CN111010818B - Smearing path planning method and device applied to tin paste smearing equipment - Google Patents

Abstract

The present application discloses a smearing path planning method and device applied to tin paste smearing equipment, wherein the smearing path planning method includes: determining the type of each to-be-processed pad on a circuit board; type and preset smear priority information, determine the smear path; output the above smear path. Since the smearing path finally determined by the solution of this application has a strong correlation with the type of the pad to be processed, using the smearing path as the basis for smearing the pads on the circuit board by the tin paste smearing equipment is beneficial to improve the smearing efficiency of the tin paste. efficiency.

Description

A method and device for smearing path planning applied to tin paste smearing equipment

technical field

The application belongs to the field of Surface Mounting Technology (SMT, Surface Mounting Technology), and in particular relates to a coating path planning method and device applied to tin paste coating equipment.

Background technique

The tin paste coating process is the first key link in the SMT manufacturing of electronic products. The quality of the coating will inevitably have a crucial impact on the final quality of the electronic product. At the same time, the impact of the coating efficiency on improving the overall production efficiency of the product is also not trivial.

In the existing solder paste application technology, the solder paste application path is applied in sequence according to the position of the circuit board pads. When there are many different types of pads to be applied on the circuit board, it is necessary to continuously adjust the application parameters, and then follow the pads. The positions are applied in sequence, and the efficiency of tin paste application is very low.

SUMMARY OF THE INVENTION

The present application provides a smearing path planning method and device applied to tin slurry smearing equipment, which is beneficial to improve the efficiency of tin slurry smearing.

Specifically, a first aspect of the present application provides a coating path planning method applied to a tin paste coating device, wherein the tin paste coating device includes a tool head, and the tool head has the function of moving and pushing the tin paste under the drive of a motor. Smear path planning methods include:

Determine the type of each pad to be processed on the circuit board;

Based on the type of each of the above-mentioned pads to be processed and the preset smearing priority information, a smearing path is determined, wherein the smearing path indicates the solder paste smearing sequence of each to-be-processed pad on the circuit board, and the smearing priority information is used to indicate The priority corresponding to each type of pad, and the priority order of solder paste application;

The above-mentioned smearing path is output, so as to drive the above-mentioned smearing tool to apply tin paste to each of the above-mentioned pads to be processed based on the above-mentioned smearing path.

Based on the above-mentioned first aspect, in a first possible implementation manner, the above-mentioned determining the smearing path based on the type to which each of the above-mentioned pads to be processed belongs and the preset smearing priority information includes:

Select a to-be-processed pad on the above circuit board as the current smear node;

The circuit board is traversed based on the type of the current smearing node and the smearing priority information to determine the next smearing node of the current smearing node;

Take the next smear node as the current smear node, and return to perform the above-mentioned action of traversing the circuit board based on the smear priority information, until all the pads to be processed on the circuit board are traversed;

The above smear paths are generated in the order of each smear node.

Based on the first possible implementation manner of the above-mentioned first aspect, in the second possible implementation manner, selecting a pad to be processed on the circuit board as the current smearing node is specifically: selecting a pad located on the circuit board The to-be-processed pad in the upper-left area is used as the current smear node.

Based on the second possible implementation manner of the above-mentioned first aspect, in a third possible implementation manner, the above-mentioned traversal of the above-mentioned circuit board based on the above-mentioned smearing priority information includes:

If there are two or more next smear nodes with the same priority in the current smear node, the next smudge node of the current smudge node is determined in the order of first right and then lower.

Based on the foregoing first aspect, or the first possible implementation manner of the foregoing first aspect, or the foregoing first aspect is in the second possible implementation manner, or the foregoing first aspect is in the third possible implementation manner, In a fourth possible implementation manner, the priority order indicated by the above-mentioned smearing priority information is, from high to low: the smearing integrity of the pads to be processed, the absence of intersecting lines in the smearing path, and the pads to be processed adjacent to smearing Pad types with short distances and priority from high to low.

A second aspect of the present application provides a smearing path planning device applied to tin slurry smearing equipment. The tin slurry smearing equipment includes a tool head, and the tool head has the function of moving and pushing tin slurry under the drive of a motor. The smearing path planning device include:

The type determination unit is used to determine the type of each pad to be processed on the circuit board;

a smearing path determining unit, configured to determine a smearing path based on the type of each of the above-mentioned pads to be processed and preset smearing priority information, wherein the above-mentioned smearing path indicates the tin paste smearing sequence of each to-be-processed pad on the above-mentioned circuit board, The above smearing priority information is used to indicate the priority corresponding to each type of pad and the priority order of solder paste smearing;

The output unit is configured to output the smear path, so as to drive the smear tool to apply tin paste to each of the to-be-processed pads based on the smear path.

Based on the above second aspect, in a first possible implementation manner, the above smear path determination unit includes:

The initial node selection unit is used to select a pad to be processed on the above-mentioned circuit board as the current smear node;

The traversal unit is used to traverse the circuit board based on the type of the current smear node and the smear priority information to determine the next smear node of the current smear node; take the next smear node as the current smear node, and return to execute the above based on The above-mentioned smear priority information traverses the above-mentioned circuit board until all the pads to be processed on the above-mentioned circuit board are traversed;

The generating unit is used to generate the above-mentioned smearing path according to the sequence of each smearing node.

Based on the first possible implementation manner of the second aspect, in the second possible implementation manner, the initial node selection unit is specifically configured to: select the pad to be processed located in the upper left corner of the circuit board as the The current paint node.

Based on the second possible implementation manner of the second aspect, in the third possible implementation manner, the traversal unit is specifically used for: when the current smear node has two or more next smear nodes with the same priority during the traversal process When , determine the next smear node of the current smear node in the order of first right and then lower.

Based on the foregoing second aspect, or the first possible implementation manner of the foregoing second aspect, or the foregoing second aspect is in the second possible implementation manner, or the foregoing second aspect is in the third possible implementation manner, In a fourth possible implementation manner, the above-mentioned smearing path planning device further includes:

a storage unit for storing the above-mentioned smear priority information;

The priority order indicated by the above smear priority information is from high to low: the smearing integrity of the pads to be processed, the absence of cross lines in the smearing path, the short distance between adjacent pads to be smeared, and the priority is determined by High to low pad type.

It can be seen from the above that the application determines the smearing path based on the type of each pad to be processed on the circuit board, and based on the type of each pad to be processed and the preset smear priority information. The corresponding priority is related to the priority order of solder paste smearing. Therefore, the smearing path can be determined based on the smearing priority information of various types of pads. Since the smearing path finally determined by the solution of the present application has a strong correlation with the type of the pad to be processed, the smearing path is used as the basis for smearing the pads on the circuit board by the tin paste smearing equipment, which is beneficial to improve the smearing efficiency of the tin paste. efficiency.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only for the present application. In some embodiments, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without any creative effort.

Fig. 1 is the schematic diagram of a kind of tin paste coating equipment provided in the embodiment of the present application;

2 is a schematic flowchart of a method for smearing path planning provided in an embodiment of the present application;

3 is a schematic diagram of a tin paste coating path planning provided in an embodiment of the present application;

4 is a schematic diagram of another tin paste application path planning provided in an embodiment of the present application;

5 is a schematic diagram of yet another tin paste application path planning provided by an embodiment of the present application;

6 is a schematic diagram of yet another tin paste application path planning provided by an embodiment of the present application;

7 is a schematic diagram of yet another tin paste application path planning provided by an embodiment of the present application;

8 is a schematic diagram of yet another tin paste application path planning provided in an embodiment of the present application;

9 is a schematic diagram of yet another tin paste application path planning provided by an embodiment of the present application;

10 is a schematic structural diagram of a smearing path planning device provided by an embodiment of the present application;

FIG. 11 is a schematic structural diagram of another smearing path planning device provided in an embodiment of the present application.

Detailed ways

In the following description, for the purpose of illustration rather than limitation, specific details such as specific system structures and technologies are set forth in order to provide a thorough understanding of the embodiments of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.

It is to be understood that, when used in this specification and the appended claims, the term "comprising" indicates the presence of the described feature, integer, step, operation, element and/or component, but does not exclude one or more other features , whole, step, operation, element, component and/or the presence or addition of a collection thereof.

It should also be understood that the terms used in the specification of the present application are for the purpose of describing particular embodiments only and are not intended to limit the present application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural unless the context clearly dictates otherwise.

It should also be further understood that, as used in this specification and the appended claims, the term "and/or" refers to and including any and all possible combinations of one or more of the associated listed items .

As used in this specification and the appended claims, the term "if" may be contextually interpreted as "when" or "once" or "in response to determining" or "in response to detecting." Similarly, the phrases "if it is determined" or "if the [described condition or event] is detected" can be interpreted, depending on the context, to mean "once it is determined" or "in response to the determination" or "once the [described condition or event] is detected. event]" or "in response to detection of the [described condition or event]".

In order to make the objectives, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described implementation The examples are only some of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this application.

The embodiments of the present application provide a tin paste coating path planning method and a path planning device applied to a tin paste coating equipment, wherein the tin paste coating equipment includes a tool head, and the tool head is provided with a motor-driven moving and pushing tin paste. Function. In practical application, the above-mentioned tin paste application equipment controls the motor of the above-mentioned tin paste application equipment according to the input application path, and the above-mentioned application tool head performs corresponding movement actions and tin paste pushing actions under the driving of the motor.

In order to better understand the solution of the present application, the above-mentioned tin paste coating equipment will be described below with a specific application example. FIG. 1 is a schematic structural diagram of the above-mentioned tin paste coating equipment. As can be seen from FIG. 1 , the solder paste coating device includes: a casing 11 , a coating tool head 12 and a circuit board fixture 13 for fixing the circuit board. In practical application, the circuit board can be moved to the area where the circuit board fixture 13 is located automatically or manually, and the circuit board can be fixed by the circuit board fixture 13 . The smearing tool head 12 can move in three dimensions along the horizontal axis, the vertical axis and the longitudinal axis under the driving of the motor (not shown in the figure), and the smearing tool head 12 can also push the solder paste under the driving of the motor.

It should be noted that the motors mentioned above relate to all motors used to drive the applicator tool to move and push the tin paste. The tin paste coating equipment shown in FIG. 1 is only a schematic representation, and is not intended to limit the specific structure of the tin paste coating equipment of the present application.

A method for smearing path planning provided by the present application and applied to a tin slurry smearing device will be described below with an embodiment, wherein the tin slurry smearing device specifically refers to the content described above, and will not be repeated here. As shown in Figure 2, the above smear path calculation method includes:

Step 201: Determine the type of each pad to be processed on the circuit board.

In step 201, a circuit board image (that is, an image of the surface where the pads are located on the circuit board) can be obtained first, and feature identification is performed on each pad to be characterized on the above-mentioned circuit board, so as to extract the characteristics of each pad to be processed on the circuit board. feature information, and then determine the type of each pad to be processed on the circuit board based on the feature information of each pad to be processed.

Specifically, each pad feature may be pre-classified based on the features of common pads. After the circuit board image is acquired, feature recognition can be performed on each of the pads to be featured on the circuit board. Features of the pads to be processed, wherein the feature information includes a feature identification value corresponding to each pad feature. For example, the pad features can be divided into: shape, start point coordinates, end point coordinates, holes, continuity, area, radius, length and center point coordinates. After obtaining the circuit board image, based on the classified pad features, respectively Perform feature identification on each pad to be processed in the above circuit board image to obtain the feature identification value corresponding to each pad feature (such as the shape of the pad to be processed, start coordinates, end coordinates, holes, continuity, area, radius. , length and center point coordinates), the above-mentioned continuous means that there are pads in the adjacent area of the pad to be processed that are consistent with the characteristics of the pad to be processed (the distance between the adjacent area and the pad to be processed is less than the preset threshold Area). The values of the above-mentioned coordinates can be obtained based on a preset coordinate system. Specifically, a coordinate system can be established in advance with the upper left corner vertex or the center point of the circuit board as the origin of the coordinate system.

Further, on the basis that the above-mentioned feature information includes a feature identification value corresponding to each pad feature, the type to which each pad to be processed belongs can be determined based on the feature information of each pad to be processed and the pre-stored category feature information, wherein, The aforementioned category feature information includes feature reference values of the aforementioned respective pad features under various types. Since the above feature information includes the feature identification value corresponding to each pad feature, the pads included in the corresponding pad to be processed can be determined by synthesizing the feature identification value of each pad feature and the feature reference value of each pad feature feature, and then determine the type of the corresponding pad to be processed. For example, if the feature identification value of each pad feature and the feature reference value of each pad feature are combined, it is determined that the pad features included in the corresponding pad to be processed include: continuous, with holes, large area and circle, then you can It is determined that the type of the corresponding pad to be processed is a continuous large circular pad with holes; for another example, if the feature identification value of each pad feature and the feature reference value of each pad feature are combined, it is determined that the corresponding pad to be processed contains The pad features include: discontinuous, with holes, large area, square, then it can be determined that the type of the corresponding pad to be processed is a single large square pad with a hole.

Alternatively, in another application scenario, the convolutional neural network can also be trained based on the pad samples in advance, and after obtaining the feature information of each pad to be processed, the feature information of each pad to be processed can be input into the volume The convolutional neural network is used for classification processing to determine the type of each pad to be processed, wherein the above-mentioned convolutional neural network is trained based on pad samples.

Of course, in step 201, the type to which each pad to be processed on the circuit board belongs may also be determined based on the received classification information of each pad to be processed. For example, each pad to be processed on the circuit board can be classified by the staff and input as the above classification information. Step 201 includes: receiving classification information of each pad to be processed on the circuit board, and determining the type of each pad to be processed on the circuit board based on the classification information of each pad to be processed.

Step 202, determining a smearing path based on the type of each of the above-mentioned pads to be processed and preset smearing priority information;

Wherein, the smearing path indicates the smearing sequence of the solder paste on each pad to be processed on the circuit board, and the smearing priority information is used to indicate the priority corresponding to each type of pad and the priority order of smearing the solder paste.

Optionally, the above-mentioned determination of the smearing path based on the type of each of the above-mentioned pads to be processed and the preset smearing priority information includes:

Select a to-be-processed pad on the above circuit board as the current smear node;

The circuit board is traversed based on the type of the current smearing node and the smearing priority information to determine the next smearing node of the current smearing node;

Take the next smear node as the current smear node, and return to perform the above-mentioned action of traversing the circuit board based on the smear priority information, until all the pads to be processed on the circuit board are traversed;

The above smear paths are generated in the order of each smear node.

Optionally, the above-mentioned selecting a pad to be processed on the circuit board as the current smearing node is specifically: selecting the pad to be processed located in the upper left area of the circuit board as the current smearing node.

Optionally, the above-mentioned traversal of the above-mentioned circuit board based on the above-mentioned smearing priority information includes:

If there are two or more next smear nodes with the same priority in the current smear node, the next smudge node of the current smudge node is determined in the order of first right and then lower.

Optionally, the priority order indicated by the above smearing priority information is as follows: the smearing integrity of the pads to be processed, the absence of cross lines in the smearing path, the short distance between adjacent pads to be smeared, And the pad type from high to low priority.

Specifically, when the priority levels are the same, it will automatically enter the next level of priority judgment. If all the priorities are the same, it will be judged according to the principle of priority level 1, priority level 2, and priority level 2. The above principle is called for supplementary priority.

Step 203 , outputting the smearing path, so as to drive the smearing tool to apply tin paste to each of the pads to be processed based on the smearing path.

In order to better understand the tin paste smearing path planning method of the present application, the tin paste smearing path planning method is further described below with an example of a specific application scenario. In this application scenario, the upper left corner of the circuit board is used as the starting point. Since there is no continuous pad type starting from the starting point, and the priority level of integrity is no at this time, the calculation of the pending pad closest to the starting point is started. And as the current smear node, as shown in Figure 3.

After that, the priority level is detected again. At this time, from the current smear node to the next smear node is the straight line category, and the straight line category is used to indicate the starting point to the end point, so the integrity is prioritized, as shown in Figure 4, and the detection is performed accordingly until it cannot be detected. When the current priority level is reached, it will enter the next priority level detection, which can improve the efficiency.

After that, repeat the above process. When a cross line appears in the smear node according to the priority level detection, as shown in Figure 5, according to the order of priority from high to low, that is, no cross line appears prior to the distance, the cross smear node is Make corrections, as shown in Figure 6.

The intersection lines appearing in the above smear nodes can also be composed of overlapping straight line categories, as shown in Figure 7. At this time, according to the order of priority from high to low, that is, no intersection lines appear prior to the distance, and the cross smear nodes are corrected, as shown in Figure 8 shown.

It should be noted that when all the priority orders fail to be judged, the smear node detection is performed according to the order of priority to the right first, and priority to the downward, as shown in Figure 9.

Among them, the continuous solid lines in Figures 3-9 represent the smear node paths.

It can be seen from the above that the application determines the smearing path based on the type of each pad to be processed on the circuit board, and based on the type of each pad to be processed and the preset smear priority information. The corresponding priority is related to the priority order of solder paste smearing. Therefore, the smearing path can be determined based on the smearing priority information of various types of pads. Since the smearing path finally determined by the solution of the present application has a strong correlation with the type of the pad to be processed, the smearing path is used as the basis for smearing the pads on the circuit board by the tin paste smearing equipment, which is beneficial to improve the smearing of the tin paste. s efficiency.

The following describes a coating path planning device applied to a tin paste coating equipment provided by the present application with an embodiment, wherein the tin paste coating equipment refers to the content described above, and will not be repeated here. As shown in Figure 10, the above-mentioned smearing path planning device includes:

a type determination unit 1001, configured to determine the type to which each pad to be processed on the circuit board belongs;

The smearing path determination unit 1002 is configured to determine the smearing path based on the type of each of the above-mentioned pads to be processed and preset smearing priority information, wherein the above-mentioned smearing path indicates the solder paste application sequence of each to-be-processed pad on the circuit board. , the above smearing priority information is used to indicate the priority corresponding to each type of pad, and the priority order of solder paste smearing;

The output unit 1003 is configured to output the smear path, so as to drive the smear tool to apply tin paste to each of the to-be-processed pads based on the smear path.

Optionally, the above-mentioned smear path determination unit 1002 includes:

The initial node selection unit 10021 is used to select a pad to be processed on the above-mentioned circuit board as the current smear node;

The traversal unit 10022 is used to traverse the circuit board based on the type of the current smear node and the smear priority information to determine the next smear node of the current smear node; take the next smear node as the current smear node, and return to execute the above The action of traversing the above-mentioned circuit board based on the above-mentioned smearing priority information, until all the pads to be processed on the above-mentioned circuit board are traversed;

The generating unit 10023 is configured to generate the above-mentioned smearing path according to the order of each smearing node.

Optionally, the above-mentioned initial node selection unit 10021 is specifically configured to: select the pad to be processed located in the upper left area of the above-mentioned circuit board as the current smear node.

Optionally, the traversing unit 10022 is specifically configured to: when there are two or more next smearing nodes with the same priority in the current smearing node during the traversing process, determine the next smearing node of the current smearing node in the order of first right and then lower.

Optionally, the above-mentioned smear path planning device further includes:

a storage unit for storing the above-mentioned smear priority information;

The priority order indicated by the above smear priority information is from high to low: the smearing integrity of the pads to be processed, the absence of cross lines in the smearing path, the short distance between adjacent pads to be smeared, and the priority is determined by High to low pad type. FIG. 11 is a schematic diagram of a specific connection structure of the smearing path planning device further provided with a storage unit 1004 on the basis of FIG. 10 .

It can be seen from the above that the application determines the smearing path based on the type of each pad to be processed on the circuit board, and based on the type of each pad to be processed and the preset smear priority information. The corresponding priority is related to the priority order of solder paste smearing. Therefore, the smearing path can be determined based on the smearing priority information of various types of pads. Since the smearing path finally determined by the solution of the present application has a strong correlation with the type of the pad to be processed, the smearing path is used as the basis for smearing the pads on the circuit board by the tin paste smearing equipment, which is beneficial to improve the smearing of the tin paste. s efficiency.

Those skilled in the art can clearly understand that, for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example. Module completion, that is, dividing the internal structure of the above device into different functional units or modules to complete all or part of the functions described above. Each functional unit and module in the embodiment may be integrated in one processing unit, or each unit may exist physically alone, or two or more units may be integrated in one unit, and the above-mentioned integrated units may adopt hardware. It can also be realized in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing from each other, and are not used to limit the protection scope of the present application. For the specific working processes of the units and modules in the above-mentioned system, reference may be made to the corresponding processes in the foregoing method embodiments, which will not be repeated here.

In the foregoing embodiments, the description of each embodiment has its own emphasis. For parts that are not described or described in detail in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

Those of ordinary skill in the art can realize that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Skilled artisans may implement the described functionality using different methods for each particular application, but such implementations should not be considered beyond the scope of this application.

In the embodiments provided in this application, it should be understood that the disclosed apparatus and method may be implemented in other manners. For example, the system embodiments described above are only illustrative. For example, the division of the above-mentioned modules or units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components may be combined. Either it can be integrated into another system, or some features can be omitted, or not implemented. On the other hand, the shown or discussed mutual coupling or direct coupling or communication connection may be through some interfaces, indirect coupling or communication connection of devices or units, and may be in electrical, mechanical or other forms.

The units described above as separate components may or may not be physically separated, and components shown as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution in this embodiment.

If the above-mentioned integrated units are implemented in the form of software functional units and sold or used as independent products, they may be stored in a computer-readable storage medium. Based on this understanding, the present application can implement all or part of the processes in the methods of the above embodiments, and can also be completed by instructing the relevant hardware through a computer program. The above computer program can be stored in a computer-readable storage medium. The computer program When executed by a processor, the steps of each of the above method embodiments can be implemented. Wherein, the above-mentioned computer program includes computer program code, and the above-mentioned computer program code may be in the form of source code, object code form, executable file or some intermediate form. The above-mentioned computer-readable medium may include: any entity or device capable of carrying the above-mentioned computer program code, recording medium, U disk, mobile hard disk, magnetic disk, optical disk, computer memory, read-only memory (ROM, Read-Only Memory), random Access memory (RAM, RandomAccess Memory), electric carrier signal, telecommunication signal and software distribution medium, etc. It should be noted that the content contained in the above-mentioned computer-readable media may be appropriately increased or decreased in accordance with the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, the computer-readable media does not Included are electrical carrier signals and telecommunication signals.

The above-mentioned embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the above-mentioned embodiments, those of ordinary skill in the art should understand that the above-mentioned embodiments can still be used for The recorded technical solutions are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the application, and should be included in the present application. within the scope of protection of the application.

Claims (8)

1. A smearing path planning method applied to tin slurry smearing equipment, it is characterized in that, described tin slurry smearing equipment comprises tool head, and described tool head has the function of moving and pushing tin slurry under motor drive, and described smearing Path planning methods include: Determine the type of each pad to be processed on the circuit board; Based on the type to which each of the pads to be processed belongs and preset smearing priority information, a smearing path is determined, wherein the smearing path indicates the order of tin paste smearing of each to-be-processed pad on the circuit board, and the smearing priority The information is used to indicate the priority corresponding to each type of pad and the priority order of solder paste application; outputting the smearing path, so as to drive the smearing tool to apply tin paste to each of the pads to be processed based on the smearing path; Wherein, determining the smearing path based on the type to which each of the pads to be processed belongs and preset smearing priority information includes: Select a pad to be processed on the circuit board as the current smear node; traversing the circuit board based on the type to which the current smearing node belongs and the smearing priority information to determine the next smearing node of the current smearing node; Taking the next smearing node as the current smearing node, returning to perform the action of traversing the circuit board based on the smearing priority information, until all the pads to be processed on the circuit board are traversed; The smear paths are generated in the order of the individual smear nodes. 2 . The smearing path planning method according to claim 1 , wherein the selecting a pad to be processed on the circuit board as the current smearing node is specifically: selecting a pad located in the upper left corner of the circuit board. 3 . The pending pad of the area is used as the current smear node. 3. The smearing path planning method according to claim 2, wherein the traversing the circuit board based on the smearing priority information comprises: If there are two or more next smear nodes with the same priority in the current smear node, the next smudge node of the current smudge node is determined in the order of first right and then lower. 4. The smearing path planning method according to any one of claims 1 to 3, wherein the priority order indicated by the smearing priority information from high to low is: There are no crossing lines in the path, the distance between adjacent painted pads to be processed is short, and the pad type is prioritized from high to low. 5. A smearing path planning device applied to tin slurry smearing equipment, characterized in that, the tin slurry smearing equipment comprises a tool head, and the tool head has the function of moving and pushing tin slurry under the driving of a motor, and the smearing The path planning device includes: The type determination unit is used to determine the type of each pad to be processed on the circuit board; a smearing path determining unit, configured to determine a smearing path based on the type to which each of the pads to be processed belongs and preset smearing priority information, wherein the smearing path indicates the solder paste of each pad to be processed on the circuit board The smearing order, the smearing priority information is used to indicate the priority corresponding to each type of pad, and the priority order of solder paste smearing; an output unit, configured to output the smearing path, so as to drive the smearing tool to apply tin paste to each of the pads to be processed based on the smearing path; The initial node selection unit is used to select a pad to be processed on the circuit board as the current smear node; The traversal unit is used to traverse the circuit board based on the type of the current smear node and the smear priority information to determine the next smear node of the current smear node; take the next smear node as the current smudge node, and return performing the action of traversing the circuit board based on the smear priority information until all the pads to be processed on the circuit board are traversed; The generating unit is used for generating the smearing path according to the order of each smearing node. 6 . The smearing path planning device according to claim 5 , wherein the initial node selection unit is specifically configured to: select the pad to be processed located in the upper left area of the circuit board as the current smearing node. 7 . 7 . The smearing path planning device according to claim 6 , wherein the traversing unit is specifically configured to: when there are two or more next smearing nodes with the same priority order in the current smearing node during the traversing process, according to the first right The order of post-down determines the next smudge node of the current smudge node. 8. The smearing path planning device according to any one of claims 5 to 7, wherein the smearing path planning device further comprises: a storage unit for storing the smear priority information; The priority order indicated by the smearing priority information is, from high to low: the smearing integrity of the pads to be processed, the absence of cross lines in the smearing path, the short distance between adjacent pads to be smeared, and the priority Pad type from high to low.

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