CN111010799A

CN111010799A - Circuit board and manufacturing method thereof

Info

Publication number: CN111010799A
Application number: CN201811169327.6A
Authority: CN
Inventors: 傅志杰
Original assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Current assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Priority date: 2018-10-08
Filing date: 2018-10-08
Publication date: 2020-04-14
Also published as: US20200113065A1; US10729017B2

Abstract

The utility model provides a circuit board, circuit board includes a base plate, the base plate include a basic unit and be formed in a first conducting wire layer and a second conducting wire layer of the relative both sides of basic unit, circuit board still includes two at least run through the slotted hole of base plate, adjacent two adjacent edges of slotted hole all are provided with a plurality of and lead electrical pillar, every lead electrical pillar with first conducting wire layer reaches second conducting wire layer electric connection. The invention also provides a manufacturing method of the circuit board.

Description

Circuit board and manufacturing method thereof

Technical Field

The present invention relates to a circuit board and a method for manufacturing the same, and more particularly, to a circuit board embedded with an inductance element and a method for manufacturing the same.

Background

In recent years, electronic products are widely used in daily work and life, and light, thin and small electronic products are increasingly popular. The flexible circuit board is used as a main component of an electronic product, and occupies a large space of the electronic product, so that the volume of the flexible circuit board influences the volume of the electronic product to a great extent, and the large-volume flexible circuit board is difficult to conform to the trend of lightness, thinness, shortness and smallness of the electronic product.

With the development of miniaturization and light weight of electronic products, the application of high-complexity, high-precision and high-density circuit boards is more and more extensive, and how to improve the space utilization rate of the circuit boards and reduce the area of wiring areas is needed to be solved by technical personnel in the field.

Disclosure of Invention

A manufacturing method of a circuit board comprises the following steps:

providing a substrate, wherein the substrate comprises two opposite surfaces;

the substrate is provided with at least two slotted holes penetrating through the substrate;

a plurality of grooves are formed in the inner wall of the slotted hole, and each groove penetrates through the substrate; and

and forming a conductive layer on the substrate, wherein part of the conductive layer is filled in each groove to form a conductive column, and the conductive layer covers two opposite surfaces of the substrate and the inner wall of the slotted hole.

The utility model provides a circuit board, circuit board includes a base plate, the base plate include a basic unit and be formed in a first conducting wire layer and a second conducting wire layer of the relative both sides of basic unit, circuit board still includes two at least run through the slotted hole of base plate, adjacent two adjacent edges of slotted hole all are provided with a plurality of and lead electrical pillar, every lead electrical pillar with first conducting wire layer reaches second conducting wire layer electric connection.

According to the circuit board, the slotted holes are formed in the circuit board, the inductance elements formed by the first conductive circuit, the conductive posts and the second conductive circuit in a gradual connection mode are arranged between the adjacent slotted holes, the inductance elements are embedded in the circuit board, a circuit connected with the externally-hung inductance element is not required to be arranged on the circuit board, the wiring area is reduced, the cost is reduced, the occupation of the inductance element on the surface connection area of the circuit board is reduced, and the saved surface area can be used for placing other miniature electronic devices or elements.

Drawings

Fig. 1 is a schematic cross-sectional view of a base layer of a circuit board according to a first embodiment of the present invention.

Fig. 2 is a schematic cross-sectional view of a slot formed in a base layer of the circuit board shown in fig. 1.

Fig. 3 is a schematic sectional view along the direction III-III of fig. 2.

Fig. 4 is a partial perspective view illustrating that a plurality of grooves are formed on the inner wall of the slot of the circuit board shown in fig. 2.

Fig. 5 is a partial perspective view illustrating metallization of a slot of the circuit board shown in fig. 4.

Fig. 6 is a partial perspective view illustrating a circuit formed on a surface of a substrate of the circuit board shown in fig. 5.

Fig. 7 is a schematic cross-sectional view of a base layer of a circuit board according to a second embodiment of the present invention.

FIG. 8 is a schematic cross-sectional view of the circuit board shown in FIG. 7 with a slot formed in the base layer.

Fig. 9 is a schematic sectional view along direction IX-IX of fig. 8.

Fig. 10 is a partial perspective view illustrating that a plurality of grooves are formed on the inner wall of the slot of the circuit board shown in fig. 9.

Fig. 11 is a partial perspective view of the circuit board of fig. 10 having traces formed on opposite surfaces of the substrate.

Fig. 12 is a partial perspective view illustrating the conductive post fabricated in the groove of the circuit board shown in fig. 11.

Fig. 13 is a partial top view of a circuit board according to a preferred embodiment of the invention.

FIG. 14 is a partial perspective view of FIG. 13 taken along the direction XIV-XIV.

Fig. 15 is a perspective view of an inductance element of a circuit board according to a preferred embodiment of the invention.

Description of the main elements

Circuit board	100
		Substrate	10
Base layer	11
		A first conductive material layer	12
First conductive circuit layer	120
		First conductive circuit	121
A second conductive material layer	13
		Second conductive circuit layer	130
Second conductive circuit	131
		A third layer of conductive material	14
Conductive pole	140
		Slotted hole	101
Groove	103
		Surface of	11a、11b

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

Referring to fig. 1 to fig. 6, a method for manufacturing a circuit board 100 according to a first embodiment of the present invention includes the following steps:

step S101, providing a substrate 10, where the substrate 10 includes two opposite surfaces.

Referring to fig. 1, in an embodiment, a substrate 10 includes a base layer 11, and a first conductive material layer 12 and a second conductive material layer 13 disposed on opposite sides of the base layer 11, wherein the first conductive material layer 12 and the second conductive material layer 13 cover a surface of the base layer 11, respectively, and the first conductive material layer 12 and the second conductive material layer 13 may be the same material or different materials. The substrate 10 may also be a multi-layer circuit board, and at least one circuit layer having a predetermined circuit pattern and having a conductive capability is disposed inside the substrate 10.

In one embodiment, the base layer 11 is a flexible material, and the composition of the flexible material may include at least one of Polyimide (PI), Polyethylene naphthalate (PEN), or Polyethylene terephthalate (PET). In this embodiment, the material of the first conductive material layer 12 and the second conductive material layer 13 is copper, and in other embodiments, the first conductive material layer 12 or the second conductive material layer 13 may also be made of other conductive materials, such as a simple metal, an alloy, a metal oxide, and the like.

Step S102, forming at least two slots 101 penetrating the substrate 10 on the substrate 10.

Referring to fig. 2 and 3, at least two slots 101 are formed to sequentially penetrate through the first conductive material layer 12, the base layer 11 and the second conductive material layer 13. In one embodiment, at least two slots 101 are disposed adjacent to each other but not connected to each other, at least two slots 101 are elongated, and the long sides of the adjacent slots 101 are adjacent. In other embodiments, the number of the slots 101 may be four, the shape of the slot 101 may be rectangular, and each slot 101 may be adjacent to a plurality of other slots 101, and the adjacent sides of the adjacent slots 101 have a similar side length.

In one embodiment, the slot 101 may be formed by laser processing, and in other embodiments, it may be formed by mechanical cutting methods such as high pressure water jet cutting, air knife cutting, lathe cutting, or other methods such as chemical etching and physical etching.

In step S103, a plurality of grooves 103 are formed on the inner wall of each slot 101, and each groove 103 penetrates through the substrate 10.

Referring to fig. 3 and 4, a plurality of grooves 103 are formed on the inner wall of each slot 101, such that each groove 103 penetrates through the first conductive material layer 12, the base layer 11 and the second conductive material layer 13, and the groove 103 is formed on the edge of one slot 101 adjacent to another slot 101. In one embodiment, the number of the grooves 103 in each slot 101 is six, the grooves 103 are disposed in parallel, and each groove 103 is a rectangular groove. In other embodiments, there may be intersections of the plurality of grooves 103, and the number, distribution and shape of the grooves 103 may be adjusted as desired.

In one embodiment, the grooves 103 may be formed by laser processing, and in other embodiments, the grooves may be formed by mechanical cutting methods such as high pressure water jet cutting, air knife cutting, lathe cutting, or other methods such as chemical etching and physical etching.

Step S104 is to fill the slot 101 and the groove 103.

Referring to fig. 4 and 5, the slot 101 and the grooves 103 are filled such that the inner wall of the slot 101 covers the third conductive material layer 14 and the third conductive material layer 14 fills each of the grooves 103, and the third conductive material layer 14 covers at least a portion of the surfaces of the first conductive material layer 12 and the second conductive material layer 13 close to the slot 101.

In this embodiment, the material of the third conductive material layer 14 is copper, and in other embodiments, the third conductive material layer 14 may also be made of other conductive materials, such as a simple metal, an alloy, a metal oxide, and the like.

Step S105, a circuit is formed on the first conductive material layer 12, the second conductive material layer 13, and the third conductive material layer 14.

Referring to fig. 5 and fig. 6, the first conductive material layer 12, the second conductive material layer 13, and the third conductive material layer 14 are patterned to form a first conductive trace layer 120, a second conductive trace layer 130, and a plurality of conductive pillars 140. In one embodiment, the circuit manufacturing process can be completed in different processes, the circuit manufacturing for the two opposite surfaces of the substrate 10 can be performed before the circuit manufacturing for the slot 101, and the first conductive circuit layer 120, the second conductive circuit layer 130 and the third conductive material layer 14 can be used as a conductive layer. The first conductive trace layer 120 includes a plurality of first conductive traces 121, and the second conductive trace layer 130 includes a plurality of second conductive traces 131. Two ends of each conductive pillar 140 are electrically connected to one of the first conductive traces 121 and one of the second conductive traces 131, that is, two ends of each conductive pillar 140 are electrically connected to the first conductive trace layer 120 and the second conductive trace layer 130, respectively. The conductive posts 140 located in different slots 101 are electrically connected to the conductive posts 140 located in the adjacent slot 101 through the first conductive trace 121 and a second conductive trace 131.

In one embodiment, the third conductive material layer 14 covering the inner wall of the slot 101 may be removed by drilling the slot 101 by a mechanical drilling method. In other embodiments, the third conductive material layer 14 covering the inner wall of the slot 101 may be removed by a mechanical cutting method such as laser cutting, high pressure water jet, air knife cutting, lathe, or other methods such as chemical etching, physical etching, or the like, so as to complete the circuit manufacturing of the third conductive material layer 14.

Second embodiment

Referring to fig. 7 to 12, a method for manufacturing a circuit board 100 according to a second embodiment of the invention includes the following steps:

in step S201, a substrate 10 is provided, where the substrate 10 includes only a base layer 11 having two

opposite surfaces

11a and 11 b.

Referring to fig. 7, the base layer 11 has two

opposite surfaces

11a and 11b, and the base layer 11 is made of a flexible material, and the composition of the flexible material may include at least one of Polyimide (PI), Polyethylene naphthalate (PEN), or Polyethylene terephthalate (PET). The substrate 10 may also be a multi-layer circuit board, and at least one circuit layer having a predetermined circuit pattern and having a conductive capability is disposed inside the substrate 10.

In step S202, at least two slots 101 are formed in the substrate 10.

Referring to fig. 8 and 9, at least two slots 101 penetrating through the base layer 11 are formed, in an embodiment, the at least two slots 101 are disposed adjacent to each other but not in contact with each other, the at least two slots 101 are elongated, and the long sides of the adjacent slots 101 are adjacent to each other. In other embodiments, the number of the slots 101 may be four, the shape of the slot 101 may be rectangular, each slot 101 may be adjacent to a plurality of other slots 101, and the sides of the adjacent slots 101 having similar sides are adjacent to each other.

In step S203, a plurality of grooves 103 are formed on the inner wall of each slot 101.

Referring to fig. 9 and 10, a plurality of grooves 103 are formed on the inner wall of each slot 101, such that each groove 103 penetrates through the base layer 11, and the grooves 103 are formed on the edges of one slot 101 adjacent to another slot 101. In one embodiment, the number of the grooves 103 in each slot 101 is six, the grooves 103 are disposed in parallel, and each groove 103 is a rectangular groove. In other embodiments, there may be intersections of the plurality of grooves 103, and the number, distribution and shape of the grooves 103 may be adjusted as desired.

In step S204, the wiring of the circuit board 10 is formed by an additive method.

Referring to fig. 10 and 11, the additive method may be a full additive method or a half additive method, a first conductive trace layer 120 is formed on the surface 11a of the base layer 11, a second conductive trace layer 130 is formed on the surface 11b of the base layer 11, and the third conductive trace layer 14 covers the inner wall of the groove 103, and the first conductive trace layer 120, the second conductive trace layer 130 and the third conductive trace layer 14 may be used as a conductive layer. The first conductive trace layer 120 includes a plurality of first conductive traces 121, and the second conductive trace layer 130 includes a plurality of second conductive traces 131.

In this embodiment, the material of the first conductive trace layer 120, the second conductive trace layer 130, or the third conductive material layer 14 is copper, and in other embodiments, the first conductive trace layer 120 or the second conductive trace layer 130 may also be made of other conductive materials, such as a simple metal, an alloy, a metal oxide, and the like.

In step S205, the third conductive material layer 14 covering the inner wall of the slot 101 is removed and the third conductive material layer 14 filling the groove 103 is remained to form the conductive pillar 140.

Referring to fig. 11 and 12, in an embodiment, a mechanical drilling method is used to drill holes corresponding to the slots 101 to remove the third conductive material layer 14 covering the inner walls of the slots 101, a conductive pillar 140 is formed in each of the grooves 103, two ends of each conductive pillar 140 are respectively electrically connected to a first conductive trace 121 and a second conductive trace 131, that is, two ends of each conductive pillar 140 are respectively electrically connected to the first conductive trace layer 120 and the second conductive trace layer 130, and the conductive pillars 140 located in different slots 101 are electrically connected to the conductive pillars 140 located in adjacent slots 101 through the first conductive traces 121 and the second conductive traces 131.

In other embodiments, the third conductive material layer 14 covering the inner wall of the slot 101 may be removed by a mechanical cutting method such as laser cutting, high pressure water jet, air knife cutting, lathe, or other methods such as chemical etching, physical etching, or the like, so as to complete the circuit manufacturing of the third conductive material layer 14.

Third embodiment

Referring to fig. 13 to fig. 15, a circuit board 100 manufactured by the manufacturing method according to the first embodiment or the second embodiment of the invention is shown.

Fig. 13 is a partial top view of the circuit board 100 according to the preferred embodiment of the invention. The circuit board 100 has at least two slots 101 penetrating through the substrate 10, and two opposite surfaces of the circuit board 100 are respectively provided with at least a first conductive trace 121 and a second conductive trace 131, in an embodiment, the first conductive trace 121 and the second conductive trace 131 are disposed between two adjacent slots 101.

Fig. 14 is a partial perspective view of fig. 13 taken along the direction XIV-XIV. The substrate 10 includes a base layer 11, and a first conductive trace layer 120 and a second conductive trace layer 130 formed on two opposite sides of the base layer 11, wherein a plurality of conductive pillars 140 are disposed on an inner wall of each slot 101, each conductive pillar 140 is electrically connected to at least one first conductive trace 121 and one second conductive trace 131, the first conductive trace 121 is included in the first conductive trace layer 120, and the second conductive trace 131 is included in the second conductive trace layer 130, that is, each conductive pillar 140 is electrically connected to at least the first conductive trace layer 120 and the second conductive trace layer 130. The substrate 10 may also be a multi-layer circuit board, and at least one circuit layer having a predetermined circuit pattern and having a conductive capability is disposed inside the substrate 10, and the at least one circuit layer may be electrically connected or insulated with the conductive pillar 140 according to a functional design.

As shown in fig. 13, the conductive posts 140 are correspondingly disposed on the adjacent sides of two adjacent slots 101, the conductive posts 140 in the same slot 101 do not contact, and the conductive posts 140 on different slots 101 are electrically connected to the conductive posts 140 on the adjacent slot 101 through the first conductive trace 121 or the second conductive trace 131.

As shown in fig. 15, which is a schematic perspective view of the inductance element of the circuit board 100 according to the preferred embodiment of the invention, the first conductive trace 121, the conductive pillar 140 and the second conductive trace 131 on the circuit board 100 are connected gradually to form an inductance element.

In one embodiment, at least two slots 101 are disposed adjacent to each other without contacting each other, at least two slots 101 are elongated, and at least one side of the adjacent slots 101 is adjacent. In other embodiments, the number of the slots 101 may be four, the shape of the slot 101 may be rectangular, each slot 101 may be adjacent to a plurality of other slots 101, the adjacent sides of each adjacent slot 101 have a similar length, and the first conductive trace 121, the conductive pillar 140 and the second conductive trace 131 are gradually connected to form an inductance element wound on the medium between the adjacent two sides of different slots.

According to the circuit board 100, the slotted holes are formed in the substrate 10 of the circuit board 100, the first conductive circuit 121, the conductive column 140 and the second conductive circuit 131 are sequentially connected to form the inductance element on the substrate 10 between the adjacent slotted holes 101, the inductance element is embedded in the circuit board 100, a circuit connected with an external inductance element is not required to be arranged on the circuit board 100, the wiring area is reduced, the cost is reduced, the occupation of the inductance element on the surface connection area of the circuit board 100 is reduced, and the saved surface area can be used for placing other micro electronic devices or elements.

Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A manufacturing method of a circuit board comprises the following steps:

providing a substrate, wherein the substrate comprises two opposite surfaces;

2. The method according to claim 1, wherein a first conductive material layer and a second conductive material layer are disposed on two opposite surfaces of the substrate, respectively, and the first conductive material layer and the second conductive material layer are patterned to form a first conductive trace layer and a second conductive trace layer, wherein the conductive layer includes the first conductive trace layer, the second conductive trace layer and a third conductive material layer, and the third conductive material layer covers the inner wall of the slot and fills the groove.

3. The method of claim 1, wherein the conductive layer is formed by additive process, and the conductive layer comprises a first conductive trace layer, a second conductive trace layer and a third conductive material layer, wherein the first conductive trace layer and the second conductive trace layer respectively cover two opposite surfaces of the substrate, and the third conductive material layer fills up the groove of the slot and covers the inner wall surface of the slot.

4. The method as claimed in claim 2 or 3, wherein the conductive posts are formed by routing the third conductive material layer covering the inner wall of the slot hole by mechanical drilling, laser cutting or etching.

5. The method of claim 1, wherein the groove is formed on an edge of one of the slots adjacent to another of the slots.

6. The utility model provides a circuit board, circuit board includes a base plate, the base plate include a basic unit and be formed in a first conducting wire layer and a second conducting wire layer of the relative both sides of basic unit, circuit board still includes two at least run through the slotted hole of base plate, adjacent two adjacent edges of slotted hole all are provided with a plurality of and lead electrical pillar, every lead electrical pillar with first conducting wire layer reaches second conducting wire layer electric connection.

7. The circuit board of claim 6, further comprising at least one circuit layer within the substrate, the circuit layer having a predetermined circuit pattern and being electrically conductive.

8. The circuit board of claim 6 or 7, wherein the number of slots is plural, each slot being adjacent to a plurality of other slots.

9. The circuit board of claim 6 or 7, wherein the first conductive trace layer comprises a first conductive trace, the second conductive trace layer comprises a second conductive trace, and the first conductive trace, the conductive post, and the second conductive trace are connected in sequence to form an inductive element.

10. The circuit board of claim 7, wherein at least one of the circuit layers is electrically connected to the conductive post.