid film modified high-toughness resin-based composite material has excellent performances of light weight, high temperature resistance, low dielectric, impact resistance and the like, and has wide application prospects in the fields of aerospace, rail transit and the like.
Detailed Description
The following examples further describe embodiments of the present invention in detail. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
The invention firstly proposes that the para-aramid film is applied to the modification of the resin-based composite material, and the para-aramid film is introduced into the resin-based composite material as an interlayer toughening material by a laminating and paving method, so that the impact resistance of the aramid film is exerted, and the toughness of the composite material is integrally improved on the premise of not reducing other performances of the composite material.
The curing of the invention is carried out by means of autoclave, press or vacuum oven.
Example 1
A flat plate die with the size of 300mm multiplied by 300mm is selected, and a para-aramid film and ZT7H/5429 carbon fiber bismaleimide resin prepreg are selected. The para-aramid film is a pure para-aramid film, and the thickness of the para-aramid film is 0.05 mm. And cutting the para-aramid film and the bismaleimide resin prepreg according to the size of 300mm multiplied by 300 mm. And (3) paving and sticking the cut para-aramid film and bismaleimide resin prepreg on a die at intervals, paving the para-aramid film firstly, paving the ZT7H/5429 carbon fiber bismaleimide resin prepreg, and alternately paving the layers to obtain 17 layers. Flattening the para-aramid fiber film and the prepreg by using an electric iron, and vacuumizing and compacting every 3 layers of the para-aramid fiber film and the prepreg; and (3) assembling the laid composite material blank in a mould, curing by adopting an autoclave at the curing temperature of 150 ℃/1 hour +180 ℃/2 hours +200 ℃/5 hours and under the pressure of 0.65MPa, and demolding after curing to obtain the bismaleimide resin carbon fiber composite material modified by the para-aramid film.
Example 2
A flat plate die with the thickness of 600mm multiplied by 300mm is selected, and a para-aramid film and ACTECH1302/SW110C glass fiber fabric reinforced epoxy resin prepreg is selected. The para-aramid film is a mixed film of para-aramid and polyethylene, the mass content of the para-aramid is 90%, and the thickness of the para-aramid film is 0.1 mm. And cutting the para-aramid film and the epoxy resin prepreg according to the size of 600mm multiplied by 300 mm. And (3) paving the cut para-aramid film and the epoxy resin prepreg on a mould, paving the para-aramid film firstly, paving the ACTECH1302/SW110C glass fiber fabric reinforced epoxy resin prepreg for 24 layers, and paving 1 layer of para-aramid film finally. Flattening the para-aramid fiber film and the prepreg by using an electric iron, and vacuumizing and compacting every 3 layers of the para-aramid fiber film and the prepreg; and (3) assembling the laid composite material blank in a mould, curing by adopting an autoclave at the curing temperature of 180 ℃/3 hours and under the pressure of 0.6MPa, and demolding after curing to obtain the para-aramid film modified glass fiber fabric reinforced epoxy resin composite material.
The above embodiments are merely illustrative of the present invention and are not to be construed as limiting the invention. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that various combinations, modifications or equivalents may be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention, and the technical solution of the present invention is covered by the claims of the present invention.
Claims (8)
1. The para-aramid film modified high-toughness resin-based composite material is characterized by being prepared by laminating and co-curing a para-aramid film and a resin-based prepreg.
2. A para-aramid film modified high tenacity resin based composite material as claimed in claim 1, wherein said para-aramid film is a pure poly-p-phenylene terephthalamide film or a film of a mixture containing poly-p-phenylene terephthalamide.
3. A para-aramid film modified high tenacity resin based composite material as claimed in claim 2, wherein the para-aramid film has a poly (p-phenylene terephthalamide) content of 50-100% and a film thickness of 0.01-0.5 mm.
4. A para-aramid film modified high tenacity resin based composite material as claimed in claim 2, wherein said film of a blend containing poly (p-phenylene terephthalamide) is a film of a blend of poly (p-phenylene terephthalamide) with polyethylene or polypropylene or polyester.
5. A para-aramid film modified high tenacity resin based composite material as claimed in claim 1, wherein the resin in said resin based prepreg comprises: the epoxy resin contains bismaleimide monomer and homologues, bismaleimide resin containing diallyl bisphenol A monomer and homologues, bisphenol A epoxy resin or bisphenol S epoxy resin or bisphenol F epoxy resin or novolac epoxy resin, and amine curing agent, imidazole curing agent or anhydride curing agent.
6. The para-aramid film-modified high-toughness resin-based composite material as claimed in claim 1, wherein the reinforcement material contained in the resin-based prepreg is: carbon fibers and fabrics thereof, glass fibers and fabrics thereof, quartz fibers and fabrics thereof, or aramid fibers and fabrics thereof.
7. A method for preparing a para-aramid film modified high-toughness resin-based composite material according to claim 1, characterized in that the method comprises the steps of:
(1) cutting the para-aramid film and the resin-based prepreg according to the size of the die;
(2) laying and pasting the cut para-aramid film and the resin-based prepreg on a die in an interval or non-interval sequence to obtain a preformed blank, flattening the film and the prepreg by using an electric iron, and performing vacuum pre-compaction according to process requirements;
(3) and curing and molding the para-aramid film modified resin-based composite material, and demolding to obtain the para-aramid film modified high-toughness resin-based composite material.
8. The method for preparing a para-aramid film-modified high-toughness resin-based composite material according to claim 7, wherein the curing in the step (3) is performed by using an autoclave, a press or a vacuum oven.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911248189.5A CN111016323A (en) | 2019-12-09 | 2019-12-09 | Para-aramid film modified high-toughness resin-based composite material and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911248189.5A CN111016323A (en) | 2019-12-09 | 2019-12-09 | Para-aramid film modified high-toughness resin-based composite material and preparation method thereof |
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| CN111016323A true CN111016323A (en) | 2020-04-17 |
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| CN201911248189.5A Pending CN111016323A (en) | 2019-12-09 | 2019-12-09 | Para-aramid film modified high-toughness resin-based composite material and preparation method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103387709A (en) * | 2012-05-08 | 2013-11-13 | 合肥杰事杰新材料股份有限公司 | Thermoplastic composite material, and preparation method and application thereof |
| CN103395212A (en) * | 2013-07-26 | 2013-11-20 | 上海舟汉纤维材料科技有限公司 | Preparation method for polyimide-based aramid composite material |
| CN108045015A (en) * | 2017-12-15 | 2018-05-18 | 大连理工大学 | A kind of enhanced carbon fiber prepreg, preparation method and application |
-
2019
- 2019-12-09 CN CN201911248189.5A patent/CN111016323A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103387709A (en) * | 2012-05-08 | 2013-11-13 | 合肥杰事杰新材料股份有限公司 | Thermoplastic composite material, and preparation method and application thereof |
| CN103395212A (en) * | 2013-07-26 | 2013-11-20 | 上海舟汉纤维材料科技有限公司 | Preparation method for polyimide-based aramid composite material |
| CN108045015A (en) * | 2017-12-15 | 2018-05-18 | 大连理工大学 | A kind of enhanced carbon fiber prepreg, preparation method and application |
Non-Patent Citations (1)
| Title |
|---|
| 慕成斌: "《通信光纤光缆材料及产业发展》", 30 June 2015 * |
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Application publication date: 20200417 |