CN111010818B - Smearing path planning method and device applied to tin paste smearing equipment - Google Patents
Smearing path planning method and device applied to tin paste smearing equipment Download PDFInfo
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- CN111010818B CN111010818B CN201911120636.9A CN201911120636A CN111010818B CN 111010818 B CN111010818 B CN 111010818B CN 201911120636 A CN201911120636 A CN 201911120636A CN 111010818 B CN111010818 B CN 111010818B
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 72
- 238000000034 method Methods 0.000 title claims abstract description 36
- 239000007788 liquid Substances 0.000 claims abstract description 14
- 230000009471 action Effects 0.000 claims description 8
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- 230000008569 process Effects 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 6
- 238000010422 painting Methods 0.000 claims 1
- 230000002349 favourable effect Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000004590 computer program Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- 230000004044 response Effects 0.000 description 4
- 238000013527 convolutional neural network Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012549 training Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004422 calculation algorithm Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The application discloses a smearing path planning method and a smearing path planning device applied to tin paste smearing equipment, wherein the smearing path planning method comprises the following steps: determining the type of each pad to be processed on the circuit board; determining a smearing path based on the type of each pad to be processed and preset smearing priority information; and outputting the smearing path. Because the final type relevance of the path of scribbling that determines of this application scheme and pending pad is strong, consequently, scribble the basis that equipment was scribbled to the pad on the circuit board as tin thick liquid with this path of scribbling, be favorable to improving the efficiency that tin thick liquid was scribbled.
Description
Technical Field
The application belongs to the field of Surface Mounting Technology (SMT), and particularly relates to a coating path planning method and device applied to tin paste coating equipment.
Background
The tin paste smearing process is used as a first key link of SMT (surface mount technology) manufacturing of electronic products, the smearing quality inevitably has a crucial influence on the final quality of the electronic products, and meanwhile, the smearing efficiency has a similar but not identical effect on improving the overall production efficiency of the products.
In the existing tin paste smearing technology, tin paste smearing paths are smeared in sequence according to the position sequence of a circuit board bonding pad, when the circuit board has multiple different types of bonding pads to be smeared, smearing parameters need to be adjusted ceaselessly, and then the tin paste smearing paths are smeared in sequence according to the position sequence of the bonding pads, so that the tin paste smearing efficiency is very low.
Disclosure of Invention
The application provides a method and a device for planning a coating path of tin paste coating equipment, which are beneficial to improving the efficiency of tin paste coating.
Specifically, a first aspect of the present application provides a method for planning a smearing path applied to a tin paste smearing device, where the tin paste smearing device includes a tool head, the tool head has a function of moving and pushing tin paste under the driving of a motor, and the method for planning the smearing path includes:
determining the type of each pad to be processed on the circuit board;
determining a smearing path based on the type of each pad to be processed and preset smearing priority information, wherein the smearing path indicates a tin paste smearing sequence of each pad to be processed on the circuit board, and the smearing priority information is used for indicating the priority corresponding to each type of pad and the priority sequence of tin paste smearing;
outputting the smearing path so as to drive the smearing tool to smear the tin paste for each pad to be processed based on the smearing path.
Based on the first aspect, in a first possible implementation manner, the determining a smearing path based on a type of each pad to be processed and preset smearing priority information includes:
selecting a pad to be processed on the circuit board as a current smearing node;
traversing the circuit board based on the type of the current smearing node and the smearing priority information to determine the next smearing node of the current smearing node;
taking the next smearing node as the current smearing node, and returning to execute the action of traversing the circuit board based on the smearing priority information until all the pads to be processed on the circuit board are traversed;
and generating the smearing paths according to the sequence of the smearing nodes.
Based on the first possible implementation manner of the first aspect, in a second possible implementation manner, the selecting a pad to be processed on the circuit board as a current daubing node specifically includes: and selecting a pad to be processed in the upper left corner area on the circuit board as a current smearing node.
Based on the second possible implementation manner of the first aspect, in a third possible implementation manner, the traversing the circuit board based on the smearing priority information includes:
and if more than two next smearing nodes with the same priority exist in the current smearing node, determining the next smearing node of the current smearing node according to the sequence of right first and lower second.
Based on the first aspect, or the first possible implementation manner of the first aspect, or the first aspect in the second possible implementation manner, or the first aspect in the third possible implementation manner, in a fourth possible implementation manner, the priority order indicated by the smearing priority information sequentially includes, from high to low: the smearing integrity of the pads to be treated, the absence of crossing lines in the smearing path, the short distance between adjacent smeared pads to be treated, and the high to low priority pad types.
This application second aspect provides a be applied to tin thick liquid and paint route planning device of paining of equipment, above-mentioned tin thick liquid paint equipment contain the instrument head, and above-mentioned instrument head possesses the function that removes and propelling movement tin thick liquid under motor drive, and the route planning device is paintd to the aforesaid includes:
the type determining unit is used for determining the type of each pad to be processed on the circuit board;
the smearing path determining unit is used for determining a smearing path based on the type of each pad to be processed and preset smearing priority information, wherein the smearing path indicates a smearing sequence of tin paste of each pad to be processed on the circuit board, and the smearing priority information is used for indicating the priority corresponding to each type of pad and the priority sequence of the tin paste smearing;
and the output unit is used for outputting the smearing path so as to drive the smearing tool to smear the tin paste for each pad to be processed based on the smearing path.
Based on the second aspect, in a first possible implementation manner, the smearing path determining unit includes:
an initial node selection unit for selecting a pad to be processed on the circuit board as a current smearing node;
the traversal unit is used for traversing the circuit board based on the type of the current smearing node and the smearing priority information so as to determine the next smearing node of the current smearing node; taking the next smearing node as the current smearing node, and returning to execute the action of traversing the circuit board based on the smearing priority information until all the pads to be processed on the circuit board are traversed;
and the generating unit is used for generating the smearing path according to the sequence of each smearing node.
Based on the first possible implementation manner of the second aspect, in a second possible implementation manner, the initial node selecting unit is specifically configured to: and selecting a pad to be processed in the upper left corner area on the circuit board as a current smearing node.
Based on the second possible implementation manner of the second aspect, in a third possible implementation manner, the traversal unit is specifically configured to: when more than two next smearing nodes with the same priority exist in the current smearing node in the traversal process, the next smearing node of the current smearing node is determined according to the sequence of first right and then lower.
Based on the second aspect, or the first possible implementation manner of the second aspect, or the second aspect is in a second possible implementation manner, or the second aspect is in a third possible implementation manner, in a fourth possible implementation manner, the smearing path planning device further includes:
a storage unit for storing the smearing priority information;
the priority order indicated by the smearing priority information is from high to low: the smearing integrity of the pads to be treated, the absence of crossing lines in the smearing path, the short distance between adjacent smeared pads to be treated, and the high to low priority pad types.
According to the method and the device, the smearing path is determined based on the type of each pad to be processed on the circuit board and the type of each pad to be processed and the preset smearing priority information, and the smearing priority information is related to the priority corresponding to each type of pad and the priority sequence of tin paste smearing, so that the smearing path can be determined based on the smearing priority information of each type of pad. Because the final type relevance of the path of scribbling that determines of this application scheme and pending pad is strong, consequently, scribble the basis that equipment was scribbled to the pad on the circuit board as tin thick liquid with this path of scribbling, be favorable to improving the efficiency that tin thick liquid was scribbled.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic view of a tin paste applying apparatus provided in an embodiment of the present application;
fig. 2 is a schematic flow chart of a smearing path planning method according to an embodiment of the present disclosure;
fig. 3 is a schematic diagram illustrating a tin paste applying path planning according to an embodiment of the present disclosure;
FIG. 4 is a schematic view illustrating another tin paste applying path planning method according to an embodiment of the present disclosure;
fig. 5 is a schematic diagram illustrating a path planning of a solder paste application according to another embodiment of the present disclosure;
fig. 6 is a schematic diagram illustrating a path planning of another solder paste application according to an embodiment of the present disclosure;
fig. 7 is a schematic diagram illustrating a path planning of a solder paste application according to another embodiment of the present disclosure;
FIG. 8 is a schematic view illustrating a path planning of a solder paste application according to an embodiment of the present disclosure;
FIG. 9 is a schematic view illustrating a path planning of a solder paste application according to another embodiment of the present disclosure;
fig. 10 is a schematic structural diagram of a smearing path planning device according to an embodiment of the present disclosure;
fig. 11 is a schematic structural diagram of another smearing path planning device according to an embodiment of the present application.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification of the present application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
As used in this specification and the appended claims, the term "if" may be interpreted contextually as "when …" or "upon" or "in response to a determination" or "in response to a detection". Similarly, the phrase "if it is determined" or "if a [ described condition or event ] is detected" may be interpreted depending on the context to mean "upon determining" or "in response to determining" or "upon detecting [ described condition or event ]" or "in response to detecting [ described condition or event ]".
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present application are clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides a tin paste smearing path planning method and a path planning device applied to tin paste smearing equipment, wherein the tin paste smearing equipment comprises a tool head, and the tool head has the functions of moving and pushing tin paste under the driving of a motor. In practical application, the tin paste smearing equipment controls a motor of the tin paste smearing equipment according to an input smearing path, and the smearing tool head executes corresponding moving action and tin paste pushing action under the driving of the motor.
In order to better understand the scheme of the present application, the tin paste applying apparatus is described below with a specific application example, and fig. 1 is a schematic structural diagram of the tin paste applying apparatus. As can be seen from fig. 1, the tin paste applying apparatus includes: a housing 11, a smear tool head 12 and a circuit board holder 13 for holding a circuit board. In practical applications, the circuit board may be moved to the area of the circuit board clamp 13 automatically or manually, and the circuit board may be fixed by the circuit board clamp 13. The plastering tool head 12 can move in three-dimensional directions along the horizontal axis, the vertical axis and the longitudinal axis under the driving of a motor (not shown in the figure), and the plastering tool head 12 can also push the tin paste under the driving of the motor.
It should be noted that the above mentioned motors relate to all motors for driving the above mentioned spreading tool to move and push the tin paste. The tin paste applying apparatus shown in fig. 1 is only an illustration, and is not a limitation to the specific structure of the tin paste applying apparatus of the present application.
The following describes a method for planning a smearing path applied to a tin paste smearing device according to an embodiment, where the tin paste smearing device specifically refers to the content described above, and is not described herein again. As shown in fig. 2, the smearing path calculation method includes:
In step 201, an image of the circuit board (i.e., an image of a surface where the pads are located on the circuit board) may be obtained, feature recognition may be performed on each pad to be processed on the circuit board to extract feature information of each pad to be processed on the circuit board, and then a type to which each pad to be processed on the circuit board belongs may be determined based on the feature information of each pad to be processed.
Specifically, the individual pad features may be pre-classified based on the features of common pads. After a circuit board image is obtained, feature recognition can be performed on each pad to be subjected to feature recognition on the circuit board based on each pad feature classified in advance, feature recognition can be performed on each pad to be subjected to feature recognition in the circuit board image, and features of each pad to be subjected to feature recognition are obtained, wherein the feature information comprises feature recognition values corresponding to each pad feature. For example, the pad characteristics can be divided into: after a circuit board image is obtained, feature recognition is respectively carried out on each pad to be processed in the circuit board image based on each classified pad feature so as to obtain a feature recognition value (such as the shape, the starting point coordinate, the end point coordinate, the hole, the continuity, the area, the radius, the length and the center point coordinate) corresponding to each pad feature, wherein the continuity means that a pad consistent with the pad feature to be processed exists in an adjacent area of the pad to be processed (an adjacent area is an area with a distance to the pad to be processed smaller than a preset threshold). The above-mentioned values of the coordinates may be obtained based on a preset coordinate system, and specifically, the coordinate system may be established in advance with the top-left corner vertex or the center point of the circuit board as the origin of the coordinate system.
Further, on the basis that the feature information includes feature identification values corresponding to features of the pads, the type to which each pad to be processed belongs may be determined based on feature information of each pad to be processed and pre-stored category feature information, where the category feature information includes feature reference values of the pad features in various types. Because the feature information contains the feature identification value corresponding to each pad feature, the pad feature contained in the corresponding pad to be processed can be determined by integrating the feature identification value of each pad feature and the feature reference value of each pad feature, and the type of the corresponding pad to be processed is further determined. For example, if the feature identification value of each pad feature and the feature reference value of each pad feature are integrated, determining the pad features included in the corresponding pad to be processed includes: the pad to be processed is continuous, provided with holes, large in area and circular, and the type of the corresponding pad to be processed can be determined to be a continuous large circular pad with holes; for another example, if the feature identification value of each pad feature and the feature reference value of each pad feature are integrated, determining the pad feature included in the corresponding pad to be processed includes: discontinuous, perforated, large-area, square, it can be determined that the type of the corresponding pad to be processed is a single perforated large square pad.
Or, in another application scenario, training of the convolutional neural network may be performed in advance based on the pad sample, and after the feature information of each to-be-processed pad is obtained, the feature information of each to-be-processed pad may be respectively input to the convolutional neural network for classification processing to determine the type of each to-be-processed pad, where the convolutional neural network is obtained based on the training of the pad sample.
Of course, in step 201, the type of each pad to be processed on the circuit board may also be determined based on the received classification information of each pad to be processed. For example, the respective pads to be processed on the circuit board may be classified by a worker and input as the classification information. Step 201 comprises: and receiving the classification information of each pad to be processed on the circuit board, and determining the type of each pad to be processed on the circuit board based on the classification information of each pad to be processed.
the smearing path indicates a tin paste smearing sequence of each pad to be processed on the circuit board, and the smearing priority information is used for indicating the priority corresponding to each type of pad and the priority sequence of the tin paste smearing.
Optionally, the determining, based on the type of each pad to be processed and preset smearing priority information, a smearing path includes:
selecting a pad to be processed on the circuit board as a current smearing node;
traversing the circuit board based on the type of the current smearing node and the smearing priority information to determine the next smearing node of the current smearing node;
taking the next smearing node as the current smearing node, and returning to execute the action of traversing the circuit board based on the smearing priority information until all the pads to be processed on the circuit board are traversed;
and generating the smearing paths according to the sequence of the smearing nodes.
Optionally, the step of selecting a pad to be processed on the circuit board as the current smearing node specifically includes: and selecting a pad to be processed in the upper left corner area on the circuit board as a current smearing node.
Optionally, traversing the circuit board based on the smearing priority information includes:
and if more than two next smearing nodes with the same priority exist in the current smearing node, determining the next smearing node of the current smearing node according to the sequence of right first and lower second.
Optionally, the priority order indicated by the smearing priority information sequentially from high to low is: the smearing integrity of the pads to be treated, the absence of crossing lines in the smearing path, the short distance between adjacent smeared pads to be treated, and the high to low priority pad types.
Specifically, when the priority levels are the same, the method automatically enters the priority level judgment of the next level, and if all the priority levels are the same, the judgment is carried out according to the principle that the priority level is first right and the priority level two is first down, and the principle is called as the supplementary priority level.
And 203, outputting the smearing path so as to drive the smearing tool to smear the tin paste on each pad to be processed based on the smearing path.
In order to better understand the tin paste smearing path planning method of the present application, the tin paste smearing path planning method is further described below with a specific application scenario example. In the application scenario, the upper left corner of the circuit board is used as a starting point, and since no continuous pad type exists from the starting point, and the priority level of the integrity is not available at this time, the pad to be processed closest to the starting point is calculated and used as the current smearing node, as shown in fig. 3.
And then detecting the priority level again, wherein the current smearing node to the next smearing node are straight line types at the moment, and the straight line types are used for indicating a starting point to an end point, so that the integrity is first, as shown in fig. 4, and the detection is carried out according to the above steps until the current priority level cannot be detected, namely, the detection of the next priority level is carried out, so that the efficiency can be improved.
After that, the above-mentioned process is repeated, and when the cross line appears in the daubing node according to the detection of the priority level, as shown in fig. 5, the cross daubing node is corrected according to the order of the priority level from high to low, that is, the cross line does not appear prior to the distance, as shown in fig. 6.
The cross lines of the smear nodes can also be formed by overlapping straight lines, as shown in fig. 7, and the cross smear nodes are corrected according to the priority from high to low, that is, the cross lines are not appeared in preference to the distance, as shown in fig. 8.
It should be noted that, when all the priority orders are judged to be failed, the smearing node detection is performed according to the order of first giving priority to the right and then giving priority to the back, as shown in fig. 9.
Wherein the continuous solid lines in fig. 3-9 represent smear node paths.
According to the method and the device, the smearing path is determined based on the type of each pad to be processed on the circuit board and the type of each pad to be processed and the preset smearing priority information, and the smearing priority information is related to the priority corresponding to each type of pad and the priority sequence of tin paste smearing, so that the smearing path can be determined based on the smearing priority information of each type of pad. Because the final type relevance of the path of scribbling that determines of this application scheme and pending pad is strong, consequently, scribble the basis that the path scribbled the pad on the circuit board as tin thick liquid and scribble equipment, be favorable to improving the efficiency that tin thick liquid was scribbled.
The following describes an embodiment of a smearing path planning device applied to a tin paste smearing device, where the tin paste smearing device specifically refers to the content described above, and is not described herein again. As shown in fig. 10, the smearing path planning device includes:
a type determining unit 1001 for determining the type of each pad to be processed on the circuit board;
a smearing path determining unit 1002, configured to determine a smearing path based on a type of each to-be-processed pad and preset smearing priority information, where the smearing path indicates a smearing order of solder paste on each to-be-processed pad on the circuit board, and the smearing priority information is used to indicate a priority corresponding to each type of pad and a priority order of the solder paste smearing;
an output unit 1003, configured to output the smearing path, so as to drive the smearing tool to smear the solder paste on each pad to be processed based on the smearing path.
Optionally, the smearing path determining unit 1002 includes:
an initial node selecting unit 10021, configured to select a pad to be processed on the circuit board as a current daubing node;
a traversing unit 10022, configured to traverse the circuit board based on the type of the current smearing node and the smearing priority information, so as to determine a next smearing node of the current smearing node; taking the next smearing node as the current smearing node, and returning to execute the action of traversing the circuit board based on the smearing priority information until all the pads to be processed on the circuit board are traversed;
a generating unit 10023 is configured to generate the smearing paths according to the order of the respective smearing nodes.
Optionally, the initial node selecting unit 10021 is specifically configured to: and selecting a pad to be processed in the upper left corner area on the circuit board as a current smearing node.
Optionally, the traversal unit 10022 is specifically configured to: when more than two next smearing nodes with the same priority exist in the current smearing node in the traversal process, the next smearing node of the current smearing node is determined according to the sequence of first right and then lower.
Optionally, the smearing path planning device further includes:
a storage unit for storing the smearing priority information;
the priority order indicated by the smearing priority information is from high to low: the smearing integrity of the pads to be treated, the absence of crossing lines in the smearing path, the short distance between adjacent smeared pads to be treated, and the high to low priority pad types. Fig. 11 is a schematic diagram of a specific connection structure of the smearing path planning device further provided with a storage unit 1004 on the basis of fig. 10.
According to the method and the device, the smearing path is determined based on the type of each pad to be processed on the circuit board and the type of each pad to be processed and the preset smearing priority information, and the smearing priority information is related to the priority corresponding to each type of pad and the priority sequence of tin paste smearing, so that the smearing path can be determined based on the smearing priority information of each type of pad. Because the final type relevance of the path of scribbling that determines of this application scheme and pending pad is strong, consequently, scribble the basis that the path scribbled the pad on the circuit board as tin thick liquid and scribble equipment, be favorable to improving the efficiency that tin thick liquid was scribbled.
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-mentioned division of the functional units and modules is illustrated, and in practical applications, the above-mentioned functions may be distributed as different functional units and modules according to needs, that is, the internal structure of the apparatus may be divided into different functional units or modules to implement all or part of the above-mentioned functions. Each functional unit and module in the embodiments may be integrated in one processing unit, or each unit may exist alone physically, or two or more units are integrated in one unit, and the integrated unit may be implemented in a form of hardware, or in a form of software functional unit. In addition, specific names of the functional units and modules are only for convenience of distinguishing from each other, and are not used for limiting the protection scope of the present application. The specific working processes of the units and modules in the system may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described system embodiments are merely illustrative, and for example, the division of the above-described modules or units is only one logical functional division, and in actual implementation, there may be another division, for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
The integrated unit may be stored in a computer-readable storage medium if it is implemented in the form of a software functional unit and sold or used as a separate product. Based on such understanding, all or part of the flow in the method of the embodiments described above may be implemented by a computer program, which may be stored in a computer readable storage medium and used by a processor to implement the steps of the embodiments of the methods described above. The computer program includes computer program code, and the computer program code may be in a source code form, an object code form, an executable file or some intermediate form. The computer readable medium may include: any entity or device capable of carrying the above-mentioned computer program code, recording medium, usb disk, removable hard disk, magnetic disk, optical disk, computer Memory, Read-Only Memory (ROM), Random Access Memory (RAM), electrical carrier signal, telecommunication signal, software distribution medium, etc. It should be noted that the computer readable medium described above may be suitably increased or decreased as required by legislation and patent practice in jurisdictions, for example, in some jurisdictions, computer readable media excludes electrical carrier signals and telecommunications signals in accordance with legislation and patent practice.
The above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.
Claims (8)
1. A smearing path planning method applied to tin paste smearing equipment is characterized in that the tin paste smearing equipment comprises a tool head, the tool head has the functions of moving and pushing tin paste under the driving of a motor, and the smearing path planning method comprises the following steps:
determining the type of each pad to be processed on the circuit board;
determining a smearing path based on the type of each pad to be processed and preset smearing priority information, wherein the smearing path indicates a tin paste smearing sequence of each pad to be processed on the circuit board, and the smearing priority information is used for indicating the priority corresponding to each type of pad and the priority sequence of tin paste smearing;
outputting the smearing path so as to drive the smearing tool to smear tin paste on each pad to be processed based on the smearing path;
wherein, the determining the smearing path based on the type of each pad to be processed and preset smearing priority information comprises:
selecting a pad to be processed on the circuit board as a current smearing node;
traversing the circuit board based on the type of the current smearing node and the smearing priority information to determine the next smearing node of the current smearing node;
taking the next smearing node as the current smearing node, and returning to execute the action of traversing the circuit board based on the smearing priority information until all the pads to be processed on the circuit board are traversed;
and generating the smearing path according to the sequence of the smearing nodes.
2. A daubing path planning method according to claim 1, wherein the selecting a pad to be processed on the circuit board as a current daubing node is specifically: and selecting a pad to be processed in the upper left corner area on the circuit board as a current smearing node.
3. The smear path planning method according to claim 2, wherein the traversing the circuit board based on the smear priority information comprises:
and if more than two next smearing nodes with the same priority exist in the current smearing node, determining the next smearing node of the current smearing node according to the sequence of right first and lower second.
4. A smearing path planning method according to any one of claims 1 to 3, wherein the smearing priority information indicates a priority order of: the smearing integrity of the pads to be treated, the absence of crossing lines in the smearing path, the short distance between adjacent smeared pads to be treated, and the high to low priority pad types.
5. The utility model provides a scribble route planning device for equipment is paintd to tin thick liquid, its characterized in that, equipment is paintd to tin thick liquid contains the tool bit, the tool bit possesses the function that removes and propelling movement tin thick liquid under motor drive, scribble route planning device and include:
the type determining unit is used for determining the type of each pad to be processed on the circuit board;
the smearing path determining unit is used for determining a smearing path based on the type of each pad to be processed and preset smearing priority information, wherein the smearing path indicates a smearing sequence of tin paste of each pad to be processed on the circuit board, and the smearing priority information is used for indicating the priority corresponding to each type of pad and the priority sequence of the tin paste smearing;
the output unit is used for outputting the smearing path so as to drive the smearing tool to smear the tin paste on each pad to be processed based on the smearing path;
the initial node selection unit is used for selecting a pad to be processed on the circuit board as a current smearing node;
the traversal unit is used for traversing the circuit board based on the type of the current smearing node and the smearing priority information so as to determine the next smearing node of the current smearing node; taking the next smearing node as the current smearing node, and returning to execute the action of traversing the circuit board based on the smearing priority information until all the pads to be processed on the circuit board are traversed;
and the generating unit is used for generating the smearing path according to the sequence of each smearing node.
6. A smear path planning apparatus according to claim 5, wherein the initial node selection unit is specifically configured to: and selecting a pad to be processed in the upper left corner area on the circuit board as a current smearing node.
7. A smear path planning device according to claim 6, wherein the traversal unit is specifically configured to: when more than two next smearing nodes with the same priority exist in the current smearing node in the traversal process, the next smearing node of the current smearing node is determined according to the sequence of first right and then lower.
8. A painting path planning device according to any one of claims 5 to 7, further comprising:
the storage unit is used for storing the smearing priority information;
the priority order indicated by the smearing priority information is from high to low: the smearing integrity of the pads to be treated, the absence of crossing lines in the smearing path, the short distance between adjacent smeared pads to be treated, and the high to low priority pad types.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911120636.9A CN111010818B (en) | 2019-11-15 | 2019-11-15 | Smearing path planning method and device applied to tin paste smearing equipment |
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| CN201911120636.9A CN111010818B (en) | 2019-11-15 | 2019-11-15 | Smearing path planning method and device applied to tin paste smearing equipment |
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| CN111010818A CN111010818A (en) | 2020-04-14 |
| CN111010818B true CN111010818B (en) | 2020-10-16 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05272928A (en) * | 1992-02-13 | 1993-10-22 | Nec Corp | Soldered-part inspecting apparatus |
| US6569753B1 (en) * | 2000-06-08 | 2003-05-27 | Micron Technology, Inc. | Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same |
| CN105729475B (en) * | 2016-04-28 | 2017-11-21 | 迈力（北京）机器人科技有限公司 | Soldering tin technique storehouse method for building up and the system applied to the soldering tin technique storehouse |
| CN108536915B (en) * | 2018-03-13 | 2022-10-25 | 京信网络系统股份有限公司 | Method and device for designing bonding pad in PCB design drawing of printed circuit board |
| CN108960306B (en) * | 2018-06-22 | 2022-03-04 | 西安电子科技大学 | Solder paste detection threshold value optimization method based on SMT big data |
| CN109332840B (en) * | 2018-11-20 | 2024-01-30 | 武汉欣远拓尔科技有限公司 | Intelligent welding system and method |
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